CN214795754U

CN214795754U - MIC seal structure and electronic equipment

Info

Publication number: CN214795754U
Application number: CN202120575791.6U
Authority: CN
Inventors: 何飞
Original assignee: Shanghai Wingtech Information Technology Co Ltd
Current assignee: Shanghai Wingtech Information Technology Co Ltd; Shanghai Wentai Information Technology Co Ltd
Priority date: 2021-03-22
Filing date: 2021-03-22
Publication date: 2021-11-19
Anticipated expiration: 2031-03-22

Abstract

The utility model discloses an MIC sealing structure, which comprises a shell and a sealing rubber sleeve which is integrally formed with the shell through double-color injection molding; a sound channel and a fixed support are arranged on one side of the shell, and a first sound outlet hole communicated with the sound channel is formed in the fixed support; the sealing rubber sleeve comprises a first sealing part, a second sealing part and a third sealing part connected between the first sealing part and the second sealing part, the first sealing part is arranged on one side, away from the sound channel, of the fixing support, a second sound outlet communicated with the first sound outlet is formed in the first sealing part, and the second sealing part covers the sound channel and is used for installing the MIC module. The utility model discloses still disclose an electronic equipment including above-mentioned MIC seal structure. Compared with the prior art, beneficial effect lies in: the casing and the sealing rubber sleeve are integrated through double-color injection molding, so that the assembling process of the sealing rubber sleeve is omitted, the sealing structure is more compact, the production efficiency can be effectively improved, and the sealing performance can be improved.

Description

MIC seal structure and electronic equipment

[ technical field ] A method for producing a semiconductor device

The utility model relates to an electronic equipment technical field, specificly relate to a MIC seal structure and electronic equipment.

[ background of the invention ]

At present, electronic equipment such as mobile phones, tablet computers and intelligent bracelets become a part of people's life, and along with the improvement of science and technology and the improvement of standard of living, people also are higher and higher to the requirement of conversation voice quality, in order to improve conversation voice quality among the prior art, except choosing better MIC (Microphone) and optimizing sound processing algorithm for use, improve MIC's sealing performance also very important. In prior art, MIC sealed gum cover is fixed in the casing through the cotton bonding of sealed bubble usually, because MIC sealed gum cover generally belongs to heterotypic structure, is unfavorable for carrying out automatic laminating through the manipulator, consequently assembles through the manual work usually, however manual work equipment is not only inefficiency, appears laminating unstability and damage the cotton bad of sealed bubble easily moreover, leads to MIC sealed gum cover's sealing performance to descend to not only increased manufacturing cost, still influenced electronic equipment's performance.

Accordingly, there is a need for an MIC sealing structure and an electronic device that overcome the deficiencies of the prior art.

[ Utility model ] content

The utility model aims at providing a MIC seal structure aims at simplifying MIC's seal structure to improve MIC's sealing performance.

In order to achieve the purpose, the utility model provides an MIC sealing structure, which comprises a shell and a sealing rubber sleeve which is integrally formed with the shell through double-color injection molding; a sound channel is formed in one side of the shell, the edge of the shell is opened by the sound channel, a fixing support is further arranged on the edge of the shell, and a first sound outlet hole communicated with the sound channel is formed in the fixing support; the sealing rubber sleeve comprises a first sealing part, a second sealing part and a third sealing part, wherein the third sealing part is connected between the first sealing part and the second sealing part and embedded into the fixing support, the first sealing part is arranged on one side, away from the sound channel, of the fixing support and is provided with a second sound outlet communicated with the first sound outlet, and the second sealing part covers the sound channel and is used for installing an MIC module.

As an improvement of the MIC sealing structure of the present invention, the second sealing portion is kept away from one end of the third sealing portion is opened with the sound channel is communicated and is used for installation the mounting hole of the MIC module.

As an improvement of the MIC sealing structure of the present invention, the second sealing portion deviates from one side of the sound passage is further protruded to form a ring around the sealing ring of the mounting hole.

As an improvement of the MIC sealing structure of the present invention, the second sealing portion and the partition plate are provided between the casings, the partition plate is provided with the mounting hole and the via hole of the sound channel communication.

As an improvement of the MIC sealing structure of the present invention, the housing is further provided with at least one protrusion formed around the sound passage for abutting against the spacing protrusion of the partition.

As an improvement of the MIC sealing structure of the present invention, the fixing bracket is kept away from one side of the sound channel is provided with a ring around the second sound outlet and the mounting groove communicated with the second sound outlet, the mounting groove is used for holding the second sealing portion.

As an improvement of the MIC sealing structure of the present invention, the fixing bracket is kept away from the one end of the housing is provided with a positioning groove communicated with the mounting groove, the positioning groove is used for holding the third sealing portion.

As an improvement of the MIC sealing structure of the present invention, the first sealing portion and the dust screen are disposed between the fixing brackets.

As an improvement of the MIC sealing structure of the present invention, the cross-sectional area of the first sound outlet is along from the first sound outlet to being close to the sound passage is gradually reduced in the direction of the sound passage.

The utility model also provides an electronic equipment including above-mentioned MIC seal structure.

Compared with the prior art, the utility model discloses MIC seal structure and electronic equipment's beneficial effect lies in: the casing and the sealing rubber sleeve are integrated through double-color injection molding, so that the assembling process of the sealing rubber sleeve is omitted, and the sealing structure is more compact, so that the production efficiency can be effectively improved, and the sealing performance can be improved.

In order to make the aforementioned and other objects, features and advantages of the present invention comprehensible, preferred embodiments accompanied with figures are described in detail below.

[ description of the drawings ]

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a perspective view of an MIC seal structure provided by the present invention.

Fig. 2 is an exploded perspective view of the MIC seal structure shown in fig. 1.

Fig. 3 is an enlarged view of the area a shown in fig. 2.

Fig. 4 is a perspective view of the sealant cap shown in fig. 1.

[ detailed description ] embodiments

In order to make the objects, technical solutions and advantageous technical effects of the present invention more clearly understood, the present invention is further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration only and not by way of limitation.

Referring to fig. 1 to 4, the present invention provides an MIC sealing structure 100, which is used in an electronic device having an MIC module, such as a mobile phone, a tablet computer, a portable intelligent terminal, and an intelligent bracelet, and is mainly used for solving the sealing problem of the MIC module.

In an embodiment of the present invention, the MIC sealing structure 100 includes a housing 10 and a sealant sleeve 20 integrally formed with the housing 10 by two-color injection molding.

Wherein, one side of the casing 10 is provided with a sound channel 101, the sound channel 101 opens the edge of the casing 10, the edge of the casing 10 is further provided with a fixing bracket 102 for installing the sealing rubber sleeve 20, and the fixing bracket 102 is provided with a first sound outlet 1021 communicated with the sound channel 101, that is, the fixing bracket 102 is disposed at the opening position of the sound channel 101.

The sealing rubber sleeve 20 includes a first sealing portion 201, a second sealing portion 202, and a third sealing portion 203 connected between the first sealing portion 201 and the second sealing portion 202, the first sealing portion 201 is disposed on one side of the fixing bracket 102 away from the sound channel 101 and is provided with a second sound outlet 204 communicated with the first sound outlet 1021, and the second sealing portion 202 covers the sound channel 101 and is used for mounting an MIC module (not shown).

In the present embodiment, the casing 10 is used for mounting electronic components on an electronic device, for this purpose, the casing 10 may be made of PC material to obtain better mechanical strength, and the sealing rubber sleeve 20 is made of silicone material to obtain good sealing performance by virtue of its soft texture.

It can be understood that the casing 10 and the sealing rubber sleeve 20 are formed into an integral structure through double-color injection molding, so that the sealing rubber can be completely combined with the casing 10, the structure is more compact, the sealing performance is better, and the assembling process of the sealing rubber sleeve 20 is omitted, thereby improving the production efficiency and reducing the production cost.

Further, in one embodiment, the second sealing portion 202 has an end away from the third sealing portion 203 opened with a mounting hole 205 for mounting the MIC module, which is communicated with the sound channel 101, that is, the second sealing portion 202 is sleeved on the MIC module, so that the portion of the MIC module extending into the sound channel 101 does not have the problem of air tightness.

Here, the side of the second sealing portion 202 facing away from the acoustic channel 101 may also be raised to form a sealing ring 2051 surrounding the mounting hole 205, the sealing ring 2051 being adapted to abut an electronic component for mounting the MIC module to further improve sealing, for example, the sealing ring 2051 may be adapted to abut a circuit board (not shown) for mounting the MIC module, the circuit board being adapted to emit acoustic signals to or receive acoustic signals from the MIC module.

Further, in one embodiment, since the housing 10 and the sealant cap 20 are formed as a single body by two-shot molding, a partition 30 is provided between the second sealing portion 202 and the housing 10 to prevent the sealant cap 20 from entering the sound channel 101 during the injection molding process. It should be noted here that when the housing 10 and the sealant sleeve 20 are injection-molded in two colors, the housing 10 and the sealant sleeve 20 are injection-molded in sequence, that is, the sealant sleeve 20 is injection-molded after the housing 10 is injection-molded, so it can be understood that the partition plate 30 is used to close the sound channel 101 before the sealant sleeve 20 is molded, so as to ensure the integrity of the sound channel 101, and meanwhile, in order to facilitate the communication between the MIC module and the sound channel 101, the partition plate 30 is provided with a through hole 301 for communicating the mounting hole with the sound channel 101.

In a preferred embodiment, in order to facilitate the placement of the baffle 30, the housing 10 further has at least one limiting protrusion 103 protruding around the sound channel 101 for abutting against the baffle 30, i.e., the limiting protrusion 103 acts as a positioning for the baffle 30 for shortening the time for placing the baffle 30.

In this embodiment, two limiting protrusions 103 are disposed on the housing 10, the two limiting protrusions 103 are disposed on two sides of the sound channel 101, and one of the limiting protrusions 103 can be used to carry a circuit board (not shown) for mounting an MIC module, and the other limiting protrusion 103 can be provided with a fastening screw for fixing the circuit board.

Further, in an embodiment, a mounting groove 1022 surrounding the first sound outlet 1021 and communicating with the first sound outlet 1021 is formed on a side of the fixing bracket 102 away from the sound channel 101, that is, the first sound outlet 1021 penetrates through the fixing bracket 102 from a bottom of the mounting groove 1022, the mounting groove 1022 is used for accommodating the first sealing portion 201, and after the two-color injection molding is completed, the first sealing portion 201 and a peripheral inner wall of the mounting groove 1022 are integrated into a whole. In the present embodiment, the cross-sectional shape of the mounting groove 1022 is substantially rectangular.

Meanwhile, the positioning groove 1023 communicated with the mounting groove 1022 is opened at one end of the fixing support 102 far away from the housing 10, the positioning groove 1023 is used for accommodating the third sealing portion 203, namely, after the injection molding of the sealing rubber sleeve 20, the third sealing portion 203 is integrated with the inner wall of the positioning groove 1023, so that the sealing rubber sleeve 20 is combined with the housing 10 more tightly.

In a preferred embodiment, a dust-proof net 40 is disposed between the first sealing portion 201 and the fixing bracket 102, and the dust-proof net 40 can prevent solid particles in the external air from entering the sound channel 101, so that the MIC module is not polluted by the solid particles in the external air, and the usability and the service life of the MIC module can be improved. It should be understood that the dust screen 40 is also placed in the mounting groove 1022 before the sealant sleeve 20 is injection molded, i.e., the dust screen 40 can be integrated with the housing 10 and the sealant sleeve 20 during two-color injection molding without additional installation.

Further, in one embodiment, the cross-sectional area of the first sound outlet hole 1021 is gradually decreased in a direction from the first sound outlet hole 1021 to the vicinity of the sound channel 101, and the maximum cross-sectional area of the first sound outlet hole 1021 is greater than twice the minimum cross-sectional area of the first sound outlet hole 1021, that is, the first sound outlet hole 1021 is in a trumpet shape, so that the sound channel 101 can conveniently collect external acoustic vibrations or transmit the acoustic vibrations to the outside through the first sound outlet hole 1021. It should be noted that the connection between the first sound outlet 1021 and the sound channel 101 needs to be smooth to facilitate sound transmission.

In the present embodiment, the shape of the first sound outlet 1021 makes the fixing bracket 102 higher than the sound channel 101, so that if the second sealing portion 202 is directly connected to the third sealing portion 203, the thickness of the second sealing portion 202 is larger, and the second sealing portion 202 is prone to shrink during the injection molding process. For this reason, one end of the second sealing portion 202 close to the first sealing portion 201 is provided with a connecting portion 2021 for connecting the third sealing portion 203, so that the thickness of the second sealing portion 202 is reduced by the connecting portion 2021, which also has a material saving effect.

It can be understood that, the fixed bracket 102 is located between the first sealing portion 201 and the connecting portion 2021, and the third sealing portion 203 is located in the positioning groove 1023 of the fixed bracket 102, so that the position of the third sealing portion 203 is the highest when the sealant cover 20 is injection molded, so as to facilitate injection molding of the sealant cover 20, an injection molding port (not shown) can be arranged in the positioning groove 1023, so as to improve the fluidity of injection molding liquid (i.e. the silicone fluid forming the sealant cover 20) through the action of gravity, thereby achieving the purpose of improving the injection molding efficiency.

To sum up, the utility model provides a MIC seal structure 100 forms casing 10 and sealed gum cover 20 through double-colored moulding plastics and becomes an organic whole, has not only left out the equipment process of sealed gum cover 20, makes seal structure compacter moreover to both can effectively improve production efficiency, can improve sealing performance again.

The present invention provides a further electronic device (not shown) comprising the MIC sealing arrangement 100 of any of the above embodiments.

It should be understood that the utility model provides an electronic equipment, through MIC seal structure 100 for electronic equipment does not assemble the process of sealed gum cover 20, and electronic equipment's sealed gum cover 20 and casing 10 are synthetic integrative, and not only the structure is compacter, and sealing performance is better moreover, can effectively reduce electronic equipment's manufacturing cost, and improves electronic equipment's performance.

The invention is not limited solely to that described in the specification and the embodiments, and additional advantages and modifications will readily occur to those skilled in the art, and it is not intended to be limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.

Claims

1. An MIC sealing structure is characterized by comprising a shell and a sealing rubber sleeve which is integrally formed with the shell through double-color injection molding;

a sound channel is formed in one side of the shell, the edge of the shell is opened by the sound channel, a fixing support is further arranged on the edge of the shell, and a first sound outlet hole communicated with the sound channel is formed in the fixing support;

the sealing rubber sleeve comprises a first sealing part, a second sealing part and a third sealing part connected between the first sealing part and the second sealing part, the first sealing part is arranged on one side, away from the sound channel, of the fixing support, a second sound outlet communicated with the first sound outlet is formed in the fixing support, and the second sealing part covers the sound channel and is used for installing an MIC module.

2. The MIC sealing arrangement of claim 1, wherein an end of the second sealing portion remote from the third sealing portion defines a mounting aperture in communication with the acoustic channel for mounting the MIC module.

3. A MIC sealing arrangement according to claim 2, characterised in that the side of the second sealing portion facing away from the acoustic passage is also raised to form a sealing ring around the mounting aperture.

4. The MIC sealing arrangement of claim 2, wherein a partition is provided between the second seal and the housing, the partition defining a through-hole communicating the mounting hole with the sound channel.

5. The MIC seal structure of claim 4, wherein the housing further bulges around the sound channel with at least one stop bulge for abutting the diaphragm.

6. The MIC sealing structure of claim 1, wherein a side of the fixing bracket away from the sound channel is provided with a mounting groove surrounding the first sound outlet hole and communicating with the first sound outlet hole, the mounting groove being configured to receive the first sealing portion.

7. The MIC sealing arrangement of claim 6, wherein an end of the fixing bracket remote from the housing defines a locating slot in communication with the mounting groove, the locating slot being configured to receive the third sealing portion.

8. The MIC sealing arrangement of claim 1, wherein a dust screen is provided between the first sealing portion and the fixed support.

9. The MIC sealing structure of claim 1, wherein the cross-sectional area of the first sound outlet hole decreases gradually in a direction from the first sound outlet hole to near the sound channel.

10. An electronic device comprising a MIC sealing structure according to any of claims 1 to 9.