CN111464898A - Combined inner module - Google Patents
Combined inner module Download PDFInfo
- Publication number
- CN111464898A CN111464898A CN201910046598.0A CN201910046598A CN111464898A CN 111464898 A CN111464898 A CN 111464898A CN 201910046598 A CN201910046598 A CN 201910046598A CN 111464898 A CN111464898 A CN 111464898A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- positioning groove
- inner module
- lower cover
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/10—Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
- H04R2201/105—Manufacture of mono- or stereophonic headphone components
Abstract
An inner module for a wireless earphone is mainly used for being installed in the wireless earphone and comprises a circuit loop and an upper cover. The circuit loop comprises at least one first circuit board, at least one second circuit board extending from the first circuit board, and a lower cover covering the first circuit board. The upper cover is used for being installed on the lower cover and is provided with at least one first side wall which forms an angle with the insulating base, and the first side wall is provided with a first positioning groove which is used for accommodating the second circuit board. The inner module component is further made into a modular design to simplify the assembling steps of the wireless earphone, and the labor cost required by the assembling of the wireless earphone is greatly reduced.
Description
Technical Field
The present invention relates to a combined inner module, and more particularly, to an inner module which is installed in a wireless headset using a modular design and can greatly reduce the assembly cost.
Background
The earphone is used for connecting the electronic device so as to transmit the sound emitted by the electronic device to the ear of the human body through the earphone. Common earphones include wired earphones connected to the electronic device via wires and wireless earphones connected to the electronic device via wireless communication transmission such as bluetooth (r) or the like (e.g., atrpod (r) products published by Apple inc.).
Because the wired earphone must be connected with the electronic device through a circuit, the application range of the wired earphone is limited, and meanwhile, the wired earphone is easy to pull due to the circuit, and the wires are easy to intertwine when being stored. The wireless earphone is transmitted by wireless communication, so the wireless earphone is used in a longer range than the wired earphone, and the wireless circuit is easy to pull or intertwine, so the wireless earphone gradually replaces the wired earphone.
A general earphone is generally provided with a circuit board, a speaker, and the like inside, except for the outside covered with a case. The inside of the wireless earphone must be provided with components such as a battery, a microphone, a wireless transmission module and the like. Since there are many components inside the wireless earphone, generally, when the wireless earphone is assembled, the circuit board, the speaker, the battery, the microphone, and the wireless transmission module are sequentially installed and fixed inside the housing. Therefore, when the wireless earphone is assembled, a large amount of manpower is required to assemble the wireless earphone, which not only increases the manpower cost, but also causes the limited internal assembly space due to the small volume of the wireless earphone, so that the components are easily damaged due to careless assembly, and the assembly yield of the wireless earphone is poor.
Therefore, how to provide an inner module component which is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost is the technical means and the purpose to be solved by the invention.
Disclosure of Invention
The present invention provides a combined inner module, and more particularly, to an inner module which is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost.
To achieve the above objective, the present invention first provides an inner module for a wireless earphone, which includes a circuit loop and an upper cover. The circuit loop comprises at least one first circuit board, at least one second circuit board extending from the first circuit board, and a lower cover covering the first circuit board. The upper cover is used for being installed on the lower cover and provided with at least one first side wall which forms an angle with the lower cover, and a first positioning groove used for containing the second circuit board is arranged on the first side wall. The inner module component is further made into a modular design to simplify the assembling steps of the wireless earphone, and the labor cost required by the assembling of the wireless earphone is greatly reduced.
In an embodiment, the upper cover further includes a second sidewall opposite to the first sidewall and a connecting wall connected between the first sidewall and the second sidewall, so that an accommodating space is formed between the upper cover and the lower cover.
In an embodiment, the inner module further includes a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
In one embodiment, the circuit loop further includes a third circuit board extending from the first circuit board and opposite to the second circuit board, and the second sidewall of the top cover further includes a second positioning groove for receiving the third circuit board, such that the third circuit board is mounted in the second positioning groove and then opposite to the second circuit board.
In an embodiment, the second circuit board further includes at least one set of first engaging mechanism engaged with the first positioning groove, so that the second circuit board is fixed in the first positioning groove by the first engaging mechanism, and the third circuit board further includes at least one set of second engaging mechanism engaged with the second positioning groove, so that the third circuit board is fixed in the second positioning groove by the second engaging mechanism.
Compared with the prior art, the inner module component for the wireless earphone has the following advantages:
the inner module piece can integrate the circuit loop, the power supply unit and the loudspeaker together in advance through the upper cover and the lower cover, so that the inner module piece forms a modular design, and the labor cost required during assembly can be greatly reduced.
The inner module can change the shapes of the upper cover and the lower cover according to the shape of the wireless earphone, and can be suitable for the wireless earphones with different shapes.
To achieve the above objective, the present invention further provides an inner module for a wireless headset, which includes a circuit loop and an insulating base. The circuit loop is provided with at least one first circuit board and at least one second circuit board extending from the first circuit board. The insulating base is formed on the first circuit board and is provided with a lower cover used for coating the first circuit board and an upper cover extending from the lower cover and forming an accommodating space, the upper cover comprises a first side wall extending from the lower cover, a second side wall extending from the lower cover and corresponding to the first side wall and a connecting wall connecting the first side wall and the second side wall and opposite to the lower cover, and the first side wall is provided with a first positioning groove used for accommodating the second circuit board. The inner module component is further made into a modular design to simplify the assembling steps of the wireless earphone, and the labor cost required by the assembling of the wireless earphone is greatly reduced.
In an embodiment, the inner module further includes a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
In one embodiment, the circuit loop further includes a third circuit board extending from the first circuit board and opposite to the second circuit board, and the second sidewall of the insulating base further includes a second positioning groove for receiving the third circuit board.
In an embodiment, the second circuit board further includes at least one set of first engaging mechanism engaged with the first positioning groove, so that the second circuit board is fixed in the first positioning groove by the first engaging mechanism, and the third circuit board further includes at least one set of second engaging mechanism engaged with the second positioning groove, so that the third circuit board is fixed in the second positioning groove by the second engaging mechanism.
In an embodiment, the inner module further includes a speaker electrically connected to the circuit loop, and the connecting wall of the insulating base further has a recessed slot for the speaker to be disposed.
Compared with the prior art, the inner module component for the wireless earphone has the following advantages:
the inner module piece can directly integrate the circuit loop, the power supply unit and the loudspeaker together through the insulating seat, so that the inner module piece forms a modular design, and the labor cost required in assembly can be greatly reduced.
The inner module can change the shape of the insulating seat according to the shape of the wireless earphone, and can be suitable for the wireless earphones with different shapes.
Drawings
Fig. 1 is a first perspective reference view of the first embodiment of the present invention in a use state.
FIG. 2 is a second perspective view of the first embodiment of the present invention.
Fig. 3 is a perspective view of the circuit loop of the present invention.
Fig. 4 is a first perspective view of the circuit loop and the upper cover in an exploded state according to the first embodiment of the present invention.
FIG. 5 is a second perspective view of the circuit loop and the top cover in an exploded state according to the first embodiment of the present invention.
FIG. 6 is a first perspective view of the second embodiment of the present invention in use.
FIG. 7 is a second perspective view of the second embodiment of the present invention.
Fig. 8 is a first perspective view of the circuit loop and the upper cover in an exploded state according to the second embodiment of the present invention.
Fig. 9 is a second perspective view of the circuit loop and the upper cover in an exploded state according to a second embodiment of the present invention.
Fig. 10 is a perspective view of a third embodiment of the present invention.
[ notation ] to show
10. 10 ', 10' inner module
20 circuit loop
21 first circuit board
22 second circuit board
23 third circuit board
24 lower cover
30. 30' upper cover
31. 31' first side wall
311. 311' first positioning groove
32. 32' second side wall
321. 321' second positioning groove
33. 33' connecting wall
331' caulking groove
34. 34', 34 ″
40 power supply unit
50 first fitting mechanism
51 first fitting projection
52 first fitting recess
60 second fitting mechanism
61 second fitting projection
62 second fitting groove
70 speaker
80 insulating base
Detailed Description
The detailed description and technical contents of the present invention will now be described with reference to the accompanying drawings:
as shown in fig. 1 to 5, the present invention is an internal module for a wireless headset, the internal module is configured to be installed in a housing (not described in detail in the prior art) of a wireless headset, and the internal module 10 includes a circuit loop 20, an upper cover 30 and a power supply unit 40.
The circuit loop 20 is composed of a first circuit board 21, a second circuit board 22, a third circuit board 23 and a lower cover 24. The first circuit board 21 is a hard circuit board. The second circuit board 22 and the third circuit board 23 are respectively a flexible circuit board and extend from two opposite sides of the first circuit board 21, so that the second circuit board 22 and the third circuit board 23 are opposite to each other. The lower cover 24 is directly formed on the first circuit board 21 by injection molding to cover the first circuit board 21, and part of the circuit contacts on the first circuit board 21 are exposed above and below the lower cover 24, and the second circuit board 22 and the third circuit board 23 extend from two opposite sides of the lower cover 24 respectively. The circuit loop 20 can be composed of a hard circuit board and a flexible circuit board, or a hard circuit board. And the first circuit board 21, the second circuit board 22 and the third circuit board 23 are electrically connected to each other.
The upper cover 30 is disposed on the lower cover 24, and the upper cover 30 includes a first sidewall 31, a second sidewall 32, and a connecting wall 33 connecting the first sidewall 31 and the second sidewall 32. The first sidewall 31 and the second sidewall 32 are opposite to each other, and when the upper cover 30 is disposed above the lower cover 24, an accommodating space 34 for the power supply unit 40 to be disposed is formed between the lower cover 24 and the upper cover 30. The first sidewall 31 further has a first positioning groove 311 for receiving the second circuit board 22, and the second sidewall 32 further has a second positioning groove 321 for receiving the third circuit board 23.
During assembly, the lower cover 24 is formed on the first circuit board 21, and the upper cover 30 is mounted on the lower cover 24 to form the accommodating space 34, so that the circuit connecting (not labeled) portion of one side of the first circuit board 21 is exposed in the accommodating space 34, and the upper cover 30 and the lower cover 24 can be assembled with each other by means of mutual engagement.
Then, the second circuit board 22 and the third circuit board 23 are bent with respect to the first circuit board 21 and then mounted in the first positioning slot 311 and the second positioning slot 321, respectively. In order to ensure that the second circuit board 22 and the third circuit board 23 can be installed in the first positioning groove 311 and the second positioning groove 321 respectively, at least one set of first engaging mechanisms 50 capable of engaging with each other is disposed between the second circuit board 22 and the first positioning groove 311, and at least one set of second engaging mechanisms 60 capable of engaging with each other is disposed between the third circuit board 23 and the second positioning groove 321 (in this embodiment, two sets of second engaging mechanisms 60 are disposed between the third circuit board 23 and the second positioning groove 321). The first engaging mechanism 50 includes at least one first engaging protrusion 51 protruding from the second circuit board 22 and at least one first engaging recess 52 recessed in the first positioning groove 311 and corresponding to the first engaging protrusion 51. Each set of the second engaging mechanism 60 includes at least one second engaging protrusion 61 protruding from the third circuit board 23 and at least one second engaging recess 62 recessed in the second positioning groove 321 and corresponding to the second engaging protrusion 61, and the first engaging mechanism 50 and the second engaging mechanism 60 are engaged with each other by a tight fit or interference, so that the second circuit board 22 and the third circuit board 23 can be effectively fixed in the first positioning groove 311 and the second positioning groove 321, respectively. The first engaging protrusion 51 and the second engaging protrusion 61 are directly formed on the second circuit board 22 and the third circuit board 23 by injection molding, so that the steps and procedures of assembling the second circuit board 22 and the third circuit board 23 in the first positioning groove 311 and the second positioning groove 321 can be greatly simplified.
Finally, the power supply unit 40 is installed in the accommodating space, and the power supply unit 40 and the first circuit board 21 are electrically connected to each other, so that the inner module 10 can form a modular design. When the inner module 10 is installed inside the housing of the wireless headset, the assembly of the wireless headset can be completed as long as the modularized inner module 10 is directly installed in the housing, thereby greatly simplifying the assembly steps of the wireless headset, greatly reducing the labor required during assembly and reducing the assembly cost.
Referring to fig. 3, 6 to 9, in the present embodiment, the inner module 10 'includes the circuit loop 20, an upper cover 30', the power supply unit 40 and a speaker 70.
The circuit loop 20 is also composed of a first circuit board 21, a second circuit board 22, a third circuit board 23 and a lower cover 24. The top cover 30 'also includes a first sidewall 31', a second sidewall 32 ', and a connecting wall 33' connecting the first sidewall 31 'and the second sidewall 32', and the connecting wall 33 'is further provided with a recess 331' for receiving the speaker 70.
In the assembly of the present embodiment, the lower cover 24 is first formed on the first circuit board 21 of the circuit loop 20 by injection molding, then, the upper cover 30 'is mounted on the lower cover 24, such that the receiving space 34' is formed between the lower cover 24 and the upper cover 30 ', and then the second circuit board 22 is embedded in the first positioning slot 311', the third circuit board 23 is embedded in the second positioning groove 321 ', and then the power supply unit 40 is installed in the accommodating space 34', and electrically connected to the circuit loop 20, and finally the speaker 70 is installed in the slot 331', and the speaker 70 is electrically connected to the circuit loop 20, so that, the speaker 70 can be effectively fixed on the upper cover 30 'and electrically connected to the circuit loop 20, thereby completing the assembly of the inner module 10'.
In addition, in the embodiment, two sets of the first engaging mechanisms 50 are disposed between the second circuit board 22 and the first positioning slot 311 ', two first engaging bumps 51 are disposed on the second circuit board 22, and the first engaging grooves 52 are disposed at positions corresponding to each of the first engaging bumps 51 in the first positioning slot 321', so that the second circuit board 22 can be more effectively fixed in the first positioning slot 321 'by two sets of the first engaging mechanisms 50, and the second circuit board 22 is further prevented from falling off from the first positioning slot 321'.
As shown in fig. 3 and 7 to 10, in the present embodiment, an insulating base 80 having the accommodating space 34 ″ is directly formed on the first circuit board 21 of the circuit loop 20 by an injection molding method. In other words, the insulating base 80 includes the lower cover 24 and the upper cover 30 ', and the upper cover is integrally extended from the lower cover, that is, the first sidewall 31' and the second sidewall 32 'are respectively extended from the lower cover 24 and are opposite to each other, and the connecting wall 33' connects the first sidewall 31 'and the second sidewall 32' and is opposite to the lower cover 24.
Since the insulating base 80 is directly formed on the first circuit board 21, after the insulating base 80 is formed, the second circuit board 22 is fixed in the first positioning groove 311 ' through the two sets of the first engaging mechanisms 50, the third circuit board 23 is fixed in the second positioning groove 321 ' through the two sets of the second engaging mechanisms 60, the power supply unit 40 is installed in the accommodating space 34 ' and electrically connected to the circuit loop 20, and finally the speaker 70 is installed in the engaging groove 341 "and electrically connected to the circuit loop 20, thereby completing the assembly of the inner module 10". Therefore, the assembly process of the inner module 10 ″ can be simplified, and the second circuit board 22 and the third circuit board 23 can be prevented from falling off from the insulating base 80.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An inner module for a wireless headset, comprising:
a circuit loop having at least a first circuit board, at least a second circuit board extending from the first circuit board, and a lower cover covering the first circuit board; and
and the upper cover is used for being arranged on the lower cover and is provided with at least one first side wall which forms an angle with the insulating base, and the first side wall is provided with a first positioning groove for accommodating the second circuit board.
2. The inner module for a wireless earphone according to claim 1, wherein the upper cover further comprises a second sidewall opposite to the first sidewall and a connecting wall connected between the first sidewall and the second sidewall, such that a receiving space is formed between the upper cover and the lower cover.
3. The inner modular assembly of claim 2, further comprising a power supply unit disposed in the accommodating space, wherein the power supply unit is electrically connected to the circuit loop.
4. The modular inner member of claim 2, wherein the circuit loop further comprises a third circuit board extending from the first circuit board and opposing the second circuit board, and the second sidewall of the top cover further comprises a second positioning slot for receiving the third circuit board, such that the third circuit board is mounted in the second positioning slot and then opposing the second circuit board.
5. The inner module of claim 4, wherein the second circuit board and the first positioning groove further comprise at least one set of first engaging mechanisms engaging with each other, such that the second circuit board is fixed in the first positioning groove by the first engaging mechanisms, and the third circuit board and the second positioning groove further comprise at least one set of second engaging mechanisms engaging with each other, such that the third circuit board is fixed in the second positioning groove by the second engaging mechanisms.
6. An inner module for a wireless headset, comprising:
a circuit loop having at least one first circuit board and at least one second circuit board extending from the first circuit board; and
the insulating base is formed on the first circuit board and provided with a lower cover used for coating the first circuit board and an upper cover extending from the lower cover and forming an accommodating space, the upper cover comprises a first side wall extending from the lower cover, a second side wall extending from the lower cover and corresponding to the first side wall and a connecting wall connecting the first side wall and the second side wall and opposite to the lower cover, and the first side wall is provided with a first positioning groove used for accommodating the second circuit board.
7. The inner module for a wireless earphone according to claim 6, wherein the inner module further comprises a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
8. The inner module for a wireless earphone according to claim 6, wherein the circuit loop further comprises a third circuit board extending from the first circuit board and opposite to the second circuit board, and the second sidewall of the insulating base further comprises a second positioning groove for receiving the third circuit board.
9. The inner module for a wireless earphone according to claim 8, wherein at least one set of first engaging means is further included between the second circuit board and the first positioning groove for engaging with each other, so that the second circuit board is fixed in the first positioning groove by the first engaging means, and at least one set of second engaging means is further included between the third circuit board and the second positioning groove for engaging with each other, so that the third circuit board is fixed in the second positioning groove by the second engaging means.
10. The inner module for a wireless earphone according to claim 6, wherein the inner module further comprises a speaker electrically connected to the circuit loop, and the connecting wall of the insulating base further has a recessed groove for the speaker to be disposed therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910046598.0A CN111464898A (en) | 2019-01-22 | 2019-01-22 | Combined inner module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910046598.0A CN111464898A (en) | 2019-01-22 | 2019-01-22 | Combined inner module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111464898A true CN111464898A (en) | 2020-07-28 |
Family
ID=71682117
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910046598.0A Pending CN111464898A (en) | 2019-01-22 | 2019-01-22 | Combined inner module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111464898A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002328291A (en) * | 2001-05-02 | 2002-11-15 | Horiba Ltd | Dust control device |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| JP2014126495A (en) * | 2012-12-27 | 2014-07-07 | Seiko Epson Corp | Sensor, electronic apparatus, and moving body |
| US20170064830A1 (en) * | 2015-08-24 | 2017-03-02 | Motorola Mobility Llc | Circuit Assembly for Compact Acoustic Device |
| US20170078784A1 (en) * | 2014-08-12 | 2017-03-16 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
| US20180255389A1 (en) * | 2007-01-06 | 2018-09-06 | Apple Inc. | Headset connector |
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
-
2019
- 2019-01-22 CN CN201910046598.0A patent/CN111464898A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002328291A (en) * | 2001-05-02 | 2002-11-15 | Horiba Ltd | Dust control device |
| US20180255389A1 (en) * | 2007-01-06 | 2018-09-06 | Apple Inc. | Headset connector |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| JP2014126495A (en) * | 2012-12-27 | 2014-07-07 | Seiko Epson Corp | Sensor, electronic apparatus, and moving body |
| US20170078784A1 (en) * | 2014-08-12 | 2017-03-16 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
| US20170064830A1 (en) * | 2015-08-24 | 2017-03-02 | Motorola Mobility Llc | Circuit Assembly for Compact Acoustic Device |
| CN108566729A (en) * | 2018-06-25 | 2018-09-21 | Oppo广东移动通信有限公司 | Circuit board assemblies and electronic equipment with it |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2012029288A (en) | Electronic equipment with audio function | |
| CN211702356U (en) | Bone conduction earphone | |
| CN211880590U (en) | Bone conduction earphone | |
| CN211880592U (en) | Earphone communication system | |
| US20080008468A1 (en) | Camera module | |
| US8374372B2 (en) | Headset | |
| JP2000299723A (en) | Mount structure for acoustic component of mobile radio unit | |
| CN108696782B (en) | Drive-by-wire subassembly and drive-by-wire formula bluetooth headset | |
| JP2012155873A (en) | Waterproof structure of jack | |
| TWI750435B (en) | Combined internal mold structure | |
| CN111464900B (en) | Combined internal mold structure | |
| CN111464898A (en) | Combined inner module | |
| CN106104733B (en) | Switching device with radio function | |
| JP6703161B1 (en) | Internal module used for wireless earphones | |
| JP6703163B1 (en) | Internal module molded using metal strip | |
| CN215344998U (en) | Earphone charging box | |
| CN111447520B (en) | Internal module with fastener | |
| CN111447533B (en) | Internal module formed by metal material belt | |
| CN211702355U (en) | Bone conduction earphone | |
| CN212463474U (en) | Bone conduction earphone | |
| CN211702358U (en) | Bone conduction earphone | |
| CN211702354U (en) | Bone conduction earphone | |
| CN111182424A (en) | Sound production device and electronic terminal | |
| JP6703162B1 (en) | Internal module with fasteners | |
| CN210092452U (en) | Mobile terminal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20200728 |