WO2018218766A1 - Loudspeaker module and electronic device - Google Patents

Loudspeaker module and electronic device Download PDF

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Publication number
WO2018218766A1
WO2018218766A1 PCT/CN2017/094161 CN2017094161W WO2018218766A1 WO 2018218766 A1 WO2018218766 A1 WO 2018218766A1 CN 2017094161 W CN2017094161 W CN 2017094161W WO 2018218766 A1 WO2018218766 A1 WO 2018218766A1
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WO
WIPO (PCT)
Prior art keywords
speaker
cavity
speaker unit
sound
inner core
Prior art date
Application number
PCT/CN2017/094161
Other languages
French (fr)
Chinese (zh)
Inventor
周树芝
郝正恩
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歌尔股份有限公司
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Publication date
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Publication of WO2018218766A1 publication Critical patent/WO2018218766A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/20Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R11/00Transducers of moving-armature or moving-core type
    • H04R11/02Loudspeakers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02Details
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06Loudspeakers

Definitions

  • the present application relates to the field of electroacoustic conversion technology, and more particularly, to a speaker module and an electronic device.
  • the speaker module is an important acoustic device of portable electronic devices, which is used to complete the conversion between electrical signals and acoustic signals, and is an energy conversion device.
  • Existing speaker modules typically include a housing.
  • a speaker unit is housed in the housing.
  • the speaker unit separates the cavity of the entire module into a front cavity and a rear cavity. Wherein, the speaker unit is disposed in the front sound cavity, and the speaker unit has a retaining wall around the periphery. The retaining wall is used to position the speaker unit and avoids the formation of the kernel sound hole.
  • One end of the core sound hole communicates with the gap between the diaphragm and the magnetic circuit system, that is, the inner side of the diaphragm, and the other end communicates with the rear sound chamber.
  • a pressure relief hole is arranged on the module housing, and the pressure relief hole is connected with the rear sound chamber. When vibrating, the air pressure inside the diaphragm can be balanced with the outside through the inner core sound hole, the rear sound chamber, and the pressure relief hole.
  • the aperture size of the kernel sound hole is fixed. This does not change the size of the aperture according to different speaker modules. Users need to design different sizes of kernel sound holes according to different speaker modules.
  • One object of the present application is a new technical solution for a speaker module.
  • a speaker module includes a module housing and a speaker unit, and a cavity is disposed inside the module housing, the speaker unit is disposed in the cavity, and the speaker unit is configured to be the cavity
  • the body is divided into a front sound chamber and a rear sound chamber.
  • the inner sound hole of the speaker unit is in communication with the rear acoustic cavity; and further includes a shielding portion configured to partially or completely occlude the inner core sound hole.
  • the inner core sound hole is opposite to the rear acoustic cavity
  • the shielding portion includes a retaining wall for fixing the speaker unit, and the retaining wall is disposed in the front acoustic cavity and the rear acoustic cavity.
  • the shielding portion further includes a convex portion extending from the retaining wall, the convex portion corresponding to the inner sound hole.
  • the barrier wall is disposed between the front acoustic cavity and the rear acoustic cavity.
  • the retaining wall and the boss are integrally injection molded with the module housing.
  • the retaining wall is integrally injection molded with the module housing, and the protrusion is injection molded on the retaining wall as an insert.
  • the module housing includes an upper shell and a lower shell that are fastened together, and a front acoustic cavity is formed between the speaker unit and the upper casing, and the retaining wall and the convex portion are disposed Inside the upper casing.
  • a sealant is applied in the gap between the raised portion and the outer surface of the speaker unit.
  • the shielding portion comprises a heat resistant tape attached at an exit of the sound hole of the inner core.
  • the sound chamber is filled with a sound absorbing material.
  • an electronic device includes the speaker module provided by the present application.
  • the shielding portion can partially or completely block the sound hole of the core. In this way, the shielding portion can correct the cross-sectional area of the sound hole of the core and adjust the sound effect of the speaker module.
  • the shielding portion can reduce the cross-sectional area of the sound hole of the core, reduce low-frequency distortion, and improve the margin of listening.
  • the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
  • the speaker module can adopt a higher power speaker unit, which improves the sound quality of the speaker module.
  • the shielding area of the core sound hole is adjusted by the shielding portion, so that the same speaker unit can be applied to different speaker modules without setting the core sound hole for each speaker module, simplifying the design process of the speaker unit. Increases the versatility of the speaker unit.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • FIG. 2 is an assembled view of an upper casing and a speaker unit in accordance with an embodiment of the present application.
  • FIG 3 is a cross-sectional view of a speaker module in accordance with an embodiment of the present application.
  • Figure 4 is a partial enlarged view of a portion A in Figure 3.
  • 11 upper shell; 12: lower shell; 13: speaker unit; 14: inner core sound hole; 15: pressure relief hole; 16: damping member; 19: FPC; 20: front sound chamber; 21: rear sound chamber; Wall; 23: raised portion.
  • FIG. 1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
  • a speaker module is provided.
  • the module includes a module housing and a speaker unit 13 as shown in FIG.
  • the speaker unit 13 is a moving coil type unit or a moving iron type unit.
  • the moving coil type unit includes a vibration component and a magnetic circuit component.
  • the vibrating assembly includes a diaphragm and a voice coil, and the diaphragm is connected to the voice coil.
  • the magnetic circuit assembly is used to form a magnetic gap. There is an alternating magnetic field in the magnetic gap, and one end of the voice coil is inserted into the magnetic gap.
  • an FPC 19 is disposed on the module housing, and the lead of the voice coil is electrically connected to the FPC 19.
  • the leads are electrically connected to an external circuit through the FPC 19.
  • a cavity is provided inside the module housing.
  • the speaker unit 13 is placed in the cavity.
  • the diaphragm of the speaker unit 13 separates the cavity into a front acoustic chamber 20 and a rear acoustic chamber 21.
  • the front acoustic chamber 20 is opposed to the outer side of the diaphragm, and the outer side is the side away from the magnetic circuit assembly of the speaker unit.
  • the front acoustic cavity 20 has an acoustic hole (not shown).
  • the speaker module makes a sound through the sound hole.
  • the sound hole passes through from the side of the module housing.
  • This structure constitutes a side sound speaker module.
  • the side-sounding speaker module is thinner in thickness and has a small footprint when installed.
  • the inner core sound hole 14 of the speaker unit 13 is in communication with the rear sound chamber 21.
  • the rear acoustic cavity 21 communicates with the inner side of the diaphragm through the inner core sound hole 14, and the inner side is near the side of the magnetic circuit assembly of the speaker unit.
  • a pressure relief hole 15 communicating with the rear sound chamber 21 is disposed on the module housing. When vibrating, the airflow inside the diaphragm is depressurized via the inner core sound hole 14, the rear sound chamber 21, and the pressure relief hole 15 to balance the internal and external pressure of the diaphragm.
  • a damper member 16 is provided outside the pressure relief hole 15, which is capable of damping the vibrational airflow and preventing external dust from entering.
  • the rear acoustic cavity 21 provides a buffer zone for the vibrating airflow. Moreover, the rear acoustic cavity 21 can adjust the low frequency effect of the speaker module.
  • the sound chamber 21 is filled with a sound absorbing material.
  • the sound absorbing material can increase the virtual space of the rear sound chamber 21, so that the speaker module can obtain a good low frequency effect without expanding the volume of the speaker module.
  • the speaker module further includes a shielding portion.
  • the obscuration portion is configured to partially or completely occlude the inner core sound hole 14.
  • the shielding portion can partially or completely block the core sound hole 14. In this way, the shielding portion can correct the size of the cross-sectional area of the core sound hole 14 and adjust the sound effect of the speaker module.
  • the shielding portion can reduce the cross-sectional area of the core sound hole 14, reduce low-frequency distortion, and improve the margin of listening.
  • the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit 13, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
  • the speaker module can adopt a higher power speaker unit 13, which improves the sound quality of the speaker module.
  • the shielding area of the core sound hole 14 is adjusted by the shielding portion, so that the same speaker unit 13 can be applied to different speaker modules without setting the core sound hole 14 for each speaker module, simplifying the speaker unit.
  • the design process of 13 improves the versatility of the speaker unit 13.
  • the speaker module has a flat structure.
  • the module housing includes an upper case 11 and a lower case 12 that are fastened together. In this way, the disassembly and assembly of the speaker unit 13 is more convenient.
  • the inner core sound hole 14 is opposite the rear sound chamber 21.
  • the shielding portion includes a blocking wall 22 that is disposed between the front acoustic cavity 20 and the rear acoustic cavity 21. This method facilitates the setting of the retaining wall.
  • the shield also includes a raised portion 23 that extends from the barrier wall 22. The raised portion 23 corresponds to the inner core sound hole 14.
  • the convex portion 23 is located above the barrier wall 22.
  • the raised portions 23 are in one-to-one correspondence with the inner core sound holes 14 to occlude the inner core sound holes 14, respectively.
  • the convex portion 23 should be as close as possible to the inner core sound hole 14.
  • the boss portion 23 has a feature of good shielding effect.
  • the retaining wall 22 is disposed between the front acoustic chamber 20 and the rear acoustic chamber 21, the retaining wall 22 It also functions to position the speaker unit 13.
  • the retaining wall 22 and the boss portion 23 are integrally injection molded with the module housing. In this way, the formation of the retaining wall 22 and the boss portion 23 becomes easy, and the connection strength between the retaining wall 22 and the boss portion 23 and the module housing is higher.
  • the retaining wall 22 is integrally injection molded with the module housing.
  • the raised portion 23 is injection molded as an insert onto the retaining wall 22. In this way, the processing steps can also be simplified, and the strength of the connection between the retaining wall 22, the boss 23 and the module housing can be increased.
  • both the front acoustic chamber 20 and the rear acoustic chamber 21 have a flat structure, and the rear acoustic chamber 21 is disposed around the speaker unit 13. In this way, the thickness of the speaker module is smaller, which is in line with the trend of thinning and thinning of electronic products.
  • the retaining wall 22 and the boss portion 23 are disposed in the upper casing 11.
  • the lower case 12 is a cover plate.
  • the user can first place the speaker unit 13 above the front sound chamber 20, so that the barrier wall 33 partially or completely blocks the inner core sound hole 22; nextly, the lower shell 12 is directly fastened to the upper shell 11, the speaker mold The assembly of the group is very convenient. In this way, the degree of integration of the upper casing 11 is improved.
  • a sealant is applied in a gap between the boss portion 23 and the outer surface of the speaker unit 13. The manner of applying the sealant can effectively prevent the airflow from passing through the gap, so that the shielding effect of the boss portion 23 is good.
  • the obscuring portion includes a heat resistant tape.
  • a heat resistant tape is attached to the exit of the core sound hole 14.
  • the user bonds the heat resistant tape to the exit of the core sound hole 14 by an adhesive.
  • the heat-resistant tape takes up a small volume and is easy to attach.
  • Heat resistant tape has good heat resistance. When the speaker unit 13 is working for a long time, it is resistant The thermal tape maintains its structural shape to ensure a occlusion effect.
  • an electronic device is provided.
  • the electronic device can be, but is not limited to, a VR device, an AR device, a mobile phone, a computer, a gaming machine, a walkie-talkie, and the like.
  • the electronic device includes the speaker module provided by the present application.
  • the electronic device has the characteristics of good sound effect.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

A loudspeaker module and an electronic device. The module comprises a module housing and a loudspeaker unit (13); a cavity is provided inside the module housing, and the loudspeaker unit (13) is provided in the cavity; the loudspeaker unit (13) divides the cavity into a front sound cavity (20) and a rear sound cavity (21); inner core sound holes (14) of the loudspeaker unit (13) are in communication with the rear sound cavity (21); the module further comprises a shielding portion which is configured to partially or entirely shield the inner core sound holes (14). A technical problem to be solved is that the size of the inner core sound holes (14) of an existing loudspeaker module is fixed and cannot be adjusted according to loudspeaker modules of different models. The size of the inner core sound holes (14) is adjusted by means of the shielding portion, so that the same loudspeaker unit (13) can be applied to different loudspeaker modules, simplifying the design process of the loudspeaker unit (13) and improving the universality of the loudspeaker unit (13).

Description

扬声器模组以及电子设备Speaker module and electronic device 技术领域Technical field
本申请涉及电声转换技术领域,更具体地,本申请涉及一种扬声器模组以及电子设备。The present application relates to the field of electroacoustic conversion technology, and more particularly, to a speaker module and an electronic device.
背景技术Background technique
扬声器模组是便携式电子设备的重要声学器件,其用于完成电信号与声信号之间的转换,是一种能量转换器件。现有的扬声器模组通常包括外壳。外壳内收容有扬声器单体。扬声器单体将整个模组的腔体分隔为前声腔和后声腔。其中,扬声器单体被设置在前声腔中,扬声器单体周边有挡墙。挡墙用于定位扬声器单体,并且对内核声孔形成避让。The speaker module is an important acoustic device of portable electronic devices, which is used to complete the conversion between electrical signals and acoustic signals, and is an energy conversion device. Existing speaker modules typically include a housing. A speaker unit is housed in the housing. The speaker unit separates the cavity of the entire module into a front cavity and a rear cavity. Wherein, the speaker unit is disposed in the front sound cavity, and the speaker unit has a retaining wall around the periphery. The retaining wall is used to position the speaker unit and avoids the formation of the kernel sound hole.
内核声孔的一端与振膜和磁路系统之间的空隙连通,即振膜的内侧,另一端与后声腔连通。模组壳体上设置有泄压孔,泄压孔与后声腔连通。在振动时,振膜内侧的气压能够经由内核声孔、后声腔以及泄压孔与外界达到平衡。One end of the core sound hole communicates with the gap between the diaphragm and the magnetic circuit system, that is, the inner side of the diaphragm, and the other end communicates with the rear sound chamber. A pressure relief hole is arranged on the module housing, and the pressure relief hole is connected with the rear sound chamber. When vibrating, the air pressure inside the diaphragm can be balanced with the outside through the inner core sound hole, the rear sound chamber, and the pressure relief hole.
然而,在通常情况下,内核声孔的孔径大小是固定的。这样不能根据不同型号的扬声器模组改变孔径的大小。用户需要根据不同的扬声器模组设计不同大小的内核声孔。However, under normal circumstances, the aperture size of the kernel sound hole is fixed. This does not change the size of the aperture according to different speaker modules. Users need to design different sizes of kernel sound holes according to different speaker modules.
此外,由于内核声孔的孔径的大小固定,故无法通过调节内核声孔的大小来调节扬声器模组的声音效果。In addition, since the aperture of the core sound hole is fixed in size, it is impossible to adjust the sound effect of the speaker module by adjusting the size of the core sound hole.
发明内容Summary of the invention
本申请的一个目的是扬声器模组的新技术方案。One object of the present application is a new technical solution for a speaker module.
根据本申请的一个方面,提供一种扬声器模组。该模组包括模组壳体和扬声器单体,在所述模组壳体的内部设置有腔体,所述扬声器单体被设置在所述腔体中,所述扬声器单体将所述腔体分隔为前声腔和后声腔,所 述扬声器单体的内核声孔与所述后声腔连通;还包括遮挡部,所述遮挡部被构造为用于对所述内核声孔进行部分或全部地遮挡。According to one aspect of the present application, a speaker module is provided. The module includes a module housing and a speaker unit, and a cavity is disposed inside the module housing, the speaker unit is disposed in the cavity, and the speaker unit is configured to be the cavity The body is divided into a front sound chamber and a rear sound chamber. The inner sound hole of the speaker unit is in communication with the rear acoustic cavity; and further includes a shielding portion configured to partially or completely occlude the inner core sound hole.
可选地,所述内核声孔与所述后声腔相对,所述遮挡部包括用于对扬声器单体进行固定的挡壁,所述挡壁被设置在所述前声腔和所述后声腔之间;所述遮挡部还包括由所述挡壁上延伸出的凸起部,所述凸起部与所述内核声孔相对应。Optionally, the inner core sound hole is opposite to the rear acoustic cavity, and the shielding portion includes a retaining wall for fixing the speaker unit, and the retaining wall is disposed in the front acoustic cavity and the rear acoustic cavity. The shielding portion further includes a convex portion extending from the retaining wall, the convex portion corresponding to the inner sound hole.
可选地,所述挡壁被设置在所述前声腔和所述后声腔之间。Optionally, the barrier wall is disposed between the front acoustic cavity and the rear acoustic cavity.
可选地,所述挡壁、凸起部与所述模组壳体一体注塑成型。Optionally, the retaining wall and the boss are integrally injection molded with the module housing.
可选地,所述挡壁与所述模组壳体一体注塑成型,所述凸起部作为嵌件注塑于所述挡壁上。Optionally, the retaining wall is integrally injection molded with the module housing, and the protrusion is injection molded on the retaining wall as an insert.
可选地,所述模组壳体包括扣合在一起的上壳和下壳,所述扬声器单体与所述上壳之间形成前声腔,所述挡壁和所述凸起部被设置在所述上壳内。Optionally, the module housing includes an upper shell and a lower shell that are fastened together, and a front acoustic cavity is formed between the speaker unit and the upper casing, and the retaining wall and the convex portion are disposed Inside the upper casing.
可选地,在所述凸起部与所述扬声器单体的外表面之间的间隙中涂覆密封胶。Optionally, a sealant is applied in the gap between the raised portion and the outer surface of the speaker unit.
可选地,所述遮挡部包括耐热胶带,所述耐热胶带被贴附在所述内核声孔的出口处。Optionally, the shielding portion comprises a heat resistant tape attached at an exit of the sound hole of the inner core.
可选地,在所述后声腔内填充有吸音材料。Optionally, the sound chamber is filled with a sound absorbing material.
根据本申请的另一个方面,提供了一种电子设备。该电子设备包括本申请提供的所述扬声器模组。According to another aspect of the present application, an electronic device is provided. The electronic device includes the speaker module provided by the present application.
本申请的一个技术效果在于,遮挡部能够对内核声孔进行部分或者全部地遮挡。通过这种方式,遮挡部能够修正内核声孔的横截面积,调节扬声器模组的声音效果。One technical effect of the present application is that the shielding portion can partially or completely block the sound hole of the core. In this way, the shielding portion can correct the cross-sectional area of the sound hole of the core and adjust the sound effect of the speaker module.
此外,遮挡部能够降低内核声孔的横截面积,降低低频失真,提高听音的余量。In addition, the shielding portion can reduce the cross-sectional area of the sound hole of the core, reduce low-frequency distortion, and improve the margin of listening.
此外,遮挡部的设置能够提高扬声器单体的声阻,从而降低振膜的振幅,降低扬声器模组产生的杂音。In addition, the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
此外,通过设置遮挡部,扬声器模组能够采用更高功率的扬声器单体,这样提高了扬声器模组的音质。 In addition, by providing a shielding portion, the speaker module can adopt a higher power speaker unit, which improves the sound quality of the speaker module.
此外,通过遮挡部调节内核声孔的遮挡面积,这样同一款扬声器单体可以应用到不同的扬声器模组中,而不用针对每种扬声器模组设置内核声孔,简化了扬声器单体的设计工艺,提高了扬声器单体的通用性。In addition, the shielding area of the core sound hole is adjusted by the shielding portion, so that the same speaker unit can be applied to different speaker modules without setting the core sound hole for each speaker module, simplifying the design process of the speaker unit. Increases the versatility of the speaker unit.
通过以下参照附图对本申请的示例性实施例的详细描述,本申请的其它特征及其优点将会变得清楚。Other features and advantages of the present application will become apparent from the following detailed description of the exemplary embodiments.
附图说明DRAWINGS
构成说明书的一部分的附图描述了本申请的实施例,并且连同说明书一起用于解释本申请的原理。The accompanying drawings, which are incorporated in FIG
图1是根据本申请的一个实施例的扬声器模组的分解图。1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
图2是根据本申请的一个实施例的上壳与扬声器单体的装配图。2 is an assembled view of an upper casing and a speaker unit in accordance with an embodiment of the present application.
图3是根据本申请的一个实施例的扬声器模组的剖视图。3 is a cross-sectional view of a speaker module in accordance with an embodiment of the present application.
图4是图3中A处的局部放大图。Figure 4 is a partial enlarged view of a portion A in Figure 3.
附图标记说明:Description of the reference signs:
11:上壳;12:下壳;13:扬声器单体;14:内核声孔;15:泄压孔;16:阻尼件;19:FPC;20:前声腔;21:后声腔;22:挡壁;23:凸起部。11: upper shell; 12: lower shell; 13: speaker unit; 14: inner core sound hole; 15: pressure relief hole; 16: damping member; 19: FPC; 20: front sound chamber; 21: rear sound chamber; Wall; 23: raised portion.
具体实施方式detailed description
现在将参照附图来详细描述本申请的各种示例性实施例。应注意到:除非另外具体说明,否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本申请的范围。Various exemplary embodiments of the present application will now be described in detail with reference to the drawings. It should be noted that the relative arrangement of the components and steps, numerical expressions and numerical values set forth in the embodiments are not intended to limit the scope of the application.
以下对至少一个示例性实施例的描述实际上仅仅是说明性的,决不作为对本申请及其应用或使用的任何限制。The following description of the at least one exemplary embodiment is merely illustrative and is in no way
对于相关领域普通技术人员已知的技术和设备可能不作详细讨论,但在适当情况下,所述技术和设备应当被视为说明书的一部分。Techniques and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the techniques and devices should be considered as part of the specification.
在这里示出和讨论的所有例子中,任何具体值应被解释为仅仅是示例性的,而不是作为限制。因此,示例性实施例的其它例子可以具有不同的值。In all of the examples shown and discussed herein, any specific values are to be construed as illustrative only and not as a limitation. Thus, other examples of the exemplary embodiments may have different values.
应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一 旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步讨论。It should be noted that similar reference numerals and letters indicate similar items in the following figures, therefore, one Once an item is defined in a drawing, it is not required to be further discussed in subsequent figures.
图1是根据本申请的一个实施例的扬声器模组的分解图。1 is an exploded view of a speaker module in accordance with one embodiment of the present application.
根据本申请的一个实施例,提供了一种扬声器模组。如图1所示该模组包括模组壳体和扬声器单体13。例如,扬声器单体13为动圈式单体或者动铁式单体。According to one embodiment of the present application, a speaker module is provided. The module includes a module housing and a speaker unit 13 as shown in FIG. For example, the speaker unit 13 is a moving coil type unit or a moving iron type unit.
为了便于说明,在该实施例中以动圈式单体为例。动圈式单体包括振动组件和磁路组件。振动组件包括振膜和音圈,振膜与音圈连接。磁路组件用于形成磁间隙。在磁间隙内具有交变磁场,音圈的一端插入磁间隙中。For convenience of explanation, a moving coil type single body is taken as an example in this embodiment. The moving coil type unit includes a vibration component and a magnetic circuit component. The vibrating assembly includes a diaphragm and a voice coil, and the diaphragm is connected to the voice coil. The magnetic circuit assembly is used to form a magnetic gap. There is an alternating magnetic field in the magnetic gap, and one end of the voice coil is inserted into the magnetic gap.
优选的是,如图1所示,在模组壳体上设置有FPC19,音圈的引线与FPC19导通。引线通过FPC19与外部电路电连接。Preferably, as shown in FIG. 1, an FPC 19 is disposed on the module housing, and the lead of the voice coil is electrically connected to the FPC 19. The leads are electrically connected to an external circuit through the FPC 19.
在模组壳体的内部设置有腔体。扬声器单体13被设置在腔体中。扬声器单体13的振膜将腔体分隔为前声腔20和后声腔21。例如,前声腔20与振膜的外侧相对,外侧即远离扬声器单体的磁路组件的一侧。前声腔20具有出声孔(未示出)。扬声器模组通过出声孔发出声音。A cavity is provided inside the module housing. The speaker unit 13 is placed in the cavity. The diaphragm of the speaker unit 13 separates the cavity into a front acoustic chamber 20 and a rear acoustic chamber 21. For example, the front acoustic chamber 20 is opposed to the outer side of the diaphragm, and the outer side is the side away from the magnetic circuit assembly of the speaker unit. The front acoustic cavity 20 has an acoustic hole (not shown). The speaker module makes a sound through the sound hole.
优选的是,出声孔从模组壳体的侧部穿出。这种结构构成侧出声扬声器模组。侧出声扬声器模组的厚度更薄,在安装时占用面积小。Preferably, the sound hole passes through from the side of the module housing. This structure constitutes a side sound speaker module. The side-sounding speaker module is thinner in thickness and has a small footprint when installed.
扬声器单体13的内核声孔14与后声腔21连通。具体地,后声腔21通过内核声孔14与振膜的内侧连通,内侧即靠近扬声器单体的磁路组件的一侧。在模组壳体上设置有与后声腔21连通的泄压孔15。在振动时,振膜的内侧的气流经由内核声孔14、后声腔21和泄压孔15进行泄压,以使振膜的内、外压力平衡。The inner core sound hole 14 of the speaker unit 13 is in communication with the rear sound chamber 21. Specifically, the rear acoustic cavity 21 communicates with the inner side of the diaphragm through the inner core sound hole 14, and the inner side is near the side of the magnetic circuit assembly of the speaker unit. A pressure relief hole 15 communicating with the rear sound chamber 21 is disposed on the module housing. When vibrating, the airflow inside the diaphragm is depressurized via the inner core sound hole 14, the rear sound chamber 21, and the pressure relief hole 15 to balance the internal and external pressure of the diaphragm.
优选的是,在泄压孔15的外侧设置有阻尼件16,该阻尼件16能够对振动的气流形成阻尼,并且能够防止外部灰尘进入。Preferably, a damper member 16 is provided outside the pressure relief hole 15, which is capable of damping the vibrational airflow and preventing external dust from entering.
后声腔21为振动的气流提供了缓冲区域。并且,后声腔21能够调节扬声器模组的低频效果。The rear acoustic cavity 21 provides a buffer zone for the vibrating airflow. Moreover, the rear acoustic cavity 21 can adjust the low frequency effect of the speaker module.
优选地,在后声腔21内填充有吸音材料。吸音材料能够增大后声腔21的虚拟空间,从而在不扩大扬声器模组的体积的情况下,使扬声器模组获得良好的低频效果。 Preferably, the sound chamber 21 is filled with a sound absorbing material. The sound absorbing material can increase the virtual space of the rear sound chamber 21, so that the speaker module can obtain a good low frequency effect without expanding the volume of the speaker module.
在该实施例中,扬声器模组还包括遮挡部。遮挡部被构造为用于对内核声孔14进行部分或全部地遮挡。In this embodiment, the speaker module further includes a shielding portion. The obscuration portion is configured to partially or completely occlude the inner core sound hole 14.
在本申请实施例的扬声器模组中,遮挡部能够对内核声孔14进行部分或者全部地遮挡。通过这种方式,遮挡部能够修正内核声孔14的横截面积的大小,调节扬声器模组的声音效果。In the speaker module of the embodiment of the present application, the shielding portion can partially or completely block the core sound hole 14. In this way, the shielding portion can correct the size of the cross-sectional area of the core sound hole 14 and adjust the sound effect of the speaker module.
此外,遮挡部能够降低内核声孔14的横截面积,降低低频失真,提高听音的余量。In addition, the shielding portion can reduce the cross-sectional area of the core sound hole 14, reduce low-frequency distortion, and improve the margin of listening.
此外,遮挡部的设置能够提高扬声器单体13的声阻,从而降低振膜的振幅,降低扬声器模组产生的杂音。In addition, the arrangement of the shielding portion can improve the acoustic resistance of the speaker unit 13, thereby reducing the amplitude of the diaphragm and reducing the noise generated by the speaker module.
此外,通过设置遮挡部,扬声器模组能够采用更高功率的扬声器单体13,这样提高了扬声器模组的音质。In addition, by providing a shielding portion, the speaker module can adopt a higher power speaker unit 13, which improves the sound quality of the speaker module.
此外,通过遮挡部调节内核声孔14的遮挡面积,这样同一款扬声器单体13可以应用到不同的扬声器模组中,而不用针对每种扬声器模组设置内核声孔14,简化了扬声器单体13的设计工艺,提高了扬声器单体13的通用性。In addition, the shielding area of the core sound hole 14 is adjusted by the shielding portion, so that the same speaker unit 13 can be applied to different speaker modules without setting the core sound hole 14 for each speaker module, simplifying the speaker unit. The design process of 13 improves the versatility of the speaker unit 13.
在一个例子中,如图1-2所示,扬声器模组呈扁平结构。模组壳体包括扣合在一起的上壳11和下壳12。通过这种方式,扬声器单体13的拆、装会更加方便。In one example, as shown in Figures 1-2, the speaker module has a flat structure. The module housing includes an upper case 11 and a lower case 12 that are fastened together. In this way, the disassembly and assembly of the speaker unit 13 is more convenient.
优选地,内核声孔14与后声腔21相对。遮挡部包括挡壁22,挡壁22被设置在前声腔20和后声腔21之间。这种方式便于挡壁的设置。遮挡部还包括由挡壁22上延伸出的凸起部23。凸起部23与内核声孔14相对应。Preferably, the inner core sound hole 14 is opposite the rear sound chamber 21. The shielding portion includes a blocking wall 22 that is disposed between the front acoustic cavity 20 and the rear acoustic cavity 21. This method facilitates the setting of the retaining wall. The shield also includes a raised portion 23 that extends from the barrier wall 22. The raised portion 23 corresponds to the inner core sound hole 14.
例如,如图1所示,在扬声器单体13上并列地设置有两个内核声孔14,并且两个内核声孔14相间隔。内核声孔14直接与后声腔21相对设置。如图3-4所示,挡壁22被设置在前声腔20与后声腔21之间。凸起部23位于挡壁22的上方。凸起部23与内核声孔14一一对应,以分别对内核声孔14进行遮挡。为了使凸起部23的遮挡效果更好,凸起部23应尽量靠近内核声孔14。凸起部23具有遮挡效果好的特点。For example, as shown in FIG. 1, two core sound holes 14 are juxtaposed on the speaker unit 13, and the two core sound holes 14 are spaced apart. The core sound hole 14 is directly disposed opposite to the rear sound chamber 21. As shown in FIGS. 3-4, the barrier wall 22 is disposed between the front acoustic cavity 20 and the rear acoustic cavity 21. The raised portion 23 is located above the barrier wall 22. The raised portions 23 are in one-to-one correspondence with the inner core sound holes 14 to occlude the inner core sound holes 14, respectively. In order to make the shielding effect of the convex portion 23 better, the convex portion 23 should be as close as possible to the inner core sound hole 14. The boss portion 23 has a feature of good shielding effect.
此外,由于挡壁22被设置在前声腔20和后声腔21之间,故挡壁22 还能起到定位扬声器单体13的作用。Further, since the retaining wall 22 is disposed between the front acoustic chamber 20 and the rear acoustic chamber 21, the retaining wall 22 It also functions to position the speaker unit 13.
本领域技术人员可以根据实际需要设置凸起部23的数量和高度,以调节扬声器单体13的声阻。Those skilled in the art can set the number and height of the bosses 23 according to actual needs to adjust the acoustic resistance of the speaker unit 13.
优选的是,挡壁22、凸起部23与模组壳体一体注塑成型。通过这种方式,挡壁22和凸起部23的制作变得容易,并且挡壁22、凸起部23与模组壳体的连接强度更高。Preferably, the retaining wall 22 and the boss portion 23 are integrally injection molded with the module housing. In this way, the formation of the retaining wall 22 and the boss portion 23 becomes easy, and the connection strength between the retaining wall 22 and the boss portion 23 and the module housing is higher.
还可以是,挡壁22与模组壳体一体注塑成型。凸起部23作为嵌件注塑于挡壁22上。通过这种方式,同样能够简化加工步骤,并且提高挡壁22、凸起部23与模组壳体的连接强度。It is also possible that the retaining wall 22 is integrally injection molded with the module housing. The raised portion 23 is injection molded as an insert onto the retaining wall 22. In this way, the processing steps can also be simplified, and the strength of the connection between the retaining wall 22, the boss 23 and the module housing can be increased.
在一个例子中,如图1所示,前声腔20与后声腔21均呈扁平结构,后声腔21环绕扬声器单体13设置。通过这种方式,扬声器模组的厚度更小,顺应了电子产品轻薄化的发展趋势。In one example, as shown in FIG. 1, both the front acoustic chamber 20 and the rear acoustic chamber 21 have a flat structure, and the rear acoustic chamber 21 is disposed around the speaker unit 13. In this way, the thickness of the speaker module is smaller, which is in line with the trend of thinning and thinning of electronic products.
优选的是,如图1所示,挡壁22和凸起部23被设置在上壳11内。下壳12为盖板。在装配时,用户可以先将扬声器单体13放置到前声腔20上方,以使挡壁33部分或者全部遮挡内核声孔22;接下来直接将下壳12扣合在上壳11上,扬声器模组的装配十分方便。通过这种方式,提高了上壳11的集成度。Preferably, as shown in FIG. 1, the retaining wall 22 and the boss portion 23 are disposed in the upper casing 11. The lower case 12 is a cover plate. When assembling, the user can first place the speaker unit 13 above the front sound chamber 20, so that the barrier wall 33 partially or completely blocks the inner core sound hole 22; nextly, the lower shell 12 is directly fastened to the upper shell 11, the speaker mold The assembly of the group is very convenient. In this way, the degree of integration of the upper casing 11 is improved.
在扬声器单体13装入壳体(例如上壳11)中后,凸起部23与扬声器单体13的外表面之间难免存在间隙。在振动时,气流会从该间隙通过,从而使凸起部23的遮挡效果变差。为了解决该技术问题,在凸起部23与扬声器单体13的外表面之间的间隙中涂覆密封胶。涂覆密封胶的方式能够有效地防止气流从间隙通过,使凸起部23的遮挡效果良好。After the speaker unit 13 is loaded into the casing (for example, the upper casing 11), there is inevitably a gap between the boss portion 23 and the outer surface of the speaker unit 13. When vibrating, the airflow passes through the gap, so that the shielding effect of the boss portion 23 is deteriorated. In order to solve the technical problem, a sealant is applied in a gap between the boss portion 23 and the outer surface of the speaker unit 13. The manner of applying the sealant can effectively prevent the airflow from passing through the gap, so that the shielding effect of the boss portion 23 is good.
本领域技术人员可以根据实际需要,采用本领域常用的密封胶对间隙进行密封。Those skilled in the art can seal the gap by using a sealant commonly used in the art according to actual needs.
在其他示例中,遮挡部包括耐热胶带。In other examples, the obscuring portion includes a heat resistant tape.
耐热胶带被贴附在内核声孔14的出口处。例如,用户通过粘结剂将耐热胶带粘结到内核声孔14的出口处。耐热胶带占用的体积小,贴附操作容易。A heat resistant tape is attached to the exit of the core sound hole 14. For example, the user bonds the heat resistant tape to the exit of the core sound hole 14 by an adhesive. The heat-resistant tape takes up a small volume and is easy to attach.
耐热胶带具有良好的耐热效果。在扬声器单体13长时间工作时,耐 热胶带能保持自身的结构形态,从而保证遮挡效果。Heat resistant tape has good heat resistance. When the speaker unit 13 is working for a long time, it is resistant The thermal tape maintains its structural shape to ensure a occlusion effect.
根据本申请的另一个方面,提供了一种电子设备。例如,电子设备可以是但不局限于VR设备、AR设备、手机、电脑、游戏机、对讲机、等。该电子设备包括本申请提供的扬声器模组。According to another aspect of the present application, an electronic device is provided. For example, the electronic device can be, but is not limited to, a VR device, an AR device, a mobile phone, a computer, a gaming machine, a walkie-talkie, and the like. The electronic device includes the speaker module provided by the present application.
该电子设备具有声音效果好的特点。The electronic device has the characteristics of good sound effect.
虽然已经通过示例对本申请的一些特定实施例进行了详细说明,但是本领域的技术人员应该理解,以上示例仅是为了进行说明,而不是为了限制本申请的范围。本领域的技术人员应该理解,可在不脱离本申请的范围和精神的情况下,对以上实施例进行修改。本申请的范围由所附权利要求来限定。 Although the specific embodiments of the present application have been described in detail by way of example, those skilled in the art should understand that the above examples are only for the purpose of illustration and not limitation. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the application. The scope of the application is defined by the appended claims.

Claims (10)

  1. 一种扬声器模组,其特征在于,包括模组壳体和扬声器单体(13),在所述模组壳体的内部设置有腔体,所述扬声器单体(13)被设置在所述腔体中,所述扬声器单体(13)将所述腔体分隔为前声腔(20)和后声腔(21),所述扬声器单体(13)的内核声孔(14)与所述后声腔(21)连通;还包括遮挡部,所述遮挡部被构造为用于对所述内核声孔(14)进行部分或全部地遮挡。A speaker module, comprising: a module housing and a speaker unit (13), a cavity is disposed inside the module housing, and the speaker unit (13) is disposed in the In the cavity, the speaker unit (13) separates the cavity into a front acoustic cavity (20) and a rear acoustic cavity (21), the inner sound hole (14) of the speaker unit (13) and the rear The acoustic cavity (21) is in communication; further comprising a shield configured to partially or fully occlude the inner core sound hole (14).
  2. 根据权利要求1所述的扬声器模组,其特征在于,所述内核声孔(14)与所述后声腔(21)相对,所述遮挡部包括用于对扬声器单体进行固定的挡壁(22),所述挡壁(22)被设置在所述前声腔(20)和所述后声腔(21)之间;The speaker module according to claim 1, wherein the inner core sound hole (14) is opposite to the rear sound chamber (21), and the shielding portion includes a retaining wall for fixing the speaker unit ( 22) the barrier wall (22) is disposed between the front acoustic cavity (20) and the rear acoustic cavity (21);
    所述遮挡部还包括由所述挡壁(22)上延伸出的凸起部(23),所述凸起部(23)与所述内核声孔(14)相对应。The shielding portion further includes a convex portion (23) extending from the retaining wall (22), the convex portion (23) corresponding to the inner core sound hole (14).
  3. 根据权利要求1或2所述的扬声器模组,其特征在于,所述挡壁(22)被设置在所述前声腔(20)和所述后声腔(21)之间。A speaker module according to claim 1 or 2, wherein said barrier wall (22) is disposed between said front acoustic chamber (20) and said rear acoustic chamber (21).
  4. 根据权利要求1-3中的任一项所述的扬声器模组,其特征在于,所述挡壁(22)、凸起部(23)与所述模组壳体一体注塑成型。The speaker module according to any one of claims 1 to 3, characterized in that the retaining wall (22) and the boss (23) are integrally injection molded with the module housing.
  5. 根据权利要求1-4中的任一项所述的扬声器模组,其特征在于,所述挡壁(22)与所述模组壳体一体注塑成型,所述凸起部(23)作为嵌件注塑于所述挡壁(22)上。The speaker module according to any one of claims 1 to 4, wherein the barrier wall (22) is integrally injection molded with the module housing, and the convex portion (23) is embedded The piece is injection molded on the retaining wall (22).
  6. 根据权利要求1-5中的任一项所述的扬声器模组,其特征在于,所述模组壳体包括扣合在一起的上壳(11)和下壳(12),所述扬声器单体(13)与所述上壳(11)之间形成前声腔(20),所述挡壁(22)和所 述凸起部(23)被设置在所述上壳(11)内。The speaker module according to any one of claims 1 to 5, wherein the module housing comprises an upper case (11) and a lower case (12) that are fastened together, the speaker list Forming a front acoustic cavity (20) between the body (13) and the upper casing (11), the retaining wall (22) and the The boss (23) is disposed in the upper case (11).
  7. 根据权利要求1-6中的任一项所述的扬声器模组,其特征在于,在所述凸起部(23)与所述扬声器单体(13)的外表面之间的间隙中涂覆密封胶。A speaker module according to any one of claims 1 to 6, wherein a coating is applied in a gap between the boss (23) and an outer surface of the speaker unit (13) Sealant.
  8. 根据权利要求1-7中的任一项所述的扬声器模组,其特征在于,所述遮挡部包括耐热胶带,The speaker module according to any one of claims 1 to 7, wherein the shielding portion comprises a heat resistant tape,
    所述耐热胶带被贴附在所述内核声孔(14)的出口处。The heat resistant tape is attached at the exit of the inner core sound hole (14).
  9. 根据权利要求1-8中的任一项所述的扬声器模组,其特征在于,在所述后声腔(21)内填充有吸音材料。A speaker module according to any one of claims 1-8, characterized in that the sound chamber (21) is filled with a sound absorbing material.
  10. 一种电子设备,其特征在于,包括如权利要求1-9中的任意一项所述的扬声器模组。 An electronic device comprising the speaker module according to any one of claims 1-9.
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