WO2014173362A1

WO2014173362A1 - Microphone encapsulation structure and terminal device

Info

Publication number: WO2014173362A1
Application number: PCT/CN2014/079383
Authority: WO
Inventors: 杨振杰
Original assignee: 中兴通讯股份有限公司
Priority date: 2013-07-29
Filing date: 2014-06-06
Publication date: 2014-10-30
Also published as: CN104349225A

Abstract

A microphone encapsulation structure and terminal device, comprising: A rear housing and an encapsulation sleeve, said encapsulation sleeve including a base, wherein: said base includes a first lateral surface, a second lateral surface and a lower end surface, said first lateral surface being opposite to said second lateral surface; the first lateral surface is provided with a cavity for accommodating a microphone, the second lateral surface is provided with a first sound channel, the upper portion of the first sound channel is connected to the lower portion of the cavity, forming a connecting section, the microphone sound aperture is opposite to the connecting section, the lower end surface is provided with a second sound channel, the second sound channel communicates with the first sound channel, the base is provided within the rear housing, the lower portion of the rear housing is provided with a sound-dispersion aperture, and the sound-dispersion aperture is opposite to a sound output port of the second sound channel.

Description

Microphone packaging structure and terminal device

Technical field

The present invention relates to a method for installing a microphone in a terminal device, and more particularly to a package structure and a terminal device of a microphone.

Background technique

As a tool for people's communication, terminal devices such as mobile phones have become an indispensable necessity in daily life. With the improvement of consumers' living standards, the requirements for audio quality and the requirements for terminal device modeling are getting higher and higher. The channel design of the microphone that is closely related to the call is becoming more and more important, especially the way of sidetones and the relationship between the shape and the audio quality are getting closer.

At present, the microphone channel design used mainly is applied to the case where the distance H between the main board and the rear case surface is 4 mm or more, 3.5 mm to 4 mm, and 3 mm to 3.5 mm. In the case of smaller H, it is not very good at present. The design method, and, at present, for the case of small H, many methods require relatively large size and position of the microphone hole. Generally, the diameter of the hole is required to be more than lmm, and the position in the thickness direction of the terminal is relatively backward, often in the battery. Covered, affecting styling and audio effects.

Summary of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a package structure and a terminal device for a microphone, which can realize the encapsulation of the microphone when the distance between the main board and the rear case surface is less than 3 mm.

In order to solve the above technical problem, the following technical solutions are used: The embodiment of the present invention provides a package structure of a microphone, including: a back shell and a package sleeve, wherein the package sleeve includes a base body, wherein:

The base body includes a first side surface, a second side surface, and a lower end surface, the first side surface being opposite to the second side surface;

a cavity for setting a microphone is disposed on the first side;

a first sound channel is opened on the second side, an upper portion of the first sound channel and the a lower portion of the cavity penetrates to form a through portion, the sound hole of the microphone is opposite to the through portion; a second sound channel is opened on the lower end surface, and the second sound channel is in communication with the first sound channel;

The base body is disposed in the rear case, and the lower end portion of the rear case is provided with a sound hole, and the sound hole is opposite to the sound output port of the second sound channel.

Optionally, a lower portion of the first sound channel is continuous with an entrance of the second sound channel, and an entrance of the second sound channel is opened on a plane parallel to the second side of the substrate.

Optionally, a step is further disposed on a side of the first side, where the step is used to set a main board where the microphone is located, and after the microphone is installed in the cavity, the main board is disposed on the step; a surface of one side of the main board is sealed with a surface of one side of the first side, wherein a surface of one side of the main board is a surface where the microphone is located, and a surface of one side of the first side is open a stepped surface provided with a cavity for mounting a microphone;

Both the second side and the lower end of the base are sealed to the inner wall of the rear case.

Optionally, a package structure of a microphone includes: a rear case and a bracket, the rear case is connected to a main board where the microphone is located, the microphone is enclosed in the rear case, and the bracket is disposed behind And forming a sound chamber with the rear case, the microphone is encapsulated in the sound chamber, and a sound hole is opened on a lower end portion of the rear case.

Optionally, a sealing connection is formed between the rear case and the main board.

Optionally, a terminal device includes: a package structure of a microphone, a main board, and a microphone, the package structure of the microphone includes: a rear case and a package sleeve, the package cover includes a base body, wherein the base body includes a first side a second side surface and a lower end surface, the first side surface being opposite to the second side surface;

a cavity for setting a microphone is disposed on the first side;

a first sound channel is defined in the second side, and an upper portion of the first sound channel and a lower portion of the cavity form a through portion, and a sound hole of the microphone is opposite to the through portion; the lower end surface a second sound channel is disposed on the upper opening, and the second sound channel is in communication with the first sound channel; The base body is disposed in the rear case, and the lower end portion of the rear case is provided with a sound hole, and the sound hole is opposite to the sound output port of the second sound channel.

Optionally, a step is further disposed on a side of the first side, where the step is used to set a main board where the microphone is located, and after the microphone is installed into the cavity, the main board is disposed on the step; The surface of one side of the main board is sealed with the surface of one side of the first side surface, wherein a surface of one side of the main board is a surface where the microphone is located, and a surface of one side of the first side surface is opened with a step And provided with a surface for mounting a cavity of the microphone;

Optionally, a terminal device includes: a package structure of a microphone, a main board, and a microphone, the package structure of the microphone includes a rear case and a bracket, the rear case is connected to a main board where the microphone is located, and the microphone is surrounded by In the rear case, the bracket is disposed on the rear case, and forms a sound chamber with the rear case, the microphone is encapsulated in the sound chamber, and the lower end portion of the rear case is provided with a sound dissipation hole.

Optionally, the rear case is sealedly connected to the main board.

In summary, the embodiment of the present invention provides a cavity, a first sound channel and a second sound channel on the package sleeve, and the back case presses the package sleeve onto the motherboard to package the microphone, thereby ensuring that the surface of the main board and the rear case can be When the distance is less than 3 mm, the microphone package is realized, and the package sleeve and the rear case are more reliable because the contact surface is relatively large.

BRIEF abstract

1 is a cross-sectional view showing a package structure of a microphone according to an embodiment of the present invention;

2 to 3 are exploded perspective views of a package structure of a microphone according to an embodiment of the present invention;

4 is a schematic view showing a seal between a package sleeve and a main board according to an embodiment of the present invention;

5 is a schematic view showing a seal between a package sleeve and a rear case according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a package structure of a microphone according to an embodiment of the present invention; FIG. FIG. 7 is a schematic structural diagram of a terminal device according to an embodiment of the present invention;

8 is a cross-sectional view showing another package structure of a microphone according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of another package structure of a microphone according to an embodiment of the present invention; FIG. 10 is a schematic structural diagram of another terminal device according to an embodiment of the present invention. Preferred embodiment of the invention

Embodiments of the present application will be described in detail below with reference to the accompanying drawings. It should be noted that, in the case of no conflict, the features in the embodiments and the embodiments in the present application may be arbitrarily combined with each other.

As shown in FIG. 1 to FIG. 3, the package structure of the microphone of the present application includes: a rear case 1 and a package sleeve 2, the package sleeve 2 includes a base body 21, and a cavity for setting a microphone is opened on the first side of the base body 21. 23, a first sound channel 25 is defined on the second side 24 of the base body 21, and the second side surface 24 is opposite to the first side surface. The upper portion of the first sound channel 25 and the lower portion of the cavity 23 penetrate to form a through portion, and the sound hole of the microphone Opposite the through portion, a second sound passage 26 is opened on the lower end surface of the base body 21, and the second sound passage 26 communicates with the first sound passage 25, the base body 21 is disposed in the rear case 1, and the lower end portion of the rear case 1 is opened. There is a sound hole 11 which is opposite to the sound outlet 261 of the second sound channel 26.

In the present embodiment, the lower portion of the first sound passage 25 and the sound input port 262 of the second sound passage 26 are penetrated, and the sound input port 262 of the second sound passage 26 is opened on a plane parallel to the second side surface 24 of the base 21.

In the present application, the sleeve can be made of a silicone sleeve.

As shown in FIG. 4, a step 27 on which the main board of the microphone is located is further disposed on one side of the first side of the base body 21. After the microphone is mounted in the cavity 23, the main board is disposed on the step 27, and the surface of the main board microphone is located. The surface 28 on which the cavity 23 of the microphone is disposed after the opening step 27 of the first side is sealed, and the surface 28 where the cavity 23 after the step 27 is opened and the main board around the microphone are sealed by interference or adhesive.

As shown in FIG. 5, after the base body 21 is disposed in the rear case 1, the second side surface 24 and the lower end surface 29 of the base body 21 are both sealed from the inner wall of the rear case 1, after the rear case 1 is fastened, and the second side of the base body 21 is attached. The side surface 24 and the first inner wall 12 of the rear case 1 are sealed by interference or backing; at the lower end surface 29 of the base 21 A seal is formed by interference with the second inner wall 13 of the rear case 1.

In order to facilitate the assembly and disassembly, generally the two seals in Figure 5 will not use the adhesive at the same time, regardless of whether the two adhesives are used or whether they are only by the interference seal, it is within the scope of the present application.

The present application presses the package sleeve 2 to the motherboard board where the microphone is located through the rear case 1, and the motherboard and the package sleeve 2 are formed by the compression of the rear case 1 (or the sealing between the main board and the package sleeve 2). a reliable sealed sound passage; the compression of the package sleeve 2 and the rear shell 1 (or the seal between the package sleeve 2 and the rear shell 1) forms a sealed sound passage, and the present application simplifies the mold of the package sleeve, The requirement for the distance between the main board and the rear case surface is lowered, and the requirement that the microphone's sound hole is moved in the thickness direction of the mobile terminal is satisfied.

FIG. 6 is a schematic structural diagram of a package structure of a microphone according to the above embodiment of the present invention, and the package structure 60 of the microphone includes: a rear case 61 and a package sleeve 62.

As shown in FIG. 7 , the present embodiment further provides a terminal device 70, including: a package structure 60 of a microphone 71, a main board 72, and a microphone. The package structure of the microphone is the package structure of the microphone described above. Let me repeat.

As shown in FIG. 8, the package structure of another microphone provided by the present application includes: a rear case 1 and a bracket 3, and the rear case 1 is connected to a main board where the microphone is located, and the microphone is enclosed in the rear case 1, and the bracket 3 is disposed at The rear case and the rear case 1 form a sound chamber 4, and the microphone is enclosed in the sound chamber 4, and the sound hole 11 is opened at the lower end portion of the rear case.

The rear case 1 is pressed against the main board by a foam to form a sealed connection. The bracket 3 is super-welded or double-sided glued to the rear case 1. This way, the microphone can be packaged under the condition that the distance between the main board and the rear case surface is 3.5 mm or less, and the position of the sound hole 11 is also flexible.

FIG. 9 is a schematic structural diagram of a package structure of a microphone according to the embodiment of FIG. 8. The package structure 90 of the microphone includes: a rear case 91 and a bracket 92.

As shown in FIG. 10, the present embodiment further provides a terminal device 100, including: a package structure 90 of a microphone 101, a main board 102, and a microphone. The package structure of the microphone is a package structure of the microphone shown in FIG. No longer.

One of ordinary skill in the art will appreciate that all or part of the steps in the above methods may be passed through the program. The instructions are related to hardware completion, and the program can be stored in a computer readable storage medium such as a read only memory, a magnetic disk, or an optical disk. Optionally, all or part of the steps of the foregoing embodiments may also be implemented by using one or more integrated circuits. Accordingly, each module/unit in the foregoing embodiment may be implemented in the form of hardware, or may use software functions. The form of the module is implemented. This application is not limited to any specific combination of hardware and software.

The above description is only the preferred embodiment of the present application, and is not intended to limit the present application, and various changes and modifications may be made to the present application. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of this application are intended to be included within the scope of this application.

Industrial Applicability The embodiment of the present invention provides a cavity, a first sound channel and a second sound channel on the package sleeve, and the rear case presses the package sleeve onto the main board to package the microphone, thereby ensuring the distance between the main board and the rear case surface. When the size is less than 3 mm, the package of the microphone is realized, and the package sleeve and the rear case are more reliable because the contact surface is relatively large. Therefore, it has strong industrial applicability.

Claims

claims

1. A microphone packaging structure, including: a back shell and a packaging sleeve, the packaging sleeve including a base body, wherein:

The base body includes a first side surface, a second side surface and a lower end surface, and the first side surface is opposite to the second side surface;

A cavity for placing the microphone is provided on the first side;

A first sound channel is provided on the second side, the upper section of the first sound channel communicates with the lower section of the cavity to form a through portion, and the sound hole of the microphone is opposite to the through portion; the lower end surface A second sound channel is provided on it, and the second sound channel is connected with the first sound channel; and

The base body is arranged in the rear shell, and a sound diffusion hole is provided at the lower end of the rear shell. The sound diffusion hole is opposite to the sound outlet of the second sound channel.

2. The packaging structure of the microphone according to claim 1, wherein the lower section of the first sound channel communicates with the sound inlet of the second sound channel, and the sound inlet of the second sound channel is opened between The second side of the base body is on a parallel plane.

3. The packaging structure of the microphone according to claim 1, wherein,

There is also a step on one side of the first side, and the step is used to set the main board where the microphone is located. After the microphone is installed in the cavity, the main board is set on the step;

The surface of one side of the main board is sealed with the surface of one side of the first side, wherein the surface of one side of the main board is the surface where the microphone is located, and the surface of one side of the first side is provided with a a surface that is stepped and provided with a cavity for mounting a microphone; and

The second side surface and the lower end surface of the base body are sealed with the inner wall of the rear shell.

4. A packaging structure for a microphone, including: a back shell and a bracket, the back shell is connected to the mainboard where the microphone is located, the microphone is surrounded by the back shell, and the bracket is provided on the back shell , and forms a sound cavity with the back shell, the microphone is packaged in the sound cavity, and a sound diffusion hole is provided on the lower end of the back shell.

5. The packaging structure of the microphone according to claim 4, wherein the back shell and the main board sealed connection.

6. A terminal device, including: a microphone, a motherboard and a packaging structure of the microphone; the packaging structure of the microphone includes: a back shell and a packaging sleeve; the packaging sleeve includes a base body, wherein,

A cavity for placing the microphone is provided on the first side;

7. The terminal device according to claim 6, wherein the lower section of the first sound channel communicates with the sound inlet of the second sound channel, and the sound inlet of the second sound channel is opened between the sound inlet and the sound inlet of the second sound channel. The second side of the base body is parallel to the plane.

8. The terminal device as claimed in claim 6, wherein,

9. A terminal device, including: a microphone, a motherboard and a packaging structure of the microphone. The packaging structure of the microphone includes a back shell and a bracket. The back shell is connected to the motherboard where the microphone is located. The microphone is surrounded by the In the back case, the bracket is arranged on the back case and forms a sound cavity with the back case, the microphone is packaged in the sound cavity, and a sound diffusion hole is provided on the lower end of the back case.

10. The terminal device according to claim 9, wherein the back shell and the motherboard are sealedly connected.