CN111447533B - Internal module formed by metal material belt - Google Patents
Internal module formed by metal material belt Download PDFInfo
- Publication number
- CN111447533B CN111447533B CN201910042156.9A CN201910042156A CN111447533B CN 111447533 B CN111447533 B CN 111447533B CN 201910042156 A CN201910042156 A CN 201910042156A CN 111447533 B CN111447533 B CN 111447533B
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- Prior art keywords
- circuit board
- metal material
- circuit
- material belt
- metal
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Manufacturing & Machinery (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses an internal module formed by utilizing a metal material belt, which is mainly used for being installed in a wireless earphone and comprises a circuit loop with at least a first circuit board and a second circuit board, wherein a plurality of circuit contacts are formed on the circuit loop. The first metal material belt is used for fixing the second circuit board and is provided with at least one first extending section which extends to the outside of the second circuit board and is provided with a cutting surface. And an insulating base formed on the first circuit board and covering the circuit loop and the first metal material belt, wherein part of the circuit contact and the first cut surface are exposed on the surface of the insulating base. Thereby the inner module forms a modular design to simplify the assembly steps of the wireless earphone.
Description
Technical Field
The invention belongs to the technical field of electronic equipment, relates to an internal module formed by utilizing a metal material belt, in particular to an internal module which is arranged in a wireless earphone by utilizing a modular design and can greatly reduce the assembly cost.
Background
The earphone is used for connecting the electronic device so as to transmit the sound emitted by the electronic device to the ear of the human body through the earphone. Common headsets are classified into wired headsets connected to the electronic device through wires and wireless headsets (e.g., airpads products published by Apple inc.) connected to the electronic device through wireless communication transmission such as bluetooth.
Because the wired earphone must be connected with the electronic device through a circuit, the application range of the wired earphone is limited, and meanwhile, the wired earphone is easy to pull due to the circuit, and the wires are easy to intertwine when being stored. The wireless earphone is transmitted by wireless communication, so the wireless earphone is used in a longer range than the wired earphone, and the wireless circuit is easy to pull or intertwine, so the wireless earphone gradually replaces the wired earphone.
A general earphone is generally provided with a circuit board, a speaker, and the like inside, except for the outside covered with a case. The inside of the wireless earphone must be provided with components such as a battery, a microphone, a wireless transmission module and the like. Since there are many components inside the wireless earphone, generally, when the wireless earphone is assembled, the circuit board, the speaker, the battery, the microphone, and the wireless transmission module are sequentially installed and fixed inside the housing. Therefore, when the wireless earphone is assembled, a large amount of manpower is needed to assemble the wireless earphone, which not only increases the manpower cost, but also causes the limited internal assembly space due to the small volume of the wireless earphone, so that the components are easily damaged due to careless assembly, and the assembly qualification rate of the wireless earphone is poor.
Therefore, how to provide an internal module which is installed inside a wireless earphone by using a modular design and can greatly reduce the assembly cost is the technical means and the purpose to be solved in the invention.
Disclosure of Invention
The present invention is directed to an inner module formed by a metal material tape, and more particularly, to an inner module which is installed inside a wireless headset by a modular design and can greatly reduce the assembly cost.
To achieve the above objective, the present invention provides an internal module formed by a metal tape, which includes a circuit loop, at least one first metal tape, and at least one insulating base. The circuit loop is provided with at least one first circuit board and at least one second circuit board extending from the first circuit board, and a plurality of circuit contacts are respectively formed on the first circuit board and the second circuit board. The first metal material belt is used for fixing the second circuit board, so that an angle is formed between the second circuit board and the first circuit board, the metal material belt is provided with at least one first extension section extending to the outside of the second circuit board, and a first cut surface is formed on the edge of the first extension section far away from the second circuit board. The insulating base covers the circuit loop and the metal material belt, the insulating base is integrally formed on the first circuit board in an injection molding mode, and part of the circuit contacts on the circuit loop and the first cut surface of the first extension section are exposed on the surface of the insulating base.
In one embodiment, the insulating base includes a bottom plate for covering the first circuit board, and a first sidewall extending from the bottom plate and covering the second circuit board and the first metal tape.
In one embodiment, the insulating base further includes a second sidewall extending from the bottom plate and opposite to the first sidewall, and a connecting wall opposite to the bottom plate and connected between the first sidewall and the second sidewall, so that an accommodating space is formed on the insulating base.
In an embodiment, the internal module further includes a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
In an embodiment, the internal module further includes a speaker electrically connected to the circuit loop, and the connecting wall of the insulating base further includes a slot for the speaker to be disposed.
In an embodiment, the circuit loop further includes a third circuit board extending from the first circuit board and wrapped on the second sidewall, and the third circuit board is electrically connected to the first circuit board.
In an embodiment, the internal module further includes a second metal tape wrapped in the second sidewall and used for fixing the third circuit board.
In an embodiment, the second metal tape further includes at least a first extending section extending to the outside of the second circuit board, and a first cut-off section exposed on the surface of the insulating base is formed on an edge of the first extending section away from the second circuit board.
In an embodiment, the inner module further includes a metal fixing plate opposite to the second metal tape, and the third circuit board is disposed between the second metal tape and the metal fixing plate.
In an embodiment, the second metal material strap further extends to form at least one buckling portion, and the buckling portion is bent after bypassing the third circuit board and the metal fixing piece, so that the third circuit board and the metal fixing piece are fixed on the second metal material strap through the buckling portion.
The internal module for the wireless earphone of the embodiment has the following advantages compared with the prior art:
the internal module can directly integrate the circuit loop, the power supply unit and the loudspeaker together through the insulating base, so that the internal module forms a modular design, and the labor cost required during assembly can be greatly reduced.
The internal module can change the shape of the insulating seat according to the shape of the wireless earphone, and can be suitable for the wireless earphones with different shapes.
Drawings
Fig. 1 is a first perspective reference view of the present invention in use.
Fig. 2 is a reference view of a second viewing angle in a use state of the present invention.
Fig. 3 is an exploded view of the circuit loop and the metal tape according to the present invention.
Fig. 4 is a schematic diagram of the circuit loop and the metal tape assembly according to the present invention.
Fig. 5 is a schematic view of a first viewing angle of the metal strip and the circuit loop of the present invention after being bent.
Fig. 6 is a schematic diagram of a second view angle of the bent metal strip and the circuit loop according to the present invention.
Fig. 7 is a schematic view of a first perspective of the insulating base after molding.
Fig. 8 is a schematic view of a second perspective of the insulating base of the present invention after being formed.
[ notation ] to show
10 inner module
20 circuit loop
21 first circuit board
22 second circuit board
23 third circuit board
24 circuit contact
30 metal material belt
31 first metal material belt
311 first extension
312 first material bridge
313 first cut-off part
314 first cutting plane
32 second metal material belt
321 second extension
322 second material bridge
323 second cutting part
324 fastening part
325 second cut surface
33 Metal fixing sheet
40 insulating base
41 base
42 first side wall
43 second side wall
44 connecting wall
441 caulking groove
45 accommodation space
50 power supply unit
60 loudspeaker
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments and the accompanying drawings.
The detailed description and technical contents of the present invention will now be described with reference to the accompanying drawings:
as shown in fig. 1 to 8, the present invention is an internal module formed by metal tape, and the internal module 10 is configured to be installed in a housing (not described in detail in the prior art) of a wireless headset, and includes a circuit loop 20, at least one metal tape 30, an insulating base 40, a power supply unit 50, and a speaker 60.
The circuit loop 20 is composed of a first circuit board 21, a second circuit board 22 and a third circuit board 23. The first circuit board 21 is a hard circuit board. The second circuit board 22 and the third circuit board 23 are respectively a flexible circuit board, and extend from two opposite sides of the first circuit board 21, so that the second circuit board 22 and the third circuit board 23 are opposite to each other. The circuit loop 20 can be composed of a hard circuit board and a soft circuit board, or both of them can be composed of a hard circuit board. And the first circuit board 21, the second circuit board 22 and the third circuit board 23 are electrically connected to each other. The circuit loop 20 is formed with a plurality of circuit contacts 24, and the circuit contacts 24 are disposed on the first circuit board 21, the second circuit board 22 and the third circuit board 23, respectively.
The metal tape 30 includes a first metal tape 31, a second metal tape 32 and a metal fixing sheet 33. The first metal tape 31 is used for fixing the second circuit board 22, and the first metal tape 31 has at least one first extension section 311 extending to the outside of the second circuit board 22, the other side of the first extension section 311 is connected with a first material bridge 312, and a first cut-off portion 313 is formed between the first extension section 311 and the first material bridge 312. In this embodiment, the first extending sections 311 are respectively extended from two opposite sides of the first metal tape 31, and each of the first extending sections 311 is extended with one of the first material bridges 312. The second metal tape 32 is used to fix the third circuit board 23, the second metal tape 32 has a second extending section 321 extending to the outside of the third circuit board 23, the other side of the second extending section 321 is connected to a second material bridge 322, and a second cutting portion 323 is formed between the second extending section 321 and the second material bridge 322. The metal fixing plate 33 is opposite to the second metal tape 32, so that the third circuit board 23 is disposed between the second metal tape 32 and the metal fixing plate 33. In order to effectively fix the third circuit board 23 between the second metal tape 32 and the metal fixing piece 33, at least one fastening portion 324 is further disposed on the second metal tape 32, and the fastening portion 324 is bent after bypassing the third circuit board 23 and the metal fixing piece 33, so as to fix the third circuit board 23 and the metal fixing piece 33 on the second metal tape 32.
The insulating base 40 is integrally formed by injection molding to cover the circuit loop 20 and the metal strip 30. The insulating seat 40 is formed by placing the circuit loop 20 and the metal tape 30 into a mold (not shown in the drawings), bending the second circuit board 22 and the third circuit board 23 in advance through the first metal tape 31, the second metal tape 32 and the metal fixing piece 33 before placing the circuit loop 20 and the metal tape 30 into the mold, so that the second circuit board 22 and the third circuit board 23 are opposite to each other and form an angle with the first circuit board 21, fixing the circuit loop 20 and the metal tape 30 in the mold through the first material bridge 312 and the second material bridge 322, and then forming the insulating seat 40 in the mold through injection molding. Furthermore, the insulating base 40 includes a base 41 covering the first circuit board 21, a first sidewall 42 extending from the bottom plate 21 and covering the second circuit board 22 and the first metal tape 31, a second sidewall 43 extending from the bottom plate 41 and covering the third circuit board 23, the second metal tape 32 and the metal fixing piece 33 and opposite to the first sidewall 42, and a connecting wall 44 opposite to the bottom plate 41 and connected between the first sidewall 42 and the second sidewall 43. And an accommodating space 45 for the power supply unit 50 is formed around the bottom plate 41, the first side wall 42, the second side wall 43 and the connecting wall 44. In addition, when the bottom plate 41 is formed on the first circuit board 21, a portion of the circuit contacts 24 on the first circuit board 21 is exposed on the bottom plate 41. When the second sidewall 43 is formed on the third circuit board 23, a portion of the circuit contacts 25 on the third circuit board 23 is exposed on the second sidewall 43. When the insulating base 40 is formed, the first material bridge 312 and the second material bridge 322 are respectively protruded outside the first sidewall 42 and the second sidewall 43. The connecting wall 44 is further formed with a recessed groove 441 for the speaker 60 to be disposed therein.
After the insulating base 40 is formed, the insulating base 40 is taken out from the mold, and then the two first material bridges 312 connected to the two sides of the first metal tape 31 and the second material bridges 322 connected to the two metal tapes 32 are broken off from the insulating base 40. When two first bridges 312 are broken off from the insulating base 40, mainly each first cut-off portion 313 between each first bridge 312 and each first extension 311 is broken off, so that after each first bridge 312 is separated from each first extension 311, a first cut-off surface 314 is formed on each first extension 311 and each connection surface connecting to the first bridge 312, and the two first cut-off surfaces 314 are respectively exposed on the surface of the first sidewall 42 of the insulating base 40.
When the second material bridge 322 is broken off from the insulating base 40, mainly the second cut-off portion 323 between the second material bridge 322 and the second extending section 321 is broken off, so that after the second material bridge 322 is separated from the second extending section 321, a second cut-off surface 325 is formed on the connecting surface of the second extending section 321 and the second material bridge 322, and the second cut-off surface 325 is exposed on the surface of the second sidewall 43 of the insulating base 40.
Then, the power supply unit 50 is installed in the accommodating space 45, and the power supply unit 50 and the circuit contacts 24 exposed on the base 41 are electrically connected to each other, so that the power supply unit 50 and the circuit loop 20 are electrically connected to each other. Finally, the speaker 60 is disposed in the recessed groove 441 of the connecting wall 44, and the speaker 60 is electrically connected to another portion of the circuit contact 24 exposed on the base 24, so that the speaker 60 and the circuit loop 20 are electrically connected to each other. In this way, a modular design of the inner module 10 is achieved.
It should be noted that the shape of the insulating base 40 can be designed to match the shape of the wireless headset so as to match the internal space of the wireless headset, so that the internal module 10 can be directly installed in the wireless headset. Therefore, the internal module 10 is pre-formed into a modular design by the present invention, and the power supply unit 50 and the speaker 60 are integrated on the internal module 10, so that the internal module 10 of the present invention can be directly installed inside the wireless headset, thereby greatly simplifying the assembly steps of the wireless headset, and simultaneously greatly reducing the labor required for assembly, and achieving the effect of reducing the assembly cost.
The above-mentioned embodiments are intended to illustrate the objects, technical solutions and advantages of the present invention in further detail, and it should be understood that the above-mentioned embodiments are only exemplary embodiments of the present invention, and are not intended to limit the present invention, and any modifications, equivalents, improvements and the like made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an utilize fashioned wireless earphone inner module in metal material area which characterized in that includes:
a circuit loop, which is provided with at least one first circuit board and at least one second circuit board extending from the first circuit board, and a plurality of circuit contacts are respectively formed on the first circuit board and the second circuit board;
the first metal material belt is used for fixing the second circuit board, so that an angle is formed between the second circuit board and the first circuit board, the metal material belt is provided with at least one first extension section extending to the outside of the second circuit board, and a first cutting surface is formed on the edge of the first extension section far away from the second circuit board; and
and the insulating seat is integrally formed on the first circuit board in an injection molding mode, and part of the circuit contacts on the circuit loop and the first cut surface of the first extension section are exposed on the surface of the insulating seat.
2. The wireless headset module of claim 1, wherein the insulating base comprises a bottom plate covering the first circuit board, and a first sidewall extending from the bottom plate and covering the second circuit board and the first metal strip.
3. The wireless earphone inner module formed by metal material belt according to claim 2, wherein the insulating base further comprises a second sidewall extending from the bottom plate and opposite to the first sidewall and a connecting wall opposite to the bottom plate and connected between the first sidewall and the second sidewall, so that an accommodating space is formed on the insulating base.
4. The wireless headset inner module formed from a metal material strap of claim 3, wherein the inner module further comprises a power supply unit disposed in the accommodating space, and the power supply unit is electrically connected to the circuit loop.
5. The wireless earphone inner module formed from a metal material strap as claimed in claim 3, wherein the inner module further comprises a speaker electrically connected to the circuit loop, and the connecting wall of the insulating base further comprises a slot for the speaker to be disposed.
6. The wireless headset module of claim 3, wherein the circuit further comprises a third circuit board extending from the first circuit board and covering the second sidewall, and the third circuit board is electrically connected to the first circuit board.
7. The wireless headset module of claim 6, wherein the module further comprises a second metal strip covering the second sidewall and fixing the third circuit board.
8. The wireless headset inner module formed by metal material belt of claim 7, wherein the second metal material belt further comprises at least a first extension section extending to the outside of the second circuit board, and a first cut-out section exposed on the surface of the insulating base is formed on the edge of the first extension section far away from the second circuit board.
9. The wireless earphone internal module formed by metal material belt according to claim 7, wherein the internal module further comprises a metal fixing piece opposite to the second metal material belt, and the third circuit board is disposed between the second metal material belt and the metal fixing piece.
10. The wireless earphone inner module formed by metal material belt according to claim 9, wherein the second metal material belt further extends with at least one buckling portion, the buckling portion is bent after bypassing the third circuit board and the metal fixing piece, so that the third circuit board and the metal fixing piece are fixed on the second metal material belt through the buckling portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910042156.9A CN111447533B (en) | 2019-01-16 | 2019-01-16 | Internal module formed by metal material belt |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910042156.9A CN111447533B (en) | 2019-01-16 | 2019-01-16 | Internal module formed by metal material belt |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111447533A CN111447533A (en) | 2020-07-24 |
| CN111447533B true CN111447533B (en) | 2021-05-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910042156.9A Active CN111447533B (en) | 2019-01-16 | 2019-01-16 | Internal module formed by metal material belt |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111447533B (en) |
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| WO2016008690A1 (en) * | 2014-07-17 | 2016-01-21 | Koninklijke Philips N.V. | Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system |
| CN206364977U (en) * | 2016-12-05 | 2017-07-28 | 深圳市科奈信科技有限公司 | A kind of low-loss wireless Bluetooth headsets |
| CN207070276U (en) * | 2017-08-04 | 2018-03-02 | 东莞志丰电子有限公司 | Neck hanging type touch-control bluetooth earphone |
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| CN208079204U (en) * | 2018-03-22 | 2018-11-09 | 广东欧珀移动通信有限公司 | The support construction of mobile terminal and its box sound chambers |
| CN208190879U (en) * | 2018-05-31 | 2018-12-04 | 重庆工商职业学院 | A kind of nested type blue-tooth earphone structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070216580A1 (en) * | 2006-03-15 | 2007-09-20 | Chant Sincere Co., Ltd. | Electro-stimulating massage confiner |
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2019
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Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6944936B2 (en) * | 1999-09-17 | 2005-09-20 | Hutchinson Technology Incorporated | Method for manufacturing an integrated lead suspension |
| WO2008085864A1 (en) * | 2007-01-06 | 2008-07-17 | Apple Inc. | Headset with microphone and connector co-location |
| CN202997145U (en) * | 2012-11-29 | 2013-06-12 | 番禺得意精密电子工业有限公司 | Combination of metal housing and material band, and electric connector for metal housing and material band |
| CN103200476A (en) * | 2013-04-09 | 2013-07-10 | 苏州恒听电子有限公司 | Receiver with split type circuit board and multi-unit receiver group |
| WO2016008690A1 (en) * | 2014-07-17 | 2016-01-21 | Koninklijke Philips N.V. | Ultrasound transducer arrangement and assembly, coaxial wire assembly, ultrasound probe and ultrasonic imaging system |
| CN206364977U (en) * | 2016-12-05 | 2017-07-28 | 深圳市科奈信科技有限公司 | A kind of low-loss wireless Bluetooth headsets |
| CN207070276U (en) * | 2017-08-04 | 2018-03-02 | 东莞志丰电子有限公司 | Neck hanging type touch-control bluetooth earphone |
| CN207854168U (en) * | 2017-12-25 | 2018-09-11 | 苏州明氏智能制造技术有限公司 | Moving-iron receiver |
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| CN208190879U (en) * | 2018-05-31 | 2018-12-04 | 重庆工商职业学院 | A kind of nested type blue-tooth earphone structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111447533A (en) | 2020-07-24 |
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