CN111403595A - Preparation method of piezoelectric ceramic multi-actuating wall structure - Google Patents
Preparation method of piezoelectric ceramic multi-actuating wall structure Download PDFInfo
- Publication number
- CN111403595A CN111403595A CN202010289906.5A CN202010289906A CN111403595A CN 111403595 A CN111403595 A CN 111403595A CN 202010289906 A CN202010289906 A CN 202010289906A CN 111403595 A CN111403595 A CN 111403595A
- Authority
- CN
- China
- Prior art keywords
- piezoelectric ceramic
- wall structure
- ceramic piece
- actuating
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
Abstract
The invention provides a preparation method of a piezoelectric ceramic multi-actuating wall structure. The method comprises the following steps: processing the piezoelectric ceramic piece by adopting a polarization process to obtain the piezoelectric ceramic piece after polarization processing; processing the piezoelectric ceramic piece after polarization treatment by adopting a cutting process to obtain the piezoelectric ceramic piece with a multi-actuating-wall structure; processing the piezoelectric ceramic piece with the multi-actuating-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic piece after secondary polarization treatment; forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic piece after the secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic piece with the electrodes; and welding a welding wire in the welding wire groove of the piezoelectric ceramic piece with the electrode by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuating wall structure. The invention solves the problems that when the piezoelectric ceramic multi-actuating-wall structure is processed, the piezoelectric property is damaged, the electrode is easy to fall off, and the lead is difficult to be led out due to small groove width.
Description
Technical Field
The invention relates to the technical field of piezoelectric ceramic elements, in particular to a preparation method of a piezoelectric ceramic multi-actuating wall structure.
Background
The driving safety is always the most important index in the automobile development process of an automobile host factory, and the tire pressure of an automobile tire is an important part for ensuring the safety of the automobile in the driving process. The tire pressure monitoring system is used as an active safety defense system of a vehicle, and can effectively improve the driving safety. In the tire pressure monitoring system, the passive tire pressure monitoring system has no battery, and has good promotion significance for improving the service efficiency, the service cycle and the like of the system, so that the passive tire pressure monitoring system formed by utilizing the piezoelectric property of piezoelectric ceramics becomes the mainstream; however, most of the existing preparation processes for piezoelectric ceramics do not solve the problem that the piezoelectric ceramics are affected by heat generated during cutting of the piezoelectric ceramics.
Disclosure of Invention
The invention provides a preparation method of a piezoelectric ceramic multi-actuating wall structure, which is used for solving the problem that heat generated during cutting influences piezoelectric characteristics of piezoelectric ceramic.
Processing the piezoelectric ceramic piece by adopting a polarization process to obtain the piezoelectric ceramic piece after polarization processing;
processing the piezoelectric ceramic sheet after polarization treatment by adopting a cutting process to obtain the piezoelectric ceramic sheet with a multi-actuating wall structure, wherein the multi-actuating wall structure comprises a plurality of strip-shaped actuating walls which are distributed at intervals, a strip-shaped groove is formed between every two adjacent actuating walls, and the strip-shaped groove comprises a communicated deep groove and a welding line groove;
processing the piezoelectric ceramic piece with the multi-actuating-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic piece after secondary polarization treatment;
forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic piece after the secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic piece with the electrodes;
and welding a welding wire in the welding wire groove of the piezoelectric ceramic piece with the electrode by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuating wall structure.
Optionally, the polarization process includes: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece corresponding to the thickness direction of the piezoelectric ceramic piece by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of the piezoelectric ceramic piece coated with the electrode, then placing the piezoelectric ceramic piece coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by water.
Optionally, the cutting process includes: cutting the upper surface of the polarized piezoelectric ceramic sheet by a cutter with the thickness of 60-80 microns in a grinding mode, forming a multi-actuating wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuating wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the used cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the used cutter.
Optionally, the secondary polarization process includes: coating an electrode and polarizing;
the secondary polarization process comprises the following steps: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece with the multi-actuating-wall structure in the thickness direction by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of a piezoelectric ceramic piece coated with an electrode, wherein the top end of each actuating wall of the multi-actuating-wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic piece coated with the electrode in silicon oil heated to 100 plus material temperature of 200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by water.
Optionally, the electrode plating process includes: fixing the piezoelectric ceramic plate after secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuating-wall structure and in the welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic plate by 180 degrees, and plating metal on the other side of the multi-actuating-wall structure and in the welding wire groove by using the evaporation method; and polishing off the electrodes on the upper surface and the lower surface of the piezoelectric ceramic sheet to form a complete multi-actuating-wall structure.
Optionally, the wire bonding process includes: and placing a wire with the diameter smaller than that of the welding wire groove in the welding wire groove, heating to 150 DEG and 250 DEG, and completing the welding wire process after the wire is completely and reliably mechanically and electrically connected with the electrode.
Optionally, a tinned copper wire is selected as a lead for connecting the electrode and the driving power supply, and the lead is connected with the electrode through high-temperature tin melting.
In the embodiment of the invention, the problems that the piezoelectric property is damaged due to small groove width of the piezoelectric ceramic multi-actuating wall structure and heat generated during mechanical processing, the electrode is easy to fall off and a lead is difficult to lead out due to small groove width are solved, the cutting process, the polarization process and the wire bonding process are improved, and the piezoelectric ceramic multi-actuating wall structure with complete piezoelectric property is prepared.
Drawings
FIG. 1 is a flow chart of a process for fabricating a piezoceramic multi-actuation wall structure according to an embodiment of the present invention;
FIG. 2 is a logic diagram of a functional interface of a method for fabricating a piezoceramic multi-actuation wall structure according to an embodiment of the present invention;
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a method for manufacturing a piezoelectric ceramic multi-actuation wall structure, including the following steps:
step 11: processing the piezoelectric ceramic piece by adopting a polarization process to obtain the piezoelectric ceramic piece after polarization processing;
step 12: processing the piezoelectric ceramic piece after polarization treatment by adopting a cutting process to obtain the piezoelectric ceramic piece with a multi-actuating-wall structure;
step 13: processing the piezoelectric ceramic piece with the multi-actuating-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic piece after secondary polarization treatment;
step 14: forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic piece after the secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic piece with the electrodes;
step 15: and welding a welding wire in the welding wire groove of the piezoelectric ceramic piece with the electrode by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuating wall structure.
In the embodiment of the invention, the piezoelectric property lost by the piezoelectric ceramic piece in the cutting process is repaired by adding the secondary polarization process, and the problem that the piezoelectric property of the piezoelectric ceramic piece is influenced by heat generated in the cutting process is solved, so that the piezoelectric ceramic multi-actuating-wall structure with complete piezoelectric property is prepared.
Referring to fig. 2, an embodiment of the invention provides a method for manufacturing a piezoelectric ceramic multi-actuation wall structure, including the following steps:
step (a): a poling process, the poling process comprising: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece corresponding to the thickness direction of the piezoelectric ceramic piece by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of a piezoelectric ceramic piece coated with an electrode, then placing the piezoelectric ceramic piece coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by water;
in the embodiment of the invention, optionally, the piezoelectric ceramic plate coated with the electrode is placed in silicone oil heated to 130 ℃;
in the embodiment of the invention, the direct-current power supply can optionally output a high-voltage direct-current electric field of 1 kV/mm.
Step (b): a cutting process, the cutting process comprising: cutting the upper surface of the polarized piezoelectric ceramic sheet by a cutter with the thickness of 60-80 microns in a grinding mode, forming a multi-actuating wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuating wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the used cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the used cutter;
in the embodiment of the invention, a cutter with the thickness of 70 μm is optionally adopted;
in the embodiment of the invention, optionally, the depth of the deep groove is 400 μm, the length is 9.5mm, and the width is 70 μm;
in the embodiment of the invention, optionally, the depth of the welding wire groove is 70 μm, the length is 2.5mm, and the width is 70 μm.
In the embodiment of the invention, the ultra-precise cutter with the same thickness as the required groove width is selected and processed in a high-speed grinding mode, so that the rapid forming of the multi-actuating-wall structure is easier.
Step (c): the secondary polarization process comprises the following steps: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece with the multi-actuating-wall structure in the thickness direction by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of a piezoelectric ceramic piece coated with an electrode, wherein the top end of each actuating wall of the multi-actuating-wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic piece coated with the electrode in silicon oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by using water;
in the embodiment of the invention, optionally, the piezoelectric ceramic plate coated with the electrode is placed in silicone oil heated to 130 ℃;
in the embodiment of the invention, the direct-current power supply can optionally output a high-voltage direct-current electric field of 1 kV/mm.
In the embodiment of the invention, the problem that the piezoelectric property of the piezoelectric ceramic sheet is damaged if the temperature exceeds the Curie of the piezoelectric ceramic sheet in the using and processing processes is considered, the secondary polarization process is carried out on the cut multi-actuating-wall structure, the piezoelectric property of the piezoelectric ceramic sheet lost in the cutting process is repaired, and the multi-actuating-wall structure with the complete piezoelectric property is formed.
Step (d): the electrode plating process comprises the following steps: fixing the piezoelectric ceramic plate after secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuating-wall structure and in the welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic plate by 180 degrees, and plating metal on the other side of the multi-actuating-wall structure and in the welding wire groove by using the evaporation method; and polishing off the electrodes on the upper surface and the lower surface of the piezoelectric ceramic sheet to form a complete multi-actuating-wall structure.
In the embodiment of the invention, copper with the thickness of 100nm is plated on one side of the multi-actuating wall structure and in the welding wire groove by using an evaporation method.
A step (e): the wire bonding process comprises the following steps: placing a wire with a diameter smaller than that of the welding wire groove in the welding wire groove, heating to 150 DEG and 250 DEG, and completing the welding wire process after the wire is completely and reliably electrically connected with the electrode;
in the embodiment of the present invention, optionally, a wire with a diameter smaller than that of the wire bonding groove is placed in the wire bonding groove and heated to 200 °.
In the embodiment of the invention, optionally, a tinned copper wire is used as a lead for connecting the electrode and a driving power supply, and the lead is connected with the electrode through high-temperature molten tin;
in the embodiment of the invention, optionally, the diameter of the tinned copper wire is 0.05 nm.
In the embodiment of the invention, the problems that the evaporated electrode is easy to fall off and the groove width is small and difficult to lead are considered, and the tinned copper wire with the diameter smaller than the groove width is selected as the wire for connecting the electrode and the driving power supply, and the high-temperature tin melting ensures that the copper wire in the wire is reliably and mechanically and electrically connected with the electrode, so that the lead is ensured and the evaporated electrode can be prevented from falling off.
In the embodiment of the invention, the problems that the groove width of the piezoelectric ceramic multi-actuating wall structure is small, the piezoelectric property is damaged due to heat generation during mechanical processing, the electrode is easy to fall off and the lead is difficult to lead out due to the small groove width are solved by improving the cutting process, the polarization process and the wire bonding process, and the piezoelectric ceramic multi-actuating wall structure with complete piezoelectric property is prepared.
While the present invention has been described with reference to the embodiments shown in the drawings, the present invention is not limited to the embodiments, which are illustrative and not restrictive, and it will be apparent to those skilled in the art that various changes and modifications can be made therein without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (7)
1. A method for preparing a piezoelectric ceramic multi-actuating wall structure is characterized by comprising the following steps,
processing the piezoelectric ceramic piece by adopting a polarization process to obtain the piezoelectric ceramic piece after polarization processing;
processing the piezoelectric ceramic sheet after polarization treatment by adopting a cutting process to obtain the piezoelectric ceramic sheet with a multi-actuating wall structure, wherein the multi-actuating wall structure comprises a plurality of strip-shaped actuating walls which are distributed at intervals, a strip-shaped groove is formed between every two adjacent actuating walls, and the strip-shaped groove comprises a communicated deep groove and a welding line groove;
processing the piezoelectric ceramic piece with the multi-actuating-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic piece after secondary polarization treatment;
forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic piece after the secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic piece with the electrodes;
and welding a welding wire in the welding wire groove of the piezoelectric ceramic piece with the electrode by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuating wall structure.
2. The method for preparing a piezoceramic multi-actuation wall structure according to claim 1,
the polarization process comprises the following steps: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece corresponding to the thickness direction of the piezoelectric ceramic piece by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of the piezoelectric ceramic piece coated with the electrode, then placing the piezoelectric ceramic piece coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by water.
3. The method for preparing a piezoceramic multi-actuation wall structure according to claim 1,
the cutting process comprises the following steps: cutting the upper surface of the polarized piezoelectric ceramic sheet by a cutter with the thickness of 60-80 microns in a grinding mode, forming a multi-actuating wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuating wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the used cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the used cutter.
4. The method for preparing a piezoceramic multi-actuation wall structure according to claim 1,
the secondary polarization process comprises the following steps: coating an electrode and polarizing;
wherein the electrode coating process comprises: coating electrodes on the upper and lower surfaces of the piezoelectric ceramic piece with the multi-actuating-wall structure in the thickness direction by using a coating rod, and then carrying out sintering and infiltrating treatment on the piezoelectric ceramic piece coated with the electrodes;
the polarization process comprises the following steps: respectively clamping positive and negative poles of a direct current power supply on the upper and lower surfaces of a piezoelectric ceramic piece coated with an electrode, wherein the top end of each actuating wall of the multi-actuating-wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic piece coated with the electrode in silicon oil heated to 100 plus material temperature of 200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic piece after 1-10 hours, and washing and drying the piezoelectric ceramic piece by water.
5. The method for preparing a piezoceramic multi-actuation wall structure according to claim 1,
the electrode plating process comprises the following steps: fixing the piezoelectric ceramic plate after secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuating-wall structure and in the welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic plate by 180 degrees, and plating metal on the other side of the multi-actuating-wall structure and in the welding wire groove by using the evaporation method; and polishing off the electrodes on the upper surface and the lower surface of the piezoelectric ceramic sheet to form a complete multi-actuating-wall structure.
6. The method for preparing a piezoceramic multi-actuation wall structure according to claim 1,
the wire bonding process comprises the following steps: and placing a wire with the diameter smaller than that of the welding wire groove in the welding wire groove, heating to 150 DEG and 250 DEG, and completing the welding wire process after the wire is completely and reliably mechanically and electrically connected with the electrode.
7. The method for preparing a piezoceramic multi-actuation wall structure according to claim 6,
and selecting a tinned copper wire as a lead for connecting the electrode and a driving power supply, and connecting the lead with the electrode through high-temperature tin melting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289906.5A CN111403595B (en) | 2020-04-14 | 2020-04-14 | Preparation method of piezoelectric ceramic multi-actuation wall structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010289906.5A CN111403595B (en) | 2020-04-14 | 2020-04-14 | Preparation method of piezoelectric ceramic multi-actuation wall structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111403595A true CN111403595A (en) | 2020-07-10 |
| CN111403595B CN111403595B (en) | 2023-09-26 |
Family
ID=71431568
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010289906.5A Active CN111403595B (en) | 2020-04-14 | 2020-04-14 | Preparation method of piezoelectric ceramic multi-actuation wall structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111403595B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900246A (en) * | 2020-08-06 | 2020-11-06 | 清华大学 | Polarization method of lithium-sodium niobate-based leadless piezoelectric ceramic |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1299319A (en) * | 1998-03-11 | 2001-06-13 | 萨尔技术有限公司 | Droplet deposition apparatus and method of mfg. same |
| CN1333719A (en) * | 1998-11-14 | 2002-01-30 | 萨尔技术有限公司 | Droplet deposition apparatus |
| JP2007281439A (en) * | 2006-03-17 | 2007-10-25 | Ngk Insulators Ltd | Piezoelectric ceramics and manufacturing method thereof |
| CN101255265A (en) * | 2008-04-11 | 2008-09-03 | 清华大学 | Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same |
| CN101538144A (en) * | 2009-04-14 | 2009-09-23 | 济南大学 | 2-2 type cement base piezoelectric composite material |
| CN101891472A (en) * | 2009-05-21 | 2010-11-24 | 中国科学院上海硅酸盐研究所 | Perovskite structure high curie temperature leadless piezoelectric ceramal and production method thereof |
-
2020
- 2020-04-14 CN CN202010289906.5A patent/CN111403595B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1299319A (en) * | 1998-03-11 | 2001-06-13 | 萨尔技术有限公司 | Droplet deposition apparatus and method of mfg. same |
| CN1333719A (en) * | 1998-11-14 | 2002-01-30 | 萨尔技术有限公司 | Droplet deposition apparatus |
| JP2007281439A (en) * | 2006-03-17 | 2007-10-25 | Ngk Insulators Ltd | Piezoelectric ceramics and manufacturing method thereof |
| CN101255265A (en) * | 2008-04-11 | 2008-09-03 | 清华大学 | Leadless piezoelectric ceramics/polymer 1-3 structure composite material and method for processing same |
| CN101538144A (en) * | 2009-04-14 | 2009-09-23 | 济南大学 | 2-2 type cement base piezoelectric composite material |
| CN101891472A (en) * | 2009-05-21 | 2010-11-24 | 中国科学院上海硅酸盐研究所 | Perovskite structure high curie temperature leadless piezoelectric ceramal and production method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111900246A (en) * | 2020-08-06 | 2020-11-06 | 清华大学 | Polarization method of lithium-sodium niobate-based leadless piezoelectric ceramic |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111403595B (en) | 2023-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5053380B2 (en) | Solar panel | |
| US9640676B2 (en) | Methods and structures for improving the structural integrity of solar cells | |
| WO2002075816A1 (en) | Solar cell and its manufacturing method | |
| CN110004472A (en) | The method of contact structures is formed on the solar cell | |
| CN101681952A (en) | Method for the production of a solar cell and solar cell produced using said method | |
| KR101159697B1 (en) | Fabrication method of invasive microelectode based on glass wafer | |
| CN105934828B (en) | The manufacture method of solar battery cell and solar battery cell | |
| WO2011161813A1 (en) | Solar cell and method for manufacturing same | |
| CN101777606A (en) | Crystalline silicon solar battery selective diffusion process | |
| CN111403595A (en) | Preparation method of piezoelectric ceramic multi-actuating wall structure | |
| JP2017011190A (en) | Solar battery manufacturing method and solar battery | |
| TWI777959B (en) | Solar cell and method of making the same | |
| JP2011258813A (en) | Firing furnace for electrode calcination of solar cell element, manufacturing method of solar cell element, and solar cell element | |
| CN103125027B (en) | Solar module | |
| JP2009135303A (en) | Solar cell module and method of manufacturing solar cell module | |
| JP2008205398A (en) | Photoelectric conversion device and its manufacturing method | |
| CN102122681A (en) | Method for connecting solar battery sheets | |
| KR101193021B1 (en) | Solar cell having dot type electrode and manufacturing method of the same | |
| JP5349523B2 (en) | Manufacturing method of solar cell | |
| JP2002353475A (en) | Solar battery element | |
| CN105742375A (en) | Back contact crystal silicon battery and preparation method thereof | |
| CN205406504U (en) | Static chuck device of graphite alkene electrode | |
| JP3188070B2 (en) | Thermoelectric generation module | |
| WO2013143350A1 (en) | Solar cell, module and method for manufacturing solar cell electrode | |
| CN110854042A (en) | Solar cell splitting method and system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |