CN111489959B - Semiconductor cleaning equipment - Google Patents
Semiconductor cleaning equipment Download PDFInfo
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- CN111489959B CN111489959B CN202010440910.7A CN202010440910A CN111489959B CN 111489959 B CN111489959 B CN 111489959B CN 202010440910 A CN202010440910 A CN 202010440910A CN 111489959 B CN111489959 B CN 111489959B
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- valve
- dilution
- pipeline
- pneumatic
- control signal
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- 238000004140 cleaning Methods 0.000 title claims abstract description 140
- 239000004065 semiconductor Substances 0.000 title claims abstract description 40
- 238000010790 dilution Methods 0.000 claims abstract description 143
- 239000012895 dilution Substances 0.000 claims abstract description 143
- 239000007788 liquid Substances 0.000 claims abstract description 106
- 238000000034 method Methods 0.000 claims abstract description 52
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 47
- 239000010703 silicon Substances 0.000 claims abstract description 47
- 238000004891 communication Methods 0.000 claims description 23
- 230000001105 regulatory effect Effects 0.000 claims description 12
- 238000007599 discharging Methods 0.000 claims description 2
- 238000002791 soaking Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 40
- 238000007865 diluting Methods 0.000 description 18
- 239000003814 drug Substances 0.000 description 7
- 238000005406 washing Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000002159 abnormal effect Effects 0.000 description 2
- 229940079593 drug Drugs 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 229910021642 ultra pure water Inorganic materials 0.000 description 2
- 239000012498 ultrapure water Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
Abstract
The invention provides semiconductor cleaning equipment, which comprises a cleaning tank, a process liquid pipeline and a silicon wafer protection device, wherein the process liquid pipeline is connected with the cleaning tank and is used for introducing process liquid into the cleaning tank; the silicon wafer protection device comprises a dilution pipeline, an on-off assembly and a first control unit, wherein one end of the dilution pipeline is connected with the cleaning tank, and the other end of the dilution pipeline is connected with a liquid source; the first control unit is connected with the on-off assembly and is used for sending a first control signal to the on-off assembly; the on-off assembly is arranged on the dilution pipeline and used for enabling the dilution pipeline to be on-off according to the first control signal, and the on-off assembly enables the dilution pipeline to be in a communicating state when the on-off assembly does not receive the first control signal. The semiconductor cleaning equipment provided by the invention can avoid the damage of the silicon wafer caused by long-time soaking in the process liquid, thereby improving the stability and safety of cleaning the silicon wafer.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to semiconductor cleaning equipment.
Background
Currently, in the silicon wafer cleaning industry, most of the silicon wafer cleaning methods still use groove cleaning methods, silicon wafers are soaked in a plurality of key liquid medicines in the cleaning process, the soaking time of the silicon wafers in the liquid medicines needs to be strictly controlled, and if the soaking time is too long, the silicon wafers are damaged. Therefore, besides the need of strictly controlling the process time when the cleaning equipment works normally, how to avoid the long-time soaking of the silicon wafer when the abnormal situation occurs in the cleaning equipment becomes the important concern and consideration problem of cleaning equipment manufacturers.
When the existing cleaning equipment is abnormal, a control system of the cleaning equipment automatically calls a protection program, and the silicon wafer in the liquid medicine tank is taken out and placed in an adjacent water tank through a manipulator, so that the influence of the liquid medicine on the silicon wafer is reduced.
However, when the cleaning device is powered off and down or the control system is in a problem, the mechanical arm cannot be controlled, or the hardware of the mechanical arm is in a problem, the silicon wafer in the liquid medicine tank cannot be taken out, so that the silicon wafer is soaked in the liquid medicine tank for a long time by the liquid medicine, and the silicon wafer is damaged.
Disclosure of Invention
The invention aims at solving at least one of the technical problems in the prior art, and provides semiconductor cleaning equipment which can avoid damage to a silicon wafer caused by long-time soaking in process liquid, thereby improving the stability and safety of cleaning the silicon wafer.
The invention provides a semiconductor cleaning device for achieving the purpose, which comprises a cleaning tank, a process liquid pipeline and a silicon wafer protection device, wherein the process liquid pipeline is connected with the cleaning tank and is used for introducing process liquid into the cleaning tank, and the silicon wafer protection device is connected with the cleaning tank and is used for introducing dilution liquid into the cleaning tank; the silicon wafer protection device comprises a dilution pipeline, an on-off assembly and a first control unit, wherein one end of the dilution pipeline is connected with the cleaning tank, and the other end of the dilution pipeline is connected with a liquid source;
the first control unit is connected with the on-off assembly and is used for sending a first control signal to the on-off assembly;
the on-off assembly is arranged on the dilution pipeline and used for enabling the dilution pipeline to be on-off according to the first control signal, and the on-off assembly enables the dilution pipeline to be in a communicating state when the first control signal is not received.
Preferably, the on-off assembly comprises a pneumatic pipeline, a first on-off valve and a second on-off valve, wherein the second on-off valve is arranged on the dilution pipeline, one end of the pneumatic pipeline is connected with the second on-off valve, the other end of the pneumatic pipeline is connected with a gas source, and the gas source is used for providing gas power for the on-off assembly;
the first control unit is used for sending the first control signal to the first on-off valve so as to control the first on-off valve to be opened or closed; the first on-off valve is arranged on the pneumatic pipeline; and the first on-off valve is in a normally open state when the first control signal is not received.
Preferably, the silicon wafer protection device further comprises a second control unit, the on-off assembly further comprises a third on-off valve, and the second control unit is used for sending a second control signal to the third on-off valve so as to control the third on-off valve to be opened or closed;
the third on-off valve is arranged on the pneumatic pipeline and is connected with the first on-off valve in parallel.
Preferably, the dilution pipeline comprises a first dilution branch and a second dilution branch which are connected in parallel, the pneumatic pipeline comprises a first pneumatic branch and a second pneumatic branch, two second on-off valves are arranged, and the two second on-off valves are respectively arranged on the first dilution branch and the second dilution branch;
one end of the first pneumatic branch is connected with one of the two second on-off valves, the other end of the first pneumatic branch is connected with the gas source, one end of the second pneumatic branch is connected with the other of the two second on-off valves, and the other end of the second pneumatic branch is connected with the gas source;
the first on-off valve is arranged on the first pneumatic branch, and the third on-off valve is arranged on the second pneumatic branch.
Preferably, the on-off assembly comprises a first on-off valve, and the first control unit is used for sending the first control signal to the first on-off valve;
the first on-off valve is arranged on the dilution pipeline and is opened or closed according to the first control signal so as to enable the dilution pipeline to be on-off, and the first on-off valve is in a normally open state when the first control signal is not received.
Preferably, the first on-off valve comprises a normally open solenoid valve, the second on-off valve comprises a normally closed pneumatic valve, and the third on-off valve comprises a normally closed solenoid valve.
Preferably, the pneumatic pipeline is provided with a one-way valve, and the one-way valve is connected in series with the third cut-off valve, so as to prevent the gas entering the pneumatic pipeline from the gas source from flowing out of the pneumatic pipeline through the third cut-off valve.
Preferably, the dilution pipeline is further provided with a manual switch valve, a flow regulating valve or a pressure regulating valve, wherein the manual switch valve is used for being opened or closed by manual operation so as to enable the dilution pipeline to be opened or closed, the flow regulating valve is used for regulating the flow of the liquid provided by the liquid source through the dilution pipeline, and the pressure regulating valve is used for regulating the pressure of the liquid provided by the liquid source through the dilution pipeline.
Preferably, the dilution pipeline is further provided with a one-way valve, and the one-way valve is used for preventing the liquid in the cleaning tank from flowing to the liquid source through the dilution pipeline.
Preferably, an overflow pipe is arranged on the side wall of the cleaning tank, and the overflow pipe is communicated with the inside of the cleaning tank and located at a preset height of the cleaning tank, and is used for discharging the process liquid reaching the preset height in the cleaning tank.
The invention has the following beneficial effects:
according to the semiconductor cleaning equipment provided by the invention, the diluting pipeline is connected with the first control signal sent by the first control unit, and when the first control signal is not received, the diluting pipeline is connected with the on-off component which can enable the diluting pipeline to be in a connected state, so that the problem that the semiconductor cleaning equipment is in outage or a control system occurs, and the problem that a mechanical arm cannot be controlled due to outage or the control system occurs, or the problem that the hardware of the mechanical arm occurs, is caused, when the silicon wafer immersed in the process liquid in the cleaning tank cannot be taken out, the diluting pipeline can be in a connected state, so that the diluting liquid can be introduced into the cleaning tank through the diluting pipeline, the process liquid in the cleaning tank is diluted by the diluting liquid, and the damage of the silicon wafer caused by long-time immersion in the process liquid can be avoided, and the stability and safety of cleaning the silicon wafer are improved.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a semiconductor cleaning apparatus according to an embodiment of the present invention;
reference numerals illustrate:
11-a dilution line; 111-a first dilution branch; 112-a second dilution branch; 12-cleaning a tank; 13-a liquid source; 141-a first gas branch; 142-a second gas branch; 15-a first on-off valve; 16-a second on-off valve; 17-a gas source; 18-a third three-way shut-off valve; 191-a one-way valve; 192-one-way valve; 21-manual on-off valve; 22-a flow regulating valve or a pressure regulating valve; 23-overflow pipe.
Detailed Description
In order to enable those skilled in the art to better understand the technical scheme of the present invention, the following describes the semiconductor cleaning apparatus provided by the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1 to 4, the present embodiment provides a semiconductor cleaning apparatus, which includes a cleaning tank 12, a process liquid pipeline and a silicon wafer protection device, wherein the process liquid pipeline is connected with the cleaning tank 12 for introducing process liquid into the cleaning tank 12, the silicon wafer protection device is connected with the cleaning tank 12 for introducing dilution liquid into the cleaning tank 12, the silicon wafer protection device includes a dilution pipeline 11, an on-off assembly and a first control unit, wherein one end of the dilution pipeline 11 is connected with the cleaning tank 12, and the other end is connected with a liquid source 13; the first control unit is connected with the on-off assembly and is used for sending a first control signal to the on-off assembly; the on-off assembly is arranged on the dilution pipeline 11 and used for enabling the dilution pipeline 11 to be on-off according to the first control signal, and the on-off assembly enables the dilution pipeline 11 to be in a communicating state when the on-off assembly does not receive the first control signal.
According to the semiconductor cleaning device provided by the embodiment, the diluting pipeline 11 is connected and disconnected by means of the first control signal sent by the first control unit, and when the first control signal is not received, the diluting pipeline 11 can be connected and disconnected by the on-off component, so that the semiconductor cleaning device is in outage or a control system is in a problem, and the mechanical arm cannot be controlled due to outage or the control system is in a problem, or the mechanical arm is in a problem due to the fact that the mechanical arm is in a problem, so that when a silicon wafer immersed in the process liquid in the cleaning tank cannot be taken out, the diluting pipeline 11 can be in a connected state, so that the diluting liquid can be introduced into the cleaning tank 12 through the diluting pipeline 11, the process liquid in the cleaning tank 12 is diluted by the diluting liquid, damage to the silicon wafer caused by long-time immersion in the process liquid can be avoided, and the stability and safety of cleaning the silicon wafer are improved.
Specifically, the first control signal sent by the first control unit to the on-off component may include a first off signal that can make the on-off component place the dilution pipeline 11 in an off state after receiving the first control signal, and a first communication signal that can make the on-off component place the dilution pipeline 11 in a communication state after receiving the first control signal, or may include only the first off signal that can make the on-off component place the dilution pipeline 11 in an off state after receiving the first control signal.
When the semiconductor cleaning device is in a cleaning process state, a first control unit sends a first turn-off signal included in a first control signal to the on-off assembly to enable the dilution pipeline 11 to be in a turn-off state so as to prevent dilution liquid from flowing into the cleaning tank 12 through the dilution pipeline 11, and therefore the cleaning process can be normally performed.
When the semiconductor cleaning device is powered off and down or the control system is in a problem, and the mechanical arm cannot be controlled due to the power off and down or the control system is in a problem, or the mechanical arm is in a problem in hardware, so that the silicon wafer immersed in the process liquid in the cleaning tank cannot be taken out, and the first control unit can be used for normally working, the first control unit can cancel the transmission of the first control signal to the on-off assembly, or the first control unit can transmit the first communication signal included in the first control signal to the on-off assembly, so that the on-off assembly does not receive the first control signal, the dilution pipeline 11 can be in a communication state, the dilution liquid can be introduced into the cleaning tank 12 through the dilution pipeline 11, and the process liquid in the cleaning tank 12 is diluted by the dilution liquid.
When the semiconductor cleaning device is powered off and down or the control system is in a problem, and the mechanical arm cannot be controlled due to the power off and down or the control system is in a problem, or the mechanical arm is in a problem in hardware, so that the silicon wafer immersed in the process liquid in the cleaning tank cannot be taken out, and the first control unit cannot normally work, at this time, the first control unit cannot send the first control signal to the on-off assembly, so that the on-off assembly cannot receive the first control signal, and the dilution pipeline 11 can be in a communicating state, so that the diluting liquid can be introduced into the cleaning tank 12 through the dilution pipeline 11, and the process liquid in the cleaning tank 12 is diluted by the diluting liquid.
When the semiconductor cleaning equipment is powered off and down or a control system is in a problem, and the mechanical mobile phone and the first control unit can work normally, the first control unit can cancel sending the first control signal to the on-off assembly, so that the on-off assembly does not receive the first control signal, or the first control unit can send the first communication signal included in the first control signal to the on-off assembly, so that the dilution pipeline 11 is in a communication state, so that the dilution liquid can be introduced into the cleaning tank 12 through the dilution pipeline 11, the process liquid in the cleaning tank 12 is diluted by the dilution liquid, and meanwhile, the silicon wafer in the cleaning tank 12 is taken out through the mechanical mobile phone, so that the time of soaking the silicon wafer in the process liquid is reduced to the maximum extent.
As shown in fig. 1 to 4, in the first embodiment of the present invention, the on-off assembly includes a pneumatic line, a first on-off valve 15, and a second on-off valve 16, wherein the second on-off valve 16 is disposed on the dilution line 11, one end of the pneumatic line is connected to the second on-off valve 16, the other end is connected to a gas source 17, and the gas source 17 is used for providing gas power to the on-off assembly; the first control unit is used for sending a first control signal to the first on-off valve 15 to control the first on-off valve 15 to be opened or closed; the first on-off valve 15 is arranged on the pneumatic pipeline; and the first on-off valve 15 is in a normally open state when the first control signal is not received.
In this embodiment, when the dilution line 11 needs to be in the off state, the first control unit may send a first off signal included in the first control signal to the first on-off valve 15 to control the first on-off valve to be closed, so that the pneumatic line is in the off state, and the gas source 17 cannot provide the gas power to the second on-off valve 16 in the on-off assembly through the pneumatic line, so that the second on-off valve 16 is in the off state, and thus the dilution line 11 is in the off state.
When the dilution line 11 needs to be in a connected state, the first control unit may cancel sending the first control signal to the first on-off valve 15, so that the first on-off valve 15 does not receive the first control signal, or the first control unit may send the first communication signal included in the first control signal to the first on-off valve 15, so as to control the first on-off valve 15 to be opened, so that the pneumatic line is in a connected state, so that the gas source 17 may provide the gas power to the second on-off valve 16 in the on-off assembly through the pneumatic line, so that the second on-off valve 16 is opened, and the dilution line 11 is connected.
In this embodiment, the second on-off valve 16 comprises a normally closed pneumatic valve which is normally closed when no pneumatic power is input, and which is changed from the closed state to the open state when pneumatic power is input, and which is changed from the open state back to the closed state once the pneumatic power is stopped.
In the present embodiment, the gas source 17 may provide compressed air (CDA) as the gas power, but is not limited thereto.
In this embodiment, the silicon wafer protection device further includes a second control unit, the on-off assembly further includes a third on-off valve 18, and the second control unit is configured to send a second control signal to the third on-off valve 18 to control the third on-off valve 18 to be opened or closed; the third on-off valve 18 is provided on the pneumatic line and is provided in parallel with the first on-off valve 15.
By means of the third cut-off valve 18 and the second control unit, when the process liquid or the cleaning tank 12 is configured, a second control signal is sent to the third cut-off valve 18 through the second control unit to control the third cut-off valve 18 to be opened, so that the dilution line 11 is in a communicating state, and the dilution liquid can enter the cleaning tank 12 to be mixed with the process liquid which is introduced into the cleaning tank 12 from the process liquid line, so as to configure the process liquid, or the dilution liquid can enter the cleaning tank 12 to be cleaned.
Of course, when the process liquid is disposed or the cleaning tank 12 is cleaned by the first on-off valve 15 and the first control unit, the dilution line 11 may be in communication so that the dilution liquid can enter the cleaning tank 12 and be mixed with the process liquid introduced into the cleaning tank 12 from the process liquid line to dispose the process liquid or so that the dilution liquid can enter the cleaning tank 12 to clean the cleaning tank 12.
The parallel arrangement of the first on-off valve 15 and the third on-off valve 18 means that the first on-off valve 15 and the third on-off valve 18 are arranged on the dilution pipeline 11 in parallel, and at least one of the first on-off valve 15 and the third on-off valve 18 is in an open state, so that the dilution pipeline 11 can be in a connected state, and the dilution pipeline 11 is in an disconnected state, and the first on-off valve 15 and the third on-off valve 18 are required to be in a closed state to be realized. By adopting the design, when one of the first on-off valve 15 and the third on-off valve 18 is out of order and cannot be opened, the other opening can be controlled to enable the dilution pipeline 11 to be in a communicated state, so that the dilution liquid can enter the cleaning tank 12 through the dilution pipeline 11, and the reliability of the semiconductor cleaning equipment is improved.
In this embodiment, the second control signal sent by the second control unit to the third on-off valve 18 may include a second off signal capable of causing the third on-off valve 18 to be in an off state after receiving the second control signal, and a second communication signal capable of causing the third on-off valve 18 to be in a communication state after receiving the second control signal, or may include only the second communication signal capable of causing the third on-off valve 18 to be in a communication state after receiving the second control signal.
In this embodiment, the third three-way shut-off valve 18 includes a normally closed solenoid valve, which is normally closed when the second control signal is not received, and can be opened or closed according to the second control signal after the second control signal is received, so as to make the pneumatic pipeline open or closed.
Alternatively, the third three-way shut-off valve 18 may be a normally closed two-position three-way valve.
In this embodiment, there are various ways in which the third on-off valve 18 is disposed in parallel with the first on-off valve 15 on the pneumatic circuit, and as shown in fig. 1-3, the first on-off valve 18 and the first on-off valve 15 may be disposed in parallel, the pneumatic circuit includes a first gas branch 141 and a second gas branch 142 that are connected in parallel, the first on-off valve 15 is disposed on the first gas branch 141, and the third on-off valve 18 is disposed on the second gas branch 142.
In the first mode in which the third on-off valve 18 is provided in parallel with the first on-off valve 15, when the process liquid or the cleaning tank 12 is disposed, the first control unit sends a first control signal to the first on-off valve 15 to control the first on-off valve 15 to close the first gas branch 141, and the second control unit sends a second control signal to the third on-off valve 18 to control the third on-off valve 18 to open the third on-off valve 18 to communicate the second gas branch 142 so that the gas can flow to the second on-off valve 16 through the second gas branch 142 to open the second on-off valve 16, thereby communicating the dilution line 11.
As shown in fig. 4, the second third on-off valve 18 and the first on-off valve 15 are arranged in parallel, that is, the dilution pipeline 11 includes a first dilution branch 111 and a second dilution branch 112 that are parallel to each other, the pneumatic pipeline includes a first gas branch 141 and a second gas branch 142, the number of the second on-off valves 16 is two, and the two second on-off valves 16 are respectively arranged on the first dilution branch 111 and the second dilution branch 112; one end of the first gas branch 141 is connected with one of the two second on-off valves 16, the other end is connected with the gas source 17, one end of the second gas branch 142 is connected with the other of the two second on-off valves 16, and the other end is connected with the gas source 17; the first on-off valve 15 is provided on the first gas branch 141, and the third on-off valve 18 is provided on the second gas branch 142.
In the second mode in which the third on-off valve 18 is disposed in parallel with the first on-off valve 15, when the process liquid or the cleaning tank 12 is disposed, the first control unit sends a first control signal to the first on-off valve 15 to control the first on-off valve 15 to close so that the first gas branch 141 is turned off to close the second on-off valve 16 on the first dilution branch 111, so that the first dilution branch 111 is turned off, the second control unit sends a second control signal to the third on-off valve 18 to control the third on-off valve 18 to open so that the second gas branch 142 is communicated so that gas can flow to the second on-off valve 16 on the second dilution branch 112 through the second gas branch 142, so that the second on-off valve 16 is opened so that the second dilution branch 112 is communicated.
In this embodiment, the air line may further be provided with a check valve 191, and the check valve 191 is disposed in series with the third on/off valve 18, so as to prevent the air entering the air line from the air source 17 from flowing out of the air line through the third on/off valve 18, so as to avoid the air entering the air line from flowing out of the third on/off valve 18 when the dilution line 11 needs to be connected, thereby avoiding insufficient air power delivered to the second on/off valve 16, and causing the situation that the second on/off valve 16 cannot be opened, and improving the reliability of the semiconductor cleaning apparatus.
In a second embodiment of the invention, the on-off assembly comprises a first on-off valve 15, the first control unit being adapted to send a first control signal to the first on-off valve 15; the first on-off valve 15 is disposed on the dilution line 11 and is opened or closed according to the first control signal to make the dilution line 11 on-off, and the first on-off valve 15 is in a normally open state when the first control signal is not received.
The second embodiment of the present invention is different from the first embodiment of the present invention in that the on-off assembly does not include the pneumatic line and the second on-off valve 16, the first on-off valve 15 is directly disposed on the dilution line 11, and the first control unit sends the first control signal to the first on-off valve 15 to open or close the first on-off valve 15 according to the first control signal, so as to turn on-off the dilution line 11.
In the present embodiment, when it is necessary to put the dilution line 11 in the off state, the first control signal may be sent to the first on-off valve 15 through the first control unit, thereby putting the dilution line 11 in the off state. When the dilution line 11 needs to be in a connected state, the first control unit may be omitted from sending the first control signal to the first on-off valve 15, so that the first on-off valve 15 does not receive the first control signal, thereby placing the dilution line 11 in a connected state.
In this embodiment, the first control signal sent by the first control unit to the on-off component may include a first off signal capable of enabling the on-off component to place the dilution pipeline 11 in an off state after receiving the first control signal, and a first communication signal capable of enabling the on-off component to place the dilution pipeline 11 in a communication state after receiving the first control signal, or may include only the first off signal capable of enabling the on-off component to place the dilution pipeline 11 in an off state after receiving the first control signal.
In the above embodiments, the first on-off valve 15 includes a normally open solenoid valve, which is in a normally open state when the first control signal is not received, and is opened or closed according to the first control signal after the first control signal is received, so that the pneumatic pipeline is turned on or off.
In the above embodiments, the liquid source 13 may supply ultrapure water (UPW) as the diluting liquid, but is not limited thereto.
In the above embodiments, the dilution pipeline 11 may include a plurality of on-off components, including a plurality of groups, on-off components are disposed on each dilution pipeline 11, the tank bottom of the cleaning tank 12 is provided with a communication port, two ends of one dilution pipeline 11 in the plurality of dilution pipelines 11 are respectively connected with the notch of the cleaning tank 12 and the liquid source 13, and two ends of the other dilution pipeline 11 are respectively connected with the communication port and the liquid source 13. By the arrangement mode, when the silicon wafer cannot be taken out from the semiconductor cleaning equipment, the diluting liquid is respectively introduced into the cleaning tank 12 from the notch and the tank bottom of the cleaning tank 12, so that the time for soaking the silicon wafer in the process liquid is further shortened, the efficiency of the semiconductor cleaning equipment is improved, the possibility of damage to the silicon wafer is further reduced, and the reliability of cleaning the silicon wafer is further improved.
Specifically, as shown in fig. 1, when the silicon wafer cannot be taken out from the semiconductor cleaning apparatus, the second on-off valves 16 provided on the dilution lines 11 connected to the communication ports of the notch and the bottom of the cleaning tank 12 are opened (as shown by the white color of the passage of the second on-off valve 16 in fig. 1), so that the dilution lines 11 connected to the communication ports of the notch and the bottom of the cleaning tank 12 are communicated, so that the diluting liquid can be introduced into the cleaning tank 12 from the notch and the bottom of the cleaning tank 12, respectively. As shown in fig. 2, when the semiconductor cleaning apparatus is in an idle or cleaning process state, the second on-off valves 16 provided on the dilution lines 11 connected to the communication ports of the notch and the tank bottom of the cleaning tank 12 are all closed (as shown by the black color at the passage of the second on-off valve 16 in fig. 2), so that the dilution lines 11 connected to the communication ports of the notch and the tank bottom of the cleaning tank 12 are all closed to avoid the flow of the dilution liquid into the cleaning tank 12. As shown in fig. 3, when disposing the process liquid or the washing tank 12, the second on-off valve 16 provided on the dilution line 11 connected to the notch of the washing tank 12 is opened (as shown by the second on-off valve 16 in white at the passage in fig. 3), the dilution line 11 connected to the notch of the washing tank 12 is made to communicate so that the dilution liquid can flow from the notch of the washing tank 12 into the washing tank 12, and the second on-off valve 16 provided on the dilution line 11 connected to the communication port of the bottom of the tank is closed (as shown by the second on-off valve 16 in black at the passage in fig. 3), and the dilution line 11 connected to the communication port of the bottom of the washing tank 12 is turned off.
In the above embodiments, the dilution line 11 is further provided with a check valve 192, and the check valve 192 is used to prevent the liquid in the cleaning tank 12 from flowing to the liquid source 13 through the dilution line 11, so as to prevent the process liquid in the cleaning tank 12 from flowing to the liquid source 13 through the dilution line 11 when the dilution line 11 is connected, so that the diluted liquid cannot flow into the cleaning tank 12, and further improve the reliability of cleaning the silicon wafer.
In the above embodiments, the dilution line 11 may further be provided with a manual switch valve 21, where the manual switch valve 21 is used for being opened or closed by manual operation to switch the dilution line 11 on or off, so that when the dilution line 11 is not needed, the dilution line 11 is switched off by manual operation, and it is ensured that the dilution liquid does not flow into the cleaning tank 12 through the dilution line 11.
In the above embodiments, the dilution line 11 may further be provided with a flow rate adjusting valve or a pressure adjusting valve 22, where the flow rate adjusting valve is used to adjust the flow rate of the liquid provided by the liquid source through the dilution line, and the pressure adjusting valve is used to adjust the pressure of the liquid provided by the liquid source through the dilution line, so as to adjust the flow rate or the pressure of the dilution liquid flowing through the dilution line 11, so as to flexibly adjust the flow rate or the pressure of the dilution liquid flowing through the dilution line 11 when the process liquid, the cleaning tank 12, and the silicon wafer cannot be removed from the semiconductor cleaning apparatus, so as to improve the flexibility of use of the protection line device of the semiconductor cleaning apparatus.
In the above embodiments, the overflow pipe 23 is disposed on the sidewall of the cleaning tank 12, and the overflow pipe 23 is communicated with the interior of the cleaning tank 12 and located at a preset height of the cleaning tank 12, so as to drain the process liquid reaching the preset height in the cleaning tank 12, so as to avoid the process liquid flowing out from the notch of the cleaning tank 12 and damaging the equipment outside the cleaning tank 12.
In summary, the semiconductor cleaning device provided by the embodiment of the invention can avoid damage to the silicon wafer caused by long-time soaking in the process liquid, thereby improving the stability and safety of cleaning the silicon wafer.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (9)
1. The semiconductor cleaning equipment comprises a cleaning tank, a process liquid pipeline and a silicon wafer protection device, wherein the process liquid pipeline is connected with the cleaning tank and is used for introducing process liquid into the cleaning tank; the silicon wafer protection device comprises a dilution pipeline, an on-off assembly and a first control unit, wherein one end of the dilution pipeline is connected with the cleaning tank, and the other end of the dilution pipeline is connected with a liquid source;
the first control unit is connected with the on-off assembly and is used for sending a first control signal to the on-off assembly;
the on-off assembly is arranged on the dilution pipeline and used for enabling the dilution pipeline to be on-off according to the first control signal, and the on-off assembly enables the dilution pipeline to be in a communication state when the first control signal is not received;
the on-off assembly comprises a pneumatic pipeline, a first on-off valve and a second on-off valve, wherein the second on-off valve is arranged on the dilution pipeline, one end of the pneumatic pipeline is connected with the second on-off valve, the other end of the pneumatic pipeline is connected with a gas source, and the gas source is used for providing gas power for the on-off assembly;
the first control unit is used for sending the first control signal to the first on-off valve so as to control the first on-off valve to be opened or closed; the first on-off valve is arranged on the pneumatic pipeline; and the first on-off valve is in a normally open state when the first control signal is not received.
2. The semiconductor cleaning apparatus according to claim 1, wherein the silicon wafer protection device further comprises a second control unit, the on-off assembly further comprises a third on-off valve, and the second control unit is configured to send a second control signal to the third on-off valve to control the third on-off valve to be opened or closed;
the third on-off valve is arranged on the pneumatic pipeline and is connected with the first on-off valve in parallel.
3. The semiconductor cleaning apparatus according to claim 2, wherein the dilution line includes a first dilution branch and a second dilution branch connected in parallel with each other, the pneumatic line includes a first pneumatic branch and a second pneumatic branch, the number of the second on-off valves is two, and the two second on-off valves are respectively provided on the first dilution branch and the second dilution branch;
one end of the first pneumatic branch is connected with one of the two second on-off valves, the other end of the first pneumatic branch is connected with the gas source, one end of the second pneumatic branch is connected with the other of the two second on-off valves, and the other end of the second pneumatic branch is connected with the gas source;
the first on-off valve is arranged on the first pneumatic branch, and the third on-off valve is arranged on the second pneumatic branch.
4. The semiconductor cleaning apparatus of claim 1, wherein the on-off assembly comprises a first on-off valve, the first control unit to send the first control signal to the first on-off valve;
the first on-off valve is arranged on the dilution pipeline and is opened or closed according to the first control signal so as to enable the dilution pipeline to be on-off, and the first on-off valve is in a normally open state when the first control signal is not received.
5. The semiconductor cleaning apparatus of claim 2, wherein the first on-off valve comprises a normally open solenoid valve, the second on-off valve comprises a normally closed pneumatic valve, and the third on-off valve comprises a normally closed solenoid valve.
6. The semiconductor cleaning apparatus of claim 2, wherein the pneumatic line is provided with a one-way valve, and the one-way valve is disposed in series with the third cut-off valve for preventing gas entering the pneumatic line from the gas source from flowing out of the pneumatic line through the third cut-off valve.
7. The semiconductor cleaning apparatus according to claim 1, wherein the dilution line is further provided with a manual on-off valve for manually opening or closing the dilution line, a flow rate regulating valve for regulating a flow rate of the liquid supplied from the liquid source through the dilution line, or a pressure regulating valve for regulating a pressure of the liquid supplied from the liquid source through the dilution line.
8. The semiconductor cleaning apparatus of claim 7, wherein the dilution line is further provided with a one-way valve for preventing liquid in the cleaning tank from flowing through the dilution line to the liquid source.
9. The semiconductor cleaning apparatus according to claim 1, wherein an overflow pipe is provided on a sidewall of the cleaning tank, the overflow pipe being communicated with an inside of the cleaning tank and located at a preset height of the cleaning tank for discharging the process liquid reaching the preset height in the cleaning tank.
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