CN104349225A - Microphone packaging structure and terminal equipment - Google Patents
Microphone packaging structure and terminal equipment Download PDFInfo
- Publication number
- CN104349225A CN104349225A CN201310322088.4A CN201310322088A CN104349225A CN 104349225 A CN104349225 A CN 104349225A CN 201310322088 A CN201310322088 A CN 201310322088A CN 104349225 A CN104349225 A CN 104349225A
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- China
- Prior art keywords
- microphone
- sound
- back cover
- sound channel
- matrix
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
Abstract
The invention discloses a microphone packaging structure and terminal equipment. The microphone packaging structure comprises a rear shell and a packaging sleeve. The packaging sleeve comprises a basic body. The first side surface of the basic body is provided with a cavity for arrangement of a microphone. The second side surface, which is opposite to the first side surface, of the basic body is provided with a first sound channel. The upper segment of the first sound channel and the lower segment of the cavity are through. The sound hole of the microphone is opposite to the through part of the first sound channel and the cavity. The lower end surface of the basic body is provided with a second sound channel which is communicated with the first sound channel. The basic body is arranged in the rear shell. The lower end part of the rear shell is provided with a sound scattering hole which is opposite to a sound generating port of the second sound channel. Packaging of the microphone is ensured to be realized when distance of a mainboard and the surface of the rear shell is less than three millimeters, and sealing is more reliable due to a larger contact surface of the packaging sleeve and the rear shell.
Description
Technical field
The present invention relates to the mounting means of microphone in terminal equipment, particularly relate to a kind of encapsulating structure and terminal equipment of microphone.
Background technology
The terminal equipments such as mobile phone are as a kind of instrument being convenient for people to communicate, become necessity indispensable in daily life, along with the raising of consumers living, for the requirement of audio quality and the requirement of terminal equipment moulding more and more higher, wherein more and more important with the channels designs of the closely-related microphone of call, particularly to go out the mode of sound and moulding and audio quality relation more and more closer in side.
The distance H that the microphone channel design of current employing is mainly used in mainboard and back cover surface is the situation between more than 4mm, 3.5mm ~ 4mm and between 3mm ~ 3.5mm, when H is less, there is no good design at present, and, at present for the situation that H is less, a lot of mode to the size of microphone aperture and status requirement higher, the diameter in General Requirements hole is at more than 1mm, on the thickness direction of terminal, location comparison rearward, on battery cover of being everlasting, affect moulding and audio frequency effect.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of encapsulating structure and terminal equipment of microphone, can realize the encapsulation of microphone when the distance on mainboard and back cover surface is less than 3 millimeters.
For solving the problems of the technologies described above, the encapsulating structure of a kind of microphone of the present invention, comprise: back cover and package cover, described package cover comprises matrix, first side of matrix offers the cavity arranging microphone, second side relative with described first side of matrix offers the first sound channel, the epimere of described first sound channel and the hypomere of described cavity through, the sound hole of described microphone and described first sound channel are relative with the through part of cavity, the lower surface of described matrix offers the second sound channel, described second sound channel and described first sound channel connection, described matrix is arranged in described back cover, the bottom of described back cover offers loose sound hole, described loose sound hole is relative with the sound mouth of described second sound channel.
Further, the hypomere of described first sound channel and described second sound channel to enter sound mouth through, the sound mouth that enters of described second sound channel is opened in the plane parallel with the second side of described matrix.
Further, on matrix, described first side, side also offers the ladder arranging microphone place mainboard, be installed to after in described cavity at described microphone, described mainboard is arranged on described ladder, the surface at the microphone place of described mainboard with offer ladder after the face seal at the cavity place of microphone is set; Second side of described matrix and lower surface all with the inner wall sealing of described back cover.
Further, a kind of encapsulating structure of microphone, comprise: back cover and support, described back cover is connected with the mainboard at microphone place, microphone is enclosed in described back cover, described Bracket setting in the rear shell forms sound chamber with described back cover, by microphone package in described sound chamber, the bottom of shell in the rear offers loose sound hole.
Further, be tightly connected between described back cover and mainboard.
Further, a kind of terminal equipment, comprise: microphone, the encapsulating structure of mainboard and microphone, the encapsulating structure of described microphone comprises back cover and package cover, described package cover comprises matrix, first side of matrix offers the cavity arranging microphone, second side relative with described first side of matrix offers the first sound channel, the epimere of described first sound channel and the hypomere of described cavity through, the sound hole of described microphone and described first sound channel are relative with the through part of cavity, the lower surface of described matrix offers the second sound channel, described second sound channel and described first sound channel connection, described matrix is arranged in described back cover, the bottom of described back cover offers loose sound hole, described loose sound hole is relative with the sound mouth of described second sound channel.
Further, the hypomere of described first sound channel and described second sound channel to enter sound mouth through, the sound mouth that enters of described second sound channel is opened in the plane parallel with the second side of described matrix.
Further, on matrix, described first side, side also offers the ladder arranging microphone place mainboard, be installed to after in described cavity at described microphone, described mainboard is arranged on described ladder, the surface at the microphone place of described mainboard with offer ladder after the face seal at the cavity place of microphone is set; Second side of described matrix and lower surface all with the inner wall sealing of described back cover.
Further, a kind of terminal equipment, comprise: the encapsulating structure of microphone, mainboard and microphone, the encapsulating structure of described microphone comprises back cover and support, described back cover is connected with the mainboard at microphone place, is enclosed in by microphone in described back cover, and described Bracket setting in the rear shell forms sound chamber with described back cover, by microphone package in described sound chamber, the bottom of shell in the rear offers loose sound hole.
Further, be tightly connected between described back cover and mainboard.
In sum, the present invention by offering cavity, the first sound channel and the second sound channel in package cover, package cover is pressed to packaged microphone on mainboard by back cover, ensure that can when the distance on mainboard and back cover surface be less than 3 millimeters, realize the encapsulation of microphone, and package cover and back cover are because contact-making surface face is larger so sealing is more reliable.
Accompanying drawing explanation
Fig. 1 is the profile of the encapsulating structure of the microphone of embodiment of the present invention;
Fig. 2 ~ 3 are the three-dimensional exploded view of the encapsulating structure of the microphone of embodiment of the present invention;
Fig. 4 is the schematic diagram sealed between the package cover of embodiment of the present invention and mainboard;
Fig. 5 is the schematic diagram sealed between the package cover of embodiment of the present invention and back cover;
Fig. 6 is the profile of the encapsulating structure of the another kind of microphone of embodiment of the present invention.
Embodiment
For making the object of the application, technical scheme and advantage clearly understand, hereinafter will by reference to the accompanying drawings the embodiment of the application be described in detail.It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combination in any mutually.
As shown in FIG. 1 to 3, the encapsulating structure of the microphone of the application, comprise: back cover 1 and package cover 2, package cover 2 comprises matrix 21, first side of matrix 21 offers the cavity 23 arranging microphone, matrix 21 second side 24 offers the first sound channel 25, second side 24 is relative with the first side, the epimere of the first sound channel 25 and the hypomere of cavity 23 through, the sound hole of microphone and the first sound channel 25 are relative with the through part of cavity 23, the lower surface of matrix 21 offers the second sound channel 26, second sound channel 26 is communicated with the first sound channel 25, matrix 21 is arranged in back cover 1, the bottom of back cover 1 offers loose sound hole 11, loose sound hole 11 is relative with the sound mouth 261 of the second sound channel 26.
In present embodiment the hypomere of the first sound channel 25 and the second sound channel 26 to enter sound mouth 262 through, the sound mouth 262 that enters of the second sound channel 26 is opened in the plane parallel with the second side 24 of matrix 21.
In the application, package cover can adopt silica gel sheath.
As shown in Figure 4, on matrix 21, the first side, side also offers the ladder 27 arranging microphone place mainboard, be installed to after in cavity 23 at microphone, mainboard is arranged on ladder 27, the surface at the microphone place of mainboard with offer ladder 27 after cavity 23 place of microphone is set surface 28 seal, offer between the mainboard around the surface 28 at ladder 27 rear chamber 23 place and microphone and form sealing by interference or gum.
As shown in Figure 5, be set to after in back cover 1 at matrix 21, second side 24 of matrix 21 and lower surface 29 all with the inner wall sealing of back cover 1, after buckling back cover 1, formed by interference or gum between second side 24 and the first inwall 12 of back cover 1 of matrix 21 and seal; Formed by interference between the lower surface 29 of matrix 21 and the second inwall 13 of back cover 1 and seal.
In order to assembly and disassembly facilitates in general Fig. 5 two sealings place can not adopt gum simultaneously, and though this two place adopt gum whether or only by interference seal all in the application's protection range.
Package cover 2 is pressed on the mainboard plate at microphone place by back cover 1 by the application, because the compression (or the sealing of adding between mainboard and package cover 2) of back cover 1 defines the sound channel of positiver sealing between mainboard and package cover 2; The compression (or the sealing of adding between package cover 2 and back cover 1) of package cover 2 and back cover 1 defines the sound channel of sealing, the application simplifies the mould of package cover, reduce the requirement of the distance to mainboard and back cover surface, and meet the requirement of loose sound hole position movement on mobile terminal thickness direction of microphone.
Present embodiment additionally provides a kind of terminal equipment, comprising: the encapsulating structure of microphone, mainboard and microphone, and the encapsulating structure of microphone is the encapsulating structure of above described microphone, repeats no more herein.
As shown in Figure 6, the encapsulating structure of the another kind of microphone that the application provides, comprise: back cover 1 and support 3, back cover 1 is connected with the mainboard at microphone place, microphone is enclosed in back cover 1, support 3 is arranged on back cover and forms sound chamber 4 with back cover 1, by microphone package in sound chamber 4, the bottom of back cover offers loose sound hole 11.
Back cover 1 is pressed to formation on mainboard by foam and is tightly connected.Support 3 surpasses weldering or double faced adhesive tape adheres on back cover 1, and this mode can ensure that the distance on mainboard and back cover surface realizes the encapsulation of microphone when below 3.5mm, and the position of loose sound hole 11 is also more flexible.
Present embodiment additionally provides a kind of terminal equipment, comprising: the encapsulating structure of microphone, mainboard and microphone, and the encapsulating structure of microphone is the encapsulating structure of the microphone shown in Fig. 6, repeats no more herein.
The all or part of step that one of ordinary skill in the art will appreciate that in said method is carried out instruction related hardware by program and is completed, and described program can be stored in computer-readable recording medium, as read-only memory, disk or CD etc.Alternatively, all or part of step of above-described embodiment also can use one or more integrated circuit to realize, and correspondingly, each module/unit in above-described embodiment can adopt the form of hardware to realize, and the form of software function module also can be adopted to realize.The application is not restricted to the combination of the hardware and software of any particular form.
The foregoing is only the preferred embodiment of the application, be not limited to the application, for a person skilled in the art, the application can have various modifications and variations.Within all spirit in the application and principle, any amendment done, equivalent replacement, improvement etc., within the protection range that all should be included in the application.
Claims (10)
1. the encapsulating structure of a microphone, it is characterized in that, comprise: back cover and package cover, described package cover comprises matrix, first side of matrix offers the cavity arranging microphone, second side relative with described first side of matrix offers the first sound channel, the epimere of described first sound channel and the hypomere of described cavity through, the sound hole of described microphone and described first sound channel are relative with the through part of cavity, the lower surface of described matrix offers the second sound channel, described second sound channel and described first sound channel connection, described matrix is arranged in described back cover, the bottom of described back cover offers loose sound hole, described loose sound hole is relative with the sound mouth of described second sound channel.
2. the encapsulating structure of microphone as claimed in claim 1, it is characterized in that, the hypomere of described first sound channel and described second sound channel to enter sound mouth through, the sound mouth that enters of described second sound channel is opened in the plane parallel with the second side of described matrix.
3. the encapsulating structure of microphone as claimed in claim 1, it is characterized in that, on matrix, described first side, side also offers the ladder arranging microphone place mainboard, be installed to after in described cavity at described microphone, described mainboard is arranged on described ladder, the surface at the microphone place of described mainboard with offer ladder after the face seal at the cavity place of microphone is set; Second side of described matrix and lower surface all with the inner wall sealing of described back cover.
4. the encapsulating structure of a microphone, it is characterized in that, comprise: back cover and support, described back cover is connected with the mainboard at microphone place, microphone is enclosed in described back cover, described Bracket setting in the rear shell forms sound chamber with described back cover, by microphone package in described sound chamber, the bottom of shell in the rear offers loose sound hole.
5. the encapsulating structure of microphone as claimed in claim 4, is characterized in that, be tightly connected between described back cover and mainboard.
6. a terminal equipment, it is characterized in that, comprise: microphone, the encapsulating structure of mainboard and microphone, the encapsulating structure of described microphone comprises back cover and package cover, described package cover comprises matrix, first side of matrix offers the cavity arranging microphone, second side relative with described first side of matrix offers the first sound channel, the epimere of described first sound channel and the hypomere of described cavity through, the sound hole of described microphone and described first sound channel are relative with the through part of cavity, the lower surface of described matrix offers the second sound channel, described second sound channel and described first sound channel connection, described matrix is arranged in described back cover, the bottom of described back cover offers loose sound hole, described loose sound hole is relative with the sound mouth of described second sound channel.
7. terminal equipment as claimed in claim 6, is characterized in that, the hypomere of described first sound channel and described second sound channel to enter sound mouth through, the sound mouth that enters of described second sound channel is opened in the plane parallel with the second side of described matrix.
8. terminal equipment as claimed in claim 6, it is characterized in that, on matrix, described first side, side also offers the ladder arranging microphone place mainboard, be installed to after in described cavity at described microphone, described mainboard is arranged on described ladder, the surface at the microphone place of described mainboard with offer ladder after the face seal at the cavity place of microphone is set; Second side of described matrix and lower surface all with the inner wall sealing of described back cover.
9. a terminal equipment, it is characterized in that, comprise: the encapsulating structure of microphone, mainboard and microphone, the encapsulating structure of described microphone comprises back cover and support, described back cover is connected with the mainboard at microphone place, is enclosed in by microphone in described back cover, and described Bracket setting in the rear shell forms sound chamber with described back cover, by microphone package in described sound chamber, the bottom of shell in the rear offers loose sound hole.
10. terminal equipment as claimed in claim 9, is characterized in that, be tightly connected between described back cover and mainboard.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310322088.4A CN104349225A (en) | 2013-07-29 | 2013-07-29 | Microphone packaging structure and terminal equipment |
| PCT/CN2014/079383 WO2014173362A1 (en) | 2013-07-29 | 2014-06-06 | Microphone encapsulation structure and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310322088.4A CN104349225A (en) | 2013-07-29 | 2013-07-29 | Microphone packaging structure and terminal equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104349225A true CN104349225A (en) | 2015-02-11 |
Family
ID=51791091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310322088.4A Pending CN104349225A (en) | 2013-07-29 | 2013-07-29 | Microphone packaging structure and terminal equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104349225A (en) |
| WO (1) | WO2014173362A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105959837A (en) * | 2016-05-30 | 2016-09-21 | 歌尔股份有限公司 | Wind noise prevention microphone and earphone line control device |
| CN106210945A (en) * | 2016-09-07 | 2016-12-07 | 上海展扬通信技术有限公司 | Mike seals structure and terminal unit |
| CN107864258A (en) * | 2017-10-27 | 2018-03-30 | 广东欧珀移动通信有限公司 | The housing unit and electronic equipment of electronic equipment |
| CN112866849A (en) * | 2021-01-13 | 2021-05-28 | 惠州Tcl移动通信有限公司 | Microphone sealing structure and mobile terminal |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105813003B (en) * | 2016-04-25 | 2019-10-22 | 歌尔股份有限公司 | Installation shell, manufacturing method and the mounting structure of loudspeaker and microphone |
| CN111107454A (en) * | 2018-10-26 | 2020-05-05 | 深圳市三诺声智联股份有限公司 | MIC seal assembly structure, installation method and terminal equipment |
| CN110290655B (en) * | 2019-05-30 | 2024-05-31 | 无锡睿勤科技有限公司 | Mobile terminal |
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| CN101296530A (en) * | 2007-04-29 | 2008-10-29 | 歌尔声学股份有限公司 | Silicon capacitor microphone |
| US20100183181A1 (en) * | 2009-01-20 | 2010-07-22 | General Mems Corporation | Miniature mems condenser microphone packages and fabrication method thereof |
| CN202276441U (en) * | 2011-10-26 | 2012-06-13 | 中兴通讯股份有限公司 | Sealing device for microphone volume channel and electronic equipment |
| US20120181639A1 (en) * | 2010-12-23 | 2012-07-19 | Ricardo Ehrenpfordt | Component and method for the manufacture thereof |
| CN202889436U (en) * | 2012-11-05 | 2013-04-17 | 广东欧珀移动通信有限公司 | Note leading structure of movable terminal |
Family Cites Families (2)
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| JP4853029B2 (en) * | 2006-01-20 | 2012-01-11 | 日本電気株式会社 | Portable terminal, speaker, and speaker mounting structure for portable terminal |
| CN201138866Y (en) * | 2007-12-24 | 2008-10-22 | 歌尔声学股份有限公司 | Silicon microphone with improved structure |
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2013
- 2013-07-29 CN CN201310322088.4A patent/CN104349225A/en active Pending
-
2014
- 2014-06-06 WO PCT/CN2014/079383 patent/WO2014173362A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101296530A (en) * | 2007-04-29 | 2008-10-29 | 歌尔声学股份有限公司 | Silicon capacitor microphone |
| US20100183181A1 (en) * | 2009-01-20 | 2010-07-22 | General Mems Corporation | Miniature mems condenser microphone packages and fabrication method thereof |
| US20120181639A1 (en) * | 2010-12-23 | 2012-07-19 | Ricardo Ehrenpfordt | Component and method for the manufacture thereof |
| CN202276441U (en) * | 2011-10-26 | 2012-06-13 | 中兴通讯股份有限公司 | Sealing device for microphone volume channel and electronic equipment |
| CN202889436U (en) * | 2012-11-05 | 2013-04-17 | 广东欧珀移动通信有限公司 | Note leading structure of movable terminal |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105959837A (en) * | 2016-05-30 | 2016-09-21 | 歌尔股份有限公司 | Wind noise prevention microphone and earphone line control device |
| CN105959837B (en) * | 2016-05-30 | 2020-01-03 | 歌尔股份有限公司 | Wind noise prevention microphone and earphone line control device |
| CN106210945A (en) * | 2016-09-07 | 2016-12-07 | 上海展扬通信技术有限公司 | Mike seals structure and terminal unit |
| CN107864258A (en) * | 2017-10-27 | 2018-03-30 | 广东欧珀移动通信有限公司 | The housing unit and electronic equipment of electronic equipment |
| CN112866849A (en) * | 2021-01-13 | 2021-05-28 | 惠州Tcl移动通信有限公司 | Microphone sealing structure and mobile terminal |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014173362A1 (en) | 2014-10-30 |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150211 |