CN111584392A - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

Info

Publication number
CN111584392A
CN111584392A CN202010092530.9A CN202010092530A CN111584392A CN 111584392 A CN111584392 A CN 111584392A CN 202010092530 A CN202010092530 A CN 202010092530A CN 111584392 A CN111584392 A CN 111584392A
Authority
CN
China
Prior art keywords
substrate
unit
wafer
processing apparatus
transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010092530.9A
Other languages
English (en)
Chinese (zh)
Inventor
丰永真臣
蓑手文隆
时松徹
石丸和俊
香月信吾
村上孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN111584392A publication Critical patent/CN111584392A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
CN202010092530.9A 2019-02-15 2020-02-14 基板处理装置和基板处理方法 Pending CN111584392A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019025712A JP7211142B2 (ja) 2019-02-15 2019-02-15 基板処理装置及び基板処理方法
JP2019-025712 2019-02-15

Publications (1)

Publication Number Publication Date
CN111584392A true CN111584392A (zh) 2020-08-25

Family

ID=72111393

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202010092530.9A Pending CN111584392A (zh) 2019-02-15 2020-02-14 基板处理装置和基板处理方法
CN202020169585.0U Active CN211654775U (zh) 2019-02-15 2020-02-14 基板处理装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202020169585.0U Active CN211654775U (zh) 2019-02-15 2020-02-14 基板处理装置

Country Status (2)

Country Link
JP (1) JP7211142B2 (ja)
CN (2) CN111584392A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230042869A (ko) 2021-09-23 2023-03-30 삼성전자주식회사 층간 반송 장치 및 이를 포함하는 물류 반송 시스템
WO2024157825A1 (ja) * 2023-01-27 2024-08-02 東京エレクトロン株式会社 基板搬送方法、基板処理装置及びプログラム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4955976B2 (ja) * 2005-01-21 2012-06-20 東京エレクトロン株式会社 塗布、現像装置及びその方法
JP4980978B2 (ja) * 2008-04-17 2012-07-18 大日本スクリーン製造株式会社 基板処理装置
JP2013243406A (ja) * 2013-08-13 2013-12-05 Tokyo Electron Ltd 塗布、現像装置、塗布、現像方法及び記憶媒体
JP6316742B2 (ja) * 2014-12-24 2018-04-25 東京エレクトロン株式会社 基板搬送装置および基板搬送方法

Also Published As

Publication number Publication date
JP7211142B2 (ja) 2023-01-24
JP2020136397A (ja) 2020-08-31
CN211654775U (zh) 2020-10-09

Similar Documents

Publication Publication Date Title
JP7136254B2 (ja) 基板処理装置及び基板処理方法
KR101790867B1 (ko) 기판 반송 장치, 기판 반송 방법 및 그 기판 반송 방법을 실행시키기 위한 프로그램을 기록한 기록 매체
CN211654775U (zh) 基板处理装置
KR102552935B1 (ko) 기판 처리 장치
CN111025850B (zh) 涂布显影装置和涂布显影方法
CN216773187U (zh) 基板处理装置
CN212694244U (zh) 涂敷、显影装置
CN217544546U (zh) 基板处理装置
KR20190008102A (ko) 기판 위치 조정 방법, 기억 매체 및 기판 처리 시스템
KR102469678B1 (ko) 성막 시스템, 성막 방법 및 컴퓨터 기억 매체
CN215576096U (zh) 基板处理装置
CN215576095U (zh) 基板处理装置
CN218826983U (zh) 基板处理装置
JP7524736B2 (ja) 基板処理装置、基板処理方法及び記憶媒体
CN112596351B (zh) 涂布显影装置和涂布显影方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination