CN111440558A - Novel heat insulation composite material and manufacturing method thereof - Google Patents
Novel heat insulation composite material and manufacturing method thereof Download PDFInfo
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- CN111440558A CN111440558A CN202010378433.6A CN202010378433A CN111440558A CN 111440558 A CN111440558 A CN 111440558A CN 202010378433 A CN202010378433 A CN 202010378433A CN 111440558 A CN111440558 A CN 111440558A
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- layer
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- composite material
- adhesive film
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a novel heat-insulating composite material, which comprises a heat-insulating main body, wherein the heat-insulating main body consists of a radiation-proof layer, a low heat-conducting layer and an assembly bonding layer, the surface of the assembly bonding layer is attached to the bottom surface of the low heat-conducting layer, the low heat-conducting layer is tightly adhered to the surface of the assembly bonding layer, the top surface of the low heat-conducting layer is attached to the bottom surface of the radiation-proof layer, the radiation-proof layer is tightly adhered to the surface of the low heat-conducting layer, and a bonding layer is adhered to the bonding part between the radiation-proof layer and the low; a method for manufacturing a novel heat insulation composite material comprises the following steps: selecting a base material for preparing the radiation-proof layer; selecting a material for preparing a low heat conduction layer; selecting a material for preparing the bonding layer; forming a heat insulation primary product; selecting a material for preparing the assembling adhesive layer; forming the novel heat insulation composite material.
Description
Technical Field
The invention relates to the field of electronic products, in particular to a novel heat-insulating composite material and a manufacturing method thereof.
Background
With the increasing intellectualization and miniaturization of electronic products, the power consumption density of the products is also increasing continuously, which leads to the more serious heat dissipation problem of the electronic products. There are three ways of heat transfer, which are: thermal conduction, convective heat transfer, and radiative heat transfer. In many products, heat insulation is an effective heat management method, but currently the most commonly used aerogel heat insulation film can effectively prevent heat conduction and convection heat transfer, but because the material itself can transmit infrared rays, the heat insulation film cannot effectively inhibit radiation heat transfer, and the heat insulation effect is poor in a space with compact size and limited use thickness. Some high porosity, low thermal conductivity foam and aerogel insulation films have similar drawbacks. The novel heat insulation composite material and the manufacturing method thereof are provided for solving the problems that the heat conduction coefficient of the materials forming the coating and the reflecting film is high, the coating and the reflecting film are difficult to be thick, and large gaps cannot be filled effectively, so that heat conduction and convection heat transfer cannot be prevented effectively in a large space, and the heat insulation effect is poor.
Disclosure of Invention
The present invention aims to overcome the above-mentioned shortcomings and provide a technical solution to solve the above-mentioned problems.
The utility model provides a novel thermal-insulated combined material, includes thermal-insulated main part, thermal-insulated main part comprises radiation protection layer, low heat-conducting layer and assembly adhesive linkage, the surface of assembly adhesive linkage is laminated with the bottom surface of low heat-conducting layer, and low heat-conducting layer closely covers the surface of gluing in the assembly adhesive linkage, the top surface of low heat-conducting layer is laminated with radiation protection layer bottom surface, and the radiation protection layer closely covers the surface of gluing in low heat-conducting layer to the bonding department between radiation protection layer and the low heat-conducting layer is pasted and is had the adhesive linkage.
Preferably, the thickness of the radiation protection layer is 0.01mm-0.3 mm.
Preferably, the thickness of the adhesive layer is 0.005mm to 0.05 mm.
Preferably, the thickness of the low thermal conductive layer is not less than 0.05 mm.
Preferably, the thickness of the assembly adhesive layer is 0.005-0.05 mm.
A method for manufacturing a novel heat insulation composite material comprises the following steps:
s1, selecting a base material for preparing the radiation-proof layer;
s2, after the substrate is selected, applying a copper, aluminum, tin, nickel and nickel-chromium alloy metal layer on the surface of the substrate in an electroplating or sputtering surface treatment mode to prepare a radiation-proof film so as to form the radiation-proof layer;
s3, selecting a material for preparing the low heat conduction layer, and preparing a low heat conduction film to form the low heat conduction layer;
s4, selecting a material for preparing the bonding layer, preparing a bonding adhesive film, and further forming the bonding layer;
s5, attaching the adhesive film prepared in the S4 to the surface of the low-heat-conductivity film prepared in the S3, and attaching the radiation-proof film prepared in the S2 to the surface of the adhesive film through the adhesive film to form a heat-insulating main body;
s6, selecting a material for preparing the assembling adhesive layer, and preparing an assembling adhesive film to form the assembling adhesive layer;
s7, adhering the assembly adhesive film formed in the step S6 to the heat insulation primary product formed in the step S5, and further forming the novel heat insulation composite material.
Compared with the prior art, the invention has the beneficial effects that: the heat insulation film which can prevent heat conduction and convection heat conduction and the radiation protection layer which can prevent radiation heat conduction are combined, so that heat transfer can be completely prevented, and the heat insulation effect is excellent; the heat insulation layer can prevent heat conduction and convection heat conduction, and has the functions of elasticity, mechanical support and the like; the radiation protection layer can play a role in preventing radiation heat transfer, can be tiled on the surface of equipment and can be wrapped in the circumferential direction, and the heat insulation requirements of various scenes are met.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural view of a novel thermal insulation composite;
FIG. 2 is another schematic diagram of a novel thermal insulation composite.
Shown in the figure: 1. the heat insulation structure comprises a heat insulation main body, 2, a radiation protection layer, 3, an adhesive layer, 4, a low heat conduction layer and 5, wherein the adhesive layer is assembled.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, in the embodiment of the present invention, a novel thermal insulation composite material includes a thermal insulation main body 1, where the thermal insulation main body 1 is composed of a radiation protection layer 2, a low thermal conductive layer 4 and an assembly adhesive layer 5, a surface of the assembly adhesive layer 5 may be attached to a bottom surface of the low thermal conductive layer 4 or to a surface (2) of the radiation protection layer, the low thermal conductive layer 4 is closely adhered to the surface of the assembly adhesive layer 5, a top surface of the low thermal conductive layer 4 is attached to a bottom surface of the radiation protection layer 2, the radiation protection layer 2 is closely adhered to a surface of the low thermal conductive layer 4, and an adhesive layer 3 is adhered to a bonding portion between the radiation protection layer 2 and the low thermal conductive layer 4.
The thickness of the radiation protection layer 2 is 0.01mm-0.3mm, the radiation protection layer prevents heat from being transmitted in a radiation heat transfer mode, and the radiation protection layer can realize a conductive or insulating function according to the requirement of an electric signal.
The thickness of the adhesive layer 3 is 0.005mm-0.05mm, and the radiation-proof layer 2 is tightly adhered to the surface of the low heat-conducting layer 4 through the adhesive layer 3.
The thickness of the low heat conduction layer 4 is not less than 0.05mm, and heat is prevented from being transmitted in the form of heat conduction and convection heat conduction through the low heat conduction layer 4.
The thickness of the assembly adhesive layer 5 is 0.005-0.05mm, and the heat insulation body 1 can be adhered to the surface of the electronic to be heat insulated through the assembly adhesive layer 5.
A method for manufacturing a novel heat insulation composite material comprises the following steps:
s1, selecting a base material for preparing the radiation-proof layer;
s2, after a substrate is selected, applying a copper, aluminum, tin, nickel and nickel-chromium alloy metal layer on the surface of the substrate in an electroplating or sputtering surface treatment mode to prepare a radiation protection film so as to form the radiation protection layer, wherein the radiation protection layer is subjected to double-sided sputtering coating or single-sided sputtering coating, the top surface of the radiation protection layer is required to be sputtered with a coating, and the bottom surface of the radiation protection layer is not required to be sputtered with a coating;
s3, selecting a material for preparing the low heat conduction layer, and preparing a low heat conduction film to form the low heat conduction layer;
s4, selecting a material for preparing the bonding layer, preparing a bonding adhesive film, and further forming the bonding layer;
s5, attaching the adhesive film prepared in the S4 to the surface of the low-heat-conductivity film prepared in the S3, and attaching the radiation-proof film prepared in the S2 to the surface of the adhesive film through the adhesive film to form a heat-insulation primary product;
s6, selecting a material for preparing the assembling adhesive layer, and preparing an assembling adhesive film to form the assembling adhesive layer;
s7, adhering the assembly adhesive film formed in the step S6 to the heat insulation primary product formed in the step S5, and further forming the novel heat insulation composite material.
The base material is any one of PET, PI or metal film.
The low heat conduction layer is made of any one of aerogel films, PU foam, PRON foam or silica gel foam, and the heat conduction coefficient is below 0.3W/m.K.
The adhesive layer is made of any one of PET double-sided adhesive tape, heat-conducting adhesive film, conductive adhesive film, adhesive film with base material or adhesive film without base material.
The assembly bonding layer is made of any one of PET double-sided adhesive tape, heat-conducting adhesive film, conductive adhesive film, adhesive film with base material or adhesive film without base material.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Claims (10)
1. The utility model provides a novel thermal-insulated combined material, includes thermal-insulated main part, its characterized in that, thermal-insulated main part comprises radiation protection layer, low heat-conducting layer and assembly adhesive linkage, the surface of assembly adhesive linkage can laminate with the bottom surface of low heat-conducting layer, and low heat-conducting layer closely covers and glues in the surface of assembly adhesive linkage, the top surface of low heat-conducting layer is laminated with radiation protection layer bottom surface, and the radiation protection layer closely covers and glues in the surface of low heat-conducting layer to the bonding department between radiation protection layer and the low heat-conducting layer is pasted and is had the adhesive linkage.
2. The novel thermal insulation composite material as claimed in claim 1, wherein the thickness of the radiation protection layer is 0.01mm to 0.3 mm.
3. The novel thermal insulation composite material as claimed in claim 1, wherein the thickness of the adhesive layer is 0.005mm to 0.05 mm.
4. The novel thermal insulating composite material as claimed in claim 1, wherein the thickness of the low thermal conductive layer is not less than 0.05 mm.
5. The novel thermal insulating composite material as claimed in claim 1, wherein the thickness of the assembly adhesive layer is 0.005-0.05 mm.
6. A method for manufacturing a novel thermal insulation composite material, which is used for manufacturing the novel thermal insulation composite material as claimed in claims 1-5, and is characterized by comprising the following steps:
s1, selecting a base material for preparing the radiation-proof layer;
s2, after the substrate is selected, applying a copper, aluminum, tin, nickel and nickel-chromium alloy metal layer on the surface of the substrate in an electroplating or sputtering surface treatment mode to prepare a radiation-proof film so as to form the radiation-proof layer;
s3, selecting a material for preparing the low heat conduction layer, and preparing a low heat conduction film to form the low heat conduction layer;
s4, selecting a material for preparing the bonding layer, preparing a bonding adhesive film, and further forming the bonding layer;
s5, attaching the adhesive film prepared in the S4 to the surface of the low-heat-conductivity film prepared in the S3, and attaching the radiation-proof film prepared in the S2 to the surface of the adhesive film through the adhesive film to form a heat-insulating main body;
s6, selecting a material for preparing the assembling adhesive layer, and preparing an assembling adhesive film to form the assembling adhesive layer;
s7, adhering the assembly adhesive film formed in the step S6 to the heat insulation main body manufactured in the step S5, and further forming the novel heat insulation composite material.
7. The method for manufacturing the novel heat insulation composite material as claimed in claim 6, wherein the base material is any one of PET, PI or metal film.
8. The manufacturing method of the novel heat insulation composite material as claimed in claim 6, wherein the low heat conduction layer is made of any one of aerogel film, PU foam, PRON foam or silica gel foam, and the heat conductivity coefficient is below 0.3W/m.K.
9. The manufacturing method of the novel heat insulation composite material as claimed in claim 6, wherein the composition material of the bonding layer is any one of PET double-sided tape, heat-conducting adhesive film, conductive adhesive film, adhesive film with substrate or adhesive film without substrate.
10. The manufacturing method of the novel heat insulation composite material as claimed in claim 6, wherein the assembling adhesive layer is made of any one of PET double-sided tape, heat-conducting adhesive film, conductive adhesive film, adhesive film with substrate or adhesive film without substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010378433.6A CN111440558A (en) | 2020-05-07 | 2020-05-07 | Novel heat insulation composite material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010378433.6A CN111440558A (en) | 2020-05-07 | 2020-05-07 | Novel heat insulation composite material and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111440558A true CN111440558A (en) | 2020-07-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010378433.6A Withdrawn CN111440558A (en) | 2020-05-07 | 2020-05-07 | Novel heat insulation composite material and manufacturing method thereof |
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| CN (1) | CN111440558A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113412041A (en) * | 2021-06-11 | 2021-09-17 | 深圳市好年璟科技有限公司 | Radiation-proof side transmission plate and manufacturing method thereof |
-
2020
- 2020-05-07 CN CN202010378433.6A patent/CN111440558A/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113412041A (en) * | 2021-06-11 | 2021-09-17 | 深圳市好年璟科技有限公司 | Radiation-proof side transmission plate and manufacturing method thereof |
| CN113412041B (en) * | 2021-06-11 | 2023-03-14 | 深圳市好年璟科技有限公司 | Radiation-proof side transparent plate and manufacturing method thereof |
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Application publication date: 20200724 |