CN111515817B - Silicon rod grinding and cutting integrated processing method - Google Patents
Silicon rod grinding and cutting integrated processing method Download PDFInfo
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- CN111515817B CN111515817B CN202010365479.4A CN202010365479A CN111515817B CN 111515817 B CN111515817 B CN 111515817B CN 202010365479 A CN202010365479 A CN 202010365479A CN 111515817 B CN111515817 B CN 111515817B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0069—Other grinding machines or devices with means for feeding the work-pieces to the grinding tool, e.g. turntables, transfer means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
- B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
- B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
- B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Abstract
The invention relates to a silicon rod opening and grinding integrated processing method, which belongs to the technical field of crystal silicon processing, wherein a rotary conveying mechanism is used for clamping silicon rods, and the silicon rods to be opened and/or ground and polished are simultaneously conveyed to an opening mechanism and/or a grinding and polishing mechanism for opening and/or grinding and polishing operation.
Description
Technical Field
The invention belongs to the technical field of crystalline silicon processing, and particularly relates to a silicon rod grinding and polishing integrated processing method.
Background
Photovoltaic power generation is one of the most important clean energy sources at present, and has great development potential. The key factors restricting the development of the photovoltaic industry are low photoelectric conversion efficiency on one hand and high cost on the other hand. Photovoltaic silicon wafers are the basic material for the production of solar cells and modules. The actual production of the single silicon rod involves the processes of preparation, edge cutting, surface grinding, polishing, chamfering, slicing, battery piece, assembly and the like. In the traditional silicon rod squaring and grinding-polishing integrated machine, manipulators are adopted for transferring silicon rods between a squaring mechanism and a grinding-polishing mechanism, and have the characteristic of convenient and fast transfer, but due to the limitation of factors such as equipment space, a plurality of manipulators often cause mutual interference in space, so that only one manipulator is generally arranged between the squaring mechanism and the grinding-polishing mechanism, only one silicon rod can be clamped by one manipulator to be squared at the squaring mechanism or ground and polished at the grinding-polishing mechanism, one of the grinding-polishing mechanism or the squaring mechanism is in an idle state when working, the other one of the grinding-polishing mechanism or the squaring mechanism is in an idle state, the utilization rate of the equipment is limited, the processing efficiency of the silicon rods is influenced, meanwhile, the manipulator is adopted to clamp the silicon rods, after the squaring mechanism is completely squaring, when the silicon rods are conveyed to the grinding-polishing mechanism to carry out grinding-polishing operation on, the problem that how to reduce the clamping times in the silicon rod processing process and improve the silicon rod processing efficiency needs to be solved is to prolong the silicon rod processing time.
Disclosure of Invention
Aiming at various defects in the prior art, the method for processing the silicon rod can be completed by clamping the silicon rod once in the processes of feeding, squaring and grinding of the silicon rod, the defect that grinding allowance is increased due to repeated clamping can be effectively avoided, the silicon rod processing time is effectively shortened, and the productivity is improved.
In order to achieve the purpose, the invention provides the following technical scheme:
a silicon rod opening and grinding integrated processing method comprises the steps that a rotary conveying mechanism clamps a silicon rod, the silicon rod to be opened and/or ground and polished is conveyed to an opening mechanism and/or a grinding and polishing mechanism simultaneously to be opened and/or ground and polished, and one silicon rod is clamped once to complete the opening and grinding and polishing operations;
the method comprises the following steps:
s1: silicon rod feeding: after the detection of the first silicon rod crystal line is finished, the first silicon rod crystal line is placed on a feeding table to be clamped, after the first silicon rod is clamped, a second silicon rod crystal line is detected and placed on the feeding table to be clamped, and the feeding table is always kept in a full-load state;
s2: first squaring of the silicon rod: the rotary conveying mechanism comprises a first clamping component and a second clamping component, the first clamping component clamps the first silicon rod, the squaring mechanism moves to the first silicon rod to cut a group of flaw-pieces, and the squaring mechanism resets;
s3: the rotary conveying mechanism rotates for the first time: conveying the first silicon rod to a grinding and polishing mechanism for carrying out first grinding and polishing and chamfering operation; the second clamping component clamps the second silicon rod, the squaring mechanism moves to the second silicon rod position and resets after the cutting of the second silicon rod position is finished;
s4: the rotary conveying mechanism rotates for the second time: after the first silicon rod is conveyed to the squaring mechanism and another pair of opposite sides are cut, the squaring mechanism resets; the grinding and polishing mechanism carries out first grinding and polishing and chamfering operation on the second silicon rod;
s5: the third rotation of the rotary conveying mechanism: after the first silicon rod is conveyed to the grinding and polishing mechanism to carry out the second grinding and polishing and chamfering operation, the blanking mechanism blanks the first silicon rod; after the second silicon rod is conveyed to the squaring mechanism and another group of side skins are cut, the squaring mechanism resets;
s6: the fourth rotation of the rotary conveying mechanism: after the second silicon rod is conveyed to the grinding and polishing mechanism to carry out the second grinding and polishing and chamfering operation, a blanking mechanism located at the grinding and polishing mechanism blanks the second silicon rod; repeating the operations of S2-S6;
the feeding table, the squaring mechanism and the grinding and polishing mechanism are sequentially arranged below the rotary conveying mechanism along the conveying direction of the silicon rod;
the rotary conveying mechanism is arranged above the squaring mechanism and the grinding and polishing mechanism and comprises a rotating shaft and a rotating table connected with the rotating shaft, the first clamping assembly and the second clamping assembly are positioned on two sides of the rotating shaft and fixedly arranged below the rotating table, and the first clamping assembly and the second clamping assembly are identical in structure;
the first clamping assembly comprises a clamping base, a headstock assembly and a tailstock assembly, the headstock assembly and the tailstock assembly are fixedly arranged on the clamping base, the clamping base is fixedly connected with the rotary table, the headstock assembly is fixedly connected with the clamping base, and the tailstock assembly is slidably connected with the clamping base through a tailstock feeding assembly, so that silicon rods with different lengths can be clamped by adjusting the distance between the headstock assembly and the tailstock assembly;
and a manipulator is arranged between the feeding table and the rotary conveying mechanism, and clamps the silicon rod on the feeding table to the rotary conveying mechanism.
Further, the angles of the first rotation, the second rotation, the third rotation and the fourth rotation of the rotary conveying mechanism are all 180 degrees.
Further, a cutting wire net of the squaring mechanism is positioned in a vertical plane, the squaring mechanism moves along the length direction of the silicon rod, and two opposite edge skins are cut off at the same time.
Further, the grinding and polishing mechanism comprises an accurate grinding component and a coarse grinding component which are coaxially arranged, the accurate grinding component is sleeved in the coarse grinding component, and after the coarse grinding component finishes coarse grinding of the silicon rod I or the silicon rod II, the accurate grinding component carries out accurate grinding operation.
Further, a flaw-piece receiving box is arranged below the feeding table and can slide along the conveying direction of the silicon rod to contain and receive the flaw-pieces.
The invention has the beneficial effects that:
the rotary conveying mechanism is arranged between the squaring mechanism and the grinding and polishing mechanism, two groups of clamping components are arranged on the rotary conveying mechanism, two silicon rods can be clamped simultaneously, the trimming skin operation and the grinding and polishing chamfering operation are respectively carried out at the squaring mechanism, one silicon rod can be clamped once to finish the trimming skin operation and the grinding and polishing chamfering operation, the silicon rods are transferred to the grinding and polishing mechanism from the squaring mechanism, secondary clamping is not needed, the defect that grinding allowance caused by secondary clamping is increased can be effectively avoided, and the processing efficiency of the silicon rods is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic structural view of the rotary conveyance mechanism.
In the drawings: 1-base, 2-feeding table, 3-squaring mechanism, 4-grinding and polishing mechanism, 5-rotary conveying mechanism, 501-rotating shaft, 502-rotating table, 503-clamping component I, 5031-clamping base, 5032-headstock component, 5033-tailstock component, 504-clamping component II, 6-flaw-piece receiving box, 7-manipulator and 8-blanking mechanism.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following description of the technical solutions of the present invention with reference to the accompanying drawings of the present invention is made clearly and completely, and other similar embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application shall fall within the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The invention is further described with reference to the drawings and the preferred embodiments.
As shown in fig. 1 and 2, the silicon rod grinding all-in-one machine comprises a base 1 and a support frame arranged above the base 1, wherein the support frame is fixedly connected with the base 1. The silicon rod cutting and polishing device is characterized in that a feeding table 2, an squaring mechanism 3 and a polishing mechanism 4 are sequentially arranged on a base 1 along the silicon rod conveying direction, a rotary conveying mechanism 5 is arranged between the squaring mechanism 3 and the polishing mechanism 4 and above the squaring mechanism and the polishing mechanism 4, the rotary conveying mechanism 5 clamps the silicon rod, the silicon rod to be squared and/or polished is simultaneously conveyed to the squaring mechanism 3 and/or the polishing mechanism 4 for squaring and/or polishing operation, and one silicon rod can be clamped once to complete the squaring and polishing operation. The device is characterized in that a flaw-piece receiving box 6 is arranged below the feeding table 2, the flaw-piece receiving box 6 is connected with the base 1 in a sliding mode and can move along the conveying direction of the silicon rod to receive cut flaw-pieces, a manipulator 7 is arranged between the feeding table 2 and the rotary conveying mechanism 5, the manipulator 7 is located above the feeding table 2, and meanwhile the manipulator 7 can be connected with the support frame in a sliding mode along the conveying direction of the silicon rod. The grinding and polishing mechanism 4 is provided with a blanking mechanism 8, and the blanking mechanism 8 can be connected with the support frame in a sliding manner along the silicon rod conveying direction and can convey the silicon rods along the silicon rod conveying direction and the vertical direction.
The rotary conveying mechanism 5 is fixedly connected with the support frame and comprises a rotating shaft 501 and a rotary table 502 connected with the rotating shaft 501, a first clamping assembly 503 and a second clamping assembly 504 are arranged on the lower portion of the rotary table 502, the first clamping assembly 503 and the second clamping assembly 504 are identical in structure, and the first clamping assembly 503 and the second clamping assembly 504 are symmetrically arranged on two sides of the rotating shaft 501. And a connecting line of the first clamping component 503 and the second clamping component 504 is parallel to the silicon rod conveying direction. Taking the first clamping assembly 503 as an example, it includes a clamping base 5031, a headstock assembly 5032 and a tailstock assembly 5033 fixed on the clamping base 5031, the clamping base 5031 is fixedly connected to the turntable 502, meanwhile, the headstock assembly 5032 is fixedly connected to the clamping base 5031, and the tailstock assembly 5033 is slidably connected to the clamping base 5031 through a tailstock feeding assembly, so as to adjust the distance between the headstock assembly 5032 and the tailstock assembly 5033, and clamp silicon rods with different lengths. The rotating shaft 501 rotates, and the first clamping assembly 503 and the clamping assembly 504 displace along with the rotating shaft.
In the initial position, the first clamping assembly 503 is located on the side close to the robot 7, and the second clamping assembly 504 is located on the side away from the robot 7.
The headstock assembly 5032 and the tailstock assembly 5033 both comprise a chuck, a fixing frame and a rotating motor, the fixing frame of the headstock assembly 5032 is fixedly connected with the clamping base 5031, the fixing frame of the tailstock assembly 5033 is connected with the tailstock feeding assembly, the rotating motor is fixed on the fixing frame, the chuck is connected with the output end of the rotating motor through a chuck rotating shaft, and the rotating motor drives the chuck to rotate. The headstock assembly 5032 and the tailstock assembly 5033 can clamp the silicon rod and rotate along the axial direction of the silicon rod, so that the square-cutting mechanism 3 can cut off the edge skin at different positions.
The squaring mechanism 3 comprises a vertically arranged cutting wire net, and the squaring mechanism 3 is connected with the base 1 in a sliding mode along the length direction of the silicon rod through a horizontal conveying assembly and used for cutting two opposite edge skins simultaneously.
The grinding and polishing mechanism 4 comprises a fine grinding component and a coarse grinding component which are coaxially arranged, the fine grinding component is sleeved in the coarse grinding component, and the coarse grinding component performs fine grinding operation after the coarse grinding of the silicon rod is finished. In addition, a flaw-piece receiving box 6 is arranged below the feeding table 2, and the bottom of the flaw-piece receiving box 6 can be connected with the base 1 in a sliding manner along the silicon rod conveying direction, and can be used for receiving the flaw-piece and conveying the flaw-piece out of the base 1.
A silicon rod grinding and grinding integrated processing method comprises the following steps:
s1: silicon rod feeding: the crystal wire inspection equipment carries out crystal wire detection on the first silicon rod, and an operator places the first silicon rod subjected to crystal wire detection on the feeding table 2 to be clamped, so that the silicon rod is prevented from rolling on the feeding table 2, and the longitudinal section of the feeding table 2 is V-shaped and used for fixing the silicon rod.
The manipulator 7 clamps the first silicon rod from both sides thereof and conveys the first silicon rod to the first clamping assembly 503, and the head bracket assembly 5032 and the tail bracket assembly 5033 of the first clamping assembly 503 clamp the first silicon rod from both ends thereof. Meanwhile, the crystal wire inspection equipment performs crystal wire detection on the second silicon rod, an operator places the second silicon rod subjected to the crystal wire detection on the feeding table 2 to be clamped, and the feeding table 2 is always kept in a full-load state.
S2: first squaring of the silicon rod: the first clamping component 503 clamps a silicon rod to be cut, the squaring mechanism 3 moves to the first clamping component 503 along the length direction of the silicon rod to cut a group of edges of the silicon rod, the edge receiving box 6 moves to the lower portion of the first clamping component 503 to receive the cut edges, and after the edges are cut, the squaring mechanism 3 resets.
S3: the rotary conveying mechanism 5 rotates for the first time, the rotation angle is 180 degrees, the first silicon rod is conveyed to the grinding and polishing mechanism 4 to be subjected to surface grinding and chamfering operation for the first time, meanwhile, the second clamping component 504 rotates to one side close to the feeding table 2, the manipulator 7 clamps the second silicon rod and moves to the position close to the second clamping component 504, the second clamping component 504 completes clamping operation on the second silicon rod (the process of clamping the second silicon rod by the second clamping component 504 is the same as the process of clamping the first silicon rod by the first clamping component 503), at the moment, the squaring mechanism 3 moves to the position of the second clamping component 504 to perform edge cutting operation on the second silicon rod, and the squaring mechanism 3 resets after cutting a group of edges of the second silicon rod.
S4: the rotary conveying mechanism 5 rotates for the second time, and the rotating angle is 180 degrees: the first silicon rod is conveyed to the squaring mechanism 3, and the second silicon rod is conveyed to the grinding and polishing mechanism 4. In the first clamping assembly 503, the headstock assembly 5032 and the tailstock assembly 5033 rotate by 90 degrees, after the cutting mechanism 3 cuts the other group of the flaw-pieces of the silicon rod one, and after the cutting of the flaw-pieces is finished, the cutting mechanism 3 resets; meanwhile, the grinding and polishing mechanism 4 carries out the first grinding and polishing and chamfering operation on the second silicon rod.
S5: the rotary conveying mechanism 5 rotates for the third time, and the rotating angle is 180 degrees: the first silicon rod is conveyed to the grinding and polishing mechanism 4, and the second silicon rod is conveyed to the squaring mechanism 3. The grinding and polishing mechanism 4 carries out secondary grinding and polishing and chamfering operations on the first silicon rod, at the moment, the processing of the first silicon rod is finished, and the blanking mechanism 8 conveys the silicon rod out of the base 1; meanwhile, the headstock assembly 5032 and the tailstock assembly 5033 in the second clamping assembly 504 rotate by 90 degrees, and after the squaring mechanism 3 cuts the other set of the flaw-piece of the second silicon rod, the squaring mechanism 3 is reset.
S6: the rotary conveying mechanism 5 rotates for the fourth time, and the rotating angle is 180 degrees: the second silicon rod is conveyed to the grinding and polishing mechanism 4, and the first clamping component 503 is conveyed to the side close to the mechanical hand 7. The grinding and polishing mechanism 4 carries out secondary grinding and polishing and chamfering operation on the second silicon rod, and after the secondary grinding and polishing and chamfering operation of the second silicon rod is finished, the blanking mechanism 8 blanks the second silicon rod and transports the second silicon rod out of the base 1; meanwhile, the first clamping assembly 503 re-clamps the silicon rod on the feeding table 2 and repeats the operations from S2 to S6.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (5)
1. A silicon rod opening and grinding integrated processing method is characterized in that a rotary conveying mechanism clamps a silicon rod, the silicon rod to be opened and/or ground is conveyed to an opening mechanism and/or a grinding and polishing mechanism simultaneously to be opened and/or ground and polished, and one silicon rod is clamped once to complete the opening and grinding and polishing operations;
the method comprises the following steps:
s1: silicon rod feeding: after the detection of the first silicon rod crystal line is finished, the first silicon rod crystal line is placed on a feeding table to be clamped, after the first silicon rod is clamped, a second silicon rod crystal line is detected and placed on the feeding table to be clamped, and the feeding table is always kept in a full-load state;
s2: first squaring of the silicon rod: the rotary conveying mechanism comprises a first clamping component and a second clamping component, the first clamping component clamps the first silicon rod, and the squaring mechanism resets after the first silicon rod is moved to a position where the first silicon rod is cut and a group of boundary leather is finished;
s3: the rotary conveying mechanism rotates for the first time: conveying the first silicon rod to a grinding and polishing mechanism for carrying out first grinding and polishing and chamfering operation; the second clamping component clamps the second silicon rod, the squaring mechanism moves to the second silicon rod position and resets after the cutting of the second silicon rod position is finished;
s4: the rotary conveying mechanism rotates for the second time: after the first silicon rod is conveyed to the squaring mechanism and another pair of opposite sides are cut, the squaring mechanism resets; the grinding and polishing mechanism carries out first grinding and polishing and chamfering operation on the second silicon rod;
s5: the third rotation of the rotary conveying mechanism: after the first silicon rod is conveyed to the grinding and polishing mechanism to carry out the second grinding and polishing and chamfering operation, the blanking mechanism blanks the first silicon rod; after the second silicon rod is conveyed to the squaring mechanism and another group of side skins are cut, the squaring mechanism resets;
s6: the fourth rotation of the rotary conveying mechanism: after the second silicon rod is conveyed to the grinding and polishing mechanism to carry out the second grinding and polishing and chamfering operation, a blanking mechanism located at the grinding and polishing mechanism blanks the second silicon rod; repeating the operations of S2-S6;
the feeding table, the squaring mechanism and the grinding and polishing mechanism are sequentially arranged below the rotary conveying mechanism along the conveying direction of the silicon rod; the rotary conveying mechanism is arranged above the squaring mechanism and the grinding and polishing mechanism and comprises a rotating shaft and a rotating table connected with the rotating shaft, the first clamping assembly and the second clamping assembly are positioned on two sides of the rotating shaft and fixedly arranged below the rotating table, and the first clamping assembly and the second clamping assembly are identical in structure; the first clamping assembly comprises a clamping base, a headstock assembly and a tailstock assembly, the headstock assembly and the tailstock assembly are fixedly arranged on the clamping base, the clamping base is fixedly connected with the rotary table, the headstock assembly is fixedly connected with the clamping base, and the tailstock assembly is slidably connected with the clamping base through a tailstock feeding assembly, so that silicon rods with different lengths can be clamped by adjusting the distance between the headstock assembly and the tailstock assembly; and a manipulator is arranged between the feeding table and the rotary conveying mechanism, and clamps the silicon rod on the feeding table to the rotary conveying mechanism.
2. The silicon rod grinding integrated processing method as recited in claim 1, wherein the angles of the first rotation, the second rotation, the third rotation and the fourth rotation of the rotary conveying mechanism are all 180 degrees.
3. The method as set forth in claim 2, wherein the wire mesh of the squaring mechanism is located in a vertical plane, and the squaring mechanism moves along the length of the silicon rod while cutting two opposing edges.
4. The silicon rod grinding and polishing integrated processing method as recited in claim 3, wherein the grinding and polishing mechanism comprises a fine grinding component and a rough grinding component which are coaxially arranged, the fine grinding component is sleeved in the rough grinding component, and after the rough grinding component finishes rough grinding of the first silicon rod or the second silicon rod, the fine grinding component carries out fine grinding operation.
5. The silicon rod grinding and processing method as claimed in claim 4, wherein a flaw-piece receiving box is arranged below the feeding table, and the flaw-piece receiving box can slide along the silicon rod conveying direction and can receive the flaw-piece.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010365479.4A CN111515817B (en) | 2020-04-30 | 2020-04-30 | Silicon rod grinding and cutting integrated processing method |
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| CN202010365479.4A CN111515817B (en) | 2020-04-30 | 2020-04-30 | Silicon rod grinding and cutting integrated processing method |
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| CN111515817B true CN111515817B (en) | 2021-07-16 |
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| CN113172518B (en) * | 2021-04-27 | 2023-02-03 | 福州众升成功医疗科技有限公司 | Tooth veneer molding device and processing method |
| CN114523409B (en) * | 2022-02-08 | 2023-05-30 | 隆基绿能科技股份有限公司 | Clamping centering method and silicon rod processing equipment |
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| CN107030562A (en) * | 2017-05-19 | 2017-08-11 | 中信戴卡股份有限公司 | A kind of switch type Double-station wheel burr remover |
| CN110355669A (en) * | 2019-08-20 | 2019-10-22 | 青岛高测科技股份有限公司 | A kind of crystal silicon corase grinding fine grinding all-in-one machine and its application method |
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