CN117549411A - Trimming method, device, equipment and medium for multilayer chip ceramic capacitor plate - Google Patents
Trimming method, device, equipment and medium for multilayer chip ceramic capacitor plate Download PDFInfo
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- CN117549411A CN117549411A CN202311497611.7A CN202311497611A CN117549411A CN 117549411 A CN117549411 A CN 117549411A CN 202311497611 A CN202311497611 A CN 202311497611A CN 117549411 A CN117549411 A CN 117549411A
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- 238000009966 trimming Methods 0.000 title claims abstract description 205
- 238000000034 method Methods 0.000 title claims abstract description 60
- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 40
- 238000005520 cutting process Methods 0.000 claims description 77
- 238000004590 computer program Methods 0.000 claims description 13
- 238000013461 design Methods 0.000 claims description 10
- 238000004458 analytical method Methods 0.000 claims description 9
- 238000003860 storage Methods 0.000 claims description 7
- 238000003708 edge detection Methods 0.000 claims description 6
- 238000005299 abrasion Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 238000003475 lamination Methods 0.000 description 8
- 239000003990 capacitor Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 6
- 238000001179 sorption measurement Methods 0.000 description 6
- 238000010030 laminating Methods 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 4
- 238000005245 sintering Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000013480 data collection Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000009740 moulding (composite fabrication) Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B11/00—Apparatus or processes for treating or working the shaped or preshaped articles
- B28B11/14—Apparatus or processes for treating or working the shaped or preshaped articles for dividing shaped articles by cutting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28B—SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER
- B28B17/00—Details of, or accessories for, apparatus for shaping the material; Auxiliary measures taken in connection with such shaping
- B28B17/0063—Control arrangements
- B28B17/0072—Product control or inspection
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The application relates to the technical field of ceramic capacitor plate production, in particular to a trimming method, a trimming device, trimming equipment and trimming medium for a multilayer chip ceramic capacitor plate. According to the method, the mark in the X direction of the bar block is more clearly exposed by pre-trimming the X direction of the bar block, so that a cutter can be controlled to trim the edge at a position close to the mark during trimming, and the problem that a side mark line is cut off is avoided; and after the Y-direction trimming, positioning the X-direction first and last marking centers, determining the positions of the X-direction first and last marking centers, and then carrying out X-direction trimming, wherein the second X-direction trimming is different from the first pre-trimming, and the X-direction marking lines are exposed after the Y-direction trimming, so that the second X-direction marking lines can be trimmed at positions close to the X-direction marking, thereby obtaining regular target trimming blocks.
Description
Technical Field
The application relates to the technical field of ceramic capacitor plate production, in particular to a trimming method, a trimming device, trimming equipment and trimming medium for a multilayer chip ceramic capacitor plate.
Background
Multilayer chip ceramic capacitor chips, also known as chip capacitors, are produced by steps such as chip forming, printing, laminating, cutting, sintering, plating, packaging, testing, etc., after which the green product prior to sintering is often referred to as a bar, which is formed by stacking a plurality of ceramic sheets containing metal electrode patterns, and during cutting, the bar is cut into a plurality of small units, each of which eventually becomes a single capacitor. The trimming machine is needed to trim the bar block during cutting, so that the bar block becomes more regular, and the cutting position is accurately positioned later.
The existing trimming technology trims the blocks according to the set cutting distance, and as the ceramic sheet deforms in the laminating process, errors exist among the sizes of each block after lamination, the trimming positions of different blocks are easy to be inconsistent, part of the blocks are easy to be cut off according to the set cutting distance, the subsequent positioning is affected, the subsequent working procedure cannot be normally executed, and the situation needs to be further improved.
Disclosure of Invention
In order to solve the problem that the side marking line is cut off easily caused by the trimming method of the existing multilayer chip ceramic capacitor plate, the application provides a trimming method, a trimming device, trimming equipment and trimming medium of the multilayer chip ceramic capacitor plate, and the technical scheme is as follows:
in a first aspect, the present application provides a trimming method for a multilayer chip ceramic capacitor chip, including the steps of:
positioning the X-direction edge of the bar block, and determining the position of the head and tail edges of the X-direction of the bar block;
controlling a cutter to pre-cut the bar blocks according to the head edge and the tail edge positions to obtain pre-cut edge bar blocks;
positioning the Y-direction head and tail marking center of the pre-cut edge bar block, and determining the position of the Y-direction head and tail marking center of the pre-cut edge bar block;
carrying out Y-direction trimming on the pre-trimming bar block according to the Y-direction marking center position to obtain a Y-direction trimming bar block;
positioning the X-direction head and tail marking center of the Y-direction trimming bar block, and determining the position of the X-direction head and tail marking center of the Y-direction trimming bar block;
and carrying out X-direction trimming on the Y-direction trimming bar block according to the X-direction marking center position to obtain a target trimming bar block.
Through adopting the technical scheme, the X-direction edge of the bar is positioned, the first edge and the last edge of the X-direction of the bar are determined, then the cutter is controlled to perform pre-trimming according to the first edge and the last edge, so that the Y-direction mark of the bar is more clearly exposed, then the Y-direction first mark and the last mark are positioned according to the center of the Y-direction first mark, the Y-direction trimming is performed according to the center of the Y-direction first mark and the last mark, and as the Y-direction mark is clearly exposed, the cutter can be controlled to perform trimming at the position close to the mark during trimming, and the problem that the side mark line is cut off is avoided; and after the Y-direction trimming, positioning the X-direction first and last marking centers, determining the positions of the X-direction first and last marking centers, and then carrying out X-direction trimming, wherein the second X-direction trimming is different from the first pre-trimming, and the X-direction marking lines are exposed after the Y-direction trimming, so that the second X-direction marking lines can be trimmed at positions close to the X-direction marking, thereby obtaining regular target trimming blocks.
Optionally, the positioning the X-direction edge of the bar block includes the following steps:
acquiring an X-direction image of the bar block;
performing edge detection on the X-direction image, and determining X-direction edge information of the bar block, wherein the X-direction edge information comprises angle information and position information;
acquiring preset bar block edge reference information;
calculating the angle deviation and the position deviation of the X-direction edge of the bar block and a datum line according to the X-direction edge information and preset bar block edge datum information;
and carrying out angle adjustment and position adjustment on the bar block according to the angle deviation and the position deviation, and positioning the adjusted bar block position.
Through adopting above-mentioned technical scheme, this application is through the X to the image of gathering the bar, then carries out edge detection to the image, confirms X to edge information, including angle information and positional information, then obtain the bar edge datum line of predetermineeing, calculate the angle deviation and the positional deviation of bar X to edge and datum line, then carry out angle and position adjustment to make the bar position put according to the datum line of predetermineeing, thereby be convenient for fix a position the X to edge of bar, with the first end edge position of determining the bar.
Optionally, the acquiring the preset bar edge position information specifically includes:
identifying the X-direction size of the bar block according to the X-direction image;
determining a design size corresponding to the bar block according to the X-direction size;
and acquiring the position information of the edge of the bar block corresponding to the design size.
Through adopting above-mentioned technical scheme, when carrying out the side cut to the bar, the bar has various dimension specifications, and this application is through the X to the image recognition bar to the size, then confirms the design size that the bar corresponds according to X to the size to obtain the bar edge position information corresponding with the design size, thereby realize the automatic identification and the location to different bar sizes.
Optionally, after the Y-direction trimming bar block is obtained, the method further includes:
acquiring an X-direction target mark of the Y-direction trimming bar block, wherein the X-direction target mark is any one of all X-direction marks of the Y-direction trimming bar block;
comparing the X-direction target mark with a preset standard mark, and determining the similarity degree of the X-direction target mark and the standard mark;
when the similarity is higher than a preset degree threshold, recording the X-direction target marks to obtain an X-direction mark available set, wherein the X-direction mark available set is used for counting the X-direction available marks;
and when the cutting operation is carried out subsequently, controlling the cutter to cut according to the marks in the X-direction mark available set.
Through adopting above-mentioned technical scheme, this application is after obtaining Y to the side cut ban piece, consequently, can clearly discern the sign of ban piece X to the side cut, through acquireing X to the target mark, then compare with preset standard mark, confirm the similarity of X to target mark and standard mark, thereby judge the deformation condition of X to target mark, when the mark warp, show when laminating the in-process, the deviation appears between each layer, lead to the mark to be different with standard mark shape, consequently, can lead to partial capacitor sheet damage when cutting apart according to the mark this moment, consequently, this application is higher than when predetermineeing the degree threshold value at the similarity, record X to target mark, obtain the available collection of X to the control cutter cuts according to the sign in the available collection of X to when cutting operation is carried out to follow-up, thereby only cut the position that partial mark is good, can cut through manual identification or other methods to the position that has the error, thereby reduce the product defective rate, improve production efficiency.
Optionally, after the target trimming bar block is obtained, the method further includes:
acquiring a Y-direction target mark of the target trimming bar block, wherein the Y-direction target mark is any one of all Y-direction marks of the target trimming bar block;
comparing the Y-direction target mark with a preset standard mark, and determining the similarity degree of the Y-direction target mark and the standard mark;
when the similarity is higher than a preset degree threshold, recording the Y-direction target marks to obtain a Y-direction mark available set, wherein the Y-direction mark available set is used for counting Y-direction available marks;
and when the cutting operation is carried out subsequently, controlling the cutter to cut according to the marks in the Y-direction mark available set.
Through adopting above-mentioned technical scheme, also, after carrying out X to cutting, can discern the mark of the bar Y to more clearly, through acquireing Y to target mark and then comparing with preset standard mark to judge the deformation condition, make the follow-up when cutting the Y to only cut the position that partial mark is good.
Optionally, after the pre-trimming the bar block according to the end-to-end edge position to obtain a pre-trimmed bar block, the method further includes:
acquiring a cutting surface image of a pre-cut edge bar block after pre-cutting;
performing roughness analysis on the cutting surface image to obtain the roughness of the cutting surface;
and when the roughness is larger than a roughness threshold, controlling the cutter to cut at a second cutting speed, wherein the second cutting speed is smaller than the cutting speed when the pre-trimming is performed.
By adopting the technical proposal, the utility model cuts at a larger cutting speed when the pre-trimming is carried out, obtains the cutting surface image of the pre-trimming bar block after the pre-trimming, obtains the roughness of the cutting surface by carrying out roughness analysis on the cutting surface image, then compares with the preset roughness threshold value, when the roughness is overlarge, the cutter is controlled to carry out Y-direction trimming and X-direction trimming at the second cutting speed, so that the fineness of the follow-up Y-direction trimming and X-direction trimming is improved, when the roughness is smaller than a preset roughness threshold value, the fineness is qualified, and the trimming is carried out at the moment through the cutting speed of the pre-trimming, so that the trimming efficiency is improved.
Optionally, after the roughness analysis is performed on the cutting surface image to obtain the roughness of the cutting surface, the method further includes:
counting roughness data of the cut surface recorded in the history to obtain a roughness data set, wherein the roughness data of each pre-cut edge is correspondingly marked with a time sequence;
analyzing the roughness change trend of the cutting surface according to the roughness data set and the time sequence;
evaluating the abrasion condition of the cutter according to the roughness change trend;
and when the cutter wear reaches the preset wear degree, sending replacement information, wherein the replacement information is used for prompting the replacement of the cutter.
Through adopting above-mentioned technical scheme, this application obtains roughness data collection through the roughness data of the cutting surface of statistics history, then according to time sequence's roughness data, analyzes the roughness change trend of cutting surface, evaluates the cutter wearing and tearing condition according to roughness change trend to send the change information in advance when reaching preset wearing and tearing degree, with the suggestion to carry out the cutter change, reduce the possibility that the product defective rate that leads to because the cutter wearing and tearing rises.
In a second aspect, the present application provides a trimming device for a multilayer chip ceramic capacitor chip, including:
the head-end edge position determining module is used for positioning the X-direction edge of the bar block and determining the head-end edge position of the X-direction of the bar block;
the pre-trimming module is used for pre-trimming the bar blocks according to the head-end edge positions to obtain pre-trimmed bar blocks;
the Y-direction mark center position determining module is used for positioning the Y-direction head and tail mark center of the pre-cut edge bar block and determining the Y-direction head and tail mark center position of the pre-cut edge bar block;
the Y-direction trimming module is used for carrying out Y-direction trimming on the pre-trimming bar block according to the Y-direction marking center position to obtain a Y-direction trimming bar block;
the X-direction mark center position determining module is used for positioning the X-direction first and last mark centers of the Y-direction trimming bar blocks and determining the X-direction first and last mark center positions of the Y-direction trimming bar blocks;
and the X-direction trimming module is used for carrying out X-direction trimming on the Y-direction trimming bar block according to the X-direction marking center position to obtain a target trimming bar block.
In a third aspect, the present application provides an electronic device, including a memory, a processor, and a computer program stored on the memory and executable on the processor, where the processor implements the steps of the trimming method of the multilayer chip ceramic capacitor chip described above when the computer program is executed.
In a fourth aspect, the present application provides a computer readable storage medium having stored thereon a computer program which, when executed by a processor, performs the steps of the trimming method of a multilayer chip ceramic capacitor chip described above.
In summary, the present application includes at least one of the following beneficial technical effects:
1. according to the method, the mark in the X direction of the bar block is more clearly exposed by pre-trimming the X direction of the bar block, so that a cutter can be controlled to trim the edge at a position close to the mark during trimming, and the problem that a side mark line is cut off is avoided; then after Y-direction trimming, positioning an X-direction first-end mark center, determining the position of the X-direction first-end mark center, then performing X-direction trimming, wherein the second X-direction trimming is different from the first pre-trimming, and the X-direction mark line is exposed after Y-direction trimming, so that the second X-direction mark line can be trimmed at a position close to the X-direction mark, and a regular target trimming bar block is obtained;
2. according to the method, the X-direction image of the bar block is acquired, then the image is subjected to edge detection, X-direction edge information comprising angle information and position information is determined, then a preset bar block edge datum line is obtained, the angle deviation and the position deviation of the X-direction edge of the bar block and the datum line are calculated, then the angle and the position are adjusted, so that the position of the bar block is placed according to the preset datum line, the X-direction edge of the bar block is conveniently positioned, and the head and tail edge positions of the bar block are determined;
3. when the similarity is higher than a preset degree threshold, recording the X-direction target marks to obtain an available X-direction mark set, so that when the cutting operation is carried out subsequently, a cutter is controlled to cut according to the marks in the available X-direction mark set, only the positions with good marks are cut, and the positions with errors can be cut through manual identification or other methods, so that the reject ratio of products is reduced, and the production efficiency is improved;
4. this application cuts with a great cutting speed when carrying out the pre-trimming, through the cutting surface image that obtains the pre-trimming after the pre-trimming, through carrying out roughness analysis to the cutting surface image, obtain the roughness of cutting surface, then compare with preset roughness threshold value, when roughness is too big, control cutter carries out Y to side cut and X to the side cut with the second cutting speed, thereby improve the fineness when follow-up Y to side cut and X to side cut, when roughness is less than preset roughness threshold value, it is qualified to indicate the fineness, still cut edge through the cutting speed of pre-trimming this moment, thereby improve side cut efficiency.
Drawings
FIG. 1 is an exemplary flow chart of a method of trimming a multilayer chip ceramic capacitor chip according to an embodiment of the present application;
FIG. 2 is an exemplary flowchart of locating an X-direction edge of a bar according to an embodiment of the present application;
FIG. 3 is a schematic view of an interface for trimming parameter settings according to embodiments of the present application;
FIG. 4 is an exemplary flow chart for obtaining an available set of X-direction markers in accordance with an embodiment of the present application;
FIG. 5 is another exemplary flow chart of a method of trimming a multilayer chip ceramic capacitor chip according to an embodiment of the present application;
FIG. 6 is yet another exemplary flow chart of a trimming method for a multilayer chip ceramic capacitor chip according to an embodiment of the present application; a step of
Fig. 7 is a schematic block diagram of a trimming device for a multilayer chip ceramic capacitor chip according to an embodiment of the present application;
fig. 8 is an internal structural view of the electronic device of the present application.
Detailed Description
The terminology used in the following embodiments of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates to the contrary. It should also be understood that the term "and/or" as used in this application is intended to encompass any or all possible combinations of one or more of the listed items.
The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature, and in the description of embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Multilayer chip ceramic capacitor chips, also known as chip capacitors, are produced by steps such as chip forming, printing, laminating, cutting, sintering, plating, packaging, testing, etc., and after lamination, the green product prior to sintering, commonly referred to as a bar, is formed by stacking a plurality of ceramic sheets containing metal electrode patterns.
The Mark is a pre-fabricated position Mark, also known as Mark, in the semiconductor process that is used to determine the precise position and orientation of the capacitor. In the manufacturing process of the multilayer chip ceramic capacitor plate, a plurality of marks are prefabricated on four sides of the bar block so as to facilitate cutting operation of the bar block.
Because the ceramic sheet will deform during lamination, the marks on the four sides of the bar will deform correspondingly, and the marks may not be visible due to extrusion or the like, which may result in the need to trim the bar to expose the marks, and also to make the bar more regular for subsequent cutting.
The existing trimming technology trims the bar according to the set cutting distance, and the ceramic sheet can deform in the lamination process, so that the side mark line is easily cut off during trimming, and the execution of the subsequent cutting step is affected.
The application provides a trimming method, a device, equipment and a medium for a multilayer chip ceramic capacitor chip, wherein the trimming method, the device, the equipment and the medium are used for pre-trimming the X direction of a bar block, so that a mark in the Y direction of the bar block is more clearly exposed, a cutter can be controlled to trim at a position close to the mark during trimming, and the problem that a side mark line is cut off is avoided; and after the Y-direction trimming, positioning the X-direction first and last marking centers, determining the positions of the X-direction first and last marking centers, and then carrying out X-direction trimming, wherein the second X-direction trimming is different from the first pre-trimming, and the X-direction marking lines are exposed after the Y-direction trimming, so that the second X-direction marking lines can be trimmed at positions close to the X-direction marking, thereby obtaining regular target trimming blocks.
Embodiments of the present application are described in further detail below with reference to the drawings attached hereto.
The method is executed by an electronic device, and the electronic device can be a server or a terminal device, wherein the server can be an independent physical server, a server cluster or a distributed system formed by a plurality of physical servers, or a cloud server for providing cloud computing service. In this embodiment, the terminal device is an electronic device, but not limited to this, but may also be an intelligent tablet, a computer, or the like, where the terminal device and the server may be directly or indirectly connected through a wired or wireless communication manner, and the embodiment of the present application is not limited herein.
In a first aspect, the application provides a trimming method of a multilayer chip ceramic capacitor chip, be applied to the cutting equipment of ceramic capacitor chip, equipment includes feeding mechanism, a platform, adsorption platform, actuating mechanism, control side camera, the cutter, collecting mechanism, clean mechanism and rim charge collecting box, feeding mechanism is used for placing the bar piece after the lamination on the platform, the platform is used for placing the bar piece, adsorption platform is used for carrying out vacuum adsorption to the bar piece, actuating mechanism is used for driving adsorption platform and removes, and then drive the bar piece and remove, control side camera setting in the left and right sides of platform, so that acquire the left and right sides image of the bar piece on the platform, thereby make the system handle according to the image, confirm the first end edge position of bar piece, mark central point position etc. information, the cutter is used for cutting edge to the bar piece, collecting mechanism is used for collecting the bar piece after cutting edge, the rim charge of bar piece can be left on the platform, clean mechanism is used for cleaning the platform, with keeping the platform, the rim charge collecting box sets up in the place platform below, be used for cleaning the clean rim charge of receiving mechanism.
Referring to fig. 1, fig. 1 is an exemplary flowchart of a trimming method of a multilayer chip ceramic capacitor chip according to an embodiment of the present application.
A trimming method of a multilayer chip ceramic capacitor plate comprises the following steps:
s110, positioning the X-direction edge of the bar block, and determining the position of the head and tail edges of the X-direction of the bar block.
Specifically, referring to fig. 2, locating the X-direction edge of the bar block includes the following sub-steps:
s111, acquiring an X-direction image of the bar block.
The bar block is generally square or rectangular, the placement platform comprises an X axis and a Y axis, the bar block is placed on the placement platform, two side edges parallel to the X axis of the placement platform are defined as X directions of the bar block, and two side edges parallel to the Y axis of the placement platform are defined as Y directions of the bar block. After the feeding mechanism conveys a block of the block to the placing platform, the system controls the adsorbing platform to carry out vacuum adsorption on the block, then the block is placed on the placing platform, and the cameras on two sides of the placing platform can collect images on two sides of the block to obtain an X-direction image of the block.
S112, performing edge detection on the X-direction image, and determining X-direction edge information of the bar block.
Wherein the X-direction edge information includes angle information and position information.
Specifically, color difference exists between the color of the bar block and the color of the placement platform, and the edge information of the bar block can be identified through an edge detection technology. Because the adsorption platform is adsorbing the in-process that the bar piece was placed to place the platform, there is the deviation between the position of placing of bar piece probably and the reference position, including the angle deviation that probably puts and the position deviation of X axle and Y axle direction.
S113, acquiring preset bar block edge reference information.
The reference information of the edges of the blocks refers to the preset angle and position of the blocks to be correctly placed, the angle and the position are required to correspond to the reference lines of the cameras on the two sides, and after the blocks are correctly placed, the blocks can be accurately positioned through the cameras on the two sides, namely the blocks are moved to the alignment positions of the cameras on the two sides.
S114, calculating the angle deviation and the position deviation of the X-direction edge of the bar block and the datum line according to the X-direction edge information and preset bar block edge datum information.
According to the bar block angle information, the position information is compared with preset bar block edge reference information, so that the angle deviation and the position deviation can be calculated.
S115, performing angle adjustment and position adjustment on the bar block according to the angle deviation and the position deviation, and positioning the adjusted bar block position.
The angle adjustment quantity, the X-axis driving adjustment quantity and the Y-axis driving adjustment quantity are calculated according to the angle deviation and the position deviation, so that the placement platform can be driven to rotate or move through the driving mechanism, and the angle and the position of the bar block are adjusted.
After the adjustment is finished, the position of the bar block is positioned at the alignment positions of the cameras at the two sides, and the position of the X-direction head edge and the tail edge of the bar block can be determined.
Wherein, when trimming the bar, the bar has various dimensions.
Thus, step S113 may further specifically include:
s1131, identifying the X-direction size of the bar block according to the X-direction image.
S1132, determining the design size corresponding to the bar block according to the X-direction size.
S1133, acquiring the bar block edge position information corresponding to the design size.
Through the method, the device and the system, the X-direction size of the bar is identified according to the X-direction image, and then the design size corresponding to the bar is determined according to the X-direction size, so that the edge position information of the bar corresponding to the design size is obtained, and automatic identification and positioning of different bar sizes are realized.
In one embodiment, the trimming parameters of each bar block type may be set in a self-defined manner through software, as shown in fig. 3, by setting the top trimming size, whether to push, depth shift, divide the edges, whether to clean, etc., the trimming settings of different bar blocks are implemented, and the trimming parameters can be stored, and after the bar blocks are identified, the trimming is performed on the bar blocks according to the preset trimming parameters.
S120, controlling a cutter to pre-cut edges of the bar blocks according to the positions of the head edge and the tail edge, and obtaining pre-cut edge bar blocks.
The side marks of the bar blocks can be cut off, so that the position of the marks can be realized when the bar blocks are cut later.
It will be appreciated that after pre-trimming the bar, the edge markings which are squeezed or blocked during lamination may be cut off so that the Y-direction markings of the bar are more clearly exposed.
Notably, the trimming of this application actually includes the side cut operation and pushes away the limit operation, and the side cut operation is that the cutter is cut down to predetermineeing the degree of depth, cuts the ban piece edge, pushes away the limit and is cutting down at the cutter, after accomplishing the side cut, the cutter lifts up to predetermineeing and pushes away the limit height, then drives the reverse removal of platform control placing platform and pushes away the limit distance, realizes rim charge and ban piece body separation.
S130, positioning the Y-direction head and tail marking centers of the pre-cut bar blocks, and determining the Y-direction head and tail marking center positions of the pre-cut bar blocks.
Since the bar is formed by laminating a plurality of ceramic sheets, the mark of the bar is generally a single region, and the mark of the sheet including a plurality of layers is generally rectangular or square. After lamination, when trimming and cutting are performed, it is necessary to position the center position of the mark to accurately position the center position of the mark.
It will be appreciated that the central position of the first and last marks in the Y direction refers to the central positions of the two marks at the first and last ends of the Y direction, and since trimming is required for the bar, the edges of the bar need to be positioned according to the marks at the first and last ends of the bar.
Specifically, drive the platform rotation 90 through actuating mechanism, the last bar of platform also follows the platform rotation 90 of placing, and the X-direction image of bar is originally shot to both sides camera, can shoot the Y-direction image of bar this moment.
It is worth noting that, when the pre-cut bar block is positioned in the first and last marking centers in the Y direction, as with the positioning of the X-direction edges of the bar block, the application needs to collect the Y-direction images of the bar block through the left and right cameras, then calculate the angle deviation and the position deviation, and then position the bar block, and at this time, the position of the bar block is at the alignment positions of the cameras at two sides, and the cameras align the Y direction of the bar block.
And S140, carrying out Y-direction trimming on the pre-trimming bar block according to the Y-direction marking center position to obtain the Y-direction trimming bar block.
After the central position of the Y-direction mark is obtained, the preset distance is moved according to the central position of the Y-direction mark, so that trimming is performed at a position close to the central position of the Y-direction mark, the integrity of the mark can be maintained while trimming is performed, and subsequent cutting operation is facilitated.
And S150, positioning the X-direction first and last marking centers of the Y-direction trimming bar blocks, and determining the X-direction first and last marking center positions of the Y-direction trimming bar blocks.
Specifically, the driving mechanism drives the placement platform to rotate 90 degrees in the opposite direction, so that the placement platform returns to the position in the pre-trimming process, and at the moment, the cameras on the two sides shoot X-direction images of the bar blocks.
Likewise, the application needs to acquire the X-direction images of the bar blocks through the left and right cameras, then calculate the angle deviation and the position deviation, then position the position, the position of the bar blocks is at the alignment positions of the cameras at the two sides, and the cameras align the X-direction of the bar blocks.
S160, carrying out X-direction trimming on the Y-direction trimming bar block according to the X-direction marking center position to obtain the target trimming bar block.
The target trimming bar block is the bar block with trimming completed.
It will be appreciated that the trimming is also performed in the X direction of the bar during pre-trimming, but since the Y direction trimming has already been performed during this trimming, the X direction mark can be exposed, so that a more accurate trimming can be performed, thereby obtaining a regular target trimmed bar.
Since deviations occur between the layers during lamination, resulting in a different shape of the mark from the standard mark, and partial capacitor plate damage may occur when the mark is divided, in one embodiment, after the Y-direction trimming bar is obtained, referring to fig. 4, the method further includes:
s141, acquiring an X-direction target mark of the Y-direction trimming bar block, wherein the X-direction target mark is any one of all X-direction marks of the Y-direction trimming bar block.
S142, comparing the X-direction target mark with a preset standard mark, and determining the similarity degree of the X-direction target mark and the standard mark.
Specifically, the difference between the pixel points of the target mark and the pixel points of the standard mark is obtained, so that the similarity degree can be determined, and the more the overlapped pixel points or the higher the ratio is, the higher the similarity degree is.
And S143, when the similarity degree is higher than a preset degree threshold, recording the X-direction target marks to obtain an X-direction mark available set, wherein the X-direction mark available set is used for counting the X-direction available marks.
S144, when the cutting operation is carried out subsequently, the cutter is controlled to cut according to the marks in the X-direction mark available set.
Through the method, when the subsequent cutting operation is carried out, the cutter is controlled to cut according to the marks in the X-direction mark available set, so that only the positions with good marks are cut, the positions with errors can be cut through manual identification or other methods, the reject ratio of products is reduced, and the production efficiency is improved.
Likewise, after obtaining the target trimmed bar, the method further comprises:
s161, acquiring a Y-direction target mark of the target trimming bar, wherein the Y-direction target mark is any one of all Y-direction marks of the target trimming bar.
S162, comparing the Y-direction target mark with a preset standard mark, and determining the similarity degree of the Y-direction target mark and the standard mark.
And S163, when the similarity degree is higher than a preset degree threshold, recording the Y-direction target marks to obtain a Y-direction mark available set, wherein the Y-direction mark available set is used for counting the Y-direction available marks.
And S164, when the cutting operation is carried out subsequently, controlling the cutter to cut according to the marks in the Y-direction mark available set.
Through the method, when the subsequent cutting operation is performed, the cutter is controlled to cut according to the marks in the Y-direction mark available set, so that only the positions with good marks are cut, the positions with errors can be cut through manual identification or other methods, the reject ratio of products is reduced, and the production efficiency is improved.
In one embodiment, referring to fig. 5, after step S120, further includes:
s121, acquiring a cutting surface image of the pre-cut edge bar block after pre-cutting.
In some embodiments, a higher precision camera may be mounted on both sides or one side of the placement platform, so that a high definition cut surface image may be captured.
S122, performing roughness analysis on the cutting surface image to obtain the roughness of the cutting surface.
And S123, when the roughness is larger than the roughness threshold, controlling the cutter to cut at a second cutting speed, wherein the second cutting speed is smaller than the cutting speed when the pre-trimming is performed.
When the cutting speed of the cutter is high, the material removal rate and heat accumulation are high, so that the surface is rough. Meanwhile, when the cutter is provided with a notch, the cut surface can be drawn and scratched after cutting, so that the surface is rougher.
The roughness of the cut surface is obtained by carrying out roughness analysis on the cut surface image, then the roughness is compared with a preset roughness threshold, when the roughness is overlarge, the cutter is controlled to carry out Y-direction trimming and X-direction trimming at a second cutting speed, so that the fineness of the follow-up Y-direction trimming and X-direction trimming is improved, when the roughness is smaller than the preset roughness threshold, the fineness is qualified, and at the moment, the trimming is carried out through the cutting speed of the pre-trimming, so that the trimming efficiency is improved.
It will be appreciated that the roughness of the bars of different materials is different, and that the bars of different materials correspond to different roughness thresholds when compared for roughness.
In one embodiment, referring to fig. 6, the method further comprises:
s124, counting roughness data of the cut surface recorded in a history way to obtain a roughness data set, wherein the roughness data of each pre-cut edge is correspondingly marked with a time sequence.
S125, analyzing the roughness change trend of the cutting surface according to the roughness data set and the time sequence.
The change condition of the roughness along with the time sequence change can be seen through the time sequence and the roughness data set, so that the change trend of the roughness of the cutting surface can be analyzed.
And S126, evaluating the abrasion condition of the cutter according to the roughness change trend.
And S127, sending replacement information when the cutter abrasion reaches a preset abrasion degree, wherein the replacement information is used for prompting cutter replacement.
Through this, this application can obtain roughness data collection through the roughness data of the cutting surface of statistics history, then according to time sequence's roughness data, analysis cutting surface's roughness change trend, according to roughness change trend aassessment cutter wearing and tearing condition to send the change information in advance when reaching the preset wearing and tearing degree, with the suggestion to carry out cutter change, reduce the possibility that the product defective rate that leads to because cutter wearing and tearing rises.
In a second aspect, the present application provides a trimming device for a multilayer chip ceramic capacitor chip, and the trimming device for a multilayer chip ceramic capacitor chip of the present application is described below in connection with the trimming method for a multilayer chip ceramic capacitor chip. Referring to fig. 7, fig. 7 is a schematic block diagram of a trimming device for a multi-layer chip ceramic capacitor according to an embodiment of the present application.
A trimming device for a multilayer chip ceramic capacitor chip, comprising:
the first-last edge position determining module 710 is configured to locate an X-direction edge of a bar, and determine a first-last edge position of the bar in the X-direction;
the pre-trimming module 720 is configured to pre-trim the bar according to the first-last edge position, so as to obtain a pre-trimmed bar;
the Y-direction mark center position determining module 730 is configured to locate a Y-direction first-last mark center of the pre-cut bar block, and determine a Y-direction first-last mark center position of the pre-cut bar block;
the Y-direction trimming module 740 is configured to perform Y-direction trimming on the pre-trimmed bar block according to the Y-direction mark center position, to obtain a Y-direction trimmed bar block;
the X-direction mark center position determining module 750 is configured to locate an X-direction first-and-last-mark center of the Y-direction trimming bar block, and determine an X-direction first-and-last-mark center position of the Y-direction trimming bar block;
and the X-direction trimming module 760 is configured to perform X-direction trimming on the Y-direction trimming bar according to the X-direction marking center position, so as to obtain a target trimming bar.
In one embodiment, the present application provides an electronic device, which may be a server, and an internal structure thereof may be as shown in fig. 8. The electronic device includes a processor, a memory, and a network interface connected by a system bus. Wherein the processor of the electronic device is configured to provide computing and control capabilities. The memory of the electronic device includes a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage media. The database of the electronic device is for storing data. The network interface of the electronic device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a trimming method of a multilayer chip ceramic capacitor chip.
It will be appreciated by those skilled in the art that the structure shown in fig. 8 is merely a block diagram of a portion of the structure associated with the present application and is not limiting of the electronic device to which the present application is applied, and that a particular electronic device may include more or fewer components than shown, or may combine certain components, or have a different arrangement of components.
In an embodiment, there is also provided an electronic device including a memory and a processor, the memory storing a computer program, the processor implementing the steps of the method embodiments described above when executing the computer program.
Those skilled in the art will appreciate that implementing all or part of the above-described methods may be accomplished by way of a computer program stored on a non-transitory computer readable storage medium, which when executed may comprise the steps of the embodiments of the methods described above. Any reference to memory, storage, database, or other medium used in embodiments provided herein may include at least one of non-volatile and volatile memory. The nonvolatile Memory may include Read-Only Memory (ROM), magnetic tape, floppy disk, flash Memory, optical Memory, or the like. Volatile memory can include random access memory (Random Access Memory, RAM) or external cache memory. By way of illustration, and not limitation, RAM can be in the form of a variety of forms, such as static random access memory (Static Random Access Memory, SRAM) or dynamic random access memory (Dynamic Random Access Memory, DRAM), and the like.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.
Claims (10)
1. The trimming method of the multilayer chip ceramic capacitor plate is characterized by comprising the following steps of:
positioning the X-direction edge of the bar block, and determining the position of the head and tail edges of the X-direction of the bar block;
controlling a cutter to pre-cut the bar blocks according to the head edge and the tail edge positions to obtain pre-cut edge bar blocks;
positioning the Y-direction head and tail marking center of the pre-cut edge bar block, and determining the position of the Y-direction head and tail marking center of the pre-cut edge bar block;
carrying out Y-direction trimming on the pre-trimming bar block according to the Y-direction marking center position to obtain a Y-direction trimming bar block;
positioning the X-direction head and tail marking center of the Y-direction trimming bar block, and determining the position of the X-direction head and tail marking center of the Y-direction trimming bar block;
and carrying out X-direction trimming on the Y-direction trimming bar block according to the X-direction marking center position to obtain a target trimming bar block.
2. The trimming method of a multilayer chip ceramic capacitor according to claim 1, wherein the positioning of the X-directional edge of the bar comprises the steps of:
acquiring an X-direction image of the bar block;
performing edge detection on the X-direction image, and determining X-direction edge information of the bar block, wherein the X-direction edge information comprises angle information and position information;
acquiring preset bar block edge reference information;
calculating the angle deviation and the position deviation of the X-direction edge of the bar block and a datum line according to the X-direction edge information and preset bar block edge datum information;
and carrying out angle adjustment and position adjustment on the bar block according to the angle deviation and the position deviation, and positioning the adjusted bar block position.
3. The trimming method of the multilayer chip ceramic capacitor plate according to claim 2, wherein the acquiring the preset bar edge position information specifically includes:
identifying the X-direction size of the bar block according to the X-direction image;
determining a design size corresponding to the bar block according to the X-direction size;
and acquiring the position information of the edge of the bar block corresponding to the design size.
4. The trimming method of a multilayer chip ceramic capacitor according to claim 1, wherein after the obtaining of the Y-direction trimming bar, the method further comprises:
acquiring an X-direction target mark of the Y-direction trimming bar block, wherein the X-direction target mark is any one of all X-direction marks of the Y-direction trimming bar block;
comparing the X-direction target mark with a preset standard mark, and determining the similarity degree of the X-direction target mark and the standard mark;
when the similarity is higher than a preset degree threshold, recording the X-direction target marks to obtain an X-direction mark available set, wherein the X-direction mark available set is used for counting the X-direction available marks;
and when the cutting operation is carried out subsequently, controlling the cutter to cut according to the marks in the X-direction mark available set.
5. The trimming method of a multilayer chip ceramic capacitor plate according to claim 1, wherein after the target trimming bar is obtained, the method further comprises:
acquiring a Y-direction target mark of the target trimming bar block, wherein the Y-direction target mark is any one of all Y-direction marks of the target trimming bar block;
comparing the Y-direction target mark with a preset standard mark, and determining the similarity degree of the Y-direction target mark and the standard mark;
when the similarity is higher than a preset degree threshold, recording the Y-direction target marks to obtain a Y-direction mark available set, wherein the Y-direction mark available set is used for counting Y-direction available marks;
and when the cutting operation is carried out subsequently, controlling the cutter to cut according to the marks in the Y-direction mark available set.
6. The trimming method of a multilayer chip ceramic capacitor according to claim 1, wherein after the pre-trimming the bar according to the end-to-end edge position to obtain a pre-trimmed bar, the method further comprises:
acquiring a cutting surface image of a pre-cut edge bar block after pre-cutting;
performing roughness analysis on the cutting surface image to obtain the roughness of the cutting surface;
and when the roughness is larger than a roughness threshold, controlling the cutter to cut at a second cutting speed, wherein the second cutting speed is smaller than the cutting speed when the pre-trimming is performed.
7. The trimming method of a multilayer chip ceramic capacitor according to claim 6, wherein after the roughness analysis is performed on the cut surface image to obtain the roughness of the cut surface, the method further comprises:
counting roughness data of the cut surface recorded in the history to obtain a roughness data set, wherein the roughness data of each pre-cut edge is correspondingly marked with a time sequence;
analyzing the roughness change trend of the cutting surface according to the roughness data set and the time sequence;
evaluating the abrasion condition of the cutter according to the roughness change trend;
and when the cutter wear reaches the preset wear degree, sending replacement information, wherein the replacement information is used for prompting the replacement of the cutter.
8. The utility model provides a trimming device of multilayer chip ceramic capacitor piece which characterized in that includes:
the head-end edge position determining module is used for positioning the X-direction edge of the bar block and determining the head-end edge position of the X-direction of the bar block;
the pre-trimming module is used for pre-trimming the bar blocks according to the head-end edge positions to obtain pre-trimmed bar blocks;
the Y-direction mark center position determining module is used for positioning the Y-direction head and tail mark center of the pre-cut edge bar block and determining the Y-direction head and tail mark center position of the pre-cut edge bar block;
the Y-direction trimming module is used for carrying out Y-direction trimming on the pre-trimming bar block according to the Y-direction marking center position to obtain a Y-direction trimming bar block;
the X-direction mark center position determining module is used for positioning the X-direction first and last mark centers of the Y-direction trimming bar blocks and determining the X-direction first and last mark center positions of the Y-direction trimming bar blocks;
and the X-direction trimming module is used for carrying out X-direction trimming on the Y-direction trimming bar block according to the X-direction marking center position to obtain a target trimming bar block.
9. An electronic device comprising a memory, a processor and a computer program stored on the memory and executable on the processor, the processor implementing the steps of the method of trimming a multilayer chip ceramic capacitor chip of any one of claims 1-7 when the computer program is executed.
10. A computer readable storage medium having stored thereon a computer program, characterized in that the computer program when executed by a processor realizes the steps of the trimming method of a multilayer chip ceramic capacitor plate as claimed in any one of claims 1 to 7.
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