CN111447520B - Internal module with fastener - Google Patents
Internal module with fastener Download PDFInfo
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- CN111447520B CN111447520B CN201910035365.0A CN201910035365A CN111447520B CN 111447520 B CN111447520 B CN 111447520B CN 201910035365 A CN201910035365 A CN 201910035365A CN 111447520 B CN111447520 B CN 111447520B
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- circuit board
- fastening
- fastener
- sidewall
- disposed
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
- H04R1/1058—Manufacture or assembly
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses an internal module with a fastener, which is mainly used for being installed in a wireless earphone and comprises a circuit loop, an insulating seat for fixing the circuit loop and at least one fastener. The circuit loop has at least one first circuit board and at least one second circuit board extending from the first circuit board. The insulating base is provided with at least one bottom plate for coating the first circuit board and a first side wall extending from the bottom plate, and the first side wall is provided with a first positioning groove for the second circuit board to be arranged. The fastener is used for being fixed on the first side wall so as to fix the second circuit board in the first positioning groove. Thereby forming a modular design to simplify the assembly steps of the wireless headset.
Description
Technical Field
The invention belongs to the technical field of electronic equipment, relates to an internal module with a fastener, and particularly relates to an internal module which is arranged in a wireless earphone by utilizing a modular design and can greatly reduce the assembly cost.
Background
The earphone is used for connecting the electronic device so as to transmit the sound emitted by the electronic device to the ear of the human body through the earphone. Common headsets are classified into wired headsets connected to the electronic device through a wire, and wireless headsets (such as atrpod products published by Apple inc.), which are connected to the electronic device through wireless communication transmission such as bluetooth.
Because the wired earphone must be connected with the electronic device through a circuit, the application range of the wired earphone is limited, and meanwhile, the wired earphone is easy to pull due to the circuit, and the wires are easy to intertwine when being stored. The wireless earphone is transmitted by wireless communication, so the wireless earphone is used in a longer range than the wired earphone, and the wireless circuit is easy to pull or intertwine, so the wireless earphone gradually replaces the wired earphone.
A general earphone is generally provided with a circuit board, a speaker, and the like inside, except for the outside covered with a case. The wireless earphone must be provided with components such as a battery, a microphone, a wireless transmission module and the like. Since there are many components inside the wireless earphone, generally, when the wireless earphone is assembled, the circuit board, the speaker, the battery, the microphone, and the wireless transmission module are sequentially installed and fixed inside the housing. Therefore, when the wireless earphone is assembled, a large amount of manpower is needed to assemble the wireless earphone, which not only increases the manpower cost, but also causes the limited internal assembly space due to the small volume of the wireless earphone, so that the components are easily damaged due to careless assembly, and the assembly qualification rate of the wireless earphone is poor.
Therefore, how to provide an internal module which is installed inside a wireless headset by using a modular design and can greatly reduce the assembly cost is the technical means and the purpose to be solved in the invention.
Disclosure of Invention
The present invention is directed to an internal module with a fastener, and more particularly, to an internal module which is installed inside a wireless headset by using a modular design and can greatly reduce the assembly cost.
To achieve the above objective, the present invention provides an internal module with a fastener, which includes a circuit loop, an insulating base and at least a first fastener. The circuit loop is provided with at least one first circuit board and at least one second circuit board extending from the first circuit board. The insulating base is provided with at least one bottom plate for coating the first circuit board and a first side wall extending from the bottom plate, and the first side wall is provided with a first positioning groove for the second circuit board to be arranged. The first fastener is used for being fixed on the first side wall so as to fix the second circuit board in the first positioning groove.
In one embodiment, the circuit loop further includes a third circuit board extending from the first circuit board and opposite to the second circuit board.
In an embodiment, the insulating base further includes a second sidewall extending from the bottom plate and opposite to the first sidewall, and the second sidewall has a second positioning slot for the third circuit board to be disposed thereon.
In an embodiment, the insulating base further includes a connecting wall opposite to the bottom plate and connecting the first sidewall and the second sidewall, so that an accommodating space for a power supply unit is formed on the insulating base, and when the power supply unit is disposed in the accommodating space, the power supply unit and the circuit loop are electrically connected to each other.
In an embodiment, the connection wall is further provided with a caulking groove for a speaker to be disposed, and when the power supply unit is disposed in the accommodating space, the power supply unit and the circuit loop are electrically connected to each other.
In an embodiment, the inner module further includes a second fastening member, and the second fastening member is configured to be fixed on the second sidewall to fix the third circuit board in the second positioning groove.
In one embodiment, at least one pair of second fastening structures is disposed between the second sidewall and the second fastening member.
In an embodiment, the second fastening structure includes a second fastening hole disposed on the second sidewall and a second fastening bump disposed on the second fastening member and fastened to the second fastening hole.
In one embodiment, at least one pair of first fastening structures is disposed between the first sidewall and the first fastening component.
In an embodiment, the first fastening structure includes a first fastening hole disposed on the first sidewall and a first fastening protrusion disposed on the first fastening component and fastened to the first fastening hole.
The internal module for the wireless earphone of the embodiment has the following advantages compared with the prior art:
the internal module can directly integrate the circuit loop, the power supply unit and the loudspeaker together through the insulating base, so that the internal module forms a modular design, and the labor cost required during assembly can be greatly reduced.
The internal module can change the shape of the insulating seat according to the shape of the wireless earphone, and can be suitable for the wireless earphones with different shapes.
Drawings
Fig. 1 is a first perspective view of the present invention in use.
Fig. 2 is a schematic view of a second viewing angle in a use state of the present invention.
Fig. 3 is a perspective view of the circuit loop of the present invention.
Fig. 4 is a schematic view of a first perspective of the insulating base formed on the circuit loop according to the present invention.
FIG. 5 is a second perspective view of the insulating base formed on the circuit loop according to the present invention.
FIG. 6 is a schematic view of the fastener and the insulating base in a disassembled state from a first perspective.
FIG. 7 is a second perspective view of the fastener and the insulating base in an exploded state.
[ notation ] to show
10 inner module
20 circuit loop
21 first circuit board
22 second circuit board
221 first positioning block
222 third positioning block
23 third circuit board
231 second positioning block
232 fourth positioning block
30 insulating base
31 bottom plate
32 first side wall
321 first positioning groove
322 first fastening hole
323 third fastening hole
33 second side wall
331 second positioning groove
332 second fastening hole
333 fourth fastening hole
34 connecting wall
341 caulking groove
35 accommodating space
40 fastener
41 first fastener
411 first fastening block
42 second fastener
421 second fastening projection
43 third fastener
431 third buckling bump
44 fourth fastener
441 fourth fastening projection
50 power supply unit
60 loudspeaker
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
The detailed description and technical contents of the present invention will now be described with reference to the accompanying drawings:
as shown in fig. 1 to 7, the present invention is an internal module with fasteners, and the internal module 10 is configured to be installed in a housing (not described in detail in the prior art) of a wireless headset and includes a circuit loop 20, an insulating base 30, at least one fastener 40, a power supply unit 50, and a speaker 60.
The circuit loop 20 is composed of a first circuit board 21, a second circuit board 22 and a third circuit board 23. The first circuit board 21 is a hard circuit board. The second circuit board 22 and the third circuit board 23 are respectively a flexible circuit board, and extend from two opposite sides of the first circuit board 21, so that the second circuit board 22 and the third circuit board 23 are opposite to each other. The circuit loop 20 can be composed of a hard circuit board and a soft circuit board, or both of them can be composed of a hard circuit board. And the first circuit board 21, the second circuit board 22 and the third circuit board 23 are electrically connected to each other.
The insulating base 30 is used for fixing the circuit loop 20, and has a bottom plate 31 covering the first circuit board, a first sidewall 32 extending from the bottom plate 31, a second sidewall 33 extending from the bottom plate 31 and opposite to the first sidewall 32, and a connecting wall 34 connecting the first sidewall 32 and the second sidewall 33 and opposite to the bottom plate, and an accommodating space 35 for accommodating the power supply unit 50 is formed on the insulating base 30 by the bottom plate 31, the first sidewall 32, the second sidewall 33, and the connecting wall 34. The first sidewall 32 is provided with a first positioning groove 321 for the second circuit board 22 to be disposed. The second sidewall 33 is provided with a second positioning slot 331 for the third circuit board 23 to be disposed. The connecting wall 34 is provided with a recessed groove 341 for the speaker 60. It should be noted that in the present embodiment, the shape of the insulating base 30 may be changed according to the shape of the wireless headset, and the insulating base 30 in the present embodiment is only one embodiment.
The fastener 40 is used to fix the second circuit board 22 and the third circuit board 23 on the insulating base 30. In the present embodiment, the fastening device 40 includes a first fastening device 41 and a third fastening device 43 for fixing the second circuit board 22 on the insulating base 30, and a second fastening device 42 and a fourth fastening device 44 for fixing the third circuit board 23 on the insulating base 30.
In the present embodiment, the insulating base 30 is directly formed on the first circuit board 21 by injection molding, but in practical applications, the insulating base 30 can also be mounted on the first circuit board 21 in a combined manner. Then, the second circuit board 22 is bent by an angle and then embedded in the first positioning groove 321, and the first fastener 41 and the third fastener 43 are fastened to the first sidewall 32 to fix the second circuit board 22 in the first positioning groove 321. Then, the third circuit board 23 is bent at an angle and then embedded in the second positioning slot 331, and then the second fastening member 42 and the fourth fastening member 44 are fastened to the second sidewall 33. Then, the power supply unit 50 is disposed in the accommodating space 34, and the power supply unit 50 and the circuit loop 20 are electrically connected to each other. Finally, the speaker 60 is disposed in the recessed groove 341, and the speaker 60 and the circuit loop 20 are electrically connected to each other. Thus, the inner module 10 can be constructed.
In order to effectively fix the second circuit board 22 in the first positioning groove 321, the second circuit board 22 is provided with a first positioning block 221 and a third positioning block 222 adjacent to the first positioning block 221, when the second circuit board 22 is disposed in the first positioning groove 321, the first positioning block 221 and the third positioning block 222 are respectively assembled with the first positioning groove 321 by a close fit or mutual interference manner, the first fastener 41 is disposed outside the first positioning block 221, and the third fastener 43 is disposed outside the third positioning block 222 and respectively fastened to the first sidewall 32.
In order to effectively engage the first fastening member 41 and the third fastening member 43 with the first sidewall 32, a pair of first engaging structures (not numbered) that can be engaged with each other is disposed between the first fastening member 41 and the first sidewall 32, and a pair of third engaging structures (not numbered) that can be engaged with each other is disposed between the third fastening member 43 and the first sidewall 32. The first fastening structure includes two first fastening holes 322 disposed on the first sidewall 32 and spaced apart from each other by the first positioning slot 321, and two first fastening protrusions 411 disposed on the first fastening member 41 and respectively corresponding to the two first fastening holes 322 and fastened to each other. The third fastening structure includes two third fastening holes 323 disposed on the first sidewall 32 and spaced apart from each other by the first positioning groove 321, and two third fastening protrusions 431 disposed on the third fastening member 43 and respectively corresponding to the third fastening holes 323 and fastened to each other.
Therefore, after the second circuit board 22 is bent and fixed inside the first positioning groove 321 through the first positioning block 221 and the third positioning block 222, the two first fastening protrusions 411 of the first fastening component 41 are fastened in the two first fastening holes 322, so that the first fastening component 41 can be effectively fixed on the first sidewall 32 to prevent the first positioning block 221 from falling off from the first positioning groove 321. Then, the two second fastening blocks 431 of the third fastening component 43 are correspondingly fastened in the two third fastening holes 323, so that the third fastening component 43 can be effectively fixed on the first sidewall 32 to prevent the third positioning block 222 from falling off from the first positioning groove 321.
In order to effectively fix the third circuit board 23 in the second positioning slot 331, a second positioning block 231 and a fourth positioning block 232 adjacent to the second positioning block 231 are disposed on the third circuit board 23, when the third circuit board 23 is disposed in the second positioning slot 331, the second positioning block 231 and the fourth positioning block 232 are respectively assembled with the second positioning slot 331 by tight fitting or mutual interference, the second fastener 42 is disposed outside the second positioning block 231, and the fourth fastener 44 is disposed outside the fourth positioning block 232 and respectively fastened with the second sidewall 33.
In order to effectively fasten the second fastening member 42 and the fourth fastening member 44 to the second sidewall 33, a pair of second fastening structures (not numbered) that can be fastened to each other is disposed between the second fastening member 42 and the second sidewall 33, and a pair of fourth fastening structures (not numbered) that can be fastened to each other is disposed between the fourth fastening member 44 and the second sidewall 33. The second fastening structure includes two second fastening holes 332 disposed on the second sidewall 33 and spaced apart from each other by the second positioning slot 331, and two second fastening protrusions 421 disposed on the second fastening member 42 and corresponding to the two second fastening holes 332 respectively and fastened to each other. The fourth fastening structure includes two fourth fastening holes 333 disposed on the second sidewall 33 and spaced apart from each other by the second positioning slot 331, and two fourth fastening protrusions 441 disposed on the fourth fastening member 44 and corresponding to the two fourth fastening holes 333 and fastened to each other.
Therefore, after the third circuit board 23 is bent and fixed inside the second positioning groove 331 through the second positioning block 231 and the fourth positioning block 232, the two second fastening protrusions 421 of the second fastening member 42 are fastened in the two second fastening holes 332, so that the second fastening member 42 can be effectively fixed on the second sidewall 33 to prevent the second positioning block 231 from falling off from the second positioning groove 331. Then, the two fourth fastening protrusions 441 of the fourth fastening component 44 are correspondingly fastened in the two fourth fastening holes 333, so that the fourth fastening component 44 can be effectively fixed on the second sidewall 33 to prevent the fourth positioning block 232 from falling off from the second positioning slot 331.
Therefore, the internal module 10 is pre-formed into a modular design by the present invention, and the power supply unit 50 and the speaker 60 are integrated on the internal module 10, so that the internal module 10 of the present invention can be directly installed inside the housing of the wireless headset, thereby greatly simplifying the assembly steps of the wireless headset, and simultaneously greatly reducing the labor for assembly, and achieving the effect of reducing the assembly cost.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. An interior module having a fastener, comprising:
a circuit loop having at least a first circuit board, at least a second circuit board extending from the first circuit board, and a third circuit board extending from the first circuit board and opposite to the second circuit board;
an insulating base for fixing the circuit loop, which is provided with at least a bottom plate for coating the first circuit board in an injection mode and a first side wall extending from the bottom plate, wherein the first side wall is provided with a first positioning groove for the second circuit board to be arranged; and
at least one first fastener for fixing on the first sidewall to fix the second circuit board in the first positioning groove;
the insulating base also comprises a second side wall extending from the bottom plate and opposite to the first side wall, and the second side wall is provided with a second positioning groove for the third circuit board to be arranged;
the insulating seat also comprises a connecting wall which is opposite to the bottom plate and is connected with the first side wall and the second side wall, so that an accommodating space for a power supply unit to be arranged is formed on the insulating seat, and when the power supply unit is arranged in the accommodating space, the power supply unit is electrically connected with the circuit loop;
wherein, the connecting wall is also provided with an embedded groove for a loudspeaker to be arranged, and when the power supply unit is arranged in the accommodating space, the power supply unit is electrically connected with the circuit loop.
2. The interior module with fasteners of claim 1 further comprising a second fastener for securing to the second sidewall to secure the third circuit board in the second positioning slot.
3. The interior module with fastener of claim 2, wherein at least one pair of second engaging structures is disposed between the second sidewall and the second fastener.
4. The internal module with fasteners according to claim 3, wherein the second fastening structure includes a second fastening hole disposed on the second sidewall and a second fastening protrusion disposed on the second fastener and fastened to the second fastening hole.
5. The interior module with fastener of claim 1, wherein at least one pair of first engaging structures is disposed between the first sidewall and the first fastener.
6. The internal module with fastening components according to claim 5, wherein the first fastening structure includes a first fastening hole disposed on the first sidewall and a first fastening protrusion disposed on the first fastening component and fastened to the first fastening hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910035365.0A CN111447520B (en) | 2019-01-16 | 2019-01-16 | Internal module with fastener |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910035365.0A CN111447520B (en) | 2019-01-16 | 2019-01-16 | Internal module with fastener |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111447520A CN111447520A (en) | 2020-07-24 |
| CN111447520B true CN111447520B (en) | 2022-06-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910035365.0A Active CN111447520B (en) | 2019-01-16 | 2019-01-16 | Internal module with fastener |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111447520B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101014207A (en) * | 2005-09-30 | 2007-08-08 | 哈拉尔德·菲利普 | Headsets and headset power management |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| JP2014126495A (en) * | 2012-12-27 | 2014-07-07 | Seiko Epson Corp | Sensor, electronic apparatus, and moving body |
| CN208241983U (en) * | 2018-04-23 | 2018-12-14 | 宏纬电子股份有限公司 | modular circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9491880B2 (en) * | 2014-08-12 | 2016-11-08 | Google Technology Holdings LLC | Circuit assembly for compact acoustic device |
| US20170064830A1 (en) * | 2015-08-24 | 2017-03-02 | Motorola Mobility Llc | Circuit Assembly for Compact Acoustic Device |
-
2019
- 2019-01-16 CN CN201910035365.0A patent/CN111447520B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101014207A (en) * | 2005-09-30 | 2007-08-08 | 哈拉尔德·菲利普 | Headsets and headset power management |
| CN102809390A (en) * | 2011-05-31 | 2012-12-05 | 精工爱普生株式会社 | Maintaining member, module, and electronic apparatus |
| JP2014126495A (en) * | 2012-12-27 | 2014-07-07 | Seiko Epson Corp | Sensor, electronic apparatus, and moving body |
| CN208241983U (en) * | 2018-04-23 | 2018-12-14 | 宏纬电子股份有限公司 | modular circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111447520A (en) | 2020-07-24 |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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Effective date of registration: 20230307 Address after: No. 688, Huangpujiang North Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee after: KUNSHAN DRAGONSTATE ELECTRONIC TECHNOLOGY Co.,Ltd. Patentee after: DRAGONSTATE TECHNOLOGY Co.,Ltd. Address before: No. 688, Huangpujiang North Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province Patentee before: KUNSHAN DRAGONSTATE ELECTRONIC TECHNOLOGY Co.,Ltd. Patentee before: CONCRAFT HOLDING Co.,Ltd. |
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| CI03 | Correction of invention patent | ||
| CI03 | Correction of invention patent |
Correction item: Patentee|Address|Patentee Correct: KUNSHAN DRAGONSTATE ELECTRONIC TECHNOLOGY Co.,Ltd.|No. 688, Huangpujiang North Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province|CONCRAFT HOLDING Co.,Ltd. False: KUNSHAN DRAGONSTATE ELECTRONIC TECHNOLOGY Co.,Ltd.|No. 688, Huangpujiang North Road, Zhoushi Town, Kunshan City, Suzhou City, Jiangsu Province|DRAGONSTATE TECHNOLOGY Co.,Ltd. Number: 11-02 Volume: 39 |