CN212519379U - TWS earphone - Google Patents

TWS earphone Download PDF

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Publication number
CN212519379U
CN212519379U CN202021258263.XU CN202021258263U CN212519379U CN 212519379 U CN212519379 U CN 212519379U CN 202021258263 U CN202021258263 U CN 202021258263U CN 212519379 U CN212519379 U CN 212519379U
Authority
CN
China
Prior art keywords
microphone
circuit board
earphone
sleeve
tws headset
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN202021258263.XU
Other languages
Chinese (zh)
Inventor
何柏胜
何芊
何辉
赖少兵
王勇
包磊
陈嘉宝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangzhou U&i Technology Co ltd
Original Assignee
Guangzhou U&i Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Guangzhou U&i Technology Co ltd filed Critical Guangzhou U&i Technology Co ltd
Priority to CN202021258263.XU priority Critical patent/CN212519379U/en
Application granted granted Critical
Publication of CN212519379U publication Critical patent/CN212519379U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a TWS earphone, which comprises a shell, and comprises an earphone head and an earphone arm, wherein an accommodating cavity is arranged in the earphone arm; the circuit board is arranged in the accommodating cavity; the microphone is arranged on the surface of the circuit board; the mounting bracket is arranged on the other surface of the circuit board, a microphone sleeve is arranged on the mounting bracket, and a through hole is formed between the microphone sleeve and the microphone; this TWS earphone is through setting up the installing support on the circuit board, and the microphone not only can be fixed a position to the installing support, can also fix the microphone cover, makes microphone cover and microphone stable cooperation use, has protected the microphone, prevents simultaneously that the microphone cover from warping, shifting in the assembling process, has improved assembly efficiency.

Description

TWS earphone
Technical Field
The utility model relates to an earphone technical field, in particular to TWS earphone.
Background
Most of the existing TWS earphones have a built-in microphone, but in actual production, the installation and positioning of the microphone are not considered, the position of the microphone and the microphone sleeve is often deviated in the assembling process, and the assembling step of placing the microphone into the earphone arm is very easy to collide due to the fact that the earphone arm is usually in a long and thin round rod shape, so that the position of the microphone and the microphone sleeve is deviated, the working quality of the microphone is affected, and the microphone is easily damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to solve one of the technical problem that exists among the prior art at least, provide a TWS earphone, can prevent that the microphone cover warp, shift at the equipment process.
According to a first aspect of the present invention, there is provided a TWS headset, comprising a housing, including a headset head and a headset arm, wherein an accommodating cavity is provided in the headset arm; the circuit board is arranged in the accommodating cavity; the microphone is arranged on the surface of the circuit board; the mounting bracket is arranged on the other surface of the circuit board, a microphone sleeve is arranged on the mounting bracket, the microphone sleeve and the microphone are positioned on the same vertical line, and a through hole is formed between the microphone sleeve and the microphone.
Has the advantages that: this TWS earphone is through setting up the installing support on the circuit board, and the microphone not only can be fixed a position to the installing support, can also fix the microphone cover, makes microphone cover and microphone stable cooperation use, has protected the microphone, prevents simultaneously that the microphone cover from warping, shifting in the assembling process, has improved assembly efficiency.
According to the utility model discloses the TWS earphone of first aspect embodiment, the one end that holds the chamber is seted up in the one end of earphone arm, and the other end that holds the chamber extends to in the earphone head, guarantees the normal installation and the wiring of circuit board.
According to the utility model discloses the TWS earphone of first aspect embodiment, the one end setting of circuit board holds the chamber and serves, and the other end setting of circuit board makes things convenient for fixed circuit board in the earphone head.
According to the utility model discloses the TWS earphone of first aspect embodiment, one of circuit board serves and is equipped with the depressed part, is equipped with the protruding portion in the earphone head, and the mode that the protruding portion passes through the buckle to be connected is installed on the depressed part, and the mode installation through the buckle is more convenient, and the maintenance of being convenient for.
According to the utility model discloses the TWS earphone of first aspect embodiment, the installing support is square, and is equipped with the opening on at least one edge, and the microphone cover can be put into from the opening, convenient assembly.
According to the utility model discloses TWS earphone of first aspect embodiment, the upper end of installing support is equipped with the inside flanging, and the microphone cover is fixed between inside flanging and circuit board.
According to the utility model discloses the TWS earphone of first aspect embodiment is equipped with the boss on the microphone cover, boss and inside flanging gomphosis, through inside flanging and boss gomphosis, can guarantee that microphone cover installation location is more accurate.
According to the utility model discloses the TWS earphone of first aspect embodiment is equipped with first mounting hole on the microphone cover, is equipped with helicitic texture on the first mounting hole, and helicitic texture fixes the microphone cover on the circuit board, avoids the displacement.
According to the utility model discloses the TWS earphone of first aspect embodiment is equipped with the second mounting hole on the earphone arm, and the helicitic texture can be screwed up at any time to second mounting hole and first mounting hole intercommunication.
According to the utility model discloses TWS earphone of first aspect embodiment, the circuit board is the PCB board, makes things convenient for arranging of circuit.
Drawings
In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.
Fig. 1 is a schematic structural diagram of an embodiment of the present invention.
Detailed Description
This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, a TWS headset includes a housing 10 including a headset head 11 and a headset arm 12, wherein a receiving cavity 122 is provided in the headset arm 12; a circuit board 20 disposed in the accommodation chamber 122; a microphone 50 disposed on a surface of the circuit board 20; the mounting bracket 30 is arranged on the other surface of the circuit board 20, the microphone sleeve 40 is arranged on the mounting bracket 30, the microphone sleeve 40 and the microphone 50 are positioned on the same vertical line, the through hole 22 is formed between the microphone sleeve 40 and the microphone 50, and sound transmission is facilitated through the through hole 22. According to the TWS earphone, the mounting support 30 is arranged on the circuit board 20, the microphone 50 can be positioned by the mounting support 30, the microphone sleeve 40 can be fixed, the microphone sleeve 40 and the microphone 50 can be stably matched for use, the microphone 50 is protected, meanwhile, the microphone sleeve 40 is prevented from deforming and displacing in the assembling process, and the assembling efficiency is improved.
In the present embodiment, the microphone 50 is soldered on the upper surface of the circuit board 20, and the mounting bracket 30 is soldered on the lower surface of the circuit board 20, and the positions of the mounting bracket 30 and the microphone 50 are overlapped on the vertical projection plane, including but not limited to the microphone sleeve 40 and the microphone 50 being on the same vertical line. In other embodiments, the microphone 50 may be soldered to the lower surface of the circuit board 20, and the mounting bracket 30 may be soldered to the upper surface of the circuit board 20.
In this embodiment, one end of the receiving cavity 122 is opened at one end of the earphone arm 12, and the other end of the receiving cavity 122 extends into the earphone head 11, so as to ensure the normal installation and wiring of the circuit board 20. One end of the circuit board 20 is disposed at one end of the accommodating cavity 122 to close the accommodating cavity 122, and the other end of the circuit board 20 is disposed in the earphone head 11 to facilitate fixing the circuit board 20. One of circuit board 20 is served and is equipped with depressed part 21, is equipped with protruding portion 123 in the earphone head 11, and protruding portion 123 is installed on depressed part 21 through the mode of buckle connection, and the mode installation through the buckle is more convenient, and be convenient for maintain.
In this embodiment, the mounting bracket 30 is square, and at least one side of the mounting bracket is provided with an opening, and the cross section of the mounting bracket is Contraband, so that the microphone boot 40 can be put in the opening, thereby facilitating the assembly. The upper end of the mounting bracket 30 is provided with an inward flange, and the microphone boot 40 is fixed between the inward flange and the circuit board 20. The microphone sleeve 40 is provided with a boss which is embedded with the inner flanging, and the microphone sleeve 40 can be ensured to be more accurately installed and positioned through the embedding of the inner flanging and the boss.
In this embodiment, the microphone sleeve 40 is provided with a first mounting hole, the first mounting hole is provided with a thread structure 60, the thread structure 60 fixes the microphone sleeve 40 on the circuit board 20, and the microphone sleeve 40 is fixed on the circuit board 20 to avoid displacement. The second mounting hole 121 is formed in the earphone arm 12, and the second mounting hole 121 is communicated with the first mounting hole, so that the thread structure 60 can be screwed at any time. The thread structure 60 may preferably be a screw.
In the present embodiment, the circuit board 20 is a PCB board, which facilitates the arrangement of the circuit.
TWS is an abbreviation of True Wireless Stereo in english, whose TWS headset is a Wireless headset developed based on bluetooth technology.
When the TWS earphone is specifically assembled, firstly, the mounting support 30 is welded on the circuit board 20 according to a designed position, the microphone 50 is welded at a corresponding position, wherein the microphone 50 and the mounting support 30 are respectively positioned on different surfaces of the circuit board 20, then the microphone sleeve 40 is embedded on the mounting support 30, and the mounting and fixing are carried out through the thread structure 60, at the moment, the thread structure 60 is only primarily fixed, then the circuit board 20 is pushed in from one end of the earphone arm 12, the protruding part 123 in the earphone head 11 is found, the other end of the circuit board 20 is fixed through buckling connection, then one end of the circuit board 20 is fixed at one end of the earphone arm 12, finally, the position of the microphone sleeve 40 is finely adjusted through the second mounting hole 121 reserved on the earphone arm 12, then the thread structure 60 is screwed, and the assembling of the TWS earphone is completed. The microphone boot 40 can be reliably fixed and positioned in the whole process, and the microphone boot 40 is prevented from being deformed and displaced in the assembling process.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (10)

1. A TWS headset, comprising:
the earphone comprises a shell, a handle and a handle, wherein the shell comprises an earphone head and an earphone arm, and an accommodating cavity is formed in the earphone arm;
the circuit board is arranged in the accommodating cavity;
a microphone disposed on a surface of the circuit board;
the mounting bracket is arranged on the other surface of the circuit board, a microphone sleeve is arranged on the mounting bracket, the microphone sleeve and the microphone are positioned on the same vertical line, and a through hole is formed between the microphone sleeve and the microphone.
2. The TWS headset of claim 1, wherein: the one end that holds the chamber is seted up the one end of earphone arm, the other end that holds the chamber extends to in the earphone head.
3. The TWS headset of claim 2, wherein: one end of the circuit board is arranged at one end of the accommodating cavity, and the other end of the circuit board is arranged in the earphone head.
4. A TWS headset according to claim 3, characterized in that: one of circuit board serves and is equipped with the depressed part, be equipped with the protruding portion in the earphone head, the protruding portion passes through the mode of buckle connection and installs on the depressed part.
5. The TWS headset of claim 1, wherein: the mounting bracket is square, and at least one edge is provided with an opening.
6. The TWS headset of claim 5, wherein: the microphone is characterized in that an inner flanging is arranged at the upper end of the mounting support, and the microphone sleeve is fixed between the inner flanging and the circuit board.
7. The TWS headset of claim 6, wherein: the microphone sleeve is provided with a boss, and the boss is embedded with the inward flange.
8. The TWS headset of claim 7, wherein: the microphone sleeve is provided with a first mounting hole, the first mounting hole is provided with a thread structure, and the thread structure fixes the microphone sleeve on the circuit board.
9. The TWS headset of claim 8, wherein: and a second mounting hole is formed in the earphone arm and communicated with the first mounting hole.
10. The TWS headset of claim 1, wherein: the circuit board is a PCB board.
CN202021258263.XU 2020-06-30 2020-06-30 TWS earphone Expired - Fee Related CN212519379U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202021258263.XU CN212519379U (en) 2020-06-30 2020-06-30 TWS earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202021258263.XU CN212519379U (en) 2020-06-30 2020-06-30 TWS earphone

Publications (1)

Publication Number Publication Date
CN212519379U true CN212519379U (en) 2021-02-09

Family

ID=74432853

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202021258263.XU Expired - Fee Related CN212519379U (en) 2020-06-30 2020-06-30 TWS earphone

Country Status (1)

Country Link
CN (1) CN212519379U (en)

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GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20210209