CN111572159A - Anti-static hardened plate and preparation method thereof - Google Patents

Anti-static hardened plate and preparation method thereof Download PDF

Info

Publication number
CN111572159A
CN111572159A CN202010446972.9A CN202010446972A CN111572159A CN 111572159 A CN111572159 A CN 111572159A CN 202010446972 A CN202010446972 A CN 202010446972A CN 111572159 A CN111572159 A CN 111572159A
Authority
CN
China
Prior art keywords
coating
hardened
static
substrate
release film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010446972.9A
Other languages
Chinese (zh)
Other versions
CN111572159B (en
Inventor
张景春
司家林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Fulang Optical Materials Co ltd
Original Assignee
Anhui Fulang Optical Materials Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Anhui Fulang Optical Materials Co ltd filed Critical Anhui Fulang Optical Materials Co ltd
Priority to CN202010446972.9A priority Critical patent/CN111572159B/en
Publication of CN111572159A publication Critical patent/CN111572159A/en
Application granted granted Critical
Publication of CN111572159B publication Critical patent/CN111572159B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/08Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an anti-friction or anti-adhesive surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/02Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber
    • B05D7/04Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to macromolecular substances, e.g. rubber to surfaces of films or sheets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/50Multilayers
    • B05D7/52Two layers
    • B05D7/54No clear coat specified
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/12Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • B32B27/365Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0038Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving application of liquid to the layers prior to lamination, e.g. wet laminating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00Ancillary operations in connection with laminating processes
    • B32B38/10Removing layers, or parts of layers, mechanically or chemically
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/103Metal fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10Inorganic fibres
    • B32B2262/106Carbon fibres, e.g. graphite fibres
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/21Anti-static

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

The invention relates to an anti-static hardened plate and a preparation method thereof. The preparation method of the anti-static hardened board comprises the following steps: providing a release film and a substrate, wherein the substrate is provided with two opposite surfaces; sequentially forming an anti-static coating and an uncured hardening coating precursor on the release film to obtain a composite layer; respectively compounding a composite layer on at least one surface of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain a composite plate; curing the hardening coating precursor in the composite board, and then removing the release film to obtain the anti-static hardening board; the anti-static hardened plate comprises a substrate, wherein at least one surface of the substrate is provided with a hardened coating and an anti-static coating which are laminated. The preparation method of the anti-static hardened board can improve the quality of the anti-static hardened board, and the prepared anti-static hardened board has the advantages of small addition amount of the conductive agent, high transparency, good appearance, wiping resistance and the like.

Description

Anti-static hardened plate and preparation method thereof
Technical Field
The invention relates to the technical field of plates, in particular to an anti-static hardened plate and a preparation method thereof.
Background
Resin plates (such as PVC, PMMA, PETG, PC and the like) are widely applied to the fields of transparent protection of precision equipment, transparent partition of a dust-free room and the like due to good processability and electric insulation performance. But the common resin plate has higher surface resistivity (> 10)14Ω/cm2) In practical application, the resin plate needs to be subjected to antistatic treatment to reduce the surface resistivity to 106~108Ω/cm2To reduce static charge build-up. Meanwhile, as a protective material, the surface of the material should have certain hardness and wear resistance so as to clean the surface regularly.
The traditional anti-static hardened plate is mainly formed by coating anti-static hardened paint on the surface of a substrate to form a plate with dual functions of static prevention and hardening. The antistatic hardened paint is prepared by compounding antistatic dispersion liquid and hardened paintHowever, the antistatic coating is prepared by the method, the compatibility problem of the two materials exists, phase separation is easy to occur in the solvent volatilization photocuring process, and pockmark defects exist in the appearance of the antistatic coating; furthermore, if 10 is to be reached6~108Ω/cm2The antistatic index of (a) often requires the addition of a large amount of antistatic agent, which results in a decrease in the light transmittance of the antistatic coating.
Disclosure of Invention
In view of the above, it is necessary to provide an anti-static hardened plate and a method for manufacturing the same, aiming at the problem of how to improve the quality of the anti-static hardened plate.
A preparation method of an anti-static hardened plate comprises the following steps:
providing a release film and a substrate, wherein the substrate is provided with two opposite surfaces;
sequentially forming an anti-static coating and an uncured hardening coating precursor on the release film to obtain a composite layer;
respectively compounding the composite layers on at least one surface of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain a composite plate; and
curing the hardening coating precursor in the composite board, and then removing the release film to obtain the anti-static hardening board; the anti-static hardened plate comprises a substrate, wherein at least one surface of the substrate is provided with a hardened coating and an anti-static coating which are laminated.
Compared with the traditional preparation method of the anti-static hardened plate, the preparation method of the anti-static hardened plate provided by the technical scheme of the invention has the advantages that the anti-static dispersion liquid and the hardened coating do not need to be mixed, the problem of phase separation of the anti-static dispersion liquid and the hardened coating due to poor compatibility is avoided, and the problem that the hardened resin covers the surface of the conductive component in the anti-static dispersion liquid to influence the overall resistance is also avoided. And secondly, the hardening coating precursor can effectively rivet the antistatic coating and the substrate while being crosslinked and cured, so that the finally obtained antistatic coating has excellent wiping resistance and adhesive force. In addition, the antistatic coating and the hardened coating are transferred onto the substrate through the release film, so that the outer surface of the antistatic coating is very smooth after the release film is removed, and the application is facilitated. In conclusion, the preparation method of the anti-static hardened plate can improve the quality of the anti-static hardened plate, and the prepared anti-static hardened plate has the advantages of small addition amount of the conductive agent, high transparency, good appearance, wiping resistance and the like.
In one embodiment, after curing the hardened coating precursor in the composite board and removing the release film, the method further comprises the following steps: and forming a protective film on the anti-static coating in the cured composite board.
In one embodiment, the protective film is a PP protective film having tackiness.
In one embodiment, the step of sequentially forming the antistatic coating layer and the uncured hardened coating precursor on the release film comprises: coating the anti-static dispersion liquid on the surface of the release film by adopting a roll-to-roll process, and drying to form an anti-static coating; and then coating the light-cured hardening coating on the surface of the antistatic coating by adopting a roll-to-roll process, and drying to form an uncured hardening coating precursor.
In one embodiment, in the step of laminating the composite layer on at least one surface of the substrate: and compounding the substrate and the composite layer through a composite press roller, wherein the compounding pressure is 0.1 bar-0.3 bar.
In one embodiment, the composite layer is respectively compounded on two surfaces of the substrate, and in the obtained anti-static hardened plate, the two surfaces of the substrate are both provided with the hardened coating and the anti-static coating which are laminated.
In one embodiment, the hardened coating has a thickness of 2 μm to 20 μm.
In one embodiment, the thickness of the antistatic coating is 10nm to 500 nm.
In one embodiment, the release film is a PET release film, a PE release film, a PC release film, a PMMA release film, or a PTFE release film.
The anti-static hardened plate is prepared by the preparation method of the anti-static hardened plate.
According to the preparation method of the anti-static hardened plate, the anti-static dispersion liquid and the hardened coating do not need to be mixed, so that the problem of phase separation of the anti-static dispersion liquid and the hardened coating due to poor compatibility is avoided, and the problem that the hardened resin covers the surface of the conductive component in the anti-static dispersion liquid to influence the overall resistance is also avoided. And secondly, the hardening coating precursor can effectively rivet the antistatic coating and the substrate while being crosslinked and cured, so that the finally obtained antistatic coating has excellent wiping resistance and adhesive force. In addition, the antistatic coating and the hardened coating are transferred onto the substrate through the release film, so that the outer surface of the antistatic coating is very smooth after the release film is removed, and the application is facilitated. In conclusion, the preparation method of the anti-static hardened plate can improve the quality of the anti-static hardened plate, and the prepared anti-static hardened plate has the advantages of small addition amount of the conductive agent, high transparency, good appearance, wiping resistance and the like.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing an anti-static hardened board according to an embodiment of the present invention;
fig. 2 is a schematic view illustrating an antistatic coating layer formed on a release film in the method for manufacturing an antistatic hardened board according to an embodiment of the present invention;
FIG. 3 is a schematic view of the method for manufacturing an antistatic hardened plate according to an embodiment of the present invention after forming an uncured hardened coating precursor on the antistatic coating;
FIG. 4 is a schematic view illustrating a substrate and a composite layer being combined together in a method for manufacturing an anti-static hardened board according to an embodiment of the present invention;
fig. 5 is a schematic view illustrating the method for manufacturing an anti-static hardened board according to an embodiment of the invention after removing the release film;
fig. 6 is a schematic view of an anti-static hardened board according to an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, a method for preparing an anti-static hardened board according to an embodiment of the present invention includes the following steps:
and S10, providing a release film and a substrate, wherein the substrate has two opposite surfaces.
Wherein, the release film refers to a film with a differentiated surface energy, and the release film and the antistatic coating have no viscosity or slight viscosity after being contacted under limited conditions.
Preferably, the release film is a PET release film, a PE release film, a PC release film, a PMMA release film or a PTFE release film. More preferably, the thickness of the PET release film is 25-125 μm, and the release force is 100-500 g.
Preferably, the substrate is made of PVC, PMMA, PETG or PC, and the thickness of the substrate is 0.3 nm-20 nm.
And S20, sequentially forming the antistatic coating and the uncured hardening coating precursor on the release film to obtain the composite layer.
Preferably, the steps of sequentially forming the antistatic coating layer 120 and the uncured hardened coating precursor 130 on the release film 110 are: coating the antistatic dispersion liquid on the surface of the release film 110 by a roll-to-roll process, and drying to form an antistatic coating 120, as shown in fig. 2; the photo-curable hardening coating is then applied to the surface of the antistatic coating 120 using a roll-to-roll process, and dried to form an uncured hardening coating precursor 130, resulting in a composite layer 140, as shown in fig. 3.
In the above steps, the antistatic dispersion liquid and the photocureable hardening coating can be dried by using an oven to remove the solvent in the antistatic dispersion liquid and the photocureable hardening coating respectively, and the baking temperature is 60-100 ℃.
In the steps, the roll-to-roll process is adopted for production, so that the production efficiency can be improved, and the application is facilitated.
In the above steps, the antistatic dispersion may be coated on the surface of the release film 110 by a roll coating process. The roller coating process is a micro-concave, gravure or slit mode. The machine speed of the roller coating process can be up to 30 m/min. The antistatic dispersion liquid and the release film are well wetted without shrinkage cavity.
Preferably, the antistatic coating 120 is an inorganic antistatic layer selected from at least one of a carbon nano antistatic layer, a metal oxide antistatic layer, and a metal nanowire antistatic layer. Of course, the antistatic coating 120 is not limited thereto.
The material of the carbon nano antistatic layer is selected from one or a mixture of several of single-walled carbon nanotubes, few-walled carbon nanotubes (less than 10 layers), single-layer graphene, few-layer graphene (less than 10 layers), carbon fibers and the like, but is not limited thereto.
Wherein, the porosity of the carbon nano tube antistatic layer is 60-90%.
The material of the metal oxide antistatic layer is preferably Indium Tin Oxide (ITO) or Antimony Tin Oxide (ATO), and the particle size of the metal oxide in the metal oxide antistatic layer is less than 20nm, but not limited thereto.
The metal nanowire antistatic layer is preferably made of silver nanowires, gold nanowires or copper nanowires, the diameter of the metal nanowires is less than 50nm, and the length of the metal nanowires is not less than 10 micrometers, but not limited thereto.
In the above step, the uncured hardened coating precursor 130 may be, for example, a photo-curable hardened paint. The photocureable hardening coating comprises a solvent-free type and a solvent type, and the solvent-free type is preferred.
Specifically, the photo-curing hardening paint is applied to the surface of the antistatic coating layer 120 by a roll coating process. The roller coating process is a micro-concave, gravure or slit mode. The machine speed of the roller coating process can be up to 30 m/min.
And S30, respectively compounding a composite layer on at least one surface of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain the composite plate.
Preferably, in the step of compounding the composite layer 140 on at least one surface of the substrate 150: and compounding the substrate 150 and the compound layer 140 through a compound press roller, wherein the compound pressure is 0.1 bar-0.3 bar. No bubble is generated in the compounding process. The composite board 160 obtained after the compounding includes the release film 110, the antistatic coating 120, the hardened coating precursor 130, and the substrate 150, which are sequentially stacked, as shown in fig. 4.
In one embodiment, the composite layer 140 is compounded on the lower surface of the substrate 150. Of course, it is also possible to compound the composite layer 140 on the upper surface of the substrate 150, or compound the composite layer 140 on both the upper and lower surfaces of the substrate 150.
S40, curing the hardening coating precursor in the composite board, and then removing the release film to obtain the anti-static hardening board; the anti-static hardened plate comprises a substrate, wherein at least one surface of the substrate is provided with a hardened coating and an anti-static coating which are laminated.
Curing the hardened coating precursor 130 in the composite board 160 by ultraviolet irradiation with an irradiation energy of 1000j/cm2~3000mj/cm2. The hardened coating precursor 130 becomes hardened coating 170 after being cured. The hardened coating precursor 130 can effectively rivet the antistatic coating 120 and the substrate 150 while being cross-linked and cured, so that the final productThe antistatic coating layer 120 has excellent scratch resistance.
The step of removing the release film 110 is: the release film 110 is removed as shown in fig. 5.
Preferably, after curing the hardening coating precursor 130 in the composite board 160 and removing the release film 110, the method further comprises the following steps: a protective film 180 is formed on the antistatic coating layer 120 in the cured composite panel 160. The protective film 180 can protect the antistatic coating 120 during transportation or other movement.
Preferably, the protective film 180 is a PP protective film having adhesiveness. The light transmittance of the PP protective film is good, and the light transmittance of the entire antistatic coating 120 and the cured coating 170 is not affected. Of course, the protective film 180 is not limited thereto, and may be a film made of other material capable of protecting the anti-static coating 120.
As shown in fig. 6, the anti-static hardened sheet material 100 includes a substrate 150, and a hardened coating 170, an anti-static coating 120 and a protective film 180 are stacked on a surface of the substrate 150.
Preferably, the thickness of the hardened coating 160 is 2 μm to 20 μm. More preferably, the thickness of the hardened coating 160 is 4 μm to 10 μm.
Preferably, the thickness of the antistatic coating layer 120 is 10nm to 500 nm.
Preferably, the antistatic coating 120 has a surface resistivity of 106Ω/cm2~108Ω/cm2. The adhesion between the antistatic coating 120 and the substrate 150 is 0 grade.
In the antistatic hardened plate material obtained by respectively compounding the composite layers on the two surfaces of the substrate, the hardened coating and the antistatic coating which are laminated are arranged on the two surfaces of the substrate.
When both surfaces of the substrate are provided with the hardened coating and the antistatic coating which are laminated, the method for preparing the antistatic hardened sheet material of the first embodiment comprises the following steps:
and S11, providing a release film and a substrate, wherein the substrate has two opposite surfaces.
And S12, sequentially forming the antistatic coating and the uncured hardening coating precursor on the release film to obtain the composite layer.
And S13, compounding composite layers on the two surfaces of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain the composite board.
S14, curing the hardening coating precursor in the composite board, and then removing the release film to obtain the anti-static hardening board; the anti-static hardened plate comprises a substrate, and the two surfaces of the substrate are both provided with a hardened coating and an anti-static coating which are laminated.
The preparation method of the anti-static hardened plate material of the second embodiment comprises the following steps:
and S21, providing a release film and a substrate, wherein the substrate has two opposite surfaces.
And S22, sequentially forming the antistatic coating and the uncured hardening coating precursor on the release film to obtain the composite layer.
And S23, compounding a composite layer on one surface of the substrate, wherein in the compounding process, the substrate is arranged opposite to the hardening coating precursor, and the hardening coating precursor in the composite board is cured.
S24, then compounding a composite layer on the other surface of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain a composite plate; then curing another hardened coating precursor in the composite board; then removing the release films on the two surfaces to obtain the anti-static hardened plate; the anti-static hardened plate comprises a substrate, and the two surfaces of the substrate are both provided with a hardened coating and an anti-static coating which are laminated.
The anti-static hardened plate can be obtained by adopting the preparation methods of the above embodiments.
In addition, in the preparation method of the anti-static hardened board, the hardened coating and the anti-static coating are sequentially formed on the release film with good flexibility and then are compounded with the substrate, so that the preparation method is not limited by factors such as material, thickness, size and the like of the substrate, and is more beneficial to large-scale application.
Compared with the traditional preparation method of the anti-static hardened plate, the preparation method of the anti-static hardened plate provided by the technical scheme of the invention has the advantages that the anti-static dispersion liquid and the hardened coating do not need to be mixed, the problem of phase separation of the anti-static dispersion liquid and the hardened coating due to poor compatibility is avoided, and the problem that the hardened resin covers the surface of the conductive component in the anti-static dispersion liquid to influence the overall resistance is also avoided. And secondly, the hardening coating precursor can effectively rivet the antistatic coating and the substrate while being crosslinked and cured, so that the finally obtained antistatic coating has excellent wiping resistance and adhesive force. In addition, the antistatic coating and the hardened coating are transferred onto the substrate through the release film, so that the outer surface of the antistatic coating is very smooth after the release film is removed, and the application is facilitated. In conclusion, the preparation method of the anti-static hardened plate can improve the quality of the anti-static hardened plate, and the prepared anti-static hardened plate has the advantages of small addition amount of the conductive agent, high transparency, good appearance, wiping resistance and the like.
The anti-static hardened plate of an embodiment is prepared by the preparation method of the anti-static hardened plate.
As shown in fig. 6, the anti-static hardened sheet material 100 includes a substrate 150, and a hardened coating 170, an anti-static coating 120 and a protective film 180 are stacked on a surface of the substrate 150.
The hardness of the hardened coating 170 on the surface of the different substrates 150 is respectively: PVC base plate HB, PMMA base plate 2H, PC base plate HB, PETG base plate H. The adhesion of the hardened coating 170 to the substrate 150 is grade 0.
The composite coating has excellent optical performance, the light transmittance of the coating is more than or equal to 99%, and the coating has higher hardness; surface resistivity of 106Ω/cm2~108Ω/cm2And the IPA wiping times is more than 2000 times under the condition of resisting 500g of force, and the coating is a high-quality coating with excellent comprehensive performances such as antistatic performance, optical performance, hardness and the like.
In this embodiment, the hardened coat layer, the antistatic coat layer, and the protective film are laminated on only one surface of the substrate. However, the antistatic hardened plate material of the present invention is not limited thereto, and a hardened coating, an antistatic coating, and a protective film may be simultaneously laminated on both surfaces of the substrate.
According to the preparation method of the anti-static hardened plate, the anti-static dispersion liquid and the hardened coating do not need to be mixed, so that the problem of phase separation of the anti-static dispersion liquid and the hardened coating due to poor compatibility is avoided, and the problem that the hardened resin covers the surface of the conductive component in the anti-static dispersion liquid to influence the overall resistance is also avoided. And secondly, the hardening coating precursor can effectively rivet the antistatic coating and the substrate while being crosslinked and cured, so that the finally obtained antistatic coating has excellent wiping resistance and adhesive force. In addition, the antistatic coating and the hardened coating are transferred onto the substrate through the release film, so that the outer surface of the antistatic coating is very smooth after the release film is removed, and the application is facilitated. In conclusion, the preparation method of the anti-static hardened plate can improve the quality of the anti-static hardened plate, and the prepared anti-static hardened plate has the advantages of small addition amount of the conductive agent, high transparency, good appearance, wiping resistance and the like.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (10)

1. The preparation method of the anti-static hardened board is characterized by comprising the following steps:
providing a release film and a substrate, wherein the substrate is provided with two opposite surfaces;
sequentially forming an anti-static coating and an uncured hardening coating precursor on the release film to obtain a composite layer;
respectively compounding the composite layers on at least one surface of the substrate, wherein in the compounding process, the substrate and the hardened coating precursor are oppositely arranged to obtain a composite plate; and
curing the hardening coating precursor in the composite board, and then removing the release film to obtain the anti-static hardening board; the anti-static hardened plate comprises a substrate, wherein at least one surface of the substrate is provided with a hardened coating and an anti-static coating which are laminated.
2. The method for preparing the antistatic hardened board as claimed in claim 1, wherein the step of curing the hardened coating precursor in the composite board and then removing the release film further comprises the following steps: and forming a protective film on the anti-static coating in the cured composite board.
3. The method for preparing an antistatic hardened plate as claimed in claim 2, wherein the protective film is a PP protective film with adhesive property.
4. The method for preparing an antistatic hardened plate as claimed in claim 1, wherein the step of sequentially forming an antistatic coating and an uncured hardened coating precursor on the release film comprises: coating the anti-static dispersion liquid on the surface of the release film by adopting a roll-to-roll process, and drying to form an anti-static coating; and then coating the light-cured hardening coating on the surface of the antistatic coating by adopting a roll-to-roll process, and drying to form an uncured hardening coating precursor.
5. The method for manufacturing an antistatic hardened plate as claimed in claim 1, wherein in the step of laminating the composite layer on at least one surface of the substrate: and compounding the substrate and the composite layer through a composite press roller, wherein the compounding pressure is 0.1 bar-0.3 bar.
6. The method for manufacturing an anti-static hardened sheet according to claim 1, wherein the composite layer is laminated on each of the two surfaces of the substrate, and the anti-static hardened sheet is obtained by laminating a hardened coating and an anti-static coating on each of the two surfaces of the substrate.
7. The method for preparing an antistatic hardened plate as claimed in claim 1 or 6, wherein the hardened coating has a thickness of 2 to 20 μm.
8. The method for preparing an antistatic hardened plate as claimed in claim 1 or 6, wherein the thickness of the antistatic coating is 10nm to 500 nm.
9. The method for preparing the anti-static-hardening plate as claimed in claim 1, wherein the release film is a PET release film, a PE release film, a PC release film, a PMMA release film or a PTFE release film.
10. An anti-static hardened plate, which is characterized by being prepared by the preparation method of the anti-static hardened plate as claimed in any one of claims 1 to 9.
CN202010446972.9A 2020-05-25 2020-05-25 Anti-static hardened plate and preparation method thereof Active CN111572159B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010446972.9A CN111572159B (en) 2020-05-25 2020-05-25 Anti-static hardened plate and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010446972.9A CN111572159B (en) 2020-05-25 2020-05-25 Anti-static hardened plate and preparation method thereof

Publications (2)

Publication Number Publication Date
CN111572159A true CN111572159A (en) 2020-08-25
CN111572159B CN111572159B (en) 2022-08-09

Family

ID=72121347

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010446972.9A Active CN111572159B (en) 2020-05-25 2020-05-25 Anti-static hardened plate and preparation method thereof

Country Status (1)

Country Link
CN (1) CN111572159B (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649733A (en) * 2002-06-27 2005-08-03 Tdk株式会社 Object with composite hard coating layer and method of forming composite hard coating layer
JP2008062217A (en) * 2006-09-11 2008-03-21 C I Kasei Co Ltd Method of forming hardened paint film and article having hardened paint film
CN102501507A (en) * 2011-10-29 2012-06-20 合肥乐凯科技产业有限公司 Preparing method of hard coating film
JP2012210739A (en) * 2011-03-30 2012-11-01 Dainippon Printing Co Ltd Method of manufacturing weather resistant hard coat film
KR20120132090A (en) * 2011-05-27 2012-12-05 도레이첨단소재 주식회사 Anti-static Silicone Release Coating Films
CN102991056A (en) * 2012-11-01 2013-03-27 合肥乐凯科技产业有限公司 Anti-static transparent hardening membrane
KR101491596B1 (en) * 2013-12-05 2015-02-09 도레이첨단소재 주식회사 Anti-static polyester release film and manufacturing method thereof
CN206242599U (en) * 2016-08-31 2017-06-13 绍兴旭源新材料科技有限公司 A kind of Anti-static release liner
CN208324398U (en) * 2018-06-26 2019-01-04 广东联硕新材料技术有限公司 A kind of Anti-static release liner
CN111154132A (en) * 2020-01-13 2020-05-15 泰兴联创绝缘材料有限公司 Anti-static screen protection film and preparation method thereof

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1649733A (en) * 2002-06-27 2005-08-03 Tdk株式会社 Object with composite hard coating layer and method of forming composite hard coating layer
JP2008062217A (en) * 2006-09-11 2008-03-21 C I Kasei Co Ltd Method of forming hardened paint film and article having hardened paint film
JP2012210739A (en) * 2011-03-30 2012-11-01 Dainippon Printing Co Ltd Method of manufacturing weather resistant hard coat film
KR20120132090A (en) * 2011-05-27 2012-12-05 도레이첨단소재 주식회사 Anti-static Silicone Release Coating Films
CN102501507A (en) * 2011-10-29 2012-06-20 合肥乐凯科技产业有限公司 Preparing method of hard coating film
CN102991056A (en) * 2012-11-01 2013-03-27 合肥乐凯科技产业有限公司 Anti-static transparent hardening membrane
KR101491596B1 (en) * 2013-12-05 2015-02-09 도레이첨단소재 주식회사 Anti-static polyester release film and manufacturing method thereof
CN206242599U (en) * 2016-08-31 2017-06-13 绍兴旭源新材料科技有限公司 A kind of Anti-static release liner
CN208324398U (en) * 2018-06-26 2019-01-04 广东联硕新材料技术有限公司 A kind of Anti-static release liner
CN111154132A (en) * 2020-01-13 2020-05-15 泰兴联创绝缘材料有限公司 Anti-static screen protection film and preparation method thereof

Also Published As

Publication number Publication date
CN111572159B (en) 2022-08-09

Similar Documents

Publication Publication Date Title
KR102074004B1 (en) Laminated structure manufacturing method, laminated structure, and electronic apparatus
CN105453001B (en) Electronic unit is bonded to patterning nano wire transparent conductor
JP5056207B2 (en) Conductive film for in-mold molding and method for producing plastic molded article with transparent conductive layer
US20140335312A1 (en) Substrate film for manufacturing transparent electrode film
TW201313874A (en) Optically clear conductive adhesive and articles therefrom
JP2011090879A (en) Method of manufacturing transparent conductor
KR100992154B1 (en) Transparent Conductive Thin Film Using Carbon Nano Tube and Method for Preparation thereof
JP2009135044A (en) Transparent conductive material and transparent conductor
US20090191389A1 (en) Transparent conductors that exhibit minimal scattering, methods for fabricating the same, and display devices comprising the same
KR20130024965A (en) Method for producing laminated film
CN102208547B (en) Substrate for flexible photoelectronic device and preparation method thereof
CN111267451B (en) Release film for high-capacity multilayer ceramic capacitor and method for producing same
JP2011082165A (en) Method of manufacturing electrode substrate
CN111572159B (en) Anti-static hardened plate and preparation method thereof
JP4666961B2 (en) Object provided with transparent conductive layer, and conductive film for transfer
TW201443926A (en) Transparent conductive film
CN111393700B (en) Anti-static hardened plate and preparation method thereof
CN208562206U (en) A kind of electromagnetic shielding adhesive tape
KR102030267B1 (en) Manufacturing method of smart window film and smart window film thereby
JP2011218586A (en) Transparent gas-barrier film
KR102004026B1 (en) Transparent conductor and display apparatus comprising the same
KR101440752B1 (en) Composite film, Composite sheet having the same, and its Manufacturing method
JP7005092B2 (en) Embedded transparent electrode substrate and its manufacturing method
JP2006108008A5 (en)
JP5056208B2 (en) Conductive film for in-mold molding and method for producing plastic molded article with transparent conductive layer

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
PE01 Entry into force of the registration of the contract for pledge of patent right

Denomination of invention: Anti static hardening plate and its preparation method

Effective date of registration: 20230926

Granted publication date: 20220809

Pledgee: Ma'anshan branch of Bank of China Ltd.

Pledgor: Anhui Fulang optical materials Co.,Ltd.

Registration number: Y2023980059038

PE01 Entry into force of the registration of the contract for pledge of patent right