CN111451938A - 研磨载具清洗装置及研磨载具清洗方法 - Google Patents
研磨载具清洗装置及研磨载具清洗方法 Download PDFInfo
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- CN111451938A CN111451938A CN202010268464.6A CN202010268464A CN111451938A CN 111451938 A CN111451938 A CN 111451938A CN 202010268464 A CN202010268464 A CN 202010268464A CN 111451938 A CN111451938 A CN 111451938A
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- Prior art keywords
- grinding
- brush head
- bristles
- carrier
- nozzle
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- 238000004140 cleaning Methods 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 29
- 238000005498 polishing Methods 0.000 title claims description 32
- 238000005507 spraying Methods 0.000 claims abstract description 19
- 239000012530 fluid Substances 0.000 claims abstract description 14
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 86
- 229910052710 silicon Inorganic materials 0.000 abstract description 85
- 239000010703 silicon Substances 0.000 abstract description 85
- 239000006227 byproduct Substances 0.000 abstract description 14
- 239000007788 liquid Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 239000012535 impurity Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002210 silicon-based material Substances 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010268464.6A CN111451938B (zh) | 2020-04-08 | 2020-04-08 | 研磨载具清洗装置及研磨载具清洗方法 |
Applications Claiming Priority (1)
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CN202010268464.6A CN111451938B (zh) | 2020-04-08 | 2020-04-08 | 研磨载具清洗装置及研磨载具清洗方法 |
Publications (2)
Publication Number | Publication Date |
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CN111451938A true CN111451938A (zh) | 2020-07-28 |
CN111451938B CN111451938B (zh) | 2021-11-12 |
Family
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CN202010268464.6A Active CN111451938B (zh) | 2020-04-08 | 2020-04-08 | 研磨载具清洗装置及研磨载具清洗方法 |
Country Status (1)
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CN (1) | CN111451938B (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113798998A (zh) * | 2021-08-04 | 2021-12-17 | 山西光兴光电科技有限公司 | 研磨工作台用的清洁装置以及研磨系统 |
CN114012596A (zh) * | 2021-10-29 | 2022-02-08 | 长江存储科技有限责任公司 | 一种晶圆减薄设备及方法 |
CN114227526A (zh) * | 2022-02-28 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 一种研磨载台、研磨装置、研磨方法及硅片 |
CN114789160A (zh) * | 2022-03-29 | 2022-07-26 | 武汉宝钢华中贸易有限公司 | 一种矫直机的清洗装置及其使用方法 |
Citations (16)
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JPH10337656A (ja) * | 1997-06-05 | 1998-12-22 | Mitsubishi Materials Corp | ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法 |
TWI265070B (en) * | 2002-04-11 | 2006-11-01 | Taiwan Semiconductor Mfg | Cleaning device for polishing pad |
JP2007180117A (ja) * | 2005-12-27 | 2007-07-12 | Micro Engineering Inc | 基板洗浄方法と装置 |
CN203622168U (zh) * | 2013-12-19 | 2014-06-04 | 杭州士兰集成电路有限公司 | 一种具有清洗装置的硅片加工设备 |
CN205488060U (zh) * | 2016-03-04 | 2016-08-17 | 和舰科技(苏州)有限公司 | 一种晶圆清洗装置 |
CN108515447A (zh) * | 2008-08-21 | 2018-09-11 | 株式会社荏原制作所 | 抛光衬底的方法和装置 |
CN108621023A (zh) * | 2017-03-20 | 2018-10-09 | 台湾积体电路制造股份有限公司 | 化学机械研磨机台及化学机械研磨制程 |
CN108701607A (zh) * | 2016-03-30 | 2018-10-23 | 株式会社斯库林集团 | 基板处理装置、基板处理方法及程序记录介质 |
CN208162141U (zh) * | 2018-01-23 | 2018-11-30 | 清华大学 | 一种抛光盘清洗装置及化学机械抛光机 |
CN208306605U (zh) * | 2018-05-28 | 2019-01-01 | 李向军 | 一种高压清洗刷头 |
CN109277940A (zh) * | 2017-07-20 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨装置和化学机械研磨方法 |
CN209125576U (zh) * | 2018-12-04 | 2019-07-19 | 德淮半导体有限公司 | 研磨液供给手臂及化学机械研磨装置 |
CN209981177U (zh) * | 2019-06-14 | 2020-01-21 | 德淮半导体有限公司 | 晶圆清洗装置 |
CN110842783A (zh) * | 2019-11-19 | 2020-02-28 | 天津中环领先材料技术有限公司 | 一种硅片抛光垫清洗装置及清洗方法 |
CN110871187A (zh) * | 2018-08-30 | 2020-03-10 | 台湾积体电路制造股份有限公司 | 晶圆清洁系统及方法 |
CN110948384A (zh) * | 2019-12-31 | 2020-04-03 | 浙江芯晖装备技术有限公司 | 一种清洗装置 |
-
2020
- 2020-04-08 CN CN202010268464.6A patent/CN111451938B/zh active Active
Patent Citations (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10337656A (ja) * | 1997-06-05 | 1998-12-22 | Mitsubishi Materials Corp | ウェーハ研磨装置およびウェーハ保持用インサートの洗浄方法 |
TWI265070B (en) * | 2002-04-11 | 2006-11-01 | Taiwan Semiconductor Mfg | Cleaning device for polishing pad |
JP2007180117A (ja) * | 2005-12-27 | 2007-07-12 | Micro Engineering Inc | 基板洗浄方法と装置 |
CN108515447A (zh) * | 2008-08-21 | 2018-09-11 | 株式会社荏原制作所 | 抛光衬底的方法和装置 |
CN203622168U (zh) * | 2013-12-19 | 2014-06-04 | 杭州士兰集成电路有限公司 | 一种具有清洗装置的硅片加工设备 |
CN205488060U (zh) * | 2016-03-04 | 2016-08-17 | 和舰科技(苏州)有限公司 | 一种晶圆清洗装置 |
CN108701607A (zh) * | 2016-03-30 | 2018-10-23 | 株式会社斯库林集团 | 基板处理装置、基板处理方法及程序记录介质 |
CN108621023A (zh) * | 2017-03-20 | 2018-10-09 | 台湾积体电路制造股份有限公司 | 化学机械研磨机台及化学机械研磨制程 |
CN109277940A (zh) * | 2017-07-20 | 2019-01-29 | 中芯国际集成电路制造(上海)有限公司 | 一种化学机械研磨装置和化学机械研磨方法 |
CN208162141U (zh) * | 2018-01-23 | 2018-11-30 | 清华大学 | 一种抛光盘清洗装置及化学机械抛光机 |
CN208306605U (zh) * | 2018-05-28 | 2019-01-01 | 李向军 | 一种高压清洗刷头 |
CN110871187A (zh) * | 2018-08-30 | 2020-03-10 | 台湾积体电路制造股份有限公司 | 晶圆清洁系统及方法 |
CN209125576U (zh) * | 2018-12-04 | 2019-07-19 | 德淮半导体有限公司 | 研磨液供给手臂及化学机械研磨装置 |
CN209981177U (zh) * | 2019-06-14 | 2020-01-21 | 德淮半导体有限公司 | 晶圆清洗装置 |
CN110842783A (zh) * | 2019-11-19 | 2020-02-28 | 天津中环领先材料技术有限公司 | 一种硅片抛光垫清洗装置及清洗方法 |
CN110948384A (zh) * | 2019-12-31 | 2020-04-03 | 浙江芯晖装备技术有限公司 | 一种清洗装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113798998A (zh) * | 2021-08-04 | 2021-12-17 | 山西光兴光电科技有限公司 | 研磨工作台用的清洁装置以及研磨系统 |
CN114012596A (zh) * | 2021-10-29 | 2022-02-08 | 长江存储科技有限责任公司 | 一种晶圆减薄设备及方法 |
CN114227526A (zh) * | 2022-02-28 | 2022-03-25 | 西安奕斯伟材料科技有限公司 | 一种研磨载台、研磨装置、研磨方法及硅片 |
CN114789160A (zh) * | 2022-03-29 | 2022-07-26 | 武汉宝钢华中贸易有限公司 | 一种矫直机的清洗装置及其使用方法 |
CN114789160B (zh) * | 2022-03-29 | 2023-08-11 | 武汉宝钢华中贸易有限公司 | 一种矫直机的清洗装置及其使用方法 |
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CN111451938B (zh) | 2021-11-12 |
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Effective date of registration: 20211025 Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Applicant after: Xi'an yisiwei Material Technology Co.,Ltd. Applicant after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: Room 1323, block a, city gate, No.1 Jinye Road, high tech Zone, Xi'an, Shaanxi 710065 Applicant before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |