CN111342327A - Laser conversion medium clamping device and laser - Google Patents
Laser conversion medium clamping device and laser Download PDFInfo
- Publication number
- CN111342327A CN111342327A CN202010147115.9A CN202010147115A CN111342327A CN 111342327 A CN111342327 A CN 111342327A CN 202010147115 A CN202010147115 A CN 202010147115A CN 111342327 A CN111342327 A CN 111342327A
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- China
- Prior art keywords
- conversion medium
- heat sink
- cooling heat
- laser conversion
- laser
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- 238000006243 chemical reaction Methods 0.000 title claims abstract description 80
- 239000000463 material Substances 0.000 claims abstract description 109
- 238000001816 cooling Methods 0.000 claims abstract description 70
- 239000010410 layer Substances 0.000 claims description 32
- 239000000945 filler Substances 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 238000013329 compounding Methods 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000002470 thermal conductor Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000002356 single layer Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract description 8
- 230000008602 contraction Effects 0.000 abstract description 5
- 239000013078 crystal Substances 0.000 description 13
- 230000008859 change Effects 0.000 description 5
- 238000001125 extrusion Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007906 compression Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Lasers (AREA)
Abstract
The invention discloses a laser conversion medium clamping device and a laser, which comprise a filling material and a cooling heat sink, wherein the laser conversion medium is connected with the cooling heat sink through the filling material, a mounting hole is formed in the cooling heat sink corresponding to the laser conversion medium, the laser conversion medium is mounted in the mounting hole, and the filling material is arranged between the laser conversion medium and the cooling heat sink. The laser conversion medium clamping device has wide temperature range adaptability, can still keep good and effective heat conduction between the laser conversion medium and the cooling heat sink when the temperature is greatly changed, and cannot cause the phenomenon that the laser conversion medium is crushed due to thermal expansion and cold contraction or the filling material is plastically deformed and cannot be recovered, so the device has good heat management effect and environmental adaptability.
Description
Technical Field
The invention belongs to the technical field of laser thermal management and environmental adaptability, and particularly relates to a laser conversion medium clamping device and a laser.
Background
The high average power laser has a non-negligible thermal effect, and in order to ensure normal output of laser parameters, a core heating component of the laser, namely a laser conversion medium, needs to be radiated. The adoption of conduction heat dissipation is one of a plurality of heat dissipation modes, and is suitable for application occasions with higher requirements on the volume weight of the laser. The laser conversion medium conducting and dissipating heat needs to be clamped, and the clamping mode has serious influence on the heat management effect and the environmental adaptability. In the application field with wider environmental temperature change range, if the clamping is improper, the consequences include that the laser with poor heat dissipation effect can not be normally output, the laser conversion medium generates larger clamping stress to cause larger change of the polarization state of the laser, and the laser conversion medium is broken and broken under the extrusion of thermal expansion and cold contraction of the clamping piece.
The clamping method adopted by the laser under the laboratory condition is generally a single filling material auxiliary heat conduction mode, namely a layer of soft and high heat conduction auxiliary material is added between a heat sink and a laser conversion medium and filled between the surface of a crystal and the surface of the heat sink, so that the problem of poor point contact heat transfer effect caused by unsmooth heat transfer between the crystal and the heat sink is solved, and the clamping method is only suitable for the use condition with small environmental temperature change due to the fact that the linear expansion coefficient of the filling material is inconsistent with that of the crystal and the heat sink. When the ambient temperature changes greatly, because the linear expansion coefficient of heat sink, crystal, filler material is inconsistent, soft filler material can take place plastic deformation under the repeated action of expend with heat and contract with cold, when the linear expansion coefficient of filler material is greater than heat sink and crystal, when ambient temperature is higher than the assembly temperature, filler material receives the extrusion attenuation, when the temperature resumes the assembly temperature will not be good and heat sink and crystal contact, lose the function that filler material assisted heat transfer.
Therefore, the prior art is subject to further improvement and development.
Disclosure of Invention
In order to solve the above problems, a clamping device for a laser conversion medium and a laser have been proposed to clamp a crystal and satisfy excellent thermal management effects and environmental suitability.
The invention provides the following technical scheme:
a laser conversion medium clamping device comprises a filling material and a cooling heat sink, wherein a laser conversion medium is connected with the cooling heat sink through the filling material, a mounting hole is formed in the cooling heat sink corresponding to the laser conversion medium, the laser conversion medium is mounted in the mounting hole, and the filling material is arranged between the laser conversion medium and the cooling heat sink.
Further, the overall linear expansion coefficient of the filling material is consistent with the linear expansion coefficients of the laser conversion medium and the cooling heat sink.
Further, the filler material may also be composed of a single material including indium, silver, graphite paper.
Preferably, the filling material is formed by compounding multiple layers of materials, the materials of the adjacent layers are different in material, and the single layer of material comprises indium, silver and graphite paper.
Further, the following relation is satisfied among the laser conversion medium, the filling material and the cooling heat sink:
Φr×αr＝Φj×αj+∑(dn×αn) (1)
wherein: phirAperture of mounting hole for cooling heat sink 1, αrCoefficient of linear expansion, phi, for cooling the heat sink 1jOuter diameter of laser conversion medium αjThe linear expansion coefficient of the laser conversion medium 2 is n layers of the filling material, and the thickness and the linear expansion coefficient of the filling material are d1、d2… … dn and α1、α2……αn。
Furthermore, the filling material is formed by compounding an inner layer material and an outer layer material, wherein the linear expansion coefficient of the inner layer material is larger than that of the laser conversion medium, and the linear expansion coefficient of the outer layer material is smaller than that of the laser conversion medium.
Further, the thickness d of the inner layer filling material1Thickness d of outer layer filling material2The following relation is satisfied:
d1×α1+d2×α2＝(d1+d2)×α0(2)
wherein α1Coefficient of linear expansion for inner layer filling material, α2Coefficient of linear expansion of the filling material for the outer layer, α0Is the linear expansion coefficient of the laser conversion medium.
Preferably, the cooling heat sink is a good thermal conductor material, and the good thermal conductor material constituting the cooling heat sink includes an oxygen-free copper material, an alloy, and a resin.
Furthermore, the cooling heat sink is formed by joining an upper cooling heat sink and a lower cooling heat sink, the mounting holes are positioned on the joining surface of the upper cooling heat sink and the lower cooling heat sink, the upper cooling heat sink and the lower cooling heat sink are fixed by fastening screws, and the material of the fastening screws is consistent with that of the cooling heat sink.
The invention also provides a laser which comprises the laser conversion medium clamping device.
Has the advantages that:
the invention provides a laser conversion medium clamping device and a laser, which have the following beneficial effects:
(1) the alloy with the linear expansion coefficient matched with the laser conversion medium material is used as the cooling heat sink, so that the problems of laser conversion medium compression caused by thermal expansion and cold contraction of the cooling heat sink or damage or heat exchange failure caused by separation from the laser conversion medium are solved in a wide temperature range, and the wide temperature range adaptability is realized.
(2) By arranging the filling material with the same linear expansion coefficient as the laser conversion medium and the cooling heat sink, the problem of heat transfer failure caused by plastic deformation generated by extrusion of the filling material during temperature change is avoided.
Drawings
Fig. 1 is a schematic structural view of a laser conversion medium holding device according to an embodiment of the present invention.
In the figure: 1-cooling heat sink, 2-laser conversion medium, 3-inner layer filling material, 4-outer layer filling material and 5-fastening screw.
Detailed Description
In order to make the technical solutions of the present invention better understood, the following description of the technical solutions of the present invention with reference to the accompanying drawings of the present invention is made clearly and completely, and other similar embodiments obtained by a person of ordinary skill in the art without any creative effort based on the embodiments in the present application shall fall within the protection scope of the present application. In addition, directional terms such as "upper", "lower", "left", "right", etc. in the following embodiments are directions with reference to the drawings only, and thus, the directional terms are used for illustrating the present invention and not for limiting the present invention.
The invention provides a laser conversion medium clamping device, which comprises a filling material and a cooling heat sink 1 as shown in figure 1, wherein a laser conversion medium 2 is connected with the cooling heat sink 1 through the filling material, a mounting hole is formed in the cooling heat sink 1 corresponding to the laser conversion medium 2, the laser conversion medium 2 is mounted in the mounting hole, and the filling material is arranged between the laser conversion medium 2 and the cooling heat sink 1.
Specifically, the laser conversion medium 2 includes, but is not limited to, Nd: YAG crystal, Yb: YAG crystal, Nd: YVO4 crystal, Nd: YLF crystal, Yb: SFAP crystals, etc. may be used to produce laser light.
Specifically, the cooling heat sink 1 is made of a good heat conductor material, the cooling heat sink 1 is formed by combining an upper cooling heat sink 1 and a lower cooling heat sink 1, the mounting holes are formed in the combined surfaces of the upper cooling heat sink 1 and the lower cooling heat sink 1 and used for accommodating the laser conversion medium 2 and the filling material, the shape of each mounting hole is matched with the outline shape of the filling material, the corresponding surfaces of the laser conversion medium 2, the filling material and the cooling heat sink 1 are tightly attached, and a good heat transfer process from the laser conversion medium 2 to the cooling heat sink 1 is guaranteed. The upper cooling heat sink 1 and the lower cooling heat sink 1 are fixed through the fastening screws 5, the material of the fastening screws 5 is consistent with that of the cooling heat sink 1, the size of the fastening screws 5 meets the fixing requirement, and the specific shape and the position of the fastening screws are not limited. The positions of the fastening screws 5 are distributed in bilateral symmetry with the axis of the laser conversion medium 2 as a symmetry axis.
In a preferred embodiment, the good thermal conductor material constituting the cooling heat sink 1 includes an oxygen-free copper material, an alloy, and a resin, wherein the alloy material is preferably a molybdenum-copper alloy.
The filling material has higher thermal conductivity and certain elasticity, and the overall linear expansion coefficient of the filling material is consistent with that of the laser conversion medium 2 and the cooling heat sink 1, so that the filling material is ensured not to be subjected to additional stress at different temperatures. The clamping device has good wide temperature range adaptability, can still keep good and effective heat conduction between the laser conversion medium and the cooling heat sink when the temperature is greatly changed, does not have the phenomenon that the laser conversion medium is crushed or the filling material is plastically deformed and cannot be recovered due to thermal expansion and cold contraction, and has good heat management effect and environmental adaptability.
In a specific embodiment, the filling material may be made of a single material, and the single material includes indium, silver, and graphite paper. In a preferred embodiment, the filling material may also be formed by compounding multiple layers of materials, the materials of adjacent layers are different materials, and the multilayer material composite structure can realize adjustment of the linear expansion coefficient of the filling material under the condition of ensuring good thermal conductivity of the filling material, so that the overall linear expansion coefficient of the filling material is consistent with the linear expansion coefficients of the laser conversion medium and the cooling heat sink, and specifically, the single-layer material may be indium, silver, or graphite paper.
The laser conversion medium 2, the filling material and the cooling heat sink 1 satisfy the following relations:
Φr×αr＝Φj×αj+∑(dn×αn) (1)
wherein: phirAperture of mounting hole for cooling heat sink 1, αrCoefficient of linear expansion, phi, for cooling the heat sink 1jOuter diameter of laser conversion medium αjThe linear expansion coefficient of the laser conversion medium 2 is n layers of the filling material, and the thickness and the linear expansion coefficient of the filling material are d1、d2… … dn and α1、α2……αn。
In a preferred embodiment, as shown in fig. 1, the filling material is formed by compounding an inner layer and an outer layer, wherein the linear expansion coefficient of the inner layer filling material is larger than that of the laser conversion medium 2, and the linear expansion coefficient of the outer layer filling material is smaller than that of the laser conversion medium 2.
Thickness d of inner layer filling material 31Thickness d of outer layer filling material 42The following relation is satisfied:
d1×α1+d2×α2＝(d1+d2)×α0(2)
wherein α1Coefficient of linear expansion for the inner layer filling material 3, α2Coefficient of linear expansion for the outer filling material 4, α0Is the linear expansion coefficient of the laser conversion medium 2.
The arrangement ensures that the expansion coefficient of the comprehensive line of the filling material is consistent with that of the laser conversion medium and the cooling heat sink, and avoids the problem of heat transfer failure caused by plastic deformation of the filling material due to extrusion during temperature change. Meanwhile, the alloy with the linear expansion coefficient matched with the laser conversion medium material is used as the cooling heat sink, so that the damage or heat exchange failure caused by the compression or separation of the cooling heat sink and the crystal caused by the expansion and contraction of the cooling heat sink in a wide temperature range is avoided. Therefore, the clamping device has good heat management effect and environmental adaptability.
The present invention has been described in detail, and it should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
Claims (10)
1. The laser conversion medium clamping device is characterized by comprising a filling material and a cooling heat sink, wherein the laser conversion medium is connected with the cooling heat sink through the filling material, a mounting hole is formed in the cooling heat sink and corresponds to the laser conversion medium, the laser conversion medium is mounted in the mounting hole, and the filling material is arranged between the laser conversion medium and the cooling heat sink.
2. The laser conversion medium clamping device according to claim 1, wherein the overall linear expansion coefficient of the filling material is consistent with the linear expansion coefficients of the laser conversion medium and the cooling heat sink.
3. The laser conversion media holding apparatus of claim 1, wherein the filler material is comprised of a single material comprising indium, silver, graphite paper.
4. The clamping device for laser conversion medium as claimed in claim 1, wherein the filling material is formed by compounding multiple layers of materials, the adjacent layers of materials are different materials, and the single layer of materials comprises indium, silver and graphite paper.
5. The laser conversion medium clamping device of claim 1, wherein the following relationship is satisfied between the laser conversion medium, the filling material and the cooling heat sink: phir×αr＝Φj×αj+∑(dn×αn) Wherein phirTo cool the aperture of the mounting hole in the heat sink, αrCoefficient of linear expansion, phi, for cooling heat sinksjOuter diameter of laser conversion medium αjThe linear expansion coefficient of the laser conversion medium is obtained by filling n layers of filling materialsThe thickness and linear expansion coefficient of the material are respectively d1、d2… … dn and α1、α2……αn。
6. The clamping device for laser conversion medium according to claim 4, wherein the filling material is formed by compounding an inner layer material and an outer layer material, wherein the linear expansion coefficient of the inner layer material is larger than that of the laser conversion medium, and the linear expansion coefficient of the outer layer material is smaller than that of the laser conversion medium.
7. The laser conversion medium clamping device of claim 6, wherein the thickness d of the inner layer material1Thickness d of outer layer material2The following relation is satisfied:
d1×α1+d2×α2＝(d1+d2)×α0wherein α1Coefficient of linear expansion of inner layer material, α2Coefficient of linear expansion of the outer layer material, α0Is the linear expansion coefficient of the laser conversion medium.
8. The laser conversion medium clamping device of claim 1, wherein the cooling heat sink is a good thermal conductor material, and the good thermal conductor material constituting the cooling heat sink comprises an oxygen-free copper material, an alloy, and a resin.
9. The laser conversion medium clamping device according to claim 1, wherein the cooling heat sink is formed by joining an upper cooling heat sink and a lower cooling heat sink, the mounting holes are located on the joining surface of the upper cooling heat sink and the lower cooling heat sink, the upper cooling heat sink and the lower cooling heat sink are fixed by fastening screws, and the material of the fastening screws is consistent with that of the cooling heat sink.
10. A laser having a laser conversion medium holding apparatus according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147115.9A CN111342327A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
| CN202410202379.8A CN118054284A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010147115.9A CN111342327A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202410202379.8A Division CN118054284A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
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| Publication Number | Publication Date |
|---|---|
| CN111342327A true CN111342327A (en) | 2020-06-26 |
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| CN202010147115.9A Pending CN111342327A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
| CN202410202379.8A Pending CN118054284A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202410202379.8A Pending CN118054284A (en) | 2020-03-05 | 2020-03-05 | Laser conversion medium clamping device and laser |
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| CN (2) | CN111342327A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140950A (en) * | 2021-03-29 | 2021-07-20 | 常州莱特康光电科技有限公司 | Laser gain unit, manufacturing method of laser gain unit and laser gain module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3683296A (en) * | 1970-10-13 | 1972-08-08 | Texas Instruments Inc | High efficiency laser cavity |
| CN101958506A (en) * | 2009-08-07 | 2011-01-26 | 西安电子科技大学 | Method for modularizing crystal and heat sink in laser diode pumped solid laser |
| CN102163789A (en) * | 2011-03-09 | 2011-08-24 | 中国电子科技集团公司第十一研究所 | Micro-channel water-cooling heat-sink device and packaging method thereof |
-
2020
- 2020-03-05 CN CN202010147115.9A patent/CN111342327A/en active Pending
- 2020-03-05 CN CN202410202379.8A patent/CN118054284A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3683296A (en) * | 1970-10-13 | 1972-08-08 | Texas Instruments Inc | High efficiency laser cavity |
| CN101958506A (en) * | 2009-08-07 | 2011-01-26 | 西安电子科技大学 | Method for modularizing crystal and heat sink in laser diode pumped solid laser |
| CN102163789A (en) * | 2011-03-09 | 2011-08-24 | 中国电子科技集团公司第十一研究所 | Micro-channel water-cooling heat-sink device and packaging method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113140950A (en) * | 2021-03-29 | 2021-07-20 | 常州莱特康光电科技有限公司 | Laser gain unit, manufacturing method of laser gain unit and laser gain module |
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| Publication number | Publication date |
|---|---|
| CN118054284A (en) | 2024-05-17 |
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Application publication date: 20200626 |