CN111546521A - High-efficiency cutting control method of dicing saw - Google Patents

High-efficiency cutting control method of dicing saw Download PDF

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CN111546521A
CN111546521A CN202010510615.4A CN202010510615A CN111546521A CN 111546521 A CN111546521 A CN 111546521A CN 202010510615 A CN202010510615 A CN 202010510615A CN 111546521 A CN111546521 A CN 111546521A
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cutting
worktable
processed product
machined
length
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CN111546521B (en
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杨云龙
李铖
高金龙
高阳
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Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
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Jiangsu Jingchuang Advanced Electronic Technology Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)

Abstract

The invention discloses a high-efficiency cutting control method of a scribing machine, which loads and installs a plurality of processed objects on a scribing worktable at the same time, performs specific design on cutting parameters, and particularly performs control based on a characteristic coordinate P of a starting point of each processed object1And end point feature coordinates P1’Calculating and determining cutting parameters corresponding to each processed object, and calculating characteristic coordinates P of the starting point of each processed object1First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1Simultaneously, the first edge and the second edge are respectively provided with a cutting residual starting length L in parallel along the cutting channel direction1And length L of cutting residual position2Determining cutting parameters corresponding to each processed object through the specific structure design; the invention realizes the simultaneous cutting of a plurality of processed objects through a single cutting process, and obviously improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.

Description

High-efficiency cutting control method of dicing saw
Technical Field
The invention relates to the technical field of semiconductor cutting processing, in particular to a high-efficiency cutting control method of a dicing saw.
Background
A dicing saw is an indispensable device for a subsequent processing step in the production of integrated circuits of semiconductor devices, and its main function is to cut semiconductor chips into individual chip elements, and in order to avoid the dicing saw from finding deviations during the cutting process, a manual straightening machine is usually used in the prior art for alignment adjustment. However, with the popularization of current intelligent manufacturing in domestic industry, the traditional manual straightening machine has the defects of low efficiency, low output ratio and the like, and compared with the popularization of intelligent manufacturing, the manual straightening technology has no market competitiveness.
Further, the cutting market is demanding more and more automatic alignment, and at the same time, it puts higher demands on the automatic alignment control technology, and for this reason, the applicant hopes to seek a technical solution for increasing the cutting number to achieve effective improvement of the cutting efficiency of the dicing saw.
Disclosure of Invention
In view of the above, an object of the present invention is to provide a high-efficiency cutting control method for a dicing saw, which simultaneously loads and installs a plurality of processed objects on a dicing table, and simultaneously performs a specific design on cutting parameters, so as to simultaneously cut the plurality of processed objects through a single cutting process, and significantly improve the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.
The technical scheme adopted by the invention is as follows:
a high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module, a driving assembly and a cutting tool, wherein a theoretical characteristic position cutting model of a machined object is pre-stored in the image acquisition module, the dicing worktable is arranged on the driving assembly, and the cutting demand of the machined object on the dicing worktable is realized through the cutting tool positioned above the dicing worktable; the scribing worktable is provided with at least 2 identical first machined objects and second machined objects which are loaded and installed at intervals, an X-Y coordinate system is established by the central point of the scribing worktable, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channels;
the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps:
A10) rotating the scribing worktable to the same cutting channel direction of each processed object, and automatically aligning and identifying the corresponding processed object through an image acquisition module according to a theoretical characteristic position cutting model corresponding to each processed object, wherein the automatic alignment and identification result comprises a starting point characteristic coordinate P of the corresponding processed object1And end point feature coordinates P1’；
A20) Based on the characteristic coordinate P of the starting point of each processed object1And end point feature coordinates P1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece1First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L1And length L of cutting residual position2The cutting residual starting length L1And length L of cutting residual position2Are all parallel to the cutting channel direction;
A30) and the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result.
Preferably, the lower tool position P of each machined object and the characteristic coordinate P of the starting point of the corresponding machined object1The distance difference between them is D1+L1(ii) a The cut length S of each processed product was 2 × D1+L1+L+L2(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding processed object1’With its characteristic coordinates P of the starting point1The effective cutting length in between.
Preferably, the edge distance D1In the range of 1-3mm, the cutting residual starting length L1Is in the range of 1-3mm, the length L of the cutting residual end position2Is in the range of 1-3mm and the effective cutting length is in the range of 80-100 mm.
Preferably, a workpiece distance D is provided between the first workpiece and the second workpiece2The distance D between the workpieces2In the range of 1-3 mm.
Preferably, at least 4 identical first machined objects, second machined objects, third machined objects and fourth machined objects which are loaded and installed at intervals are arranged on the scribing worktable, an X-Y coordinate system is established by the central point of the scribing worktable, and the first machined objects, the second machined objects, the third machined objects and the fourth machined objects are positioned in different quadrants of the X-Y coordinate system and are distributed pairwise symmetrically relative to the X-Y coordinate system; each of the workpieces has a first identical cutting channel and a second identical cutting channel.
Preferably, the first identical cutting channel is perpendicular to the second identical cutting channel.
Preferably, the first processed object and the second processed object are firstly cut by a first same cutting channel, then the third processed object and the fourth processed object are cut by a first same cutting channel, then the first processed object and the third processed object are cut by a second same cutting channel, and finally the second processed object and the fourth processed object are cut by a first same cutting channel.
Preferably, the first processed object and the second processed object are firstly subjected to first identical cutting channel cutting, then the third processed object and the fourth processed object are subjected to first identical cutting channel cutting, and then the first processed object, the second processed object, the third processed object and the fourth processed object are sequentially subjected to second identical cutting channel cutting.
Preferably, the starting point feature coordinates P1The identification control process comprises the following steps:
when the image acquisition module identifies again, the image acquisition module firstly identifies the set upper left corner coordinate to identify the feature point, and when the image acquisition interface does not find the feature coordinate P of the starting point1The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point1Wherein the motion process comprises: firstly moving one stepping unit to the negative direction of the Y axis, then moving one stepping unit to the negative direction of the X axis, then moving two stepping units to the positive direction of the Y axis, then moving three stepping units to the positive direction of the X axis, then moving three stepping units to the negative direction of the Y axis, and adding a single stepping unit according to the sequence as a motion track cycle until the characteristic coordinate P of the identification starting point of the image acquisition interface is taken as a motion track cycle until the characteristic coordinate P of the identification starting point1。
Preferably, the processed object is a semiconductor wafer, and the scribing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor is installed on the X-Y axis movement module in a relatively rotating mode.
The invention loads and installs a plurality of processed objects on the scribing worktable at the same time, performs specific design on cutting parameters, and particularly performs characteristic coordinate P based on the starting point of each processed object1And end point feature coordinates P1’Calculating and determining cutting parameters (specifically including a lower cutter position P and a cutting length S) corresponding to each machined object, and in order to ensure the cutting quality and avoid damaging the machined objects, the invention creatively provides a characteristic coordinate P of a starting point of each machined object1First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1Simultaneously, the first edge and the second edge are respectively provided with cutting in parallel along the direction of the cutting channelResidual starting length L1And length L of cutting residual position2Determining cutting parameters corresponding to each processed object through the specific structure design; therefore, the invention realizes the simultaneous cutting of a plurality of processed objects through a single cutting process, and obviously improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.
Drawings
FIG. 1 shows the characteristic coordinates P of the starting point of the first wafer in example 1 of the present invention1Identifying a motion trail interface diagram;
FIG. 2 is a loading and mounting interface diagram of each wafer on a dicing table in example 1 of the present invention;
FIG. 3 is a loading interface diagram of a scribing table on which 4 wafers are loaded in embodiment 2 of the present invention;
FIG. 4 is a schematic view of the whole process for rapidly cutting each wafer in example 2 of the present invention;
fig. 5 is a schematic flow chart of a process for cutting each wafer in the first same cutting channel in embodiment 2 of the present invention;
fig. 6 is a schematic flow chart of a process for cutting each wafer in a second identical cutting channel in embodiment 2 of the present invention.
Detailed Description
The embodiment of the invention discloses a high-efficiency cutting control method of a dicing saw, wherein the dicing saw comprises a dicing worktable, an image acquisition module pre-storing a theoretical characteristic position cutting model of a machined object, and the dicing worktable is arranged on a driving assembly, and the cutting requirement on the machined object on the dicing worktable is realized through a cutting tool positioned above the dicing worktable; the scribing workbench is provided with at least 2 identical first machined objects and second machined objects which are loaded at intervals, an X-Y coordinate system is established by the central point of the scribing workbench, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing workbench, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channel; the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps: A10) scribing workThe platform rotates to the same cutting channel direction of each processed object, the image acquisition module carries out automatic alignment identification on the corresponding processed object according to the theoretical characteristic position cutting model corresponding to each processed object, and the automatic alignment identification result comprises the initial point characteristic coordinate P of the corresponding processed object1And end point feature coordinates P1’；
A20) Based on the characteristic coordinates P of the starting point of each processed object1And end point feature coordinates P1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece1First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L1And length L of cutting residual position2Cutting residual start length L1And length L of cutting residual position2Are all parallel to the direction of the cutting channel; A30) and the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object, and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result.
In order to make those skilled in the art better understand the technical solution of the present invention, the technical solution in the embodiment of the present invention will be clearly and completely described below with reference to the drawings in the embodiment of the present invention, and it is obvious that the described embodiment is only a part of the embodiment of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1: a high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module pre-stored with a theoretical characteristic position cutting model of a processed object, and the dicing worktable installed on a driving assembly, wherein the cutting demand of the processed object on the dicing worktable is realized through a cutting tool above the dicing worktable, and particularly preferably, in the embodiment, as shown in figure 1, the processed object is a semiconductor wafer 1, and the dicing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor can be installed on the X-Y axis movement module in a relatively rotating mode;
in the embodiment, 2 identical first wafer 1 and second wafer 1 which are loaded and installed at intervals are arranged on a scribing worktable, an X-Y coordinate system is established by using the central point of the scribing worktable, the first wafer 1 and the second wafer 1 are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first wafer 1 and the second wafer 1 have 1 identical cutting channel; the same cutting channel is cut by adopting a high-efficiency cutting control method, and comprises the following operation steps:
A10) rotating the scribing worktable to the same cutting channel direction of each wafer 1, and automatically aligning and identifying the corresponding wafer 1 through an image acquisition module according to the theoretical characteristic position cutting model corresponding to each wafer 1, wherein the automatic alignment and identification result comprises the initial point characteristic coordinate P of the corresponding wafer 11And end point feature coordinates P1’(ii) a Preferably, in this step a10), please further refer to fig. 1, the starting point feature coordinate P1The identification control process comprises the following steps:
when the image acquisition module identifies again, the feature point identification is carried out on the set upper left corner coordinate first, and when the image acquisition interface is found not to find the feature coordinate P of the starting point1The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point1Wherein, the motion process includes: firstly moving one stepping unit to the negative direction of the Y axis, then moving one stepping unit to the negative direction of the X axis, then moving two stepping units to the positive direction of the Y axis, then moving three stepping units to the positive direction of the X axis, then moving three stepping units to the negative direction of the Y axis, and adding a single stepping unit according to the sequence as a motion track cycle until the characteristic coordinate P of the identification starting point of the image acquisition interface is taken as a motion track cycle until the characteristic coordinate P of the identification starting point1(ii) a In particular, in the present implementationIn the mode, each step unit is 1 mm;
A20) referring to FIG. 2, the feature coordinates P of the starting point of each wafer 1 are based1And end point feature coordinates P1’Calculating and determining cutting parameters corresponding to each wafer 1, wherein the cutting parameters of each wafer 1 comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the start point of each wafer 11First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L1And length L of cutting residual position2Cutting residual start length L1And length L of cutting residual position2Are all parallel to the direction of the cutting channel;
preferably, in the present embodiment, the lower tool position P of each wafer 1 and the start point characteristic coordinate P of the corresponding wafer 11The distance difference between them is D1+L1(ii) a The cutting length S of each wafer 1 is 2 × D1+L1+L+L2(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding wafer 11’With its characteristic coordinates P of the starting point1Effective cutting length in between; particularly preferably, the edge distance D1In the range of 1-3mm, the cutting residual starting length L1Is in the range of 1-3mm, and the length L of the cutting residual position2The range of (1-3 mm) and the range of effective cutting length of 80-100 mm; a wafer 1 space D is arranged between the first wafer 1 and the second wafer 121 pitch D of wafer2Is in the range of 1-3 mm; wafer 1 pitch D2Length L of the cutting residual position of the first wafer 1 and the second wafer 12；
A30) And the cutting tool executes the cutting parameters of the cutting tool corresponding to each wafer 1, and simultaneously realizes the rapid cutting of each wafer 1 in the same cutting channel based on the automatic alignment recognition result.
Example 2: the rest of the technical scheme of the embodiment 2 is the same as the embodiment 1, except thatIn this embodiment 2, please refer to fig. 3 in combination with fig. 1, a scribing table 2 is provided with 4 identical first, second, third and fourth wafers 1a, 1b, 1c and 1D which are loaded and installed at intervals, an X-Y coordinate system is established with a central point of the scribing table 2, the first, second, third and fourth wafers 1a, 1b, 1c and 1D are located in different quadrants of the X-Y coordinate system and are symmetrically distributed in pairs with respect to the X-Y coordinate system, and a wafer distance D is provided between every two adjacent wafers2Wafer spacing D2Is 1.6mm, each wafer edge distance D12.2mm, the cutting residual starting length L12.5mm, length L of the cutting residual position2Is 1.6mm (wafer pitch D)2Can be used as the length L of the cutting residual ending position2) The effective cutting length L is 90 mm;
the image acquisition module recognizes that: characteristic coordinates P of the start point of the first wafer 1a1(-75mm, 60mm), characteristic coordinates P of the starting point of the second wafer 1b2(0.8mm, 60mm), the characteristic coordinates P of the starting point of the third wafer 1c3(-75mm, -0.8mm), characteristic coordinates P of the starting point of the fourth wafer 1d4(0.8mm, -0.8 mm); each wafer is provided with a first same cutting channel and a second same cutting channel; wherein the first identical cutting channels are 90 ° perpendicular to the second identical cutting channels; preferably, as shown in fig. 4, in the present embodiment, first, the first identical cutting channel cutting is performed on the first wafer 1a and the second wafer 1b, then, the first identical cutting channel cutting is performed on the third wafer 1c and the fourth wafer 1d, and then, the second identical cutting channel cutting is performed on the first wafer 1a, the second wafer 1b, the third wafer 1c, and the fourth wafer 1d in sequence, which is favorable for a better cutting effect; specifically, in the present embodiment, referring to fig. 5, in an initial state, after the whole scribing table 2 rotates clockwise by 270 °, the first wafer 1a and the second wafer 1b are cut by the same cutting channel, and after the whole scribing table 2 rotates counterclockwise by 180 °, the third wafer 1c and the fourth wafer 1d are cut by the same cutting channel(ii) a After the first identical cutting channel is finished; as further shown in fig. 6, when the scribing worktable 2 rotates counterclockwise by 90 ° in its entirety, the first wafer 1a is first cut through the second same cutting channel, when the scribing worktable 2 rotates clockwise by 180 ° in its entirety, the second wafer 1b is cut through the second same cutting channel, when the scribing worktable 2 rotates counterclockwise by 180 ° in its entirety, the third wafer 1c is cut through the second same cutting channel, and finally, when the scribing worktable 2 rotates clockwise by 180 ° in its entirety, the fourth wafer 1d is cut through the second same cutting channel, thereby completing the cutting process efficiently;
in other embodiments, the following cutting sequence may be used as an alternative: firstly, the first wafer 1a and the second wafer 1b are subjected to cutting in the same cutting channel, then the third wafer 1c and the fourth wafer 1d are subjected to cutting in the same cutting channel, then the first wafer 1a and the third wafer 1c are subjected to cutting in the same cutting channel, and finally the second wafer 1b and the fourth wafer 1d are subjected to cutting in the same cutting channel, so that higher cutting efficiency can be obtained.
In this embodiment, 4 wafers are loaded and mounted on the scribing table 2 at the same time, and the cutting parameters are specifically designed, specifically, the characteristic coordinates P of the starting point based on each wafer1And end point feature coordinates P1’Calculating and determining cutting parameters (specifically including a cutting position P and a cutting length S) corresponding to each wafer 1a, 1b, 1c, 1d, and in order to ensure the cutting quality and avoid damage to the wafers 1a, 1b, 1c, 1d, the present embodiment creatively proposes that a characteristic coordinate P is set at a starting point of each wafer 1a, 1b, 1c, 1d1、P2、P3、P4First edge near to it, and end point feature coordinates P1’、P2’、P3’、P4’Edge distances D are respectively arranged between the second edges close to the first edges1Simultaneously, the first edge and the second edge are respectively provided with a cutting residual starting length L in parallel along the cutting channel direction1And length L of cutting residual position2Determining each wafer by the specific structure designCutting parameters corresponding to the sheets 1a, 1b, 1c, 1 d; therefore, the present embodiment realizes simultaneous cutting of four wafers 1a, 1b, 1c, and 1d by a single cutting process, and significantly improves the cutting efficiency of the dicing saw on the premise of ensuring the cutting quality.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims (10)

1. A high-efficiency cutting control method of a dicing saw comprises a dicing worktable, an image acquisition module, a driving assembly and a cutting tool, wherein a theoretical characteristic position cutting model of a machined object is pre-stored in the image acquisition module, the dicing worktable is arranged on the driving assembly, and the cutting demand of the machined object on the dicing worktable is realized through the cutting tool positioned above the dicing worktable; the scribing worktable is provided with at least 2 identical first machined objects and second machined objects which are loaded and installed at intervals, an X-Y coordinate system is established by using the central point of the scribing worktable, the first machined objects and the second machined objects are symmetrically distributed relative to the X-axis direction or the Y-axis direction of the scribing worktable, and the first machined objects and the second machined objects are provided with at least 1 identical cutting channels;
the same cutting channel is cut by adopting a high-efficiency cutting control method, and the method comprises the following operation steps:
A10) rotating the scribing worktable to the same cutting channel direction of each processed object, and automatically aligning and identifying the corresponding processed object through an image acquisition module according to a theoretical characteristic position cutting model corresponding to each processed object, wherein the automatic alignment and identification result comprises a starting point characteristic coordinate P of the corresponding processed object1And end point feature coordinates P1’；
A20) Based on the characteristic coordinate P of the starting point of each processed object1And end point feature coordinates P1’Calculating and determining cutting parameters corresponding to each processed object, wherein the cutting parameters of each processed object comprise a lower cutter position P and a cutting length S; characteristic coordinates P of the starting point of each workpiece1First edge near to it, and end point feature coordinates P1’Edge distances D are respectively arranged between the second edges close to the first edges1The first edge and the second edge are both positioned in the direction of the cutting channel, and the first edge and the second edge are respectively provided with a cutting residual starting length L1And length L of cutting residual position2The cutting residual starting length L1And length L of cutting residual position2Are all parallel to the cutting channel direction;
A30) and the cutting tool executes the cutting parameters of the cutting tool corresponding to each machined object and simultaneously realizes the rapid cutting of each machined object in the same cutting channel based on the automatic alignment recognition result.
2. The high-efficiency cutting control method according to claim 1, wherein the lower tool position P of each machined object and the starting point feature coordinate P of the corresponding machined object1The distance difference between them is D1+L1(ii) a The cut length S of each processed product was 2 × D1+L1+L+L2(ii) a Wherein L is the characteristic coordinate P of the end point of the corresponding processed object1’With its characteristic coordinates P of the starting point1The effective cutting length in between.
3. The high efficiency cutting control method of claim 2, wherein the edge distance D1In the range of 1-3mm, the cutting residual starting length L1Is in the range of 1-3mm, the length L of the cutting residual end position2Is in the range of 1-3mm and the effective cutting length is in the range of 80-100 mm.
4. The high-efficiency cutting control method according to claim 1, 2 or 3, wherein a workpiece distance D is provided between the first workpiece and the second workpiece2The distance D between the workpieces2In the range of 1-3 mm.
5. The high-efficiency cutting control method according to claim 1, 2, 3 or 4, wherein at least 4 identical first machined objects, second machined objects, third machined objects and fourth machined objects which are loaded at intervals are arranged on the scribing worktable, an X-Y coordinate system is established by using the central point of the scribing worktable, and the first machined objects, the second machined objects, the third machined objects and the fourth machined objects are positioned in different quadrants of the X-Y coordinate system and are distributed in pairwise symmetry relative to the X-Y coordinate system; each of the workpieces has a first identical cutting channel and a second identical cutting channel.
6. The method of claim 5, wherein the first identical cutting channel is perpendicular to the second identical cutting channel.
7. The high-efficiency cutting control method according to claim 6, characterized in that first identical cutting pass cutting is performed on the first processed product and the second processed product, then first identical cutting pass cutting is performed on the third processed product and the fourth processed product, then second identical cutting pass cutting is performed on the first processed product and the third processed product, and finally first identical cutting pass cutting is performed on the second processed product and the fourth processed product.
8. The high-efficiency cutting control method according to claim 6, characterized in that first identical cutting pass cutting is performed on the first processed product and the second processed product, then first identical cutting pass cutting is performed on the third processed product and the fourth processed product, and then second identical cutting pass cutting is performed on the first processed product, the second processed product, the third processed product, and the fourth processed product in sequence.
9. The high-efficiency cutting control method according to claim 1, wherein the starting point feature coordinate P is set to the starting point feature coordinate P1The identification control process comprises the following steps:
when the image acquisition module identifies again, the image acquisition module firstly identifies the set upper left corner coordinate to identify the feature point, and when the image acquisition interface does not find the feature coordinate P of the starting point1The spiral motion of the image acquisition module from inside to outside is used for searching the characteristic coordinate P of the initial point1Wherein the motion process comprises: firstly moving one stepping unit to the negative direction of the Y axis, then moving one stepping unit to the negative direction of the X axis, then moving two stepping units to the positive direction of the Y axis, then moving three stepping units to the positive direction of the X axis, then moving three stepping units to the negative direction of the Y axis, and adding a single stepping unit according to the sequence as a motion track cycle until the characteristic coordinate P of the identification starting point of the image acquisition interface is taken as a motion track cycle until the characteristic coordinate P of the identification starting point1。
10. The high-efficiency cutting control method according to claim 1, wherein the workpiece is a semiconductor wafer, and the scribing worktable adopts a vacuum adsorption worktable disc; the driving assembly comprises a T-direction motor capable of rotating in the forward and reverse directions and an X-Y axis movement module, the scribing worktable is installed on the T-direction motor, and the T-direction motor is installed on the X-Y axis movement module in a relatively rotating mode.
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Cited By (1)

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CN117549411A (en) * 2023-11-11 2024-02-13 肇庆市宏华电子科技有限公司 Trimming method, device, equipment and medium for multilayer chip ceramic capacitor plate

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