WO2018218766A1 - Module de haut-parleur et dispositif électronique - Google Patents

Module de haut-parleur et dispositif électronique Download PDF

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Publication number
WO2018218766A1
WO2018218766A1 PCT/CN2017/094161 CN2017094161W WO2018218766A1 WO 2018218766 A1 WO2018218766 A1 WO 2018218766A1 CN 2017094161 W CN2017094161 W CN 2017094161W WO 2018218766 A1 WO2018218766 A1 WO 2018218766A1
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WO
WIPO (PCT)
Prior art keywords
speaker
cavity
speaker unit
sound
inner core
Prior art date
Application number
PCT/CN2017/094161
Other languages
English (en)
Chinese (zh)
Inventor
周树芝
郝正恩
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2018218766A1 publication Critical patent/WO2018218766A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R11/00—Transducers of moving-armature or moving-core type
    • H04R11/02—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers

Definitions

  • the present application relates to the field of electroacoustic conversion technology, and more particularly, to a speaker module and an electronic device.
  • the speaker module is an important acoustic device of portable electronic devices, which is used to complete the conversion between electrical signals and acoustic signals, and is an energy conversion device.
  • Existing speaker modules typically include a housing.
  • a speaker unit is housed in the housing.
  • the speaker unit separates the cavity of the entire module into a front cavity and a rear cavity. Wherein, the speaker unit is disposed in the front sound cavity, and the speaker unit has a retaining wall around the periphery. The retaining wall is used to position the speaker unit and avoids the formation of the kernel sound hole.
  • One end of the core sound hole communicates with the gap between the diaphragm and the magnetic circuit system, that is, the inner side of the diaphragm, and the other end communicates with the rear sound chamber.
  • a pressure relief hole is arranged on the module housing, and the pressure relief hole is connected with the rear sound chamber. When vibrating, the air pressure inside the diaphragm can be balanced with the outside through the inner core sound hole, the rear sound chamber, and the pressure relief hole.
  • the aperture size of the kernel sound hole is fixed. This does not change the size of the aperture according to different speaker modules. Users need to design different sizes of kernel sound holes according to different speaker modules.
  • One object of the present application is a new technical solution for a speaker module.
  • a speaker module includes a module housing and a speaker unit, and a cavity is disposed inside the module housing, the speaker unit is disposed in the cavity, and the speaker unit is configured to be the cavity
  • the body is divided into a front sound chamber and a rear sound chamber.
  • the inner sound hole of the speaker unit is in communication with the rear acoustic cavity; and further includes a shielding portion configured to partially or completely occlude the inner core sound hole.
  • the inner core sound hole is opposite to the rear acoustic cavity
  • the shielding portion includes a retaining wall for fixing the speaker unit, and the retaining wall is disposed in the front acoustic cavity and the rear acoustic cavity.
  • the shielding portion further includes a convex portion extending from the retaining wall, the convex portion corresponding to the inner sound hole.
  • the barrier wall is disposed between the front acoustic cavity and the rear acoustic cavity.
  • the retaining wall and the boss are integrally injection molded with the module housing.
  • the retaining wall is integrally injection molded with the module housing, and the protrusion is injection molded on the retaining wall as an insert.
  • the module housing includes an upper shell and a lower shell that are fastened together, and a front acoustic cavity is formed between the speaker unit and the upper casing, and the retaining wall and the convex portion are disposed Inside the upper casing.
  • a sealant is applied in the gap between the raised portion and the outer surface of the speaker unit.
  • the shielding portion comprises a heat resistant tape attached at an exit of the sound hole of the inner core.
  • the sound chamber is filled with a sound absorbing material.
  • an electronic device includes the speaker module provided by the present application.
  • the shielding portion can partially or completely block the sound hole of the core. In this way, the shielding portion can correct the cross-sectional area of the sound hole of the core and adjust the sound effect of the speaker module.
  • the shielding portion can reduce the cross-sectional area of the sound hole of the core, reduce low-frequency distortion, and improve the margin of listening.
  • the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
  • the speaker module can adopt a higher power speaker unit, which improves the sound quality of the speaker module.
  • the shielding area of the core sound hole is adjusted by the shielding portion, so that the same speaker unit can be applied to different speaker modules without setting the core sound hole for each speaker module, simplifying the design process of the speaker unit. Increases the versatility of the speaker unit.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • FIG. 2 is an assembled view of an upper casing and a speaker unit in accordance with an embodiment of the present application.
  • FIG 3 is a cross-sectional view of a speaker module in accordance with an embodiment of the present application.
  • Figure 4 is a partial enlarged view of a portion A in Figure 3.
  • 11 upper shell; 12: lower shell; 13: speaker unit; 14: inner core sound hole; 15: pressure relief hole; 16: damping member; 19: FPC; 20: front sound chamber; 21: rear sound chamber; Wall; 23: raised portion.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • a speaker module is provided.
  • the module includes a module housing and a speaker unit 13 as shown in FIG.
  • the speaker unit 13 is a moving coil type unit or a moving iron type unit.
  • the moving coil type unit includes a vibration component and a magnetic circuit component.
  • the vibrating assembly includes a diaphragm and a voice coil, and the diaphragm is connected to the voice coil.
  • the magnetic circuit assembly is used to form a magnetic gap. There is an alternating magnetic field in the magnetic gap, and one end of the voice coil is inserted into the magnetic gap.
  • an FPC 19 is disposed on the module housing, and the lead of the voice coil is electrically connected to the FPC 19.
  • the leads are electrically connected to an external circuit through the FPC 19.
  • a cavity is provided inside the module housing.
  • the speaker unit 13 is placed in the cavity.
  • the diaphragm of the speaker unit 13 separates the cavity into a front acoustic chamber 20 and a rear acoustic chamber 21.
  • the front acoustic chamber 20 is opposed to the outer side of the diaphragm, and the outer side is the side away from the magnetic circuit assembly of the speaker unit.
  • the front acoustic cavity 20 has an acoustic hole (not shown).
  • the speaker module makes a sound through the sound hole.
  • the sound hole passes through from the side of the module housing.
  • This structure constitutes a side sound speaker module.
  • the side-sounding speaker module is thinner in thickness and has a small footprint when installed.
  • the inner core sound hole 14 of the speaker unit 13 is in communication with the rear sound chamber 21.
  • the rear acoustic cavity 21 communicates with the inner side of the diaphragm through the inner core sound hole 14, and the inner side is near the side of the magnetic circuit assembly of the speaker unit.
  • a pressure relief hole 15 communicating with the rear sound chamber 21 is disposed on the module housing. When vibrating, the airflow inside the diaphragm is depressurized via the inner core sound hole 14, the rear sound chamber 21, and the pressure relief hole 15 to balance the internal and external pressure of the diaphragm.
  • a damper member 16 is provided outside the pressure relief hole 15, which is capable of damping the vibrational airflow and preventing external dust from entering.
  • the rear acoustic cavity 21 provides a buffer zone for the vibrating airflow. Moreover, the rear acoustic cavity 21 can adjust the low frequency effect of the speaker module.
  • the sound chamber 21 is filled with a sound absorbing material.
  • the sound absorbing material can increase the virtual space of the rear sound chamber 21, so that the speaker module can obtain a good low frequency effect without expanding the volume of the speaker module.
  • the speaker module further includes a shielding portion.
  • the obscuration portion is configured to partially or completely occlude the inner core sound hole 14.
  • the shielding portion can partially or completely block the core sound hole 14. In this way, the shielding portion can correct the size of the cross-sectional area of the core sound hole 14 and adjust the sound effect of the speaker module.
  • the shielding portion can reduce the cross-sectional area of the core sound hole 14, reduce low-frequency distortion, and improve the margin of listening.
  • the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit 13, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
  • the speaker module can adopt a higher power speaker unit 13, which improves the sound quality of the speaker module.
  • the shielding area of the core sound hole 14 is adjusted by the shielding portion, so that the same speaker unit 13 can be applied to different speaker modules without setting the core sound hole 14 for each speaker module, simplifying the speaker unit.
  • the design process of 13 improves the versatility of the speaker unit 13.
  • the speaker module has a flat structure.
  • the module housing includes an upper case 11 and a lower case 12 that are fastened together. In this way, the disassembly and assembly of the speaker unit 13 is more convenient.
  • the inner core sound hole 14 is opposite the rear sound chamber 21.
  • the shielding portion includes a blocking wall 22 that is disposed between the front acoustic cavity 20 and the rear acoustic cavity 21. This method facilitates the setting of the retaining wall.
  • the shield also includes a raised portion 23 that extends from the barrier wall 22. The raised portion 23 corresponds to the inner core sound hole 14.
  • the convex portion 23 is located above the barrier wall 22.
  • the raised portions 23 are in one-to-one correspondence with the inner core sound holes 14 to occlude the inner core sound holes 14, respectively.
  • the convex portion 23 should be as close as possible to the inner core sound hole 14.
  • the boss portion 23 has a feature of good shielding effect.
  • the retaining wall 22 is disposed between the front acoustic chamber 20 and the rear acoustic chamber 21, the retaining wall 22 It also functions to position the speaker unit 13.
  • the retaining wall 22 and the boss portion 23 are integrally injection molded with the module housing. In this way, the formation of the retaining wall 22 and the boss portion 23 becomes easy, and the connection strength between the retaining wall 22 and the boss portion 23 and the module housing is higher.
  • the retaining wall 22 is integrally injection molded with the module housing.
  • the raised portion 23 is injection molded as an insert onto the retaining wall 22. In this way, the processing steps can also be simplified, and the strength of the connection between the retaining wall 22, the boss 23 and the module housing can be increased.
  • both the front acoustic chamber 20 and the rear acoustic chamber 21 have a flat structure, and the rear acoustic chamber 21 is disposed around the speaker unit 13. In this way, the thickness of the speaker module is smaller, which is in line with the trend of thinning and thinning of electronic products.
  • the retaining wall 22 and the boss portion 23 are disposed in the upper casing 11.
  • the lower case 12 is a cover plate.
  • the user can first place the speaker unit 13 above the front sound chamber 20, so that the barrier wall 33 partially or completely blocks the inner core sound hole 22; nextly, the lower shell 12 is directly fastened to the upper shell 11, the speaker mold The assembly of the group is very convenient. In this way, the degree of integration of the upper casing 11 is improved.
  • a sealant is applied in a gap between the boss portion 23 and the outer surface of the speaker unit 13. The manner of applying the sealant can effectively prevent the airflow from passing through the gap, so that the shielding effect of the boss portion 23 is good.
  • the obscuring portion includes a heat resistant tape.
  • a heat resistant tape is attached to the exit of the core sound hole 14.
  • the user bonds the heat resistant tape to the exit of the core sound hole 14 by an adhesive.
  • the heat-resistant tape takes up a small volume and is easy to attach.
  • Heat resistant tape has good heat resistance. When the speaker unit 13 is working for a long time, it is resistant The thermal tape maintains its structural shape to ensure a occlusion effect.
  • an electronic device is provided.
  • the electronic device can be, but is not limited to, a VR device, an AR device, a mobile phone, a computer, a gaming machine, a walkie-talkie, and the like.
  • the electronic device includes the speaker module provided by the present application.
  • the electronic device has the characteristics of good sound effect.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

L'invention concerne un module de haut-parleur et un dispositif électronique. Le module comprend un boîtier de module et une unité de haut-parleur (13) ; une cavité est disposée à l'intérieur du boîtier de module, et l'unité de haut-parleur (13) est disposée dans la cavité ; l'unité de haut-parleur (13) divise la cavité en une cavité sonore avant (20) et une cavité sonore arrière (21) ; des trous acoustiques de noyau interne (14) de l'unité de haut-parleur (13) sont en communication avec la cavité sonore arrière (21) ; le module comprend en outre une partie de blindage qui est configurée pour protéger partiellement ou entièrement les trous acoustiques de noyau interne (14). Un problème technique à résoudre est que la taille des trous acoustiques de noyau interne (14) d'un module de haut-parleur existant est fixe et ne peut pas être ajustée en fonction de modules de haut-parleur de différents modèles. La taille des trous acoustiques de noyau interne (14) est ajustée au moyen de la partie de blindage, de telle sorte que la même unité de haut-parleur (13) peut être appliquée à différents modules de haut-parleur, ce qui simplifie le processus de conception de l'unité de haut-parleur (13) et améliore l'universalité de l'unité de haut-parleur (13).
PCT/CN2017/094161 2017-05-31 2017-07-24 Module de haut-parleur et dispositif électronique WO2018218766A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201720622349.8 2017-05-31
CN201720622349.8U CN207070324U (zh) 2017-05-31 2017-05-31 扬声器模组以及电子设备

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Publication Number Publication Date
WO2018218766A1 true WO2018218766A1 (fr) 2018-12-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021237837A1 (fr) * 2020-05-29 2021-12-02 瑞声声学科技(深圳)有限公司 Dispositif de production de son

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Publication number Priority date Publication date Assignee Title
CN110113697B (zh) * 2019-04-08 2021-04-09 Oppo广东移动通信有限公司 电声组件和移动终端
JP2022549232A (ja) * 2019-09-19 2022-11-24 深▲セン▼市韶音科技有限公司 音響出力装置
CN213028514U (zh) * 2020-05-29 2021-04-20 瑞声科技(新加坡)有限公司 发声器件
CN212588498U (zh) * 2020-05-29 2021-02-23 瑞声科技(新加坡)有限公司 发声器件
CN212628367U (zh) * 2020-05-29 2021-02-26 瑞声科技(新加坡)有限公司 发声器件
CN113965849B (zh) * 2021-11-24 2023-10-27 深圳市智昇科技发展有限公司 一种音效声效调节装置

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KR20050094701A (ko) * 2004-03-24 2005-09-28 주식회사 팬택앤큐리텔 스피커와 이를 갖는 휴대폰
CN101115320A (zh) * 2006-07-28 2008-01-30 三星电子株式会社 用于移动终端的扬声器装置
CN103297904A (zh) * 2013-05-18 2013-09-11 歌尔声学股份有限公司 一种双振膜扬声器模组
CN203574851U (zh) * 2013-11-14 2014-04-30 歌尔声学股份有限公司 扬声器模组
CN104159179A (zh) * 2014-06-30 2014-11-19 歌尔声学股份有限公司 扬声器模组
CN104202700A (zh) * 2014-06-30 2014-12-10 歌尔声学股份有限公司 发声器件
CN205213036U (zh) * 2015-11-12 2016-05-04 瑞声光电科技(常州)有限公司 一种扬声器

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050094701A (ko) * 2004-03-24 2005-09-28 주식회사 팬택앤큐리텔 스피커와 이를 갖는 휴대폰
CN101115320A (zh) * 2006-07-28 2008-01-30 三星电子株式会社 用于移动终端的扬声器装置
CN103297904A (zh) * 2013-05-18 2013-09-11 歌尔声学股份有限公司 一种双振膜扬声器模组
CN203574851U (zh) * 2013-11-14 2014-04-30 歌尔声学股份有限公司 扬声器模组
CN104159179A (zh) * 2014-06-30 2014-11-19 歌尔声学股份有限公司 扬声器模组
CN104202700A (zh) * 2014-06-30 2014-12-10 歌尔声学股份有限公司 发声器件
CN205213036U (zh) * 2015-11-12 2016-05-04 瑞声光电科技(常州)有限公司 一种扬声器

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021237837A1 (fr) * 2020-05-29 2021-12-02 瑞声声学科技(深圳)有限公司 Dispositif de production de son

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