WO2014173362A1 - Structure d'encapsulation de microphone, et dispositif formant terminal - Google Patents

Structure d'encapsulation de microphone, et dispositif formant terminal Download PDF

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Publication number
WO2014173362A1
WO2014173362A1 PCT/CN2014/079383 CN2014079383W WO2014173362A1 WO 2014173362 A1 WO2014173362 A1 WO 2014173362A1 CN 2014079383 W CN2014079383 W CN 2014079383W WO 2014173362 A1 WO2014173362 A1 WO 2014173362A1
Authority
WO
WIPO (PCT)
Prior art keywords
microphone
sound
sound channel
cavity
main board
Prior art date
Application number
PCT/CN2014/079383
Other languages
English (en)
Chinese (zh)
Inventor
杨振杰
Original Assignee
中兴通讯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Publication of WO2014173362A1 publication Critical patent/WO2014173362A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor

Definitions

  • the present invention relates to a method for installing a microphone in a terminal device, and more particularly to a package structure and a terminal device of a microphone.
  • terminal devices such as mobile phones have become an indispensable necessity in daily life.
  • the requirements for audio quality and the requirements for terminal device modeling are getting higher and higher.
  • the channel design of the microphone that is closely related to the call is becoming more and more important, especially the way of sidetones and the relationship between the shape and the audio quality are getting closer.
  • the microphone channel design used mainly is applied to the case where the distance H between the main board and the rear case surface is 4 mm or more, 3.5 mm to 4 mm, and 3 mm to 3.5 mm. In the case of smaller H, it is not very good at present.
  • the design method, and, at present, for the case of small H, many methods require relatively large size and position of the microphone hole. Generally, the diameter of the hole is required to be more than lmm, and the position in the thickness direction of the terminal is relatively backward, often in the battery. Covered, affecting styling and audio effects.
  • the technical problem to be solved by the embodiments of the present invention is to provide a package structure and a terminal device for a microphone, which can realize the encapsulation of the microphone when the distance between the main board and the rear case surface is less than 3 mm.
  • the embodiment of the present invention provides a package structure of a microphone, including: a back shell and a package sleeve, wherein the package sleeve includes a base body, wherein:
  • the base body includes a first side surface, a second side surface, and a lower end surface, the first side surface being opposite to the second side surface;
  • a cavity for setting a microphone is disposed on the first side
  • a first sound channel is opened on the second side, an upper portion of the first sound channel and the a lower portion of the cavity penetrates to form a through portion, the sound hole of the microphone is opposite to the through portion;
  • a second sound channel is opened on the lower end surface, and the second sound channel is in communication with the first sound channel;
  • the base body is disposed in the rear case, and the lower end portion of the rear case is provided with a sound hole, and the sound hole is opposite to the sound output port of the second sound channel.
  • a lower portion of the first sound channel is continuous with an entrance of the second sound channel, and an entrance of the second sound channel is opened on a plane parallel to the second side of the substrate.
  • a step is further disposed on a side of the first side, where the step is used to set a main board where the microphone is located, and after the microphone is installed in the cavity, the main board is disposed on the step; a surface of one side of the main board is sealed with a surface of one side of the first side, wherein a surface of one side of the main board is a surface where the microphone is located, and a surface of one side of the first side is open a stepped surface provided with a cavity for mounting a microphone;
  • Both the second side and the lower end of the base are sealed to the inner wall of the rear case.
  • a package structure of a microphone includes: a rear case and a bracket, the rear case is connected to a main board where the microphone is located, the microphone is enclosed in the rear case, and the bracket is disposed behind And forming a sound chamber with the rear case, the microphone is encapsulated in the sound chamber, and a sound hole is opened on a lower end portion of the rear case.
  • a sealing connection is formed between the rear case and the main board.
  • a terminal device includes: a package structure of a microphone, a main board, and a microphone
  • the package structure of the microphone includes: a rear case and a package sleeve
  • the package cover includes a base body, wherein the base body includes a first side a second side surface and a lower end surface, the first side surface being opposite to the second side surface;
  • a cavity for setting a microphone is disposed on the first side
  • a first sound channel is defined in the second side, and an upper portion of the first sound channel and a lower portion of the cavity form a through portion, and a sound hole of the microphone is opposite to the through portion;
  • the lower end surface a second sound channel is disposed on the upper opening, and the second sound channel is in communication with the first sound channel;
  • the base body is disposed in the rear case, and the lower end portion of the rear case is provided with a sound hole, and the sound hole is opposite to the sound output port of the second sound channel.
  • a lower portion of the first sound channel is continuous with an entrance of the second sound channel, and an entrance of the second sound channel is opened on a plane parallel to the second side of the substrate.
  • a step is further disposed on a side of the first side, where the step is used to set a main board where the microphone is located, and after the microphone is installed into the cavity, the main board is disposed on the step;
  • the surface of one side of the main board is sealed with the surface of one side of the first side surface, wherein a surface of one side of the main board is a surface where the microphone is located, and a surface of one side of the first side surface is opened with a step And provided with a surface for mounting a cavity of the microphone;
  • Both the second side and the lower end of the base are sealed to the inner wall of the rear case.
  • a terminal device includes: a package structure of a microphone, a main board, and a microphone, the package structure of the microphone includes a rear case and a bracket, the rear case is connected to a main board where the microphone is located, and the microphone is surrounded by In the rear case, the bracket is disposed on the rear case, and forms a sound chamber with the rear case, the microphone is encapsulated in the sound chamber, and the lower end portion of the rear case is provided with a sound dissipation hole.
  • the rear case is sealedly connected to the main board.
  • the embodiment of the present invention provides a cavity, a first sound channel and a second sound channel on the package sleeve, and the back case presses the package sleeve onto the motherboard to package the microphone, thereby ensuring that the surface of the main board and the rear case can be When the distance is less than 3 mm, the microphone package is realized, and the package sleeve and the rear case are more reliable because the contact surface is relatively large.
  • FIG. 1 is a cross-sectional view showing a package structure of a microphone according to an embodiment of the present invention
  • FIGS. 2 to 3 are exploded perspective views of a package structure of a microphone according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing a seal between a package sleeve and a main board according to an embodiment of the present invention
  • FIG. 5 is a schematic view showing a seal between a package sleeve and a rear case according to an embodiment of the present invention
  • FIG. 6 is a schematic structural diagram of a package structure of a microphone according to an embodiment of the present invention
  • FIG. 7 is a schematic structural diagram of a terminal device according to an embodiment of the present invention
  • FIG. 8 is a cross-sectional view showing another package structure of a microphone according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of another package structure of a microphone according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of another terminal device according to an embodiment of the present invention. Preferred embodiment of the invention
  • the package structure of the microphone of the present application includes: a rear case 1 and a package sleeve 2, the package sleeve 2 includes a base body 21, and a cavity for setting a microphone is opened on the first side of the base body 21. 23, a first sound channel 25 is defined on the second side 24 of the base body 21, and the second side surface 24 is opposite to the first side surface.
  • the lower portion of the first sound passage 25 and the sound input port 262 of the second sound passage 26 are penetrated, and the sound input port 262 of the second sound passage 26 is opened on a plane parallel to the second side surface 24 of the base 21.
  • the sleeve can be made of a silicone sleeve.
  • a step 27 on which the main board of the microphone is located is further disposed on one side of the first side of the base body 21. After the microphone is mounted in the cavity 23, the main board is disposed on the step 27, and the surface of the main board microphone is located.
  • the surface 28 on which the cavity 23 of the microphone is disposed after the opening step 27 of the first side is sealed, and the surface 28 where the cavity 23 after the step 27 is opened and the main board around the microphone are sealed by interference or adhesive.
  • the second side surface 24 and the lower end surface 29 of the base body 21 are both sealed from the inner wall of the rear case 1, after the rear case 1 is fastened, and the second side of the base body 21 is attached.
  • the side surface 24 and the first inner wall 12 of the rear case 1 are sealed by interference or backing; at the lower end surface 29 of the base 21 A seal is formed by interference with the second inner wall 13 of the rear case 1.
  • the present application presses the package sleeve 2 to the motherboard board where the microphone is located through the rear case 1, and the motherboard and the package sleeve 2 are formed by the compression of the rear case 1 (or the sealing between the main board and the package sleeve 2). a reliable sealed sound passage; the compression of the package sleeve 2 and the rear shell 1 (or the seal between the package sleeve 2 and the rear shell 1) forms a sealed sound passage, and the present application simplifies the mold of the package sleeve, The requirement for the distance between the main board and the rear case surface is lowered, and the requirement that the microphone's sound hole is moved in the thickness direction of the mobile terminal is satisfied.
  • FIG. 6 is a schematic structural diagram of a package structure of a microphone according to the above embodiment of the present invention, and the package structure 60 of the microphone includes: a rear case 61 and a package sleeve 62.
  • the present embodiment further provides a terminal device 70, including: a package structure 60 of a microphone 71, a main board 72, and a microphone.
  • the package structure of the microphone is the package structure of the microphone described above. Let me repeat.
  • the package structure of another microphone includes: a rear case 1 and a bracket 3, and the rear case 1 is connected to a main board where the microphone is located, and the microphone is enclosed in the rear case 1, and the bracket 3 is disposed at The rear case and the rear case 1 form a sound chamber 4, and the microphone is enclosed in the sound chamber 4, and the sound hole 11 is opened at the lower end portion of the rear case.
  • the rear case 1 is pressed against the main board by a foam to form a sealed connection.
  • the bracket 3 is super-welded or double-sided glued to the rear case 1. This way, the microphone can be packaged under the condition that the distance between the main board and the rear case surface is 3.5 mm or less, and the position of the sound hole 11 is also flexible.
  • FIG. 9 is a schematic structural diagram of a package structure of a microphone according to the embodiment of FIG. 8.
  • the package structure 90 of the microphone includes: a rear case 91 and a bracket 92.
  • the present embodiment further provides a terminal device 100, including: a package structure 90 of a microphone 101, a main board 102, and a microphone.
  • the package structure of the microphone is a package structure of the microphone shown in FIG. No longer.
  • the embodiment of the present invention provides a cavity, a first sound channel and a second sound channel on the package sleeve, and the rear case presses the package sleeve onto the main board to package the microphone, thereby ensuring the distance between the main board and the rear case surface.
  • the size is less than 3 mm, the package of the microphone is realized, and the package sleeve and the rear case are more reliable because the contact surface is relatively large. Therefore, it has strong industrial applicability.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

L'invention concerne une structure d'encapsulation de microphone, et un dispositif formant terminal. Le dispositif comprend un boîtier arrière et un manchon d'encapsulation, ledit manchon d'encapsulation comprenant une base. Ladite base comprend une première surface latérale, une seconde surface latérale et une surface d'extrémité inférieure, ladite première surface latérale étant opposée à ladite seconde surface latérale. La première surface latérale comprend une cavité pour recevoir un microphone, la seconde surface latérale comprend une première voie son. La section supérieure de la première voie son est connectée à la section inférieure de la cavité, formant ainsi une section de connexion. L'ouverture de sortie de son du microphone est opposée à la section de connexion. La surface d'extrémité inférieure comprend une seconde voie son. La seconde voie son communique avec la première voie son, la base comprend le boîtier arrière, la section inférieure du boîtier arrière comprend une ouverture de dispersion de son, et l'ouverture de dispersion de son est opposée à un port de sortie de son de la seconde voie son.
PCT/CN2014/079383 2013-07-29 2014-06-06 Structure d'encapsulation de microphone, et dispositif formant terminal WO2014173362A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201310322088.4 2013-07-29
CN201310322088.4A CN104349225A (zh) 2013-07-29 2013-07-29 一种麦克风的封装结构及终端设备

Publications (1)

Publication Number Publication Date
WO2014173362A1 true WO2014173362A1 (fr) 2014-10-30

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PCT/CN2014/079383 WO2014173362A1 (fr) 2013-07-29 2014-06-06 Structure d'encapsulation de microphone, et dispositif formant terminal

Country Status (2)

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CN (1) CN104349225A (fr)
WO (1) WO2014173362A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105813003A (zh) * 2016-04-25 2016-07-27 歌尔声学股份有限公司 扬声器与麦克风的安装壳体、制造方法及安装结构
CN110290655A (zh) * 2019-05-30 2019-09-27 无锡睿勤科技有限公司 一种移动终端
CN111107454A (zh) * 2018-10-26 2020-05-05 深圳市三诺声智联股份有限公司 一种mic密封装配结构、安装方法及终端设备
CN110290655B (zh) * 2019-05-30 2024-05-31 无锡睿勤科技有限公司 一种移动终端

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CN105959837B (zh) * 2016-05-30 2020-01-03 歌尔股份有限公司 防风噪麦克风以及耳机线控装置
CN106210945A (zh) * 2016-09-07 2016-12-07 上海展扬通信技术有限公司 麦克风密封结构及终端设备
CN107864258B (zh) * 2017-10-27 2019-12-27 Oppo广东移动通信有限公司 电子设备的壳体组件及电子设备
CN112866849A (zh) * 2021-01-13 2021-05-28 惠州Tcl移动通信有限公司 一种麦克风密封结构及移动终端

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CN201138866Y (zh) * 2007-12-24 2008-10-22 歌尔声学股份有限公司 改进结构的硅麦克风
CN101296530A (zh) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 硅电容传声器
CN101361400A (zh) * 2006-01-20 2009-02-04 日本电气株式会社 移动终端和扬声器
CN202276441U (zh) * 2011-10-26 2012-06-13 中兴通讯股份有限公司 一种麦克风音量通道的密封装置及电子设备

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US8325951B2 (en) * 2009-01-20 2012-12-04 General Mems Corporation Miniature MEMS condenser microphone packages and fabrication method thereof
DE102010064120B4 (de) * 2010-12-23 2023-05-25 Robert Bosch Gmbh Bauteil und Verfahren zu dessen Herstellung
CN202889436U (zh) * 2012-11-05 2013-04-17 广东欧珀移动通信有限公司 一种移动终端的导音结构

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CN101361400A (zh) * 2006-01-20 2009-02-04 日本电气株式会社 移动终端和扬声器
CN101296530A (zh) * 2007-04-29 2008-10-29 歌尔声学股份有限公司 硅电容传声器
CN201138866Y (zh) * 2007-12-24 2008-10-22 歌尔声学股份有限公司 改进结构的硅麦克风
CN202276441U (zh) * 2011-10-26 2012-06-13 中兴通讯股份有限公司 一种麦克风音量通道的密封装置及电子设备

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105813003A (zh) * 2016-04-25 2016-07-27 歌尔声学股份有限公司 扬声器与麦克风的安装壳体、制造方法及安装结构
CN105813003B (zh) * 2016-04-25 2019-10-22 歌尔股份有限公司 扬声器与麦克风的安装壳体、制造方法及安装结构
CN111107454A (zh) * 2018-10-26 2020-05-05 深圳市三诺声智联股份有限公司 一种mic密封装配结构、安装方法及终端设备
CN110290655A (zh) * 2019-05-30 2019-09-27 无锡睿勤科技有限公司 一种移动终端
CN110290655B (zh) * 2019-05-30 2024-05-31 无锡睿勤科技有限公司 一种移动终端

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