WO2018196132A1 - Module de haut-parleur et dispositif électronique - Google Patents

Module de haut-parleur et dispositif électronique Download PDF

Info

Publication number
WO2018196132A1
WO2018196132A1 PCT/CN2017/089140 CN2017089140W WO2018196132A1 WO 2018196132 A1 WO2018196132 A1 WO 2018196132A1 CN 2017089140 W CN2017089140 W CN 2017089140W WO 2018196132 A1 WO2018196132 A1 WO 2018196132A1
Authority
WO
WIPO (PCT)
Prior art keywords
speaker
module
speaker unit
chambers
housing
Prior art date
Application number
PCT/CN2017/089140
Other languages
English (en)
Chinese (zh)
Inventor
赵国栋
平康
王国福
杨鑫峰
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Publication of WO2018196132A1 publication Critical patent/WO2018196132A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers

Definitions

  • the present invention relates to the field of electroacoustic products, and more particularly, to a speaker module and an electronic device.
  • the speaker module comprises a module shell and a speaker unit housed in the module shell.
  • the diaphragm of the speaker unit separates the inner cavity of the module shell into a front sound chamber and a rear sound chamber, wherein the front sound chamber has a sound hole. In order to make the speaker module sound through the front cavity.
  • the common problem of the existing speaker module is that there is a relatively obvious noise when outputting a single-frequency signal such as a piano music, thereby affecting the stability of the sound quality of the speaker module, and this problem has become a problem that the industry needs to focus on.
  • An object of the embodiments of the present invention is to provide a new technical solution of a speaker module to improve the noise phenomenon when outputting a single frequency signal such as a piano piece.
  • a speaker module includes a module housing and a speaker unit, and the speaker unit is housed in the module housing, and the diaphragm of the speaker unit is
  • the inner cavity of the module housing is divided into a rear acoustic cavity and a front acoustic cavity having an acoustic hole; the speaker unit has two or more leakage holes, and the two or more leakage holes are in communication with the rear acoustic cavity;
  • the rear acoustic chamber includes more than two chambers, each of which communicates with a portion of the leak holes.
  • the speaker unit includes a single housing and a magnetic circuit assembly mounted on the single housing, and at least one of the two or more leakage holes is formed in the single housing Between the magnetic circuit components.
  • At least one of the two or more leak holes is disposed on a single housing of the speaker unit.
  • the speaker unit includes a single housing and a magnetic circuit assembly mounted on the single housing, and at least one of the two or more leakage holes is disposed on the magnetic circuit assembly .
  • the speaker unit has an even number of the leak holes, and the even number of the leak holes are symmetrically arranged with respect to at least one middle section of the diaphragm of the speaker unit.
  • the speaker module includes a partition wall disposed in the rear sound chamber, the partition wall being configured to divide the rear sound chamber into the two or more chambers; the partition wall Formed integrally with the module housing.
  • the speaker module includes a partition wall disposed in the rear sound chamber, the partition wall being configured to divide the rear sound chamber into the two or more chambers; the partition wall Made of sound absorbing material.
  • the module housing is provided with a damping hole corresponding to the two or more chambers, and each of the chambers communicates with the outside through a corresponding damping hole.
  • the two or more leak holes are arranged in one-to-one correspondence with the two or more chambers.
  • an electronic device provided with the speaker module according to the first aspect of the present invention.
  • the speaker module of the present invention divides the rear sound chamber into at least two chambers, and each chamber communicates only with a part of the leakage holes of the speaker unit, which can effectively reduce the passage of the speaker unit.
  • the degree of collision of the airflow flowing out of different leak holes in the rear sound cavity improves the smoothness of the airflow, and effectively solves the problem of noise generated when the speaker module outputs a single-frequency signal such as piano sound.
  • FIG. 1 is a schematic overall structural view of a speaker module according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a module housing that opens the speaker module of FIG. 1;
  • FIG. 3 is a schematic exploded view of the speaker module of FIG. 1;
  • FIG. 4 is a cross-sectional view of the speaker module of FIG. 1 at a position of a partition wall.
  • 1 to 4 are schematic structural views of a speaker module according to an embodiment of the present invention.
  • the speaker module of the present invention comprises a module housing 100 and a speaker unit 200 , and the speaker unit 200 is received in the inner cavity of the module housing 100 .
  • the speaker unit 200 may include a single housing 220, a magnetic circuit assembly 260, and a vibration assembly 230.
  • the vibration assembly 230 includes a diaphragm 231 and a voice coil 232.
  • the diaphragm 231 may include a central portion at the center, a folded portion surrounding the flat portion, and an edge portion surrounding the folded portion.
  • the edge portion of the diaphragm 231 is fixedly attached to the edge of the unit case 220, for example, by an adhesive means.
  • the voice coil 232 is fixedly coupled to the flat portion of the diaphragm 231 by, for example, an adhesive means, and the voice coil 232 and the unit casing 220 are located on the same side of the diaphragm 231.
  • the vibration assembly 230 may further include a reinforcing portion (DOME) 233 that is fixedly coupled to the flat portion of the diaphragm 231.
  • DOME reinforcing portion
  • the reinforcing portion 233 and the voice coil 232 may be located on the same side of the diaphragm 231 or on different sides of the diaphragm 231.
  • the magnetic circuit assembly 260 is mounted on the single housing 220, and the voice coil 232 is placed in the magnetic gap of the magnetic circuit assembly 260 to vibrate under the action of the magnetic circuit assembly 260 upon receiving an audio signal (alternating signal).
  • the diaphragm 231 incites the surrounding air to sound.
  • the magnetic circuit assembly 260 may include a center magnet 262, a flat-shaped magnetic yoke 261, and an edge magnet 263.
  • the center magnet 262 and the side magnet 263 are fixedly coupled to the surface of the yoke 261 facing the voice coil 232, and the side magnet 263 is disposed around the center magnet 262 to form the magnetic gap between the side magnet 263 and the center magnet 262.
  • the magnetic circuit system 260 may further include a central magnetic conductive plate 264 disposed on a surface of the central magnet 262 facing the diaphragm 231 to function to correct magnetic lines of force.
  • the magnetic circuit system 260 may further include an edge magnetic conductive plate disposed on a surface of the side magnet 263 facing the diaphragm 231 to function to correct magnetic lines of force.
  • the magnetic circuit assembly 260 can also include a bowl-shaped yoke and a center magnetic
  • the iron yoke further includes a flat plate portion and a side wall portion that is bent and extended toward the side of the voice coil 232 via the edge of the flat plate portion.
  • the center magnet is fixedly attached to the surface of the flat plate portion facing the voice coil 232 by, for example, bonding, to form the magnetic gap between the side wall portion and the center magnet.
  • the speaker unit 200 may further include a unit front cover 210 to securely connect the diaphragm 231 between the unit housing 220 and the unit front cover 210.
  • the speaker unit 200 can also dispense with the single front cover 210, and can further protect the diaphragm 213 from the other side by the module housing 100.
  • the diaphragm 231 of the speaker unit 200 separates the inner chamber into mutually independent front and rear acoustic chambers.
  • the single housing 220, voice coil 232, and magnetic circuit assembly 260 of the speaker unit 200 are all located in the rear acoustic cavity of the speaker module.
  • the module housing 100 has an acoustic hole communicating with the front acoustic cavity to sound through the sound hole.
  • the speaker module may further include a dustproof net 300 disposed on the module housing 100 and covering the sound hole of the module housing 100 .
  • a damping hole communicating with the rear acoustic cavity may be disposed on the module housing 100, and on the speaker unit 200. Set the leak hole that communicates with the rear cavity.
  • the leak hole may be provided on the unit case 220 of the speaker unit 200.
  • the leak hole may also be provided on the magnetic circuit assembly 260 of the speaker unit 200.
  • it is disposed on the yoke 261 of the magnetic circuit assembly 260.
  • the leak hole may also be formed between the unit case 220 and the magnetic circuit assembly 260, that is, a leak hole is formed by a gap between the unit case 220 and the magnetic circuit assembly 260.
  • the speaker unit 200 can be provided with two or more (including two) leakage holes. After analysis, the airflow flowing out of the speaker unit 200 through different leakage holes will collide in the rear sound cavity, thereby causing airflow disorder, which is to a large extent. This causes the speaker module to have a noise when outputting a single-frequency signal such as a piano sound.
  • the rear acoustic cavity of the speaker module includes two or more (including two) chambers, each of which communicates only with a portion of the leakage holes of the speaker unit 200.
  • the degree of collision of the airflow flowing out of the different leakage holes of the speaker unit 200 in the rear sound cavity can be reduced, the smoothness of the airflow can be improved, and the problem of noise generated when the speaker module outputs a single-frequency signal such as piano sound can be effectively solved.
  • each chamber may be configured in one-to-one correspondence with the leak holes such that each chamber communicates with a leak hole.
  • each chamber may be configured in one-to-one correspondence with the leak holes such that each chamber communicates with a leak hole.
  • the speaker unit 200 can have an even number of leak holes.
  • the even number of leak holes may be further symmetrically disposed about at least one mid-section of the diaphragm 231 to enhance the balancing of the gas flow.
  • the speaker unit 200 has four leak holes (not shown), and the rear sound chamber has four chambers 130, which are the first chamber 131 and the second chamber, respectively. 132.
  • the third chamber 133 and the fourth chamber 134 each have a plurality of leak holes communicating with a chamber 130.
  • four leak holes may be located at the four corners of the speaker unit 200 such that the four leak holes are symmetrically arranged with respect to the two middle sections of the diaphragm 231.
  • the speaker unit 200 can also have an odd number of leak holes.
  • Each chamber of the rear acoustic chamber can have substantially the same volume or can be designed differently depending on the commissioning of acoustic performance.
  • the module housing 100 can be provided with a damping hole communicating with the outside for each chamber.
  • the speaker module includes a partition wall 500 disposed in the rear sound chamber to divide the rear sound chamber into two or more chambers 130 by the cooperation of the partition wall 500 and the unit housing 220.
  • the partition wall 500 can be integrally formed with the module housing 100.
  • the partition wall 500 can also be fixedly coupled to the module housing 100 by means of welding, bonding, or the like.
  • the module housing 100 can include a module upper case 110 and a module lower case 120 fixedly connected to the module upper case 110.
  • the sound hole of the speaker module is disposed on the module upper case 110.
  • the partition wall 500 can be integrally formed with the module lower case 120, for example.
  • the partition wall 500 can be made of a sound absorbing material to also be able to adjust the sound quality through the partition wall 500.
  • the partition wall 500 can be bonded, for example, to the rear acoustic cavity.
  • the sound absorbing materials are mostly loose porous materials such as slag wool, foam, silica, zeolite, sound absorbing cotton and the like.
  • the sound absorption mechanism of the sound absorbing material is that the sound wave penetrates into the pores of the material, and the pores are mostly open pores which are mutually penetrated inside, and are subjected to the friction and viscous resistance of the air molecules, so that the fine fibers are mechanically vibrated, thereby converting the sound energy into heat energy.
  • the sound absorption coefficient of such a porous sound absorbing material generally increases from low frequency to high frequency, so the sound absorption effect on high frequency and intermediate frequency is better.
  • the speaker module may further include a foam 400 that is laid between the speaker unit 200 and the module housing 100.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Soundproofing, Sound Blocking, And Sound Damping (AREA)

Abstract

L'invention concerne un module de haut-parleur et un dispositif électronique. Le module de haut-parleur comprend un boîtier de module (100) et une unité de haut-parleur (200), l'unité de haut-parleur (200) étant logée dans le boîtier de module (100), et une membrane vibrante (231) de l'unité de haut-parleur (200) divisant une cavité interne du boîtier de module (100) en une cavité sonore arrière et en une cavité sonore avant pourvue de trous de sortie sonore ; l'unité de haut-parleur (200) est pourvue d'au moins deux trous de fuite sonore, et les deux trous de fuite sonore sont en communication avec la cavité sonore arrière ; et la cavité sonore arrière comprend deux chambres ou plus, et chacune des chambres est en communication avec une partie des trous de fuite sonore.
PCT/CN2017/089140 2017-04-24 2017-06-20 Module de haut-parleur et dispositif électronique WO2018196132A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201710273851.7A CN106973348B (zh) 2017-04-24 2017-04-24 扬声器模组及电子设备
CN201710273851.7 2017-04-24

Publications (1)

Publication Number Publication Date
WO2018196132A1 true WO2018196132A1 (fr) 2018-11-01

Family

ID=59334030

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2017/089140 WO2018196132A1 (fr) 2017-04-24 2017-06-20 Module de haut-parleur et dispositif électronique

Country Status (2)

Country Link
CN (1) CN106973348B (fr)
WO (1) WO2018196132A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN208112927U (zh) * 2018-04-28 2018-11-16 歌尔科技有限公司 用于电子产品的发声装置和电子产品
CN108366313B (zh) * 2018-05-17 2024-06-04 歌尔股份有限公司 发声器及耳机
CN108650603A (zh) * 2018-08-01 2018-10-12 歌尔股份有限公司 发声器件及便携终端
CN212628375U (zh) * 2020-05-29 2021-02-26 瑞声科技(新加坡)有限公司 发声器件
CN213028514U (zh) * 2020-05-29 2021-04-20 瑞声科技(新加坡)有限公司 发声器件
CN212628367U (zh) * 2020-05-29 2021-02-26 瑞声科技(新加坡)有限公司 发声器件
CN212588498U (zh) * 2020-05-29 2021-02-23 瑞声科技(新加坡)有限公司 发声器件
CN212628370U (zh) * 2020-05-29 2021-02-26 瑞声科技(新加坡)有限公司 发声器件
CN213028516U (zh) * 2020-05-29 2021-04-20 瑞声科技(新加坡)有限公司 发声器件
US11265629B2 (en) * 2020-06-04 2022-03-01 AAC Technologies Pte. Ltd. Speaker box

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1198109A1 (fr) * 2000-10-13 2002-04-17 Sony International (Europe) GmbH Ecouteur à coussin pour téléphone mobile
CN101500185A (zh) * 2008-01-30 2009-08-05 深圳富泰宏精密工业有限公司 扬声器组件
CN201893922U (zh) * 2010-11-10 2011-07-06 瑞声光电科技(常州)有限公司 电磁扬声器
CN103220608A (zh) * 2013-04-16 2013-07-24 歌尔声学股份有限公司 扬声器模组
CN204948336U (zh) * 2015-07-24 2016-01-06 歌尔声学股份有限公司 微型扬声器
CN105681984A (zh) * 2016-01-27 2016-06-15 瑞声光电科技(常州)有限公司 扬声器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203387666U (zh) * 2013-06-14 2014-01-08 歌尔声学股份有限公司 发声器件
CN104168525A (zh) * 2014-07-25 2014-11-26 无锡杰夫电声有限公司 倒相式多点激励扬声器箱
CN206820996U (zh) * 2017-04-24 2017-12-29 歌尔股份有限公司 扬声器模组及电子设备

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1198109A1 (fr) * 2000-10-13 2002-04-17 Sony International (Europe) GmbH Ecouteur à coussin pour téléphone mobile
CN101500185A (zh) * 2008-01-30 2009-08-05 深圳富泰宏精密工业有限公司 扬声器组件
CN201893922U (zh) * 2010-11-10 2011-07-06 瑞声光电科技(常州)有限公司 电磁扬声器
CN103220608A (zh) * 2013-04-16 2013-07-24 歌尔声学股份有限公司 扬声器模组
CN204948336U (zh) * 2015-07-24 2016-01-06 歌尔声学股份有限公司 微型扬声器
CN105681984A (zh) * 2016-01-27 2016-06-15 瑞声光电科技(常州)有限公司 扬声器

Also Published As

Publication number Publication date
CN106973348A (zh) 2017-07-21
CN106973348B (zh) 2019-02-26

Similar Documents

Publication Publication Date Title
WO2018196132A1 (fr) Module de haut-parleur et dispositif électronique
US11026016B2 (en) Tubular passive acoustic radiator module
JP4064160B2 (ja) スピーカ装置
WO2017041514A1 (fr) Module de haut-parleur et dispositif de terminal
US6704425B1 (en) System and method to enhance reproduction of sub-bass frequencies
WO2018095033A1 (fr) Unité de haut-parleur et module de haut-parleur
CN109756828A (zh) 发声装置以及电子设备
US10362386B2 (en) Loudspeaker enclosure with a sealed acoustic suspension chamber
JP2016524390A (ja) ダブルダイアフラム型スピーカーモジュール
US9602913B2 (en) Dual-frequency coaxial headphone
WO2018218766A1 (fr) Module de haut-parleur et dispositif électronique
WO2022222489A1 (fr) Dispositif de génération de son
JP6924962B2 (ja) スピーカ装置
WO2021088225A1 (fr) Dispositif acoustique et appareil électronique
CN103781002B (zh) 一种多振膜扬声器
WO2016052695A1 (fr) Excitateur
WO2022143209A1 (fr) Dispositif d'entraînement et casque d'écoute
CN107995573B (zh) 一种扬声器
US8085968B2 (en) Resonating cone transducer
JP5393915B1 (ja) スピーカ装置
KR101111100B1 (ko) 이어폰용 고음질 스피커 유닛
JP6052718B2 (ja) スピーカ装置
CN206820996U (zh) 扬声器模组及电子设备
KR100769885B1 (ko) 전자음향변환기
CN109040872B (zh) 一种吸顶音箱

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17907841

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17907841

Country of ref document: EP

Kind code of ref document: A1