WO2021129185A1 - Sound generating device module and electronic product - Google Patents

Sound generating device module and electronic product Download PDF

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Publication number
WO2021129185A1
WO2021129185A1 PCT/CN2020/126932 CN2020126932W WO2021129185A1 WO 2021129185 A1 WO2021129185 A1 WO 2021129185A1 CN 2020126932 W CN2020126932 W CN 2020126932W WO 2021129185 A1 WO2021129185 A1 WO 2021129185A1
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WO
WIPO (PCT)
Prior art keywords
sound
device module
hole
adhesive layer
size
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PCT/CN2020/126932
Other languages
French (fr)
Chinese (zh)
Inventor
李洪杰
刘影男
鲁路路
Original Assignee
歌尔股份有限公司
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Publication of WO2021129185A1 publication Critical patent/WO2021129185A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/02Casings; Cabinets ; Supports therefor; Mountings therein
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention belongs to the technical field of electro-acoustic conversion. Specifically, the present invention relates to a sound-generating device module and an electronic product.
  • the speakers used in consumer electronic products are small in size.
  • the acoustic performance such as the resonant frequency and bass performance of the speaker is affected by the volume of the speaker.
  • a relatively large speaker back cavity can better improve the acoustic performance of the speaker.
  • the space inside the loudspeaker needs to allow sound and air flow to pass, and the loudspeaker needs to be provided with structures such as pressure relief holes communicating with the outside. If the overall size of the speaker is small, the air flow space will be complicated, which does not meet the air circulation requirements of the acoustic performance, which will adversely affect the resonance frequency of the speaker and the sensitivity of the speaker diaphragm.
  • An object of the present invention is to provide an improved sound generating device module.
  • a sound device module including:
  • a module housing, a sound leakage hole is formed on the module housing, and the sound leakage hole communicates with the inside of the module housing;
  • the mesh assembly includes a cover plate, mesh and adhesive layer
  • the cover plate has an adhesive surface, an air channel is formed on the cover plate, the inner opening of the air channel is located on the adhesive surface, and the outer opening of the air channel is configured to communicate with the outside ,
  • the mesh cloth is set at the inner opening;
  • the mesh cloth component is adhesively fixed on the module housing through the glue layer, and the inner through opening is in communication with the sound leakage hole.
  • a strip groove is provided on the sticking surface, the strip groove extends to the edge of the cover plate, the glue layer covers the sticking surface, and the glue layer and the strip
  • the groove combination constitutes the air guiding channel, and one end of the strip groove extending to the edge of the cover plate serves as the outer through opening.
  • the strip-shaped groove forms a pattern depression at one end located in the sticking surface, the size of the pattern depression is greater than the width of the strip-shaped groove, and the pattern depression serves as the inner through opening.
  • the graphic depression is rectangular, circular or triangular.
  • the size of the pattern depression is larger than the size of the sound leakage hole.
  • the adhesive layer includes a first adhesive layer, the first adhesive layer covers the adhesive surface, and the first adhesive layer is formed with a first through hole at a position corresponding to the inner through hole , The mesh cloth is attached to the side of the first adhesive layer away from the adhesive surface.
  • the adhesive layer includes a second adhesive layer, the second adhesive layer is pasted on a side of the first adhesive layer away from the adhesive surface, and a second adhesive layer is provided on the second adhesive layer.
  • the size of the second through hole and the mesh cloth is larger than the size of the first through hole, and the mesh cloth is located at the second through hole.
  • the size of the mesh cloth is larger than the size of the first through hole.
  • the size of the mesh cloth is larger than the size of the sound leakage hole.
  • the present invention also provides an electronic product, including:
  • the sounding device module is arranged in the product body, the sounding device module is configured to work to produce sound, and the sound hole is for sound to be transmitted.
  • a technical effect of the present invention is to improve the sound venting structure of the sound device module, thereby improving the acoustic performance of the sound device module.
  • Figure 1 is an exploded schematic diagram of the mesh assembly of the sound device module provided by the present invention
  • Figure 2 is a schematic diagram of the overall structure of the mesh assembly provided by the present invention.
  • FIG. 3 is a schematic diagram of the structure of the sticking surface of the mesh cloth component provided by the present invention.
  • Fig. 4 is a schematic side sectional view of the mesh cloth assembly provided by the present invention.
  • the present invention provides a sound generating device module.
  • the sound generating device module includes a module housing and a mesh assembly.
  • the module housing is used for accommodating components in the sound device module.
  • a sound generating device assembly including a diaphragm and a magnetic circuit system can be arranged in the module housing, and the sound generating device assembly can vibrate to generate sound after being connected to a sound signal, and the sound generated can be transmitted from the module housing .
  • the sound device module can usually be used as a speaker or earpiece in electronic products such as mobile phones and tablet computers.
  • a sound leakage hole may be formed on the module housing, and the sound leakage hole is in communication with the internal structure of the module housing.
  • the diaphragm When the sound device module is actually working, the diaphragm will vibrate to produce sound. Due to the vibration of the diaphragm, the air on both sides of the diaphragm will produce air pressure changes. Wherein, the air connecting the diaphragm to the side of the sound outlet can communicate with the outside through the sound outlet, thereby releasing the pressure generated by the air pressure change.
  • the air connected to the inner side of the module housing by the diaphragm is often difficult to directly communicate with the outside, and the pressure generated by the air pressure change is difficult to release.
  • the sound vent holes on the module housing can lead out the airflow inside the module housing, thereby releasing the pressure formed inside the module housing. Furthermore, it avoids problems such as a decrease in the vibration sensitivity of the diaphragm and limited amplitude due to the difference in air pressure on both sides of the diaphragm.
  • the mesh cloth assembly includes a cover plate 1, a mesh cloth 3 and a glue layer.
  • An air guide channel is formed in the mesh cloth assembly.
  • the mesh assembly is used for mounting on the module housing, one end of the air guiding channel is connected with the sound leakage hole, and the other end of the air guiding channel is connected with the outside.
  • the buffer pressure of the sound vent hole and the effect of absorbing sound vibration can be improved, thereby improving the acoustic performance of the sound device module.
  • Figure 2 shows the state of the mesh assembly when assembled, the lower surface of the mesh assembly shown in Figure 2 can be directly fixed on the outer surface of the module housing, so that the air guide channel and The sound leakage holes are in butt connection and communication.
  • the cover plate 1 has an adhesive surface 11.
  • the air guide channel is formed on the cover plate 1.
  • the inner through opening 102 (one end) of the air guiding channel is located on the sticking surface 11.
  • the outer port 101 (the other end) of the air guide channel communicates with the outside.
  • the air guide channel constitutes a complete passage in the cover plate 1 so that air can circulate and the pressure generated by the vibration of the diaphragm is relieved.
  • the mesh cloth 3 is arranged at the inner opening 102, and the mesh cloth 3 is used to provide a damping effect. On the one hand, it can absorb vibration, and on the other hand, it can let air pass through, thereby achieving a pressure relief effect.
  • the mesh cloth component is pasted and fixed on the module housing through the glue layer, and the inner through port is connected with the sound leakage hole.
  • the mesh cloth plays a role of absorbing, isolating and buffering vibration, and the air can pass through the mesh cloth to form convection with the air guide channel and the external environment to release air pressure.
  • the technical scheme of the present invention effectively plays the role of balancing airflow and improving sound compliance.
  • the air guide channel further plays a role of guiding the air, increases the acoustic resistance, reduces the resonance frequency of the sound device module, and effectively improves the acoustic performance.
  • the cover plate is formed by injection molding of a plastic material, which can reduce the difficulty of forming the air guide channel in the cover plate from a technological perspective, and it is easier to form the air guide channel with a predetermined shape according to the requirements of acoustic performance.
  • the sticking surface 11 is provided with a strip groove 111, and the strip groove 111 extends from the central area of the cover plate 1 to the edge of the cover plate 1.
  • the adhesive layer covers the adhesive surface 11.
  • the glue layer is covered on the strip groove 111, which together with the strip groove 111 forms the air guide channel.
  • One end of the strip groove 111 that extends to the edge of the cover plate 1 serves as the outer through opening 101.
  • One end of the strip-shaped groove 111 located on the central area of the cover plate 1 serves as the inner through opening 102.
  • the air guide channel may also be directly opened inside the cover plate.
  • one end of the air guide channel is located on the adhesive surface, and the air guide channel is curved and extends in the thickness direction of the cover plate, and then extends from the upper surface of the cover plate opposite to the adhesive surface.
  • the external port is formed to form a communication relationship with the outside world.
  • the strip-shaped groove 111 forms a pattern depression at one end located in the central area of the sticking surface 11.
  • the size of the pattern depression is greater than the width of the strip groove 111.
  • the graphic depression serves as the inner opening 102 of the air guide channel.
  • the graphic depression is circular.
  • the pattern depression may also be rectangular or triangular.
  • the specific shape of the graphic recess can be changed depending on factors such as the docking manner of the sound leakage hole and the graphic recess, the internal port 102 required by the acoustic performance, and the shape of the air guide channel. Different shapes of graphic depressions produce different acoustic properties.
  • the diameter of the graphic depression may be in the range of 0.6-0.8 mm, and correspondingly, the diameter of the pressure relief hole may be in the range of 0.3 mm-0.4 mm.
  • This design method can ensure the docking relationship between the pressure relief hole and the inner through opening 102, and can also better play the role of air diversion.
  • the size of the pattern depression is larger than the size of the sound leakage hole.
  • the adhesive layer may include a first adhesive layer 21.
  • the first adhesive layer 21 covers the adhesive surface 11, and the first adhesive layer 21 has a first through hole 211 formed at a position corresponding to the inner through opening 102.
  • the mesh cloth 3 can be attached to the side of the first adhesive layer 21 away from the adhesive surface 11.
  • the first adhesive layer directly functions to fix the mesh cloth 3 on the side of the sticking surface 11.
  • the cover plate with the first adhesive layer can be directly attached to the module housing.
  • the first through hole 211 is used to allow air to pass through.
  • the adhesive layer may further include a second adhesive layer 22.
  • the second adhesive layer 22 is pasted on the side of the first adhesive layer 21 away from the pasting surface 11. Since the mesh cloth 3 is pasted on the first adhesive layer 21, when the first adhesive layer 21 is directly used for bonding to the module housing, the thickness of the mesh cloth 3 will cause a certain obstacle to the adhesion. .
  • the second adhesive layer 22 is provided with a second through hole 221, and the size of the second through hole 221 can match the size of the mesh 3.
  • the size of the second through hole 221 and the mesh cloth 3 is optionally larger than the size of the first through hole 211. In this way, the mesh cloth can potentially be located at the second through hole, that is, the second through hole plays a role of accommodating the mesh cloth, thereby reducing the effect of the mesh cloth on sticking the cover plate to the module housing. Hinder interference.
  • Designing the size of the second through hole 221 and the mesh cloth 3 to be larger than the first through hole 211 helps to reduce the difficulty in assembling and positioning the second adhesive layer, the mesh cloth 3 and the first through hole 211.
  • the mesh cloth 3 By combining the first adhesive layer and the second adhesive layer to form the adhesive layer, the mesh cloth 3 can be effectively contained therein, and the cover plate is bonded and fixed to the module shell through the second adhesive layer Physically.
  • the thickness of the mesh cloth 3 may be less than or equal to the thickness of the second adhesive layer, which can further eliminate the obstacle of the mesh cloth 3 from sticking the adhesive layer to the module housing.
  • the size of the mesh cloth may also be designed to be larger than the size of the first through hole.
  • the size of the mesh cloth may be designed to be larger than the size of the sound leakage hole.
  • the adhesive layer may also be formed with a gap at the outer through opening 101, so that the outer through The opening 101 does not completely cover the strip groove.
  • This implementation manner can make the outer opening present an open structural feature, improve the smoothness of the air guide channel communicating with the outside, and improve the pressure relief capability of the air guide channel.
  • the present invention also provides an electronic product, which includes a product main body and the above-mentioned sound device module.
  • the product body is provided with a sound hole.
  • the main body of the product may be a mobile phone, a tablet computer, a headset, and the like.
  • the sound device module is arranged inside the product theme. The sound device module is configured to be able to pass in a sound signal and then work to produce sound, and the sound hole is for the sound generated by it to pass out.
  • the mesh assembly is fixed on the module housing of the sound device module, and is fixed inside the product body together with the sound device module.
  • the external opening can be connected to the large internal cavity of the product body, and further communicate with the external space through the gaps and openings on the product body.

Abstract

Disclosed are a sound generating device module and an electronic product. The sound generating device module comprises: a module housing, a sound discharge hole being formed on the module housing, and the sound discharge hole being in communication with the interior of the module housing; a mesh cloth assembly, the mesh cloth assembly comprising a cover plate, a mesh cloth and an adhesive layer; the cover plate has an adhesive surface, an air guide passage is formed on the cover plate, an inner opening of the air guide passage is located on the adhesive surface, an outer opening of the air guide passage is configured to communicate with the outside, and the mesh cloth is provided at the inner opening; and the mesh cloth assembly is bonded and secured onto the module housing by means of the adhesive layer, and the inner opening is in communication with the sound discharge hole.

Description

一种发声装置模组和电子产品Sound device module and electronic product 技术领域Technical field
本发明属于电声转换技术领域,具体地,本发明涉及一种发声装置模组和电子产品。The present invention belongs to the technical field of electro-acoustic conversion. Specifically, the present invention relates to a sound-generating device module and an electronic product.
背景技术Background technique
近年来消费类电子产品的发展迅速,手机、平板电脑等电子设备得到消费者的广泛应用。其中,扬声器是电子产品中的重要声学部件,其用于将电信号转化成声音,以供消费者收听。随着电子产品相关技术的快速发展,消费者对电子产品的声学性能提出了更高的性能需求。在这种情况下,本领域技术人员需要对声学器件作出相应的改进。In recent years, consumer electronic products have developed rapidly, and electronic devices such as mobile phones and tablet computers have been widely used by consumers. Among them, the speaker is an important acoustic component in electronic products, which is used to convert electrical signals into sound for consumers to listen to. With the rapid development of related technologies of electronic products, consumers have put forward higher performance requirements for the acoustic performance of electronic products. In this case, those skilled in the art need to make corresponding improvements to the acoustic device.
应用于消费类电子产品中的扬声器体积较小。而扬声器的谐振频率、低音性能等声学性能受到扬声器体积的影响。在实际应用中,往往相对较大的扬声器后腔能够更好的提高扬声器的声学性能。另外,扬声器内部的空间需要供声音、气流通过,扬声器需要设置于外界连通的泄压孔等结构。如果扬声器整体尺寸较小,会造成空气流动空间复杂,不符合声学性能的空气流通需求,从而对扬声器的谐振频率、扬声器振膜的灵敏度等性能造成不利影响。The speakers used in consumer electronic products are small in size. The acoustic performance such as the resonant frequency and bass performance of the speaker is affected by the volume of the speaker. In practical applications, a relatively large speaker back cavity can better improve the acoustic performance of the speaker. In addition, the space inside the loudspeaker needs to allow sound and air flow to pass, and the loudspeaker needs to be provided with structures such as pressure relief holes communicating with the outside. If the overall size of the speaker is small, the air flow space will be complicated, which does not meet the air circulation requirements of the acoustic performance, which will adversely affect the resonance frequency of the speaker and the sensitivity of the speaker diaphragm.
发明内容Summary of the invention
本发明的一个目的是提供一种改进的发声装置模组。An object of the present invention is to provide an improved sound generating device module.
根据本发明的第一方面,提供了一种发声装置模组,包括:According to the first aspect of the present invention, a sound device module is provided, including:
模组壳体,所述模组壳体上形成有泄声孔,所述泄声孔与所述模组壳体的内部连通;A module housing, a sound leakage hole is formed on the module housing, and the sound leakage hole communicates with the inside of the module housing;
网布组件,所述网布组件包括盖板、网布和胶层;Mesh assembly, the mesh assembly includes a cover plate, mesh and adhesive layer;
所述盖板具有粘贴面,所述盖板上形成有导气通道,所述导气通道的 内通口位于所述粘贴面上,所述导气通道的外通口被配置为与外界连通,所述网布设置在所述内通口处;The cover plate has an adhesive surface, an air channel is formed on the cover plate, the inner opening of the air channel is located on the adhesive surface, and the outer opening of the air channel is configured to communicate with the outside , The mesh cloth is set at the inner opening;
所述网布组件通过所述胶层粘接固定在所述模组壳体上,所述内通口与所述泄声孔连通。The mesh cloth component is adhesively fixed on the module housing through the glue layer, and the inner through opening is in communication with the sound leakage hole.
可选地,所述粘贴面上开设有条形槽,所述条形槽延伸至所述盖板的边缘,所述胶层覆盖在所述粘贴面上,所述胶层与所述条形槽组合构成所述导气通道,所述条形槽的延伸至所述盖板的边缘的一端作为所述外通口。Optionally, a strip groove is provided on the sticking surface, the strip groove extends to the edge of the cover plate, the glue layer covers the sticking surface, and the glue layer and the strip The groove combination constitutes the air guiding channel, and one end of the strip groove extending to the edge of the cover plate serves as the outer through opening.
可选地,所述条形槽在位于所述粘贴面中的一端形成图形凹陷,所述图形凹陷的尺寸大于所述条形槽的宽度,所述图形凹陷作为所述内通口。Optionally, the strip-shaped groove forms a pattern depression at one end located in the sticking surface, the size of the pattern depression is greater than the width of the strip-shaped groove, and the pattern depression serves as the inner through opening.
可选地,所述图形凹陷呈矩形、圆形或三角形。Optionally, the graphic depression is rectangular, circular or triangular.
可选地,所述图形凹陷的尺寸大于所述泄声孔的尺寸。Optionally, the size of the pattern depression is larger than the size of the sound leakage hole.
可选地,所述胶层包括第一胶层,所述第一胶层覆盖在所述粘贴面上,所述第一胶层在对应所述内通口的位置处形成有第一通孔,所述网布贴在所述第一胶层的远离所述粘贴面的一侧。Optionally, the adhesive layer includes a first adhesive layer, the first adhesive layer covers the adhesive surface, and the first adhesive layer is formed with a first through hole at a position corresponding to the inner through hole , The mesh cloth is attached to the side of the first adhesive layer away from the adhesive surface.
可选地,所述胶层包括第二胶层,所述第二胶层粘贴在所述第一胶层的远离所述粘贴面的一侧,所述第二胶层上开设有第二通孔,所述第二通孔和网布的尺寸大于所述第一通孔的尺寸,所述网布位于所述第二通孔处。Optionally, the adhesive layer includes a second adhesive layer, the second adhesive layer is pasted on a side of the first adhesive layer away from the adhesive surface, and a second adhesive layer is provided on the second adhesive layer. The size of the second through hole and the mesh cloth is larger than the size of the first through hole, and the mesh cloth is located at the second through hole.
可选地,所述网布的尺寸大于所述第一通孔的尺寸。Optionally, the size of the mesh cloth is larger than the size of the first through hole.
可选地,所述网布的尺寸大于所述泄声孔的尺寸。Optionally, the size of the mesh cloth is larger than the size of the sound leakage hole.
本发明还提供了一种电子产品,包括:The present invention also provides an electronic product, including:
产品主体,所述产品主体上形成有出声孔;A product body, where a sound hole is formed on the product body;
上述发声装置模组,所述发声装置模组设置在所述产品主体内,所述发声装置模组被配置为能工作发声,所述出声孔供声音传出。In the above-mentioned sounding device module, the sounding device module is arranged in the product body, the sounding device module is configured to work to produce sound, and the sound hole is for sound to be transmitted.
本发明的一个技术效果在于改善了发声装置模组的泄声结构,进而改善发声装置模组的声学性能。A technical effect of the present invention is to improve the sound venting structure of the sound device module, thereby improving the acoustic performance of the sound device module.
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。Through the following detailed description of exemplary embodiments of the present invention with reference to the accompanying drawings, other features and advantages of the present invention will become clear.
附图说明Description of the drawings
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例,并且连同其说明一起用于解释本发明的原理。The drawings incorporated in the specification and constituting a part of the specification illustrate the embodiments of the present invention, and together with the description are used to explain the principle of the present invention.
图1是本发明提供的发声装置模组的网布组件的爆炸示意图;Figure 1 is an exploded schematic diagram of the mesh assembly of the sound device module provided by the present invention;
图2是本发明提供的网布组件的整体结构示意图;Figure 2 is a schematic diagram of the overall structure of the mesh assembly provided by the present invention;
图3是本发明提供的网布组件的粘贴面结构示意图;3 is a schematic diagram of the structure of the sticking surface of the mesh cloth component provided by the present invention;
图4是本发明提供的网布组件的侧面剖视示意图。Fig. 4 is a schematic side sectional view of the mesh cloth assembly provided by the present invention.
具体实施方式Detailed ways
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本发明及其应用或使用的任何限制。The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论,但在适当情况下,所述技术、方法和设备应当被视为说明书的一部分。The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiment may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in the subsequent drawings.
本发明提供了一种发声装置模组,该发声装置模组包括模组壳体和网布组件。所述模组壳体用于容纳发声装置模组中的零部件。例如,包括振膜、磁路系统的发声装置组件可以设置在所述模组壳体中,发声装置组件通入声音信号后能够振动产生声音,其产生的声音能够从模组壳体中传出。所述发声装置模组通常可以作为手机、平板电脑等电子产品中的扬声器或听筒。The present invention provides a sound generating device module. The sound generating device module includes a module housing and a mesh assembly. The module housing is used for accommodating components in the sound device module. For example, a sound generating device assembly including a diaphragm and a magnetic circuit system can be arranged in the module housing, and the sound generating device assembly can vibrate to generate sound after being connected to a sound signal, and the sound generated can be transmitted from the module housing . The sound device module can usually be used as a speaker or earpiece in electronic products such as mobile phones and tablet computers.
所述模组壳体上可以形成有泄声孔,所述泄声孔与所述模组壳体的内部结构连通。在发声装置模组实际工作时,振膜会振动产生声音。由于振 膜的振动,振膜两侧的空气会产生气压变化。其中,振膜连通至出声口一侧的空气能够通过出声口与外界连通,从而释放气压变化产生的压力。而振膜连通至模组壳体内部一侧的空气往往难以直接与外界连通,气压变化产生的压力难以释放。开设与模组壳体上的泄声孔可以将模组壳体内部的气流导出,从而释放模组壳体内部形成的压力。进一步地,避免振膜两侧气压不同而造成振膜的振动灵敏度下降、振幅受限等问题。A sound leakage hole may be formed on the module housing, and the sound leakage hole is in communication with the internal structure of the module housing. When the sound device module is actually working, the diaphragm will vibrate to produce sound. Due to the vibration of the diaphragm, the air on both sides of the diaphragm will produce air pressure changes. Wherein, the air connecting the diaphragm to the side of the sound outlet can communicate with the outside through the sound outlet, thereby releasing the pressure generated by the air pressure change. However, the air connected to the inner side of the module housing by the diaphragm is often difficult to directly communicate with the outside, and the pressure generated by the air pressure change is difficult to release. The sound vent holes on the module housing can lead out the airflow inside the module housing, thereby releasing the pressure formed inside the module housing. Furthermore, it avoids problems such as a decrease in the vibration sensitivity of the diaphragm and limited amplitude due to the difference in air pressure on both sides of the diaphragm.
如图1所示,所述网布组件包括盖板1、网布3和胶层。所述网布组件中形成有导气通道。所述网布组件用于贴装在所述模组壳体上,所述导气通道的一端与所述泄声孔连通,所述导气通道的另一端则与外界连通。通过所述导气通道与所述泄声孔配合,能够提高泄声孔的缓冲压力、吸收声音振动的作用,从而提高发声装置模组的声学性能。图2示出了所述网布组件装配在一起时的状态,图2所示的网布组件的下表面可以直接固定在所述模组壳体的外表现上,使所述导气通道与所述泄声孔对接连通。As shown in Fig. 1, the mesh cloth assembly includes a cover plate 1, a mesh cloth 3 and a glue layer. An air guide channel is formed in the mesh cloth assembly. The mesh assembly is used for mounting on the module housing, one end of the air guiding channel is connected with the sound leakage hole, and the other end of the air guiding channel is connected with the outside. Through the cooperation of the air guide channel and the sound vent hole, the buffer pressure of the sound vent hole and the effect of absorbing sound vibration can be improved, thereby improving the acoustic performance of the sound device module. Figure 2 shows the state of the mesh assembly when assembled, the lower surface of the mesh assembly shown in Figure 2 can be directly fixed on the outer surface of the module housing, so that the air guide channel and The sound leakage holes are in butt connection and communication.
如图1、3所示,所述盖板1具有粘贴面11,在该实施方式中,所述导气通道形成在所述盖板1上。所述导气通道的内通口102(一端)位于所述粘贴面11上。所述导气通道的外通口101(另一端)则与外界连通。通过这种设计,所述导气通道构成在所述盖板1中构成完整的通路,以便空气能够流通,缓解振膜振动产生的压力。所述网布3则设置在所述内通口102处,所述网布3用于提供阻尼效果,一方面其可以吸收振动,另一方面其可以让空气通过,从而实现泄压作用。As shown in FIGS. 1 and 3, the cover plate 1 has an adhesive surface 11. In this embodiment, the air guide channel is formed on the cover plate 1. The inner through opening 102 (one end) of the air guiding channel is located on the sticking surface 11. The outer port 101 (the other end) of the air guide channel communicates with the outside. Through this design, the air guide channel constitutes a complete passage in the cover plate 1 so that air can circulate and the pressure generated by the vibration of the diaphragm is relieved. The mesh cloth 3 is arranged at the inner opening 102, and the mesh cloth 3 is used to provide a damping effect. On the one hand, it can absorb vibration, and on the other hand, it can let air pass through, thereby achieving a pressure relief effect.
所述网布组件通过所述胶层粘贴固定在所述模组壳体上,并且使所述内通口与所述泄声孔连通。这样,在振膜振动工作时,模组壳体内部的空气可以将振动以及气压传递至所述泄声孔处。所述网布对振动起到吸收、隔离缓冲的作用,空气可以透过所述网布进而与所述导气通道、外界环境形成对流,将空气压力释放。本发明的技术方案有效起到了平衡气流、提高声音顺性的作用。所述导气通道进一步起到对空气的引导作用,增大声阻、降低发声装置模组的谐振频率,有效的改善了声学性能。The mesh cloth component is pasted and fixed on the module housing through the glue layer, and the inner through port is connected with the sound leakage hole. In this way, when the diaphragm vibrates, the air inside the module housing can transmit vibration and air pressure to the sound vent. The mesh cloth plays a role of absorbing, isolating and buffering vibration, and the air can pass through the mesh cloth to form convection with the air guide channel and the external environment to release air pressure. The technical scheme of the present invention effectively plays the role of balancing airflow and improving sound compliance. The air guide channel further plays a role of guiding the air, increases the acoustic resistance, reduces the resonance frequency of the sound device module, and effectively improves the acoustic performance.
可选地,所述盖板采用塑料材料注塑形成,这样可以从工艺角度降低在所述盖板中形成导气通道的难度,更容易根据声学性能的要求形成具有 预定形状的导气通道。Optionally, the cover plate is formed by injection molding of a plastic material, which can reduce the difficulty of forming the air guide channel in the cover plate from a technological perspective, and it is easier to form the air guide channel with a predetermined shape according to the requirements of acoustic performance.
可选地,如图3、4所示,所述粘贴面11上开设有条形槽111,所述条形槽111从所述盖板1的中心区域延伸至盖板1的边缘。所述胶层这覆盖在所述粘贴面11上。在这种实施方式中,所述胶层封盖在所述条形槽111上,其与所述条形槽111共同构成了所述导气通道。所述条形槽111的延伸至所述盖板1的边缘的一端作为所述外通口101。条形槽111位于盖板1中心区域上的一端作为内通口102。该实施方式的优点在于,所述导气通道的成型难度更低,而且更容易根据声学性能的要求形成预定的弯曲形状。Optionally, as shown in FIGS. 3 and 4, the sticking surface 11 is provided with a strip groove 111, and the strip groove 111 extends from the central area of the cover plate 1 to the edge of the cover plate 1. The adhesive layer covers the adhesive surface 11. In this embodiment, the glue layer is covered on the strip groove 111, which together with the strip groove 111 forms the air guide channel. One end of the strip groove 111 that extends to the edge of the cover plate 1 serves as the outer through opening 101. One end of the strip-shaped groove 111 located on the central area of the cover plate 1 serves as the inner through opening 102. The advantage of this embodiment is that the formation of the air guide channel is less difficult, and it is easier to form a predetermined curved shape according to the requirements of acoustic performance.
在其它实施方式中,所述导气通道还可以直接开设在所述盖板的内部。例如,所述导气通道的一端位于所述粘贴面上,所述导气通道在所述盖板的厚度方向内弯曲延伸,之后从所述盖板的与所述粘贴面相对的上表面上形成所述外通口,与外界形成连通关系。In other embodiments, the air guide channel may also be directly opened inside the cover plate. For example, one end of the air guide channel is located on the adhesive surface, and the air guide channel is curved and extends in the thickness direction of the cover plate, and then extends from the upper surface of the cover plate opposite to the adhesive surface. The external port is formed to form a communication relationship with the outside world.
可选地,如图3所示,所述条形槽111在位于所述粘贴面11中心区域的一端形成图形凹陷。所述图形凹陷的尺寸大于所述条形槽111的宽度。该图形凹陷作为所述导气通道的内通口102。通过形成尺寸较大的图形凹陷,能够使导气通道的内通口102更容易与所述泄声孔形成对接关系,降低因网布组件与模组壳体之间因装配误差而引起的内通口无法与泄声孔准确对接的问题。另一方面,将所述内通口设计成具有更宽大的尺寸,能够更好的起到引导空气、泄压的作用。Optionally, as shown in FIG. 3, the strip-shaped groove 111 forms a pattern depression at one end located in the central area of the sticking surface 11. The size of the pattern depression is greater than the width of the strip groove 111. The graphic depression serves as the inner opening 102 of the air guide channel. By forming a large-sized graphic recess, the inner through opening 102 of the air guide channel can be more easily formed abutting relationship with the sound bleed hole, and the internal error caused by the assembly error between the mesh component and the module housing can be reduced. The problem that the port cannot be accurately connected to the sound vent. On the other hand, the inner port is designed to have a wider size, which can better guide air and relieve pressure.
可选地,在如图3所示的实施方式中,所述图形凹陷呈圆形。在其它实施方式中,所述图形凹陷也可以呈矩形或三角形。所述图形凹陷所采用的具体形状,视所述泄声孔与图形凹陷的对接方式、声学性能所要求的内通口102以及导气通道的形状等因素可以进行改变。不同形状的图形凹陷所产生的声学性能不同。Optionally, in the embodiment shown in FIG. 3, the graphic depression is circular. In other embodiments, the pattern depression may also be rectangular or triangular. The specific shape of the graphic recess can be changed depending on factors such as the docking manner of the sound leakage hole and the graphic recess, the internal port 102 required by the acoustic performance, and the shape of the air guide channel. Different shapes of graphic depressions produce different acoustic properties.
可选地,在所述图形凹陷呈圆形的实施方式中,所述图形凹陷的直径范围可以为0.6-0.8mm,相应的,所述泄压孔的直径范围可以为0.3mm-0.4mm。这种设计方式可以保证泄压孔与所述内通口102的对接关系,也能够更好的起到导流空气的作用。可选地,所述图形凹陷的尺寸大 于所述泄声孔的尺寸。Optionally, in the embodiment where the graphic depression is circular, the diameter of the graphic depression may be in the range of 0.6-0.8 mm, and correspondingly, the diameter of the pressure relief hole may be in the range of 0.3 mm-0.4 mm. This design method can ensure the docking relationship between the pressure relief hole and the inner through opening 102, and can also better play the role of air diversion. Optionally, the size of the pattern depression is larger than the size of the sound leakage hole.
如图1、4所示,所述胶层可以包括第一胶层21。所述第一胶层21覆盖在所述粘贴面11上,所述第一胶层21在对应所述内通口102的位置处形成有第一通孔211。所述网布3则可以贴装在所述第一胶层21的远离所述粘贴面11的一侧。在这种实施方式中,所述第一胶层直接起到将网布3固定在粘贴面11一侧的作用。另一方面,可以直接将附有第一胶层的盖板贴在模组壳体上。所述第一通孔211用于供空气通过。As shown in FIGS. 1 and 4, the adhesive layer may include a first adhesive layer 21. The first adhesive layer 21 covers the adhesive surface 11, and the first adhesive layer 21 has a first through hole 211 formed at a position corresponding to the inner through opening 102. The mesh cloth 3 can be attached to the side of the first adhesive layer 21 away from the adhesive surface 11. In this embodiment, the first adhesive layer directly functions to fix the mesh cloth 3 on the side of the sticking surface 11. On the other hand, the cover plate with the first adhesive layer can be directly attached to the module housing. The first through hole 211 is used to allow air to pass through.
可选地,所述胶层还可以包括第二胶层22。所述第二胶层22粘贴在所述第一胶层21的远离于所述粘贴面11的一侧。由于所述网布3粘贴在所述第一胶层21上,因此在直接用第一胶层21向模组壳体上粘接时,所述网布3的厚度会对粘接造成一定阻碍。在优选的实施方式中,如图4所示,通过设置第二胶层22,可以降低或排除所述网布3造成的粘贴干扰。所述第二胶层22上开设有第二通孔221,所述第二通孔221的尺寸可以与所述网布3的尺寸相匹配。所述第二通孔221以及所述网布3的尺寸可选地大于所述第一通孔211的尺寸。这样,所述网布能够潜在所述第二通孔处,也即第二通孔起到了收容所述网布的作用,从而降低所述网布对将盖板粘贴到模组壳体上形成的阻碍干扰。Optionally, the adhesive layer may further include a second adhesive layer 22. The second adhesive layer 22 is pasted on the side of the first adhesive layer 21 away from the pasting surface 11. Since the mesh cloth 3 is pasted on the first adhesive layer 21, when the first adhesive layer 21 is directly used for bonding to the module housing, the thickness of the mesh cloth 3 will cause a certain obstacle to the adhesion. . In a preferred embodiment, as shown in FIG. 4, by providing the second adhesive layer 22, the adhesion interference caused by the mesh cloth 3 can be reduced or eliminated. The second adhesive layer 22 is provided with a second through hole 221, and the size of the second through hole 221 can match the size of the mesh 3. The size of the second through hole 221 and the mesh cloth 3 is optionally larger than the size of the first through hole 211. In this way, the mesh cloth can potentially be located at the second through hole, that is, the second through hole plays a role of accommodating the mesh cloth, thereby reducing the effect of the mesh cloth on sticking the cover plate to the module housing. Hinder interference.
将所述第二通孔221以及网布3的尺寸设计为大于所述第一通孔211,有助于降低第二胶层、网布3与所述第一通孔211的装配定位难度。Designing the size of the second through hole 221 and the mesh cloth 3 to be larger than the first through hole 211 helps to reduce the difficulty in assembling and positioning the second adhesive layer, the mesh cloth 3 and the first through hole 211.
通过所述第一胶层和第二胶层组合构成所述胶层,能够有效的将网布3容纳在其中,所述盖板通过所述第二胶层粘接固定在所述模组壳体上。By combining the first adhesive layer and the second adhesive layer to form the adhesive layer, the mesh cloth 3 can be effectively contained therein, and the cover plate is bonded and fixed to the module shell through the second adhesive layer Physically.
可选地,所述网布3的厚度可以小于或等于所述第二胶层的厚度,这样可以进一步消除网布3对胶层粘贴到模组壳体上形成的阻碍。Optionally, the thickness of the mesh cloth 3 may be less than or equal to the thickness of the second adhesive layer, which can further eliminate the obstacle of the mesh cloth 3 from sticking the adhesive layer to the module housing.
可选地,在其它实施方式中,也可以将所述网布的尺寸设计为大于所述第一通孔的尺寸。可选地,可以将所述网布的尺寸设计为大于所述泄声孔的尺寸。一方面,提高阻尼效果,起到良好的吸收振动的作用。另一方面,降低网布与第一通孔、泄声孔之间的定位难度,提高产品功能可靠性。Optionally, in other embodiments, the size of the mesh cloth may also be designed to be larger than the size of the first through hole. Optionally, the size of the mesh cloth may be designed to be larger than the size of the sound leakage hole. On the one hand, the damping effect is improved, and it plays a good role in absorbing vibration. On the other hand, the positioning difficulty between the mesh and the first through hole and the sound vent hole is reduced, and the functional reliability of the product is improved.
可选地,在采用条形槽与所述胶层组合构成所述导气通道的实施方式中,所述胶层在所述外通口101处也可以形成有缺口,从而在所述外通口 101处不完全覆盖所述条形槽。这种实施方式可以使得所述外通口呈敞开的结构特点,提高导气通道与外界连通的顺畅程度,提高导气通道的泄压能力。Optionally, in an embodiment in which a strip-shaped groove is combined with the adhesive layer to form the air guide channel, the adhesive layer may also be formed with a gap at the outer through opening 101, so that the outer through The opening 101 does not completely cover the strip groove. This implementation manner can make the outer opening present an open structural feature, improve the smoothness of the air guide channel communicating with the outside, and improve the pressure relief capability of the air guide channel.
本发明还提供了一种电子产品,该电子产品包括产品主体和上述发声装置模组。所述产品主体上设置有出声孔。所述产品主体可以是手机、平板电脑、耳机等。所述发声装置模组设置在所述产品主题内部。所述发声装置模组被配置为能通入声音信号进而工作发声,所述出声孔则供其产生的声音传出。The present invention also provides an electronic product, which includes a product main body and the above-mentioned sound device module. The product body is provided with a sound hole. The main body of the product may be a mobile phone, a tablet computer, a headset, and the like. The sound device module is arranged inside the product theme. The sound device module is configured to be able to pass in a sound signal and then work to produce sound, and the sound hole is for the sound generated by it to pass out.
所述网布组件固定在发声装置模组的模组壳体上,其与发声装置模组一同固定在产品主体内部。所述外通口可以连通至产品主体的内部大空腔中,进而通过产品主体上的缝隙、开孔进一步与外界空间连通。The mesh assembly is fixed on the module housing of the sound device module, and is fixed inside the product body together with the sound device module. The external opening can be connected to the large internal cavity of the product body, and further communicate with the external space through the gaps and openings on the product body.
虽然已经通过例子对本发明的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上例子仅是为了进行说明,而不是为了限制本发明的范围。本领域的技术人员应该理解,可在不脱离本发明的范围和精神的情况下,对以上实施例进行修改。本发明的范围由所附权利要求来限定。Although some specific embodiments of the present invention have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration and not for limiting the scope of the present invention. Those skilled in the art should understand that the above embodiments can be modified without departing from the scope and spirit of the present invention. The scope of the invention is defined by the appended claims.

Claims (10)

  1. 一种发声装置模组,其特征在于,包括:A sound device module, characterized in that it comprises:
    模组壳体,所述模组壳体上形成有泄声孔,所述泄声孔与所述模组壳体的内部连通;A module housing, a sound leakage hole is formed on the module housing, and the sound leakage hole communicates with the inside of the module housing;
    网布组件,所述网布组件包括盖板、网布和胶层;Mesh assembly, the mesh assembly includes a cover plate, mesh and adhesive layer;
    所述盖板具有粘贴面,所述盖板上形成有导气通道,所述导气通道的内通口位于所述粘贴面上,所述导气通道的外通口被配置为与外界连通,所述网布设置在所述内通口处;The cover plate has an adhesive surface, an air channel is formed on the cover plate, the inner opening of the air channel is located on the adhesive surface, and the outer opening of the air channel is configured to communicate with the outside , The mesh cloth is set at the inner opening;
    所述网布组件通过所述胶层粘接固定在所述模组壳体上,所述内通口与所述泄声孔连通。The mesh cloth component is adhesively fixed on the module housing through the glue layer, and the inner through opening is in communication with the sound leakage hole.
  2. 根据权利要求1所述的发声装置模组,其特征在于,所述粘贴面上开设有条形槽,所述条形槽延伸至所述盖板的边缘,所述胶层覆盖在所述粘贴面上,所述胶层与所述条形槽组合构成所述导气通道,所述条形槽的延伸至所述盖板的边缘的一端作为所述外通口。The sounding device module according to claim 1, wherein a strip groove is formed on the sticking surface, the strip groove extends to the edge of the cover plate, and the glue layer covers the sticking surface. On the surface, the adhesive layer and the strip-shaped groove are combined to form the air guiding channel, and one end of the strip-shaped groove extending to the edge of the cover plate serves as the outer opening.
  3. 根据权利要求2所述的发声装置模组,其特征在于,所述条形槽在位于所述粘贴面中的一端形成图形凹陷,所述图形凹陷的尺寸大于所述条形槽的宽度,所述图形凹陷作为所述内通口。The sound device module according to claim 2, wherein the strip-shaped groove forms a pattern depression at one end located in the sticking surface, and the size of the pattern depression is larger than the width of the strip-shaped groove. The pattern depression serves as the inner port.
  4. 根据权利要求3所述的发声装置模组,其特征在于,所述图形凹陷呈矩形、圆形或三角形。4. The sound device module of claim 3, wherein the pattern depression is rectangular, circular or triangular.
  5. 根据权利要求3所述的发声装置模组,其特征在于,所述图形凹陷的尺寸大于所述泄声孔的尺寸。4. The sound device module of claim 3, wherein the size of the pattern depression is larger than the size of the sound leakage hole.
  6. 根据权利要求1所述的发声装置模组,其特征在于,所述胶层包括第一胶层,所述第一胶层覆盖在所述粘贴面上,所述第一胶层在对应所述内通口的位置处形成有第一通孔,所述网布贴在所述第一胶层的远离所述粘贴面的一侧。The sound device module according to claim 1, wherein the adhesive layer comprises a first adhesive layer, the first adhesive layer covers the sticking surface, and the first adhesive layer corresponds to the A first through hole is formed at the position of the inner through opening, and the mesh cloth is pasted on the side of the first adhesive layer away from the pasting surface.
  7. 根据权利要求6所述的发声装置模组,其特征在于,所述胶层包括第二胶层,所述第二胶层粘贴在所述第一胶层的远离所述粘贴面的一侧,所述第二胶层上开设有第二通孔,所述第二通孔和网布的尺寸大于所述第 一通孔的尺寸,所述网布位于所述第二通孔处。The sound device module according to claim 6, wherein the glue layer comprises a second glue layer, and the second glue layer is pasted on a side of the first glue layer away from the sticking surface, The second adhesive layer is provided with a second through hole, the size of the second through hole and the mesh is larger than the size of the first through hole, and the mesh is located at the second through hole.
  8. 根据权利要求1所述的发声装置模组,其特征在于,所述网布的尺寸大于所述第一通孔的尺寸。The sound device module according to claim 1, wherein the size of the mesh cloth is larger than the size of the first through hole.
  9. 根据权利要求1所述的发声装置模组,其特征在于,所述网布的尺寸大于所述泄声孔的尺寸。The sound device module according to claim 1, wherein the size of the mesh cloth is larger than the size of the sound leakage hole.
  10. 一种电子产品,其特征在于,包括:An electronic product, characterized in that it includes:
    产品主体,所述产品主体上形成有出声孔;A product body, where a sound hole is formed on the product body;
    权利要求1-9任意之一所述的发声装置模组,所述发声装置模组设置在所述产品主体内,所述发声装置模组被配置为能工作发声,所述出声孔供声音传出。The sounding device module according to any one of claims 1-9, the sounding device module is arranged in the product body, the sounding device module is configured to work to produce sound, and the sound hole is for sound Outgoing.
PCT/CN2020/126932 2019-12-27 2020-11-06 Sound generating device module and electronic product WO2021129185A1 (en)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110958509A (en) * 2019-12-27 2020-04-03 歌尔科技有限公司 Sound generating device module and electronic product
CN113645535B (en) * 2020-04-27 2022-09-09 华为技术有限公司 Mobile terminal
CN111556385A (en) * 2020-05-12 2020-08-18 深圳市信维声学科技有限公司 Micro speaker and amplitude adjusting method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105516870A (en) * 2016-02-29 2016-04-20 歌尔声学股份有限公司 Loudspeaker module
EP3370431A2 (en) * 2017-03-02 2018-09-05 Sonion Nederland B.V. A sensor comprising two parallel acoustical filter elements, an assembly comprising a sensor and the filter, a hearable and a method
US10225645B1 (en) * 2018-08-06 2019-03-05 AAC Technologies Pte. Ltd. Speaker box
CN208908494U (en) * 2018-05-04 2019-05-28 瑞声科技(新加坡)有限公司 Loudspeaker mould group
CN209462523U (en) * 2019-03-12 2019-10-01 深圳市信维声学科技有限公司 A kind of sound chamber BOX structure
CN110958509A (en) * 2019-12-27 2020-04-03 歌尔科技有限公司 Sound generating device module and electronic product

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105516870A (en) * 2016-02-29 2016-04-20 歌尔声学股份有限公司 Loudspeaker module
EP3370431A2 (en) * 2017-03-02 2018-09-05 Sonion Nederland B.V. A sensor comprising two parallel acoustical filter elements, an assembly comprising a sensor and the filter, a hearable and a method
CN208908494U (en) * 2018-05-04 2019-05-28 瑞声科技(新加坡)有限公司 Loudspeaker mould group
US10225645B1 (en) * 2018-08-06 2019-03-05 AAC Technologies Pte. Ltd. Speaker box
CN209462523U (en) * 2019-03-12 2019-10-01 深圳市信维声学科技有限公司 A kind of sound chamber BOX structure
CN110958509A (en) * 2019-12-27 2020-04-03 歌尔科技有限公司 Sound generating device module and electronic product

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