CN111405809A - Electronic equipment cooling system - Google Patents

Abstract

The invention discloses a cooling system of electronic equipment, which comprises at least one group of cooling subsystems, wherein each group of cooling subsystems comprises a loop heat pipe and an immersion device, the evaporation end of the loop heat pipe is connected with a target heating part of the electronic equipment, and the condensation end of the loop heat pipe is connected with the immersion device; a loop heat pipe for transferring heat of a target heat generating component from an evaporation end to a condensation end; and the immersion device is used for carrying out immersion condensation operation on the condensation end. By applying the technical scheme provided by the embodiment of the invention, the requirement on the cooling liquid is greatly reduced, the consumption of the cooling liquid is greatly reduced, and the cost is reduced.

Description

An electronic equipment cooling system

technical field

The invention relates to the technical field of data center cooling, in particular to a cooling system for electronic equipment.

Background technique

With the development of the electronic information industry, the power density of electronic equipment (such as servers and other IT equipment) increases rapidly, but a large amount of heat is generated during the high-speed operation of electronic equipment, which requires heat dissipation.

Most of the existing heat dissipation methods of electronic equipment use the whole electronic equipment immersed in the cooling liquid, and the heating element in the electronic equipment can be in direct contact with the cooling liquid, which greatly improves the heat transfer effect. However, there are many deficiencies in the current fully immersed electronic device cooling method, which makes it unable to be applied on a large scale. First of all, since the electronic equipment is immersed in the cooling liquid as a whole, the materials of the electronic equipment are complex, and it is difficult to ensure that all materials do not chemically react with the cooling liquid, so high requirements are placed on the cooling liquid (insulation, thermal conductivity). , volatile, non-toxic, etc.), the cost of coolant is high. Submerge the entire electronic device in the coolant, and the amount of coolant is huge.

To sum up, how to effectively solve the problems of high requirements on cooling liquid, large amount of cooling liquid and high cost of the existing electronic equipment cooling methods is an urgent problem to be solved by those skilled in the art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to provide a cooling system for electronic equipment, which greatly reduces the requirement for cooling liquid, greatly reduces the amount of cooling liquid, and reduces the cost.

In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:

An electronic equipment cooling system, comprising:

At least one group of cooling subsystems, each group of cooling subsystems includes a loop heat pipe and an immersion device, the evaporative end of the loop heat pipe is connected to the target heat-generating component of the electronic device, and the condensation end of the loop heat pipe is connected to the immersion device connected;

the loop heat pipe, used for transferring the heat of the target heat-generating component from the evaporation end to the condensation end;

The immersion device is used to perform a immersion condensation operation on the condensation end.

In a specific embodiment of the present invention, the height of the heat pipe at the condensation end is smaller than the height of the heat pipe at the evaporation end.

In a specific embodiment of the present invention, a cold air sealing device is also included, and the cold air sealing device includes:

case;

is arranged in the housing, and is deployed with a plurality of U-position beams, which are used to support and install each of the electronic devices by using each of the U-positions;

The first blind plate is used to block the U position in the beam where the equipment components are not installed.

In a specific embodiment of the present invention, the cold air sealing device further includes:

The second blind plate is used to block the U position of the equipment component in the beam;

The first brushes arranged around each of the equipment components are used to block the gap between the second blind plate and each of the equipment components.

In a specific embodiment of the present invention, the immersion device includes a first liquid inlet main pipe, a first liquid outlet main pipe, a first liquid inlet branch pipe communicated with the first liquid inlet main pipe, and a first liquid inlet branch pipe connected to the first liquid inlet main pipe. The first liquid outlet branch pipe communicated with the first liquid outlet main pipe, the first regulating valve respectively arranged on the first liquid inlet branch pipe and the first liquid outlet branch pipe, and the first liquid inlet branch pipe. The immersion tank communicates with the top of the first liquid outlet branch pipe and is connected with the first liquid inlet branch pipe and the first liquid outlet branch pipe.

In a specific embodiment of the present invention, the immersion device further comprises:

The first liquid receiving tank is arranged at the bottom of the first liquid inlet main pipe and the first liquid outlet main pipe.

In a specific embodiment of the present invention, it also includes:

The fan opening is arranged on the casing.

In a specific embodiment of the present invention, the cooling subsystem further includes a gas-liquid heat exchange device, and the gas-liquid heat exchange device includes:

The second liquid inlet main pipe, the second liquid outlet main pipe, the second liquid inlet branch pipe communicated with the second liquid inlet main pipe, the second liquid outlet branch pipe communicated with the second liquid outlet main pipe, The second regulating valve respectively arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, the heat exchange fins arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, the cover is connected to the A shroud outside the heat exchange fins, and a fan disposed between the shroud and the fan opening; wherein the second liquid inlet branch pipe is communicated with the top of the second liquid outlet branch pipe.

In a specific embodiment of the present invention, the gas-liquid heat exchange device further includes:

The second liquid receiving tank is arranged at the bottom of the second liquid inlet main pipe and the second liquid outlet main pipe.

In a specific embodiment of the present invention, it also includes:

a wire outlet arranged on the casing;

a second brush arranged at the outlet;

The wire routing slot arranged on the side wall of the casing is used for receiving the outgoing wire drawn from the wire outlet.

The electronic equipment cooling system provided by the embodiment of the present invention includes: at least one group of cooling subsystems, each group of cooling subsystems includes a loop heat pipe and an immersion device, and the evaporating end of the loop heat pipe is connected to the target heating component of the electronic equipment, The condensing end of the loop heat pipe is connected to the immersion device; the loop heat pipe is used to transfer the heat of the target heating component from the evaporation end to the condensation end; the immersion device is used to perform the immersion condensation operation on the condensing end. By setting up a cooling subsystem including a loop heat pipe and an immersion device, the evaporating end of the loop heat pipe is used to transfer the heat of the target heating component of the electronic equipment to the condensation end, and then the immersion device is used to condense the condensing end, so that the condensation device is The cooling liquid is not in direct contact with the electronic equipment, which greatly reduces the requirements for the cooling liquid. Only the condensation end of the loop heat pipe needs to be cooled. Compared with the existing cooling method of immersing the entire electronic equipment, the The amount of coolant is reduced and the cost is reduced.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative efforts.

1 is a structural block diagram of an electronic equipment cooling system in an embodiment of the present invention;

2 is a structural block diagram of another electronic equipment cooling system in an embodiment of the present invention;

3 is a schematic structural diagram of a loop heat pipe in an embodiment of the present invention;

4 is a schematic structural diagram of a cold air sealing device in an embodiment of the present invention;

5 is a schematic structural diagram of an immersion device in an embodiment of the present invention;

6 is a side view of an immersion device in an embodiment of the present invention;

FIG. 7 is another structural schematic diagram of the cold air sealing device in the embodiment of the present invention;

8 is a schematic structural diagram of a gas-liquid heat exchange device in an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of an electronic device cooling system according to an embodiment of the present invention.

The figures are marked as follows:

1-Electronic equipment cooling system, 2-cooling subsystem, 3-loop heat pipe, 31-evaporating end, 32-condensing end, 4-immersion device, 41-first liquid inlet pipe, 42-first liquid outlet Pipe, 43-first liquid inlet branch pipe, 44-first liquid outlet branch pipe, 45-first regulating valve, 46-immersion tank, 47-first liquid contact tank, 5-cold air sealing device, 51-shell, 52 -beam, 53-first blind plate, 54-second blind plate, 55-fan opening, 56-wire outlet, 57-second brush, 58-wire groove, 6-gas-liquid heat exchange device, 61- The second liquid inlet main pipe, 62- the second liquid outlet main pipe, 63- the second liquid inlet branch pipe, 64- the second liquid outlet branch pipe, 65- the second regulating valve, 66- heat exchange fins, 67- diversion hood, 68-fan, 69-second liquid tank.

Detailed ways

In order to make those skilled in the art better understand the solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

1 and 2, FIG. 1 is a structural block diagram of an electronic equipment cooling system in an embodiment of the present invention, and FIG. 2 is a structural block diagram of another electronic equipment cooling system in an embodiment of the present invention. The electronic equipment cooling system 1 Can include:

At least one group of cooling subsystems 2, each group of cooling subsystems 2 includes a loop heat pipe 3 and an immersion device 4, the evaporation end 31 of the loop heat pipe 3 is connected to the target heating component of the electronic device, and the condensation end 32 of the loop heat pipe 3 is connected to The immersion device 4 is connected;

The loop heat pipe 3 is used to transfer the heat of the target heating element from the evaporation end 31 to the condensation end 32;

The immersion device 4 is used to perform the immersion condensation operation on the condensation end 32 .

As shown in FIG. 1 and FIG. 2 , the electronic device cooling system 1 provided by the embodiment of the present invention may include at least one set of cooling subsystems 2 , wherein FIG. 1 shows that the electronic device cooling system 1 includes only one set of cooling subsystems 2, FIG. 2 shows the situation that the electronic device cooling system 1 includes multiple groups of cooling subsystems 2. Each group of cooling subsystems 2 includes a loop heat pipe 3 and an immersion device 4. The evaporation end 31 of the loop heat pipe 3 is connected to the target heating component of the electronic equipment, and the condensation end 32 of the loop heat pipe 3 is connected to the immersion device 4; 3, for transferring the heat of the target heat-generating component from the evaporation end 31 to the condensation end 32;

Referring to FIG. 3 , a loop heat pipe 3 (Loop Heat Pipe, LHP) refers to a loop closed loop heat pipe. It generally consists of an evaporator, a condenser, a liquid accumulator, and vapor and liquid lines. Its working principle is to apply a thermal load to the evaporator, the working medium evaporates on the outer surface of the evaporator capillary wick, and the generated vapor flows out of the vapor channel into the vapor line, and then enters the condenser to condense into liquid and subcool, and the reflux liquid passes through the liquid line. Entering the liquid main channel to replenish the capillary wick of the evaporator, and so on, and the circulation of the working fluid is driven by the capillary pressure generated by the capillary wick of the evaporator, without external power. Because the condensation section and the evaporation section are separated, the loop heat pipe is widely used in the comprehensive application of energy and the recovery of waste heat.

The target heat-generating component may be a main heat-generating component of an electronic device, such as a CPU of a server, and may of course also include other heat-generating components of the electronic device, which is not limited in this embodiment of the present invention.

Since the condensing end 32 of the loop heat pipe 3 is in direct contact with the immersion device 4, the electronic equipment is not in direct contact with the immersion device 4, and the condensing end 32 has a strong adaptability to liquid, so the cooling liquid contained in the immersion device 4 It can be water, and water is used to perform condensation operation on the condensation end 32 of the loop heat pipe 3, so as to indirectly condense the target heat-generating components of the electronic device. Compared with the existing cooling method that uses expensive cooling liquid to immerse the entire electronic device, the amount of cooling liquid is greatly reduced, and the cost is reduced.

The electronic equipment cooling system provided by the embodiment of the present invention includes: at least one group of cooling subsystems, each group of cooling subsystems includes a loop heat pipe and an immersion device, and the evaporating end of the loop heat pipe is connected to the target heating component of the electronic equipment, The condensing end of the loop heat pipe is connected to the immersion device; the loop heat pipe is used to transfer the heat of the target heating component from the evaporation end to the condensation end; the immersion device is used to perform the immersion condensation operation on the condensing end. By setting up a cooling subsystem including a loop heat pipe and an immersion device, the evaporating end of the loop heat pipe is used to transfer the heat of the target heating component of the electronic equipment to the condensation end, and then the immersion device is used to condense the condensing end, so that the condensation device is The cooling liquid is not in direct contact with the electronic equipment, which greatly reduces the requirements for the cooling liquid. Only the condensation end of the loop heat pipe needs to be cooled. Compared with the existing cooling method of immersing the entire electronic equipment, the The amount of coolant is reduced and the cost is reduced.

In a specific embodiment of the present invention, as shown in FIG. 3 , the height of the heat pipe at the condensation end 32 is smaller than the height of the heat pipe at the evaporation end 31 .

As shown in FIG. 3 , the height of the heat pipe at the condensation end 32 can be set to be smaller than the height of the heat pipe at the evaporation end 31 . By making the heat pipe height h at the top of the condensation end 32 of the loop heat pipe 3 as small as possible, the work done by the loop heat pipe 3 against gravity is small, thereby improving the overall efficiency.

In a specific embodiment of the present invention, as shown in FIG. 4 , the electronic equipment cooling system 1 may further include a cold air sealing device 5, and the cold air sealing device 5 includes:

shell 51;

Disposed in the housing 51, a plurality of U-position beams 52 are deployed, and are used to support and install each electronic device by using each U-position;

The first blind plate 53 is used to block the U position in the beam 52 where no equipment components are installed.

As shown in FIG. 4 , the electronic device cooling system 1 provided in the embodiment of the present invention may further include a cold air sealing device 5 , and the cold air sealing device 5 may include a casing 51 , and may also include a beam 52 disposed in the casing 51 . The beam 52 is arranged with a plurality of U positions, and each of the U positions is used to support and install each electronic device. It can also include a first blind plate 53 for blocking the U position in the beam 52 where no equipment components are installed, so that the cold air can only flow out through the electronic equipment, so as to prevent waste of cold energy.

In a specific embodiment of the present invention, as shown in FIG. 4 , the cold air sealing device 5 may further include:

The second blind plate 54 is used to block the U position in the beam 52 where the equipment components are installed;

The first brushes arranged around each equipment part are used to block the gap between the second blind plate 54 and each equipment part.

As shown in FIG. 4 , the cold air sealing device 5 may further include a second blind plate 54 for blocking the U position in the beam 52 where the equipment parts are installed, and a second blind plate 54 arranged around each equipment part for sealing the second blind plate 54 and the first brush for sealing the gap between each equipment component. The cold air can only flow out through the electronic equipment, further preventing the waste of cold energy.

In a specific embodiment of the present invention, as shown in FIG. 5 , the immersion device 4 includes a first liquid inlet main pipe 41 , a first liquid outlet main pipe 42 , and a first liquid inlet main pipe 41 that communicates with the first liquid inlet main pipe 41 . The liquid inlet branch pipe 43, the first liquid outlet branch pipe 44 communicated with the first liquid outlet main pipe 42, the first regulating valve 45 respectively provided in the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, and the A liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 are connected to the top of the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 and communicate with the immersion tank 46 .

As shown in FIG. 5 , the immersion device 4 in each group of cooling subsystems 2 may include a first liquid inlet main pipe 41 , a first liquid outlet main pipe 42 , and a first liquid inlet communicated with the first liquid inlet main pipe 41 . The branch pipe 43, the first liquid outlet branch pipe 44 communicated with the first liquid outlet main pipe 42, the first regulating valve 45 respectively disposed in the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44, and the first liquid inlet branch pipe 45. The tops of the liquid branch pipe 43 and the first liquid outlet branch pipe 44 are connected to the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 and communicate with the immersion tank 46 . The immersion device 4 can be arranged on one or both sides of the outer side of the top of the casing 51, the first liquid inlet branch pipe 43 and the first liquid outlet branch pipe 44 are arranged in pairs, and the immersion tank 46 is arranged on the top of the two, and the first liquid inlet branch pipe 43 is arranged on the top. The liquid branch pipe 43 and the first liquid outlet branch pipe 44 are both provided with a first regulating valve 45 , and the liquid level and liquid flow in the immersion tank 46 can be adjusted by the first regulating valve 45 . The first liquid inlet branch pipe 43 , the first liquid outlet branch pipe 44 , the immersion tank 46 , and the first regulating valve 45 are connected to form a group of immersion devices 4 . The immersion devices 4 are independent of each other and can be independently adjusted to meet the cooling requirements of different heat-generating components in different electronic devices.

In a specific embodiment of the present invention, as shown in FIG. 5 , the immersion device 4 may further include:

The first liquid receiving tank 47 is arranged at the bottom of the first liquid inlet main pipe 41 and the first liquid outlet main pipe 42 .

As shown in FIG. 5 , the immersion device 4 provided in the embodiment of the present invention may further include a first liquid receiving tank 47 disposed at the bottom of the first liquid inlet main pipe 41 and the first liquid outlet main pipe 42 . The first liquid inlet main pipe 41 and the first liquid outlet main pipe 42 are arranged side by side in the liquid receiving tank. The first liquid receiving tank 47 is used to receive the first liquid inlet main pipe 41 , the first liquid outlet main pipe 42 , the first liquid inlet branch pipe 43 , the first liquid outlet branch pipe 44 , the first regulating valve 45 , and the surface of the immersion tank 46 . Condensation and possible leaks. Referring to FIG. 6, FIG. 6 is a side view of an immersion device 4 in an embodiment of the present invention.

In a specific embodiment of the present invention, as shown in FIG. 7 , the electronic device cooling system 1 may further include:

The fan 68 provided in the casing 51 has an opening 55 .

As shown in FIG. 7 , the electronic device cooling system 1 provided by the embodiment of the present invention may further include a fan 68 opening 55 disposed in the casing 51 for installing a heat exchange fan 68 .

In a specific embodiment of the present invention, as shown in FIG. 8 , the cooling subsystem 2 further includes a gas-liquid heat exchange device 6, and the gas-liquid heat exchange device 6 includes:

The second liquid inlet main pipe 61 , the second liquid outlet main pipe 62 , the second liquid inlet branch pipe 63 communicated with the second liquid inlet main pipe 61 , and the second liquid outlet branch pipe communicated with the second liquid outlet main pipe 62 64. The second regulating valve 65 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 respectively, the heat exchange fins 66 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64, the cover connected to the The shroud 67 outside the heat exchange fins 66 and the fan 68 disposed between the shroud 67 and the opening 55 of the fan 68; wherein the top of the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 are connected.

As shown in FIG. 8 , the cooling subsystem 2 further includes a gas-liquid heat exchange device 6 . The gas-liquid heat exchange device 6 includes a second liquid inlet main pipe 61 , a second liquid outlet main pipe 62 , a second liquid inlet branch pipe 63 connected with the second liquid inlet main pipe 61 , and a second liquid outlet main pipe 62 . The second liquid outlet branch pipe 64 connected to the second liquid outlet pipe 64, the second regulating valve 65 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 respectively, and the heat exchange provided in the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 The fins 66, the shroud 67 covering the outside of the heat exchange fins 66, the fan 68 arranged between the shroud 67 and the opening 55 of the fan 68; wherein, the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 connected at the top. The specific heat exchange mode of the gas-liquid heat exchange device 6 may be an air-cold water heat exchange mode, and the gas-liquid heat exchange device 6 may be arranged on one or both sides of the outer side of the bottom of the casing 51 . The second regulating valve 65 is used to regulate the water flow in the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 . The tops of the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 are connected to form a sub-circuit. The heat exchange fins 66 arranged on the second liquid inlet branch pipe 63 and the second liquid outlet branch pipe 64 are used for exchanging heat with the air flowing therethrough and cooling the air. A shroud 67 is provided outside the heat exchange fins 66, and the shroud 67 cooperates with the opening 55 of the fan 68, so that all the heat-exchanged air can be introduced into the casing 51 to other evaporating ends 31 of the electronic equipment that are not connected to the annular heat pipe. components to cool down. The connected second liquid inlet branch pipe 63, second liquid outlet branch pipe 64, second regulating valve 65, fan 68, shroud 67, and heat exchange fins 66 form a gas-liquid heat exchange device 6, and each electronic equipment cooling system 1 may contain a plurality of gas-liquid heat exchange devices 6, and each gas-liquid heat exchange device 6 is independent of each other and can be adjusted independently.

In a specific embodiment of the present invention, as shown in FIG. 8 , the gas-liquid heat exchange device 6 further includes:

The second liquid receiving tank 69 is arranged at the bottom of the second liquid inlet main pipe 61 and the second liquid outlet main pipe 62 .

As shown in FIG. 8 , the gas-liquid heat exchange device 6 may further include a second liquid receiving tank 69 disposed at the bottom of the second liquid inlet main pipe 61 and the second liquid outlet main pipe 62 . The second liquid inlet main pipe 61 and the second liquid outlet main pipe 62 are arranged side by side in the second water receiving tank. The second liquid receiving tank 69 is used to receive the condensed water that may be generated on the surface of the second liquid inlet main pipe 61 , the second liquid outlet main pipe 62 , the second liquid inlet branch pipe 63 , the second liquid outlet branch pipe 64 and the second regulating valve 65 . and possible leaks. As shown in FIG. 9 , FIG. 9 is a schematic structural diagram of an electronic device cooling system 1 in an embodiment of the present invention.

In a specific embodiment of the present invention, as shown in FIG. 4 and FIG. 7 , the electronic device cooling system 1 may further include:

The wire outlet 56 arranged on the casing 51;

the second brush 57 arranged at the outlet 56;

The wire routing slot 58 disposed on the side wall of the housing 51 is used to receive the outgoing wire drawn from the wire outlet 56 .

As shown in FIG. 4 and FIG. 7 , the electronic device cooling system 1 provided in the embodiment of the present invention may further include a wire outlet 56 provided on the housing 51 , a second brush 57 provided on the wire outlet 56 , and a wire outlet 57 provided on the housing 51 . The wiring slot 58 on the side wall of the body 51 . The wire routing slot 58 is used to receive the outgoing wire drawn from the wire outlet 56 .

The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments may be referred to each other.

The principles and implementations of the present invention are described herein by using specific examples, and the descriptions of the above embodiments are only used to help understand the technical solutions and core ideas of the present invention. It should be pointed out that for those skilled in the art, without departing from the principle of the present invention, several improvements and modifications can also be made to the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims (10)

1. An electronic device cooling system, comprising:

each cooling subsystem comprises a loop heat pipe and an immersion device, wherein an evaporation end of the loop heat pipe is connected with a target heating component of the electronic equipment, and a condensation end of the loop heat pipe is connected with the immersion device;

the loop heat pipe is used for transferring the heat of the target heat generating component from the evaporation end to the condensation end;

the immersion device is used for performing immersion condensation operation on the condensation end.

2. The electronic device cooling system according to claim 1, wherein a height of the heat pipe of the condensation end is smaller than a height of the heat pipe of the evaporation end.

3. The electronic device cooling system according to claim 1 or 2, further comprising a cold air sealing device, the cold air sealing device comprising:

a housing;

the beam is arranged in the shell, is provided with a plurality of U positions and is used for supporting and installing each electronic device by utilizing each U position;

and the first blind plate is used for plugging the U position of the beam without the equipment component.

4. The electronic device cooling system according to claim 3, wherein said cold air sealing device further comprises:

the second blind plate is used for plugging a U position of an equipment component installed in the cross beam;

and the first hairbrushes are arranged on the periphery of each equipment part and used for plugging gaps between the second blind plate and each equipment part.

5. The electronic device cooling system according to claim 1, wherein the immersion device comprises a first liquid inlet trunk pipe, a first liquid outlet trunk pipe, a first liquid inlet branch pipe communicated with the first liquid inlet trunk pipe, a first liquid outlet branch pipe communicated with the first liquid outlet trunk pipe, a first regulating valve respectively arranged on the first liquid inlet branch pipe and the first liquid outlet branch pipe, and an immersion tank arranged on top of the first liquid inlet branch pipe and the first liquid outlet branch pipe and communicated with the first liquid inlet branch pipe and the first liquid outlet branch pipe.

6. The electronic device cooling system of claim 5, wherein the immersion device further comprises:

and the first liquid receiving tank is arranged at the bottoms of the first liquid inlet main pipe and the first liquid outlet main pipe.

7. The electronic device cooling system according to claim 3, further comprising:

and a fan opening provided in the housing.

8. The electronic device cooling system of claim 7, wherein the cooling subsystem further comprises a gas-to-liquid heat exchange device comprising:

the second liquid inlet main pipe, the second liquid outlet main pipe, a second liquid inlet branch pipe communicated with the second liquid inlet main pipe, a second liquid outlet branch pipe communicated with the second liquid outlet main pipe, second regulating valves respectively arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, heat exchange fins arranged on the second liquid inlet branch pipe and the second liquid outlet branch pipe, a flow guide cover covering the heat exchange fins, and a fan arranged between the flow guide cover and the fan opening; and the second liquid inlet branch pipe is communicated with the top of the second liquid outlet branch pipe.

9. The electronic equipment cooling system of claim 8, wherein the gas-to-liquid heat exchange device further comprises:

and the second liquid receiving tank is arranged at the bottoms of the second liquid inlet main pipe and the second liquid outlet main pipe.

10. The electronic device cooling system according to claim 3, further comprising:

the wire outlet is arranged on the shell;

the second brush is arranged at the wire outlet;

and the wiring groove is arranged on the side wall of the shell and is used for receiving the outgoing line led out from the outlet.

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