CN111464900A - Combined internal mold structure - Google Patents
Combined internal mold structure Download PDFInfo
- Publication number
- CN111464900A CN111464900A CN201910060696.XA CN201910060696A CN111464900A CN 111464900 A CN111464900 A CN 111464900A CN 201910060696 A CN201910060696 A CN 201910060696A CN 111464900 A CN111464900 A CN 111464900A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- mold structure
- lower cover
- upper cover
- inner mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
Abstract
A combined internal mold structure is mainly used for being installed inside a wireless earphone and comprises a circuit loop, a lower cover and an upper cover. The circuit loop has at least one first circuit board and at least one second circuit board extending from the first circuit board. The upper cover is arranged above the lower cover and used for fixing the first circuit board between the upper cover and the lower cover, and the upper cover is provided with at least one first side wall which is arranged at an angle with the lower cover and used for mounting the second circuit board, so that an included angle is formed between the second circuit board and the first circuit board. Therefore, the inner mold structure forms a modular design, so that the assembling steps of the wireless earphone are simplified, and the labor cost required by assembling the wireless earphone is greatly reduced.
Description
Technical Field
The present invention relates to a combined internal mold structure, and more particularly, to an internal mold structure which is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost.
Background
General earphones are classified into wired earphones connected to an electronic device through a wire and wireless earphones connected to the electronic device through wireless communication transmission such as bluetooth (r) and the like (e.g., airpads products published by APP L E).
Because the wired earphone must be connected with the electronic device through a circuit, the application range of the wired earphone is limited, and meanwhile, the wired earphone is easy to pull due to the circuit, and the wires are easy to intertwine when being stored. The wireless earphone is transmitted by wireless communication, so the wireless earphone is used in a longer range than the wired earphone, and the wireless circuit is easy to pull or intertwine, so the wireless earphone gradually replaces the wired earphone.
A general earphone is generally provided with a circuit board, a speaker, and the like inside, except for the outside covered with a case. The inside of the wireless earphone must be provided with components such as a battery, a microphone, a wireless transmission module and the like. Since there are many components inside the wireless earphone, generally, when the wireless earphone is assembled, the circuit board, the speaker, the battery, the microphone, and the wireless transmission module are sequentially installed and fixed inside the housing. Therefore, when the wireless earphone is assembled, a large amount of manpower is required to assemble the wireless earphone, which not only increases the manpower cost, but also causes the limited internal assembly space due to the small volume of the wireless earphone, so that the components are easily damaged due to careless assembly, and the assembly yield of the wireless earphone is poor.
Therefore, how to provide an internal mold structure that is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost is the technical means and the purpose to be solved in the invention.
Disclosure of Invention
The present invention provides a combined internal mold structure, and more particularly, to an internal mold structure which is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost.
To achieve the above object, the present invention provides a combined internal mold structure, which includes a circuit loop, a lower cover and an upper cover. The circuit loop has at least one first circuit board and at least one second circuit board extending from the first circuit board. The lower cover is used for mounting the first circuit board. The upper cover is arranged above the lower cover and used for fixing the first circuit board between the upper cover and the lower cover, the upper cover is provided with at least one first side wall which forms an angle with the lower cover, and the first side wall is provided with a first positioning groove for accommodating the second circuit board, so that a first included angle is formed between the second circuit board and the first circuit board after the second circuit board is arranged in the first positioning groove. The inner mold structure forms a modular design to simplify the assembling steps of the wireless earphone, and the labor cost required by the wireless earphone assembly is greatly reduced.
In an embodiment, at least one set of first engaging mechanism is further included between the second circuit board and the first positioning slot, so that the second circuit board is fixed in the first positioning slot by the first engaging mechanism.
In an embodiment, the upper cover further includes a second sidewall opposite to the first sidewall and a connecting wall connected between the first sidewall and the second sidewall, so that an accommodating space is formed between the upper cover and the lower cover.
In an embodiment, the inner mold structure further includes a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
In an embodiment, the inner mold structure further includes a speaker, and the connecting wall further forms a recessed slot for the speaker to be disposed thereon, and the speaker is electrically connected to the circuit loop.
In an embodiment, the circuit loop further includes a third circuit board extending from the first circuit board and opposite to the second circuit board, and the second sidewall of the top cover further includes a second positioning groove for receiving the third circuit board, so that the third circuit board is mounted in the second positioning groove and then opposite to the second circuit board, and a second included angle is formed between the third circuit board and the first circuit board.
In an embodiment, at least one set of second engaging mechanism is further included between the third circuit board and the second positioning slot, so that the third circuit board is fixed in the second positioning slot by the second engaging mechanism.
In one embodiment, the first circuit board is a hard circuit board, and the second circuit board and the third circuit board are respectively a soft circuit board.
In one embodiment, a through hole is further formed at the central portion of the lower cover, so that when the first circuit board is mounted on the lower cover, one surface of the first circuit board is exposed in the accommodating space, and the other surface of the first circuit board is exposed in the through hole.
In one embodiment, a set of third engaging mechanisms is further included between the upper cover and the lower cover, which can be engaged and fixed with each other.
Compared with the prior art, the combined internal mold structure has the following advantages:
1. the inner die structure can integrate the circuit loop, the power supply unit and the loudspeaker together in advance through the upper cover and the lower cover, so that the inner die structure forms a modular design, and the labor cost required during assembly can be greatly reduced.
2. The inner mold structure can change the shapes of the upper cover and the lower cover according to the shape of the wireless earphone, and can be suitable for the wireless earphones with different shapes.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is a perspective view of another aspect of the present invention.
Fig. 3 is an exploded view of the present invention.
Fig. 4 is a back perspective view of the circuit loop of the present invention.
FIG. 5 is an exploded view of another aspect of the present invention.
Fig. 6 is a perspective view of the combination of the upper cover and the lower cover of the present invention.
Fig. 7 is a perspective view of another perspective after the upper cover and the lower cover are combined.
Fig. 8 is a perspective view of the back of the combination of the upper cover and the lower cover of the present invention.
Fig. 9 is a schematic plan view of the present invention.
[ notation ] to show
10 internal mold structure
20 circuit loop
21 first circuit board
22 second circuit board
23 third circuit board
30 lower cover
31 through hole
40 upper cover
41 first side wall
411 first positioning groove
42 second side wall
421 second positioning groove
43 connecting wall
431 caulking groove
44 space for accommodating
Theta 1 first included angle
Theta 2 second angle
50 power supply unit
60 loudspeaker
70 third fitting mechanism
71 third fitting groove
72 third fitting projection
80 first fitting mechanism
81 first fitting projection
82 first fitting recess
90 second fitting mechanism
91 second fitting projection
92 second fitting recess
Detailed Description
The detailed description and technical contents of the present invention will now be described with reference to the accompanying drawings:
as shown in fig. 1 to 5, the present invention is a combined internal mold structure, and the internal mold structure 10 includes a circuit loop 20, a lower cover 30, an upper cover 40, a power supply unit 50, and a speaker 60.
The circuit loop 20 is composed of a first circuit board 21, a second circuit board 22 and a third circuit board 23. The first circuit board 21 is a hard circuit board. The second circuit board 22 and the third circuit board 23 are respectively a flexible circuit board and extend from two opposite sides of the first circuit board 21, so that the second circuit board 22 and the third circuit board 23 are opposite to each other. In addition, the circuit loop 20 can be composed of a hard circuit board and a flexible circuit board, and can also be composed of a flexible circuit board or a hard circuit board. And the first circuit board 21, the second circuit board 22 and the third circuit board 23 are electrically connected to each other.
The lower cover 30 is used for the first circuit board 21 to be disposed, and a through hole 31 penetrating through the lower cover is formed at a central portion of the lower cover 30.
The upper cover 40 is disposed on the lower cover 30 to fix the first circuit board 21 between the lower cover 30 and the upper cover 40, and the upper cover 40 includes a first sidewall 41, a second sidewall 42, and a connecting wall 43 connecting the first sidewall 41 and the second sidewall 42. The first sidewall 41 and the second sidewall 42 are opposite to each other, and when the upper cover 40 is disposed above the lower cover 30, an accommodating space 44 for the power supply unit 50 to be disposed is formed between the lower cover 30 and the upper cover 40. The first sidewall 41 is further provided with a first positioning slot 411 for receiving the second circuit board 22, and the second sidewall 42 is further provided with a second positioning slot 421 for receiving the third circuit board 23. The connecting wall 43 is provided with a recessed groove 431 for the speaker 60 to be disposed.
As shown in fig. 1 to 9, during assembly, the first circuit board 21 is first mounted on the lower cover 30, and then the upper cover 40 is mounted on the lower cover 30, such that one surface of the first circuit board 21 is partially exposed in the accommodating space 44 and the other surface is exposed in the through hole 31. In order to achieve a good engagement effect between the lower cover 30 and the upper cover 40, at least one set of third engagement mechanisms 70 is disposed between the lower cover 30 and the upper cover 40, and in this embodiment, two sets of the third engagement mechanisms 70 are disposed between the lower cover 30 and the upper cover 40. The third engaging mechanism 70 includes at least a third engaging recess 71 concavely disposed on the lower cover 30 and a third engaging protrusion 72 convexly disposed on the lower cover 40 and opposite to the third engaging recess, the third engaging recess 71 and the third engaging protrusion 72 are engaged with each other in a tight-fitting manner or a mutual interference manner, so that the lower cover 30 and the upper cover 40 can be effectively engaged with each other, and the second circuit board 22 and the third circuit board 23 respectively extend to two sides of the lower cover 30 and the upper cover 40 after being combined with each other.
Then, the second circuit board 22 and the third circuit board 23 are bent with respect to the first circuit board 21 and then mounted in the first positioning slot 411 and the second positioning slot 421, respectively. In order to ensure that the second circuit board 22 and the third circuit board 23 can be reliably mounted in the first positioning slot 411 and the second positioning slot 421, at least one set of first engaging mechanisms 80 capable of engaging with each other is disposed between the second circuit board 22 and the first positioning slot 411 (in this embodiment, two sets of first engaging mechanisms 80 are disposed between the second circuit board 22 and the first positioning slot 411), and at least one set of second engaging mechanisms 90 capable of engaging with each other is disposed between the third circuit board 23 and the second positioning slot 421 (in this embodiment, two sets of second engaging mechanisms 90 are disposed between the third circuit board 23 and the second positioning slot 421). Each set of the first engaging mechanism 80 includes at least one first engaging protrusion 81 protruding from the second circuit board 22 and at least one first engaging recess 82 recessed in the first positioning slot 411 and corresponding to the first engaging protrusion 81. Each set of the second engaging mechanisms 90 includes at least one second engaging protrusion 91 protruding from the third circuit board 23 and at least one second engaging recess 92 recessed in the second positioning groove 421 and corresponding to the second engaging protrusion 91, and the first engaging mechanism 80 and the second engaging mechanism 90 are engaged with each other by a tight fit or interference. The second circuit board 22 and the third circuit board 23 can be effectively fixed in the first positioning slot 411 and the second positioning slot 421, respectively. The first engaging protrusion 81 and the second engaging protrusion 91 are directly formed on the second circuit board 22 and the third circuit board 23 by injection molding, so that the steps and procedures of the second circuit board 22 and the third circuit board 23 assembled in the first positioning slot 411 and the second positioning slot 421 can be greatly reduced. When the upper cover 40 is disposed on the lower cover 30, an angle is formed between the first sidewall 41 and the second sidewall 42 and the lower cover 30, so that a first included angle θ 1 is formed between the second circuit board 22 and the first circuit board 21, and a second included angle θ 2 is formed between the third circuit board 23 and the first circuit board 22.
Finally, the speaker 60 is mounted in the recessed groove 431 of the connecting wall 43, and the speaker 60 and the first circuit board 21 of the circuit loop 20 are electrically connected to each other. The power supply unit 50 is installed in the accommodating space 44, and the power supply unit 50 is electrically connected to the first circuit board 21 of the circuit loop 20. The inner mold structure 10 can form a modular design, and when the inner mold structure 10 is installed on the housing (not shown in the figures) of the wireless headset, the assembly of the wireless headset can be completed by directly installing the modular inner mold structure 10 on the housing, thereby greatly simplifying the assembly steps of the wireless headset, greatly reducing the labor required during assembly, and reducing the assembly cost.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A combined inner mold structure, comprising:
a circuit loop having at least one first circuit board and at least one second circuit board extending from the first circuit board;
a lower cover for mounting the first circuit board; and
the upper cover is arranged above the lower cover and used for fixing the first circuit board between the upper cover and the lower cover, the upper cover is provided with at least one first side wall which forms an angle with the lower cover, and the first side wall is provided with a first positioning groove used for accommodating the second circuit board, so that a first included angle is formed between the second circuit board and the first circuit board after the second circuit board is arranged in the first positioning groove.
2. The combined inner mold structure according to claim 1, wherein at least one set of first engaging means is further included between the second circuit board and the first positioning groove, such that the second circuit board is fixed in the first positioning groove by the first engaging means.
3. The combined inner mold structure according to claim 1, wherein the upper cover further comprises a second sidewall opposite to the first sidewall and a connecting wall connected between the first sidewall and the second sidewall, such that a receiving space is formed between the upper cover and the lower cover.
4. The combined inner mold structure according to claim 3, wherein the inner mold structure further comprises a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
5. The combined internal mold structure of claim 3, wherein the internal mold structure further comprises a speaker, and the connecting wall further forms a recessed slot for the speaker to be disposed, and the speaker is electrically connected to the circuit loop.
6. The combined inner mold structure according to claim 3, wherein the circuit loop further comprises a third circuit board extending from the first circuit board and opposing the second circuit board, and the second sidewall of the upper cover further comprises a second positioning groove for receiving the third circuit board, such that the third circuit board is mounted in the second positioning groove and then opposing the second circuit board, and a second angle is formed between the third circuit board and the first circuit board.
7. The combined inner mold structure according to claim 6, wherein at least one set of second engaging mechanisms is further included between the third circuit board and the second positioning groove, such that the third circuit board is fixed in the second positioning groove by the second engaging mechanisms.
8. The combined inner mold structure according to claim 6, wherein the first circuit board is a hard circuit board, and the second circuit board and the third circuit board are respectively a soft circuit board.
9. The internal mold structure of claim 3, wherein a through hole is further formed at a central portion of the lower cover, such that when the first circuit board is mounted on the lower cover, one surface of the first circuit board is protruded out of the receiving space and the other surface is exposed in the through hole.
10. The combined inner mold structure of claim 1, wherein a set of third engaging mechanisms is further included between the upper cover and the lower cover for engaging and fixing each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910060696.XA CN111464900B (en) | 2019-01-22 | 2019-01-22 | Combined internal mold structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910060696.XA CN111464900B (en) | 2019-01-22 | 2019-01-22 | Combined internal mold structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111464900A true CN111464900A (en) | 2020-07-28 |
| CN111464900B CN111464900B (en) | 2022-03-25 |
Family
ID=71678975
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910060696.XA Active CN111464900B (en) | 2019-01-22 | 2019-01-22 | Combined internal mold structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111464900B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002328291A (en) * | 2001-05-02 | 2002-11-15 | Horiba Ltd | Dust control device |
| CN102402255A (en) * | 2010-09-09 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| US20160050474A1 (en) * | 2014-08-12 | 2016-02-18 | Google Technology Holdings LLC | Circuit Assembly for Compact Acoustic Device |
-
2019
- 2019-01-22 CN CN201910060696.XA patent/CN111464900B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002328291A (en) * | 2001-05-02 | 2002-11-15 | Horiba Ltd | Dust control device |
| CN102402255A (en) * | 2010-09-09 | 2012-04-04 | 鸿富锦精密工业（深圳）有限公司 | Electronic device |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| US20160050474A1 (en) * | 2014-08-12 | 2016-02-18 | Google Technology Holdings LLC | Circuit Assembly for Compact Acoustic Device |
| US20170078784A1 (en) * | 2014-08-12 | 2017-03-16 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111464900B (en) | 2022-03-25 |
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