WO2021129185A1 - Module de dispositif de génération de sons et produit électronique - Google Patents

Module de dispositif de génération de sons et produit électronique Download PDF

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Publication number
WO2021129185A1
WO2021129185A1 PCT/CN2020/126932 CN2020126932W WO2021129185A1 WO 2021129185 A1 WO2021129185 A1 WO 2021129185A1 CN 2020126932 W CN2020126932 W CN 2020126932W WO 2021129185 A1 WO2021129185 A1 WO 2021129185A1
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WO
WIPO (PCT)
Prior art keywords
sound
device module
hole
adhesive layer
size
Prior art date
Application number
PCT/CN2020/126932
Other languages
English (en)
Chinese (zh)
Inventor
李洪杰
刘影男
鲁路路
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2021129185A1 publication Critical patent/WO2021129185A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention belongs to the technical field of electro-acoustic conversion. Specifically, the present invention relates to a sound-generating device module and an electronic product.
  • the speakers used in consumer electronic products are small in size.
  • the acoustic performance such as the resonant frequency and bass performance of the speaker is affected by the volume of the speaker.
  • a relatively large speaker back cavity can better improve the acoustic performance of the speaker.
  • the space inside the loudspeaker needs to allow sound and air flow to pass, and the loudspeaker needs to be provided with structures such as pressure relief holes communicating with the outside. If the overall size of the speaker is small, the air flow space will be complicated, which does not meet the air circulation requirements of the acoustic performance, which will adversely affect the resonance frequency of the speaker and the sensitivity of the speaker diaphragm.
  • An object of the present invention is to provide an improved sound generating device module.
  • a sound device module including:
  • a module housing, a sound leakage hole is formed on the module housing, and the sound leakage hole communicates with the inside of the module housing;
  • the mesh assembly includes a cover plate, mesh and adhesive layer
  • the cover plate has an adhesive surface, an air channel is formed on the cover plate, the inner opening of the air channel is located on the adhesive surface, and the outer opening of the air channel is configured to communicate with the outside ,
  • the mesh cloth is set at the inner opening;
  • the mesh cloth component is adhesively fixed on the module housing through the glue layer, and the inner through opening is in communication with the sound leakage hole.
  • a strip groove is provided on the sticking surface, the strip groove extends to the edge of the cover plate, the glue layer covers the sticking surface, and the glue layer and the strip
  • the groove combination constitutes the air guiding channel, and one end of the strip groove extending to the edge of the cover plate serves as the outer through opening.
  • the strip-shaped groove forms a pattern depression at one end located in the sticking surface, the size of the pattern depression is greater than the width of the strip-shaped groove, and the pattern depression serves as the inner through opening.
  • the graphic depression is rectangular, circular or triangular.
  • the size of the pattern depression is larger than the size of the sound leakage hole.
  • the adhesive layer includes a first adhesive layer, the first adhesive layer covers the adhesive surface, and the first adhesive layer is formed with a first through hole at a position corresponding to the inner through hole , The mesh cloth is attached to the side of the first adhesive layer away from the adhesive surface.
  • the adhesive layer includes a second adhesive layer, the second adhesive layer is pasted on a side of the first adhesive layer away from the adhesive surface, and a second adhesive layer is provided on the second adhesive layer.
  • the size of the second through hole and the mesh cloth is larger than the size of the first through hole, and the mesh cloth is located at the second through hole.
  • the size of the mesh cloth is larger than the size of the first through hole.
  • the size of the mesh cloth is larger than the size of the sound leakage hole.
  • the present invention also provides an electronic product, including:
  • the sounding device module is arranged in the product body, the sounding device module is configured to work to produce sound, and the sound hole is for sound to be transmitted.
  • a technical effect of the present invention is to improve the sound venting structure of the sound device module, thereby improving the acoustic performance of the sound device module.
  • Figure 1 is an exploded schematic diagram of the mesh assembly of the sound device module provided by the present invention
  • Figure 2 is a schematic diagram of the overall structure of the mesh assembly provided by the present invention.
  • FIG. 3 is a schematic diagram of the structure of the sticking surface of the mesh cloth component provided by the present invention.
  • Fig. 4 is a schematic side sectional view of the mesh cloth assembly provided by the present invention.
  • the present invention provides a sound generating device module.
  • the sound generating device module includes a module housing and a mesh assembly.
  • the module housing is used for accommodating components in the sound device module.
  • a sound generating device assembly including a diaphragm and a magnetic circuit system can be arranged in the module housing, and the sound generating device assembly can vibrate to generate sound after being connected to a sound signal, and the sound generated can be transmitted from the module housing .
  • the sound device module can usually be used as a speaker or earpiece in electronic products such as mobile phones and tablet computers.
  • a sound leakage hole may be formed on the module housing, and the sound leakage hole is in communication with the internal structure of the module housing.
  • the diaphragm When the sound device module is actually working, the diaphragm will vibrate to produce sound. Due to the vibration of the diaphragm, the air on both sides of the diaphragm will produce air pressure changes. Wherein, the air connecting the diaphragm to the side of the sound outlet can communicate with the outside through the sound outlet, thereby releasing the pressure generated by the air pressure change.
  • the air connected to the inner side of the module housing by the diaphragm is often difficult to directly communicate with the outside, and the pressure generated by the air pressure change is difficult to release.
  • the sound vent holes on the module housing can lead out the airflow inside the module housing, thereby releasing the pressure formed inside the module housing. Furthermore, it avoids problems such as a decrease in the vibration sensitivity of the diaphragm and limited amplitude due to the difference in air pressure on both sides of the diaphragm.
  • the mesh cloth assembly includes a cover plate 1, a mesh cloth 3 and a glue layer.
  • An air guide channel is formed in the mesh cloth assembly.
  • the mesh assembly is used for mounting on the module housing, one end of the air guiding channel is connected with the sound leakage hole, and the other end of the air guiding channel is connected with the outside.
  • the buffer pressure of the sound vent hole and the effect of absorbing sound vibration can be improved, thereby improving the acoustic performance of the sound device module.
  • Figure 2 shows the state of the mesh assembly when assembled, the lower surface of the mesh assembly shown in Figure 2 can be directly fixed on the outer surface of the module housing, so that the air guide channel and The sound leakage holes are in butt connection and communication.
  • the cover plate 1 has an adhesive surface 11.
  • the air guide channel is formed on the cover plate 1.
  • the inner through opening 102 (one end) of the air guiding channel is located on the sticking surface 11.
  • the outer port 101 (the other end) of the air guide channel communicates with the outside.
  • the air guide channel constitutes a complete passage in the cover plate 1 so that air can circulate and the pressure generated by the vibration of the diaphragm is relieved.
  • the mesh cloth 3 is arranged at the inner opening 102, and the mesh cloth 3 is used to provide a damping effect. On the one hand, it can absorb vibration, and on the other hand, it can let air pass through, thereby achieving a pressure relief effect.
  • the mesh cloth component is pasted and fixed on the module housing through the glue layer, and the inner through port is connected with the sound leakage hole.
  • the mesh cloth plays a role of absorbing, isolating and buffering vibration, and the air can pass through the mesh cloth to form convection with the air guide channel and the external environment to release air pressure.
  • the technical scheme of the present invention effectively plays the role of balancing airflow and improving sound compliance.
  • the air guide channel further plays a role of guiding the air, increases the acoustic resistance, reduces the resonance frequency of the sound device module, and effectively improves the acoustic performance.
  • the cover plate is formed by injection molding of a plastic material, which can reduce the difficulty of forming the air guide channel in the cover plate from a technological perspective, and it is easier to form the air guide channel with a predetermined shape according to the requirements of acoustic performance.
  • the sticking surface 11 is provided with a strip groove 111, and the strip groove 111 extends from the central area of the cover plate 1 to the edge of the cover plate 1.
  • the adhesive layer covers the adhesive surface 11.
  • the glue layer is covered on the strip groove 111, which together with the strip groove 111 forms the air guide channel.
  • One end of the strip groove 111 that extends to the edge of the cover plate 1 serves as the outer through opening 101.
  • One end of the strip-shaped groove 111 located on the central area of the cover plate 1 serves as the inner through opening 102.
  • the air guide channel may also be directly opened inside the cover plate.
  • one end of the air guide channel is located on the adhesive surface, and the air guide channel is curved and extends in the thickness direction of the cover plate, and then extends from the upper surface of the cover plate opposite to the adhesive surface.
  • the external port is formed to form a communication relationship with the outside world.
  • the strip-shaped groove 111 forms a pattern depression at one end located in the central area of the sticking surface 11.
  • the size of the pattern depression is greater than the width of the strip groove 111.
  • the graphic depression serves as the inner opening 102 of the air guide channel.
  • the graphic depression is circular.
  • the pattern depression may also be rectangular or triangular.
  • the specific shape of the graphic recess can be changed depending on factors such as the docking manner of the sound leakage hole and the graphic recess, the internal port 102 required by the acoustic performance, and the shape of the air guide channel. Different shapes of graphic depressions produce different acoustic properties.
  • the diameter of the graphic depression may be in the range of 0.6-0.8 mm, and correspondingly, the diameter of the pressure relief hole may be in the range of 0.3 mm-0.4 mm.
  • This design method can ensure the docking relationship between the pressure relief hole and the inner through opening 102, and can also better play the role of air diversion.
  • the size of the pattern depression is larger than the size of the sound leakage hole.
  • the adhesive layer may include a first adhesive layer 21.
  • the first adhesive layer 21 covers the adhesive surface 11, and the first adhesive layer 21 has a first through hole 211 formed at a position corresponding to the inner through opening 102.
  • the mesh cloth 3 can be attached to the side of the first adhesive layer 21 away from the adhesive surface 11.
  • the first adhesive layer directly functions to fix the mesh cloth 3 on the side of the sticking surface 11.
  • the cover plate with the first adhesive layer can be directly attached to the module housing.
  • the first through hole 211 is used to allow air to pass through.
  • the adhesive layer may further include a second adhesive layer 22.
  • the second adhesive layer 22 is pasted on the side of the first adhesive layer 21 away from the pasting surface 11. Since the mesh cloth 3 is pasted on the first adhesive layer 21, when the first adhesive layer 21 is directly used for bonding to the module housing, the thickness of the mesh cloth 3 will cause a certain obstacle to the adhesion. .
  • the second adhesive layer 22 is provided with a second through hole 221, and the size of the second through hole 221 can match the size of the mesh 3.
  • the size of the second through hole 221 and the mesh cloth 3 is optionally larger than the size of the first through hole 211. In this way, the mesh cloth can potentially be located at the second through hole, that is, the second through hole plays a role of accommodating the mesh cloth, thereby reducing the effect of the mesh cloth on sticking the cover plate to the module housing. Hinder interference.
  • Designing the size of the second through hole 221 and the mesh cloth 3 to be larger than the first through hole 211 helps to reduce the difficulty in assembling and positioning the second adhesive layer, the mesh cloth 3 and the first through hole 211.
  • the mesh cloth 3 By combining the first adhesive layer and the second adhesive layer to form the adhesive layer, the mesh cloth 3 can be effectively contained therein, and the cover plate is bonded and fixed to the module shell through the second adhesive layer Physically.
  • the thickness of the mesh cloth 3 may be less than or equal to the thickness of the second adhesive layer, which can further eliminate the obstacle of the mesh cloth 3 from sticking the adhesive layer to the module housing.
  • the size of the mesh cloth may also be designed to be larger than the size of the first through hole.
  • the size of the mesh cloth may be designed to be larger than the size of the sound leakage hole.
  • the adhesive layer may also be formed with a gap at the outer through opening 101, so that the outer through The opening 101 does not completely cover the strip groove.
  • This implementation manner can make the outer opening present an open structural feature, improve the smoothness of the air guide channel communicating with the outside, and improve the pressure relief capability of the air guide channel.
  • the present invention also provides an electronic product, which includes a product main body and the above-mentioned sound device module.
  • the product body is provided with a sound hole.
  • the main body of the product may be a mobile phone, a tablet computer, a headset, and the like.
  • the sound device module is arranged inside the product theme. The sound device module is configured to be able to pass in a sound signal and then work to produce sound, and the sound hole is for the sound generated by it to pass out.
  • the mesh assembly is fixed on the module housing of the sound device module, and is fixed inside the product body together with the sound device module.
  • the external opening can be connected to the large internal cavity of the product body, and further communicate with the external space through the gaps and openings on the product body.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

L'invention porte sur un module de dispositif de génération de sons et sur un produit électronique. Le module de dispositif de génération de sons comprend : un boîtier de module, un trou d'émission de sons étant formé sur le boîtier de module et le trou de d'émission de sons étant en communication avec l'intérieur du boîtier de module ; un ensemble tissu à mailles, l'ensemble tissu à mailles comprenant une plaque de recouvrement, un tissu à mailles et une couche adhésive ; la plaque de recouvrement présente une surface adhésive, un passage de guidage d'air est formé sur la plaque de recouvrement, une ouverture interne du passage de guidage d'air est située sur la surface adhésive, une ouverture externe du passage de guidage d'air est configurée pour communiquer avec l'extérieur et le tissu à mailles est disposé au niveau de l'ouverture interne ; et l'ensemble tissu à mailles est lié et fixé sur le boîtier de module au moyen de la couche adhésive et l'ouverture interne est en communication avec le trou d'émission de sons.
PCT/CN2020/126932 2019-12-27 2020-11-06 Module de dispositif de génération de sons et produit électronique WO2021129185A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911379140.3A CN110958509A (zh) 2019-12-27 2019-12-27 一种发声装置模组和电子产品
CN201911379140.3 2019-12-27

Publications (1)

Publication Number Publication Date
WO2021129185A1 true WO2021129185A1 (fr) 2021-07-01

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Application Number Title Priority Date Filing Date
PCT/CN2020/126932 WO2021129185A1 (fr) 2019-12-27 2020-11-06 Module de dispositif de génération de sons et produit électronique

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CN (1) CN110958509A (fr)
WO (1) WO2021129185A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110958509A (zh) * 2019-12-27 2020-04-03 歌尔科技有限公司 一种发声装置模组和电子产品
CN113645535B (zh) * 2020-04-27 2022-09-09 华为技术有限公司 移动终端
CN111556385A (zh) * 2020-05-12 2020-08-18 深圳市信维声学科技有限公司 微型扬声器及其振幅调节方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105516870A (zh) * 2016-02-29 2016-04-20 歌尔声学股份有限公司 扬声器模组
EP3370431A2 (fr) * 2017-03-02 2018-09-05 Sonion Nederland B.V. Capteur comprenant deux éléments de filtre acoustique parallèles, ensemble comprenant un capteur et le filtre, appareil acoustique et procédé
US10225645B1 (en) * 2018-08-06 2019-03-05 AAC Technologies Pte. Ltd. Speaker box
CN208908494U (zh) * 2018-05-04 2019-05-28 瑞声科技(新加坡)有限公司 扬声器模组
CN209462523U (zh) * 2019-03-12 2019-10-01 深圳市信维声学科技有限公司 一种音腔box结构
CN110958509A (zh) * 2019-12-27 2020-04-03 歌尔科技有限公司 一种发声装置模组和电子产品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105516870A (zh) * 2016-02-29 2016-04-20 歌尔声学股份有限公司 扬声器模组
EP3370431A2 (fr) * 2017-03-02 2018-09-05 Sonion Nederland B.V. Capteur comprenant deux éléments de filtre acoustique parallèles, ensemble comprenant un capteur et le filtre, appareil acoustique et procédé
CN208908494U (zh) * 2018-05-04 2019-05-28 瑞声科技(新加坡)有限公司 扬声器模组
US10225645B1 (en) * 2018-08-06 2019-03-05 AAC Technologies Pte. Ltd. Speaker box
CN209462523U (zh) * 2019-03-12 2019-10-01 深圳市信维声学科技有限公司 一种音腔box结构
CN110958509A (zh) * 2019-12-27 2020-04-03 歌尔科技有限公司 一种发声装置模组和电子产品

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