CN111405809A - Electronic equipment cooling system - Google Patents
Electronic equipment cooling system Download PDFInfo
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- CN111405809A CN111405809A CN202010132412.6A CN202010132412A CN111405809A CN 111405809 A CN111405809 A CN 111405809A CN 202010132412 A CN202010132412 A CN 202010132412A CN 111405809 A CN111405809 A CN 111405809A
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- 238000001816 cooling Methods 0.000 title claims abstract description 64
- 238000007654 immersion Methods 0.000 claims abstract description 56
- 238000009833 condensation Methods 0.000 claims abstract description 47
- 230000005494 condensation Effects 0.000 claims abstract description 46
- 238000001704 evaporation Methods 0.000 claims abstract description 22
- 230000008020 evaporation Effects 0.000 claims abstract description 21
- 238000010438 heat treatment Methods 0.000 claims abstract description 6
- 239000007788 liquid Substances 0.000 claims description 194
- 238000007789 sealing Methods 0.000 claims description 15
- 230000001105 regulatory effect Effects 0.000 claims description 13
- 239000000110 cooling liquid Substances 0.000 abstract description 13
- 239000002826 coolant Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000903 blocking effect Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 231100000956 nontoxicity Toxicity 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/208—Liquid cooling with phase change
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a cooling system of electronic equipment, which comprises at least one group of cooling subsystems, wherein each group of cooling subsystems comprises a loop heat pipe and an immersion device, the evaporation end of the loop heat pipe is connected with a target heating part of the electronic equipment, and the condensation end of the loop heat pipe is connected with the immersion device; a loop heat pipe for transferring heat of a target heat generating component from an evaporation end to a condensation end; and the immersion device is used for carrying out immersion condensation operation on the condensation end. By applying the technical scheme provided by the embodiment of the invention, the requirement on the cooling liquid is greatly reduced, the consumption of the cooling liquid is greatly reduced, and the cost is reduced.
Description
Technical Field
The invention relates to the technical field of data center cooling, in particular to an electronic equipment cooling system.
Background
With the development of the electronic information industry, the power density of electronic devices (such as IT devices like servers) is rapidly increasing, but a large amount of heat is generated during the high-speed operation of the electronic devices, and heat dissipation treatment is required.
The existing heat dissipation mode of electronic equipment mostly adopts the mode that the whole electronic equipment is immersed in cooling liquid, and a heating device in the electronic equipment can be in direct contact with the cooling liquid, so that the heat transfer effect is greatly improved. However, the existing fully-immersed electronic equipment cooling mode has many defects, so that the fully-immersed electronic equipment cooling mode cannot be applied on a large scale. First, because the electronic device is entirely immersed in the coolant, the materials of the electronic device are complex, and it is difficult to ensure that all the materials do not chemically react with the coolant, so that high requirements (insulation, thermal conductivity, volatility, nontoxicity, etc.) are imposed on the coolant, and the cost of the coolant is high. The whole electronic equipment is fully immersed in the cooling liquid, and the consumption of the cooling liquid is large.
In summary, how to effectively solve the problems of high requirement on cooling liquid, large consumption of cooling liquid, high cost and the like of the existing cooling mode of electronic equipment is a problem which needs to be solved urgently by a person skilled in the art at present.
Disclosure of Invention
The invention aims to provide a cooling system of electronic equipment, which greatly reduces the requirement on cooling liquid, greatly reduces the consumption of the cooling liquid and reduces the cost.
In order to solve the technical problems, the invention provides the following technical scheme:
an electronic device cooling system comprising:
each cooling subsystem comprises a loop heat pipe and an immersion device, wherein an evaporation end of the loop heat pipe is connected with a target heating component of the electronic equipment, and a condensation end of the loop heat pipe is connected with the immersion device;
the loop heat pipe is used for transferring the heat of the target heat generating component from the evaporation end to the condensation end;
the immersion device is used for performing immersion condensation operation on the condensation end.
In one embodiment of the present invention, the height of the heat pipe at the condensation end is smaller than the height of the heat pipe at the evaporation end.
In one embodiment of the present invention, the present invention further comprises a cold air sealing device, the cold air sealing device comprising:
a housing;
the beam is arranged in the shell, is provided with a plurality of U positions and is used for supporting and installing each electronic device by utilizing each U position;
and the first blind plate is used for plugging the U position of the beam without the equipment component.
In an embodiment of the present invention, the cold air sealing apparatus further includes:
the second blind plate is used for plugging a U position of an equipment component installed in the cross beam;
and the first hairbrushes are arranged on the periphery of each equipment part and used for plugging gaps between the second blind plate and each equipment part.
In a specific embodiment of the present invention, the immersion device includes a first liquid inlet main pipe, a first liquid outlet main pipe, a first liquid inlet branch pipe communicated with the first liquid inlet main pipe, a first liquid outlet branch pipe communicated with the first liquid outlet main pipe, a first regulating valve respectively disposed on the first liquid inlet branch pipe and the first liquid outlet branch pipe, and an immersion tank disposed on top of the first liquid inlet branch pipe and the first liquid outlet branch pipe and communicated with the first liquid inlet branch pipe and the first liquid outlet branch pipe.
In one embodiment of the present invention, the immersion device further comprises:
and the first liquid receiving tank is arranged at the bottoms of the first liquid inlet main pipe and the first liquid outlet main pipe.
In one embodiment of the present invention, the method further comprises:
and a fan opening provided in the housing.
In a specific embodiment of the present invention, the cooling subsystem further includes a gas-liquid heat exchange device, and the gas-liquid heat exchange device includes:
the second liquid inlet main pipe, the second liquid outlet main pipe, a second liquid inlet branch pipe communicated with the second liquid inlet main pipe, a second liquid outlet branch pipe communicated with the second liquid outlet main pipe, second regulating valves respectively arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, heat exchange fins arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, a flow guide cover covering the heat exchange fins, and a fan arranged between the flow guide cover and the fan opening; and the second liquid inlet branch pipe is communicated with the top of the second liquid outlet branch pipe.
In a specific embodiment of the present invention, the gas-liquid heat exchanger further includes:
and the second liquid receiving tank is arranged at the bottoms of the second liquid inlet main pipe and the second liquid outlet main pipe.
In one embodiment of the present invention, the method further comprises:
the wire outlet is arranged on the shell;
the second brush is arranged at the wire outlet;
and the wiring groove is arranged on the side wall of the shell and is used for receiving the outgoing line led out from the outlet.
The electronic equipment cooling system provided by the embodiment of the invention comprises: each cooling subsystem comprises a loop heat pipe and an immersion device, wherein an evaporation end of the loop heat pipe is connected with a target heating component of the electronic equipment, and a condensation end of the loop heat pipe is connected with the immersion device; a loop heat pipe for transferring heat of a target heat generating component from an evaporation end to a condensation end; and the immersion device is used for carrying out immersion condensation operation on the condensation end. Through setting up the cooling subsystem including loop heat pipe and submergence device, utilize the evaporation end of loop heat pipe to transmit the condensation end with the heat transfer of the electronic equipment target part that generates heat, reuse submergence device to carry out the condensation operation to the condensation end, thereby make the coolant liquid among the condensation device not with electronic equipment direct contact, greatly reduced the requirement to the coolant liquid, only need cool off the condensation end of loop heat pipe, compare in the current cooling method that carries out submergence with whole electronic equipment, the quantity of coolant liquid has greatly been reduced, and the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a block diagram of a cooling system for an electronic device according to an embodiment of the present invention;
FIG. 2 is a block diagram of another cooling system for electronic equipment according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a loop heat pipe according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a cold air sealing device according to an embodiment of the present invention;
FIG. 5 is a schematic view of an immersion apparatus according to an embodiment of the present invention;
FIG. 6 is a side view of an immersion apparatus in an embodiment of the present invention;
FIG. 7 is a schematic view of another structure of the cold air sealing device according to the embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a gas-liquid heat exchanger according to an embodiment of the present invention;
fig. 9 is a schematic structural diagram of a cooling system of an electronic device according to an embodiment of the present invention.
The drawings are numbered as follows:
1-electronic equipment cooling system, 2-cooling subsystem, 3-loop heat pipe, 31-evaporation end, 32-condensation end, 4-immersion device, 41-first liquid inlet main pipe, 42-first liquid outlet main pipe, 43-first liquid inlet branch pipe, 44-first liquid outlet branch pipe, 45-first regulating valve, 46-immersion groove, 47-first liquid receiving groove, 5-cold air sealing device, 51-shell, 52-beam, 53-first blind plate, 54-second blind plate, 55-fan opening, 56-outlet port, 57-second brush, 58-wiring groove, 6-gas-liquid heat exchange device, 61-second liquid inlet main pipe, 62-second liquid outlet main pipe, 63-second liquid inlet branch pipe, 64-second liquid outlet branch pipe, 65-a second regulating valve, 66-a heat exchange fin, 67-a guide sleeve, 68-a fan and 69-a second liquid receiving tank.
Detailed Description
In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 and fig. 2, fig. 1 is a block diagram of a cooling system for electronic equipment according to an embodiment of the present invention, and fig. 2 is a block diagram of a cooling system for electronic equipment according to another embodiment of the present invention, where the cooling system 1 for electronic equipment may include:
each group of cooling subsystems 2 comprises a loop heat pipe 3 and an immersion device 4, an evaporation end 31 of the loop heat pipe 3 is connected with a target heat generating component of the electronic equipment, and a condensation end 32 of the loop heat pipe 3 is connected with the immersion device 4;
a loop heat pipe 3 for transferring heat of a target heat-generating component from the evaporation end 31 to the condensation end 32;
and the immersion device 4 is used for carrying out immersion condensation operation on the condensation end 32.
As shown in fig. 1 and fig. 2, an electronic device cooling system 1 provided in an embodiment of the present invention may include at least one set of cooling subsystems 2, where fig. 1 shows a case where only one set of cooling subsystems 2 is included in the electronic device cooling system 1, and fig. 2 shows a case where multiple sets of cooling subsystems 2 are included in the electronic device cooling system 1. Each group of cooling subsystems 2 comprises a loop heat pipe 3 and an immersion device 4, wherein an evaporation end 31 of the loop heat pipe 3 is connected with a target heat-generating component of the electronic equipment, and a condensation end 32 of the loop heat pipe 3 is connected with the immersion device 4; a loop heat pipe 3 for transferring heat of a target heat-generating component from the evaporation end 31 to the condensation end 32; and the immersion device 4 is used for carrying out immersion condensation operation on the condensation end 32.
Referring to fig. 3, a loop Heat Pipe 3 (L oop Heat Pipe, L HP) is a loop closed loop Heat Pipe, which generally comprises an evaporator, a condenser, a liquid reservoir, and vapor and liquid pipelines, and the working principle of the loop Heat Pipe is that a thermal load is applied to the evaporator, a working medium is evaporated on the outer surface of a capillary core of the evaporator, the generated vapor flows out of a vapor channel and enters the vapor pipeline, then enters the condenser to be condensed into liquid and is subcooled, a return liquid enters a liquid main channel through the liquid pipeline to supply the capillary core of the evaporator, so that the circulation of the working medium is driven by the capillary pressure generated by the capillary core of the evaporator, and no external power is needed.
The target heat generating component may be a main heat generating component of the electronic device, such as a CPU of a server, and may also include other heat generating components of the electronic device, which is not limited in the embodiment of the present invention.
Because the condensation end 32 of the loop heat pipe 3 is in direct contact with the immersion device 4, the electronic equipment is not in direct contact with the immersion device 4, and the condensation end 32 has strong adaptability to liquid, so that the cooling liquid contained in the immersion device 4 can be water, and the condensation end 32 of the loop heat pipe 3 is condensed by the water, thereby playing a role in indirectly condensing a target heat generating component of the electronic equipment. Compared with the existing cooling mode of immersing the whole electronic equipment by using expensive cooling liquid, the cooling liquid consumption is greatly reduced, and the cost is reduced.
The electronic equipment cooling system provided by the embodiment of the invention comprises: each cooling subsystem comprises a loop heat pipe and an immersion device, wherein an evaporation end of the loop heat pipe is connected with a target heating component of the electronic equipment, and a condensation end of the loop heat pipe is connected with the immersion device; a loop heat pipe for transferring heat of a target heat generating component from an evaporation end to a condensation end; and the immersion device is used for carrying out immersion condensation operation on the condensation end. Through setting up the cooling subsystem including loop heat pipe and submergence device, utilize the evaporation end of loop heat pipe to transmit the condensation end with the heat transfer of the electronic equipment target part that generates heat, reuse submergence device to carry out the condensation operation to the condensation end, thereby make the coolant liquid among the condensation device not with electronic equipment direct contact, greatly reduced the requirement to the coolant liquid, only need cool off the condensation end of loop heat pipe, compare in the current cooling method that carries out submergence with whole electronic equipment, the quantity of coolant liquid has greatly been reduced, and the cost is reduced.
In one embodiment of the present invention, as shown in fig. 3, the height of the heat pipe at the condensation end 32 is smaller than the height of the heat pipe at the evaporation end 31.
As shown in fig. 3, the height of the heat pipe at the condensation end 32 can be set smaller than the height of the heat pipe at the evaporation end 31. The height h of the loop heat pipe 3 at the top of the condensation end 32 should be as small as possible, so that the work of the loop heat pipe 3 against gravity is small, and the overall efficiency is improved.
In an embodiment of the present invention, as shown in fig. 4, the electronic device cooling system 1 may further include a cold air sealing device 5, where the cold air sealing device 5 includes:
a housing 51;
a plurality of U-shaped cross members 52 disposed in the housing 51 for supporting and mounting the electronic devices by the U-shaped cross members;
and the first blind plate 53 is used for plugging the U position of the cross beam 52 where no equipment part is installed.
As shown in fig. 4, the electronic device cooling system 1 according to the embodiment of the present invention may further include a cold air sealing device 5, where the cold air sealing device 5 may include a housing 51, and may further include a cross beam 52 disposed in the housing 51, where the cross beam 52 is disposed with a plurality of U positions, and each electronic device is supported and mounted by using each U position. The first blind plate 53 for blocking the U position of the cross beam 52 where no equipment component is installed can be further included, so that the cold air can only flow out through the electronic equipment, and the waste of cold energy is prevented.
In an embodiment of the present invention, as shown in fig. 4, the cold air sealing device 5 may further include:
the second blind plate 54 is used for plugging the U position of the equipment component installed in the cross beam 52;
and the first brushes are arranged on the periphery of each equipment part and used for plugging gaps between the second blind plate 54 and each equipment part.
As shown in fig. 4, the cold air sealing device 5 may further include a second blind plate 54 for blocking a U position of the cross beam 52 where the equipment components are installed, and further include first brushes disposed around the equipment components for blocking gaps between the second blind plate 54 and the equipment components. The cold air can only flow out through the electronic equipment, and the waste of cold energy is further prevented.
In an embodiment of the present invention, as shown in fig. 5, the immersion device 4 includes a first liquid inlet main pipe 41, a first liquid outlet main pipe 42, a first liquid inlet branch pipe 43 communicated with the first liquid inlet main pipe 41, a first liquid outlet branch pipe 44 communicated with the first liquid outlet main pipe 42, a first adjusting valve 45 respectively disposed on the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, and an immersion tank 46 disposed on top of the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 and communicated with the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44.
As shown in fig. 5, the immersion devices 4 in each group of cooling subsystems 2 may include a first liquid inlet trunk pipe 41, a first liquid outlet trunk pipe 42, a first liquid inlet branch pipe 43 communicated with the first liquid inlet trunk pipe 41, a first liquid outlet branch pipe 44 communicated with the first liquid outlet trunk pipe 42, first adjusting valves 45 respectively disposed on the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, and an immersion tank 46 disposed at the top of the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 and communicated with the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44. The immersion device 4 can be disposed on one side or both sides of the top outer side of the housing 51, the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 are disposed in pairs, the immersion groove 46 is disposed on the tops of the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, the first regulating valve 45 is disposed on both the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, and the liquid level and the liquid flow rate in the immersion groove 46 can be regulated through the first regulating valve 45. The first liquid inlet branch pipe 43, the first liquid outlet branch pipe 44, the immersion tank 46 and the first regulating valve 45 which are connected form a group of immersion devices 4, and a plurality of groups of immersion devices 4 can be arranged in the whole electronic equipment cooling system 1 according to requirements. The immersion devices 4 are independent of each other and can be adjusted independently to meet the refrigeration requirements of different heat generating components in different electronic equipment.
In an embodiment of the present invention, as shown in fig. 5, the immersion device 4 may further include:
and the first liquid receiving tank 47 is arranged at the bottom of the first liquid inlet main pipe 41 and the first liquid outlet main pipe 42.
As shown in fig. 5, the immersion device 4 provided by the embodiment of the present invention may further include a first liquid receiving tank 47 disposed at the bottom of the first liquid inlet main pipe 41 and the first liquid outlet main pipe 42. The first liquid inlet main pipe 41 and the first liquid outlet main pipe 42 are arranged in the liquid receiving tank side by side. The first liquid receiving tank 47 is used for receiving the first liquid inlet main pipe 41, the first liquid outlet main pipe 42, the first liquid inlet branch pipe 43, the first liquid outlet branch pipe 44, the first adjusting valve 45 and the possible condensate water and the possible water leakage on the surface of the immersion tank 46. Referring to fig. 6, fig. 6 is a side view of an immersion device 4 according to an embodiment of the present invention.
In an embodiment of the present invention, as shown in fig. 7, the electronic device cooling system 1 may further include:
and a fan 68 opening 55 provided in the housing 51.
As shown in fig. 7, the electronic device cooling system 1 according to the embodiment of the present invention may further include an opening 55 of a fan 68 disposed in the housing 51 for installing the fan 68 for heat exchange.
In an embodiment of the present invention, as shown in fig. 8, the cooling subsystem 2 further includes a gas-liquid heat exchanging device 6, and the gas-liquid heat exchanging device 6 includes:
the second liquid inlet main pipe 61, the second liquid outlet main pipe 62, a second liquid inlet branch pipe 63 communicated with the second liquid inlet main pipe 61, a second liquid outlet branch pipe 64 communicated with the second liquid outlet main pipe 62, a second regulating valve 65 respectively arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64, a heat exchange fin 66 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64, a flow guide cover 67 covering the heat exchange fin 66, and a fan 68 arranged between the flow guide cover 67 and the fan 68 opening 55; wherein, the second liquid inlet branch pipe 63 is communicated with the top of the second liquid outlet branch pipe 64.
As shown in fig. 8, the cooling subsystem 2 further includes a gas-liquid heat exchange device 6. The gas-liquid heat exchange device 6 comprises a second liquid inlet main pipe 61, a second liquid outlet main pipe 62, a second liquid inlet branch pipe 63 communicated with the second liquid inlet main pipe 61, a second liquid outlet branch pipe 64 communicated with the second liquid outlet main pipe 62, a second regulating valve 65 respectively arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64, heat exchange fins 66 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64, a flow guide cover 67 covering the heat exchange fins 66, and a fan 68 arranged between the flow guide cover 67 and the fan 68 opening 55; wherein, the second liquid inlet branch pipe 63 is communicated with the top of the second liquid outlet branch pipe 64. The gas-liquid heat exchange device 6 may be an air-cold water heat exchange mode, and the gas-liquid heat exchange device 6 may be disposed on one side or both sides of the bottom outer side of the housing 51. The second adjusting valve 65 is used for adjusting the water flow in the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64. The top of the second liquid inlet branch pipe 63 is communicated with the top of the second liquid outlet branch pipe 64 to form a sub-loop. The heat exchange fins 66 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 are used for exchanging heat with air flowing through and cooling the air. The outside of the heat exchange fin 66 is provided with the air guide sleeve 67, the air guide sleeve 67 is matched with the opening 55 of the fan 68, and the air after heat exchange can be completely guided into the shell 51 to cool other parts of the electronic equipment, which are not provided with the evaporation end 31 of the annular heat pipe. The connected second liquid inlet branch pipe 63, second liquid outlet branch pipe 64, second adjusting valve 65, fan 68, air guide sleeve 67 and heat exchange fins 66 form a gas-liquid heat exchange device 6, each electronic equipment cooling system 1 can contain a plurality of gas-liquid heat exchange devices 6, and each gas-liquid heat exchange device 6 is independent and can be independently adjusted.
In an embodiment of the present invention, as shown in fig. 8, the gas-liquid heat exchanger 6 further includes:
and a second liquid receiving tank 69 arranged at the bottom of the second liquid inlet main pipe 61 and the second liquid outlet main pipe 62.
As shown in fig. 8, the gas-liquid heat exchanger 6 may further include a second liquid receiving tank 69 disposed at the bottom of the second liquid inlet main pipe 61 and the second liquid outlet main pipe 62. The second liquid inlet main pipe 61 and the second liquid outlet main pipe 62 are arranged in the second water receiving tank side by side. The second liquid receiving tank 69 is used for receiving the condensate water possibly generated on the surfaces of the second liquid inlet main pipe 61, the second liquid outlet main pipe 62, the second liquid inlet branch pipe 63, the second liquid outlet branch pipe 64 and the second regulating valve 65 and the water leakage possibly generated. Fig. 9 is a schematic structural diagram of an electronic device cooling system 1 according to an embodiment of the present invention.
In an embodiment of the present invention, as shown in fig. 4 and 7, the electronic device cooling system 1 may further include:
an outlet 56 provided in the housing 51;
a second brush 57 disposed at the outlet 56;
and the wiring groove 58 is arranged on the side wall of the shell 51 and is used for receiving the outgoing line led out from the outlet 56.
As shown in fig. 4 and 7, the electronic device cooling system 1 according to the embodiment of the present invention may further include an outlet 56 disposed on the housing 51, a second brush 57 disposed on the outlet 56, and a wire trough 58 disposed on a side wall of the housing 51. The cabling channel 58 is used for receiving the outgoing line from the outlet 56.
The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same or similar parts among the embodiments are referred to each other.
The principle and the implementation of the present invention are explained in the present application by using specific examples, and the above description of the embodiments is only used to help understanding the technical solution and the core idea of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. An electronic device cooling system, comprising:
each cooling subsystem comprises a loop heat pipe and an immersion device, wherein an evaporation end of the loop heat pipe is connected with a target heating component of the electronic equipment, and a condensation end of the loop heat pipe is connected with the immersion device;
the loop heat pipe is used for transferring the heat of the target heat generating component from the evaporation end to the condensation end;
the immersion device is used for performing immersion condensation operation on the condensation end.
2. The electronic device cooling system according to claim 1, wherein a height of the heat pipe of the condensation end is smaller than a height of the heat pipe of the evaporation end.
3. The electronic device cooling system according to claim 1 or 2, further comprising a cold air sealing device, the cold air sealing device comprising:
a housing;
the beam is arranged in the shell, is provided with a plurality of U positions and is used for supporting and installing each electronic device by utilizing each U position;
and the first blind plate is used for plugging the U position of the beam without the equipment component.
4. The electronic device cooling system according to claim 3, wherein said cold air sealing device further comprises:
the second blind plate is used for plugging a U position of an equipment component installed in the cross beam;
and the first hairbrushes are arranged on the periphery of each equipment part and used for plugging gaps between the second blind plate and each equipment part.
5. The electronic device cooling system according to claim 1, wherein the immersion device comprises a first liquid inlet trunk pipe, a first liquid outlet trunk pipe, a first liquid inlet branch pipe communicated with the first liquid inlet trunk pipe, a first liquid outlet branch pipe communicated with the first liquid outlet trunk pipe, a first regulating valve respectively arranged on the first liquid inlet branch pipe and the first liquid outlet branch pipe, and an immersion tank arranged on top of the first liquid inlet branch pipe and the first liquid outlet branch pipe and communicated with the first liquid inlet branch pipe and the first liquid outlet branch pipe.
6. The electronic device cooling system of claim 5, wherein the immersion device further comprises:
and the first liquid receiving tank is arranged at the bottoms of the first liquid inlet main pipe and the first liquid outlet main pipe.
7. The electronic device cooling system according to claim 3, further comprising:
and a fan opening provided in the housing.
8. The electronic device cooling system of claim 7, wherein the cooling subsystem further comprises a gas-to-liquid heat exchange device comprising:
the second liquid inlet main pipe, the second liquid outlet main pipe, a second liquid inlet branch pipe communicated with the second liquid inlet main pipe, a second liquid outlet branch pipe communicated with the second liquid outlet main pipe, second regulating valves respectively arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, heat exchange fins arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, a flow guide cover covering the heat exchange fins, and a fan arranged between the flow guide cover and the fan opening; and the second liquid inlet branch pipe is communicated with the top of the second liquid outlet branch pipe.
9. The electronic equipment cooling system of claim 8, wherein the gas-to-liquid heat exchange device further comprises:
and the second liquid receiving tank is arranged at the bottoms of the second liquid inlet main pipe and the second liquid outlet main pipe.
10. The electronic device cooling system according to claim 3, further comprising:
the wire outlet is arranged on the shell;
the second brush is arranged at the wire outlet;
and the wiring groove is arranged on the side wall of the shell and is used for receiving the outgoing line led out from the outlet.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010132412.6A CN111405809A (en) | 2020-02-29 | 2020-02-29 | Electronic equipment cooling system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010132412.6A CN111405809A (en) | 2020-02-29 | 2020-02-29 | Electronic equipment cooling system |
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| CN111405809A true CN111405809A (en) | 2020-07-10 |
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Application publication date: 20200710 |