CN111403595B - Preparation method of piezoelectric ceramic multi-actuation wall structure - Google Patents
Preparation method of piezoelectric ceramic multi-actuation wall structure Download PDFInfo
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- CN111403595B CN111403595B CN202010289906.5A CN202010289906A CN111403595B CN 111403595 B CN111403595 B CN 111403595B CN 202010289906 A CN202010289906 A CN 202010289906A CN 111403595 B CN111403595 B CN 111403595B
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- 239000000919 ceramic Substances 0.000 title claims abstract description 119
- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 claims abstract description 67
- 230000010287 polarization Effects 0.000 claims abstract description 52
- 238000003466 welding Methods 0.000 claims abstract description 36
- 238000005520 cutting process Methods 0.000 claims abstract description 18
- 238000007747 plating Methods 0.000 claims abstract description 13
- 238000000576 coating method Methods 0.000 claims description 25
- 239000011248 coating agent Substances 0.000 claims description 19
- 230000005684 electric field Effects 0.000 claims description 8
- 229920002545 silicone oil Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 7
- 238000000227 grinding Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 230000008595 infiltration Effects 0.000 claims description 6
- 238000001764 infiltration Methods 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 6
- 238000012544 monitoring process Methods 0.000 description 4
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
- H10N30/085—Shaping or machining of piezoelectric or electrostrictive bodies by machining
- H10N30/088—Shaping or machining of piezoelectric or electrostrictive bodies by machining by cutting or dicing
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Abstract
The invention provides a preparation method of a piezoelectric ceramic multi-actuation wall structure. The method comprises the following steps: processing the piezoelectric ceramic sheet by adopting a polarization process to obtain a piezoelectric ceramic sheet after polarization processing; processing the piezoelectric ceramic sheet subjected to polarization treatment by adopting a cutting process to obtain a piezoelectric ceramic sheet with a multi-actuation-wall structure; processing the piezoelectric ceramic sheet with the multi-actuation-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic sheet subjected to secondary polarization processing; forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic sheet subjected to secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic sheet with the electrodes; and welding the welding wires in the welding wire grooves of the piezoelectric ceramic plates with the electrodes by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuation-wall structure. The invention solves the problems that the piezoelectric characteristics are damaged, the electrode is easy to fall off and the lead is difficult to be led out due to small groove width when the piezoelectric ceramic multi-actuation-wall structure is processed.
Description
Technical Field
The invention relates to the technical field of piezoelectric ceramic elements, in particular to a preparation method of a piezoelectric ceramic multi-actuation-wall structure.
Background
The driving safety is always the most important index of an automobile host factory in the automobile development process, and the tire pressure of an automobile tire is an important ring for ensuring the safety of the automobile in the driving process. The tire pressure monitoring system is used as an active safety defense system of the vehicle, and can effectively improve the driving safety. Among tire pressure monitoring systems, passive tire pressure monitoring systems have good promotion significance for improving the service efficiency, the service period and the like of the system because of no battery, so that passive tire pressure monitoring systems formed by utilizing the piezoelectric characteristics of piezoelectric ceramics have become mainstream; however, most of the existing preparation processes for piezoelectric ceramics do not solve the problem that heat generated when cutting the piezoelectric ceramics affects the piezoelectric ceramics well.
Disclosure of Invention
The invention provides a preparation method of a piezoelectric ceramic multi-actuation wall structure, which is used for solving the problem that the piezoelectric characteristics of piezoelectric ceramics are affected by heat generated during cutting.
Processing the piezoelectric ceramic sheet by adopting a polarization process to obtain a piezoelectric ceramic sheet after polarization processing;
processing the piezoelectric ceramic sheet subjected to polarization treatment by adopting a cutting process to obtain a piezoelectric ceramic sheet with a multi-actuation-wall structure, wherein the multi-actuation-wall structure comprises a plurality of strip-shaped actuation walls which are distributed at intervals, strip-shaped grooves are formed between every two adjacent actuation walls, and each strip-shaped groove comprises a deep communicating groove and a welding groove;
processing the piezoelectric ceramic sheet with the multi-actuation-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic sheet subjected to secondary polarization processing;
forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic sheet subjected to secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic sheet with the electrodes;
and welding the welding wires in the welding wire grooves of the piezoelectric ceramic plates with the electrodes by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuation-wall structure.
Optionally, the polarization process includes: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with the electrode, placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and cleaning and drying the piezoelectric ceramic plate with water.
Optionally, the cutting process includes: cutting the upper surface of the polarized piezoelectric ceramic sheet by adopting a cutter with the thickness of 60-80 mu m in a grinding way, and forming a multi-actuation wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuation wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each strip-shaped groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the cutter.
Optionally, the secondary polarization process includes: a coating electrode process and a polarization process;
the secondary polarization process includes: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet with the multi-actuation-wall structure by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with an electrode, wherein the top end of each actuating wall of the multi-actuating wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and cleaning and drying the piezoelectric ceramic plate by water.
Optionally, the electrode plating process includes: firstly, fixing the piezoelectric ceramic sheet subjected to secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuation-wall structure and in a welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic sheet by 180 degrees, and plating metal on the other side of the multi-actuation-wall structure and in the welding wire groove by using the evaporation method; and grinding electrodes on the upper surface and the lower surface of the piezoelectric ceramic plate to form a complete multi-actuation wall structure.
Optionally, the wire bonding process includes: and placing a wire with the diameter smaller than that of the wire bonding groove in the wire bonding groove, heating to 150-250 degrees, and completing the wire bonding process after the wire is completely and reliably and mechanically electrically connected with the electrode.
Optionally, a tinned copper wire is used as a wire for connecting the electrode and the driving power source, and the wire is connected with the electrode through a height Wen Rongxi.
According to the embodiment of the invention, the problems that the piezoelectric characteristics are damaged due to small groove width of the piezoelectric ceramic multi-actuation wall structure and heat generated during mechanical processing, the electrode is easy to fall off, and a lead wire is difficult to lead out due to small groove width are solved, and the cutting process, the polarization process and the wire bonding process are improved, so that the piezoelectric ceramic multi-actuation wall structure with complete piezoelectric characteristics is prepared.
Drawings
FIG. 1 is a flow chart of a process for fabricating a piezoelectric ceramic multi-actuation wall structure according to an embodiment of the present invention;
FIG. 2 is a functional interface logic diagram of a method for fabricating a piezoelectric ceramic multi-actuation wall structure according to an embodiment of the present invention;
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, an embodiment of the present invention provides a method for preparing a piezoelectric ceramic multi-actuation wall structure, which includes the following steps:
step 11: processing the piezoelectric ceramic sheet by adopting a polarization process to obtain a piezoelectric ceramic sheet after polarization processing;
step 12: processing the piezoelectric ceramic sheet subjected to polarization treatment by adopting a cutting process to obtain a piezoelectric ceramic sheet with a multi-actuation-wall structure;
step 13: processing the piezoelectric ceramic sheet with the multi-actuation-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic sheet subjected to secondary polarization processing;
step 14: forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic sheet subjected to secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic sheet with the electrodes;
step 15: and welding the welding wires in the welding wire grooves of the piezoelectric ceramic plates with the electrodes by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuation-wall structure.
In the embodiment of the invention, the piezoelectric characteristics of the piezoelectric ceramic plate, which are lost in the cutting process, are repaired by adding the secondary polarization process, and the problem that the piezoelectric characteristics of the piezoelectric ceramic are affected by heat generated in the cutting process is solved, so that the piezoelectric ceramic multi-actuation-wall structure with complete piezoelectric characteristics is prepared.
Referring to fig. 2, an embodiment of the present invention provides a method for preparing a piezoelectric ceramic multi-actuation wall structure, which includes the following steps:
step (a): a polarization process, the polarization process comprising: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with an electrode, placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and cleaning and drying the piezoelectric ceramic plate with water;
in the embodiment of the invention, optionally, the piezoelectric ceramic sheet coated with the electrode is placed in silicone oil heated to 130 ℃;
in the embodiment of the invention, the direct current power supply can output a high-voltage direct current electric field of 1 kV/mm.
Step (b): a cutting process, the cutting process comprising: cutting the upper surface of the polarized piezoelectric ceramic sheet by adopting a cutter with the thickness of 60-80 mu m in a grinding way, and forming a multi-actuation wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuation wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each strip-shaped groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the cutter;
in the embodiment of the invention, a cutter with the thickness of 70 mu m is optionally adopted;
in the embodiment of the invention, the depth of the deep groove is 400 μm, the length is 9.5mm, and the width is 70 μm;
in an embodiment of the present invention, optionally, the depth of the welding wire groove is 70 μm, the length is 2.5mm, and the width is 70 μm.
In the embodiment of the invention, the ultra-precise cutter with the same thickness as the required groove width is selected for processing in a high-speed grinding mode, so that the rapid forming of the multi-actuation wall structure is easier.
Step (c): the secondary polarization process includes: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet with the multi-actuation-wall structure by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with an electrode, wherein the top end of each actuating wall of the multi-actuating wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and washing and drying the piezoelectric ceramic plate by water;
in the embodiment of the invention, optionally, the piezoelectric ceramic sheet coated with the electrode is placed in silicone oil heated to 130 ℃;
in the embodiment of the invention, the direct current power supply can output a high-voltage direct current electric field of 1 kV/mm.
In the embodiment of the invention, the problem that the piezoelectric characteristics of the piezoelectric ceramic plate are damaged if the temperature exceeds the Curie point in the using and processing process is considered, the secondary polarization process is carried out on the cut multi-actuation wall structure, and the piezoelectric characteristics of the piezoelectric ceramic plate, which are lost in the cutting process, are repaired, so that the multi-actuation wall structure with complete piezoelectric characteristics is formed.
Step (d): the electrode plating process comprises the following steps: firstly, fixing the piezoelectric ceramic sheet subjected to secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuation-wall structure and in a welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic sheet by 180 degrees, and plating metal on the other side of the multi-actuation-wall structure and in the welding wire groove by using the evaporation method; and grinding electrodes on the upper surface and the lower surface of the piezoelectric ceramic plate to form a complete multi-actuation wall structure.
In the embodiment of the invention, copper with the thickness of 100nm is plated on one side of the multi-actuation-wall structure and in the welding line groove by an evaporation method.
Step (e): the bonding wire process comprises the following steps: placing a wire with the diameter smaller than that of the wire bonding groove in the wire bonding groove, heating to 150-250 degrees, and completing the wire bonding process after the wire is completely and reliably mechanically and electrically connected with the electrode;
in the embodiment of the invention, optionally, a wire with a diameter smaller than that of the wire bonding groove is placed in the wire bonding groove, and heated to 200 degrees.
In the embodiment of the invention, optionally, a tinned copper wire is used as a wire for connecting the electrode and the driving power supply, and the wire is connected with the electrode through a height Wen Rongxi;
in the embodiment of the invention, optionally, the diameter of the tinned copper wire is 0.05nm.
In the embodiment of the invention, the problems that the evaporated electrode is easy to fall off and the groove width is smaller and difficult to lead are considered, and the copper wire in the lead is reliably and mechanically electrically connected with the electrode by adopting the tinned copper wire with the diameter smaller than the groove width as the lead for connecting the electrode with a driving power supply and the height Wen Rongxi, so that the evaporated electrode can be prevented from falling off while the lead is ensured.
In the embodiment of the invention, the problems that the piezoelectric ceramic multi-actuation wall structure is small in groove width, the piezoelectric property is damaged due to heat generation during mechanical processing, the electrode is easy to fall off, and the lead wire is difficult to lead out due to the small groove width are solved by improving the cutting process, the polarization process and the wire bonding process, so that the piezoelectric ceramic multi-actuation wall structure with complete piezoelectric property is prepared.
The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above-described embodiments, which are merely illustrative, not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present invention and the scope of the claims, which are to be protected by the present invention.
Claims (7)
1. The preparation method of the piezoelectric ceramic multi-actuation-wall structure is characterized by comprising the following steps:
s1: processing the piezoelectric ceramic sheet by adopting a polarization process to obtain a piezoelectric ceramic sheet after polarization processing;
s2: processing the piezoelectric ceramic sheet subjected to polarization treatment by adopting a cutting process to obtain a piezoelectric ceramic sheet with a multi-actuation-wall structure, wherein the multi-actuation-wall structure comprises a plurality of strip-shaped actuation walls which are distributed at intervals, strip-shaped grooves are formed between every two adjacent actuation walls, and each strip-shaped groove comprises a deep communicating groove and a welding groove;
s3: processing the piezoelectric ceramic sheet with the multi-actuation-wall structure by adopting a polarization process again to obtain a piezoelectric ceramic sheet subjected to secondary polarization processing;
s4: forming electrodes on two sides of the strip-shaped actuating wall of the piezoelectric ceramic sheet subjected to secondary polarization treatment and the welding wire grooves by adopting an electrode plating process to obtain the piezoelectric ceramic sheet with the electrodes;
s5: and welding the welding wires in the welding wire grooves of the piezoelectric ceramic plates with the electrodes by adopting a welding wire process to form a complete piezoelectric ceramic multi-actuation-wall structure.
2. The method of fabricating a piezoceramic multi-actuation wall structure of claim 1, wherein,
the polarization process comprises the following steps: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with the electrode, placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and cleaning and drying the piezoelectric ceramic plate with water.
3. The method of fabricating a piezoceramic multi-actuation wall structure of claim 1, wherein,
the cutting process comprises the following steps: cutting the upper surface of the polarized piezoelectric ceramic sheet by adopting a cutter with the thickness of 60-80 mu m in a grinding way, and forming a multi-actuation wall structure on the upper surface of the piezoelectric ceramic sheet, wherein the multi-actuation wall structure comprises a plurality of strip-shaped grooves which are arranged in parallel, and each strip-shaped groove comprises a deep groove and a welding line groove which are communicated; the depth of the deep groove is 300-500 mu m, the length is 9-10mm, and the width is the thickness of the cutter; the depth of the welding wire groove is 60-80 mu m, the length is 2-3mm, and the width is the thickness of the cutter.
4. The method of fabricating a piezoceramic multi-actuation wall structure of claim 1, wherein,
the secondary polarization process includes: a coating electrode process and a polarization process;
wherein the electrode coating process comprises the following steps: coating electrodes on the upper and lower surfaces corresponding to the thickness direction of the piezoelectric ceramic sheet with the multi-actuation-wall structure by using a coating rod, and then performing sintering infiltration treatment on the piezoelectric ceramic sheet coated with the electrodes;
the polarization process comprises the following steps: respectively clamping the positive electrode and the negative electrode of a direct current power supply on the upper surface and the lower surface of a piezoelectric ceramic plate coated with an electrode, wherein the top end of each actuating wall of the multi-actuating wall structure is contacted with the positive electrode or the negative electrode of the power supply, then placing the piezoelectric ceramic plate coated with the electrode in silicone oil heated to 100-200 ℃, simultaneously controlling the direct current power supply to output a high-voltage direct current electric field of 0.5-1.5kV/mm, taking out the piezoelectric ceramic plate after 1-10 hours, and cleaning and drying the piezoelectric ceramic plate by water.
5. The method of fabricating a piezoceramic multi-actuation wall structure of claim 1, wherein,
the electrode plating process comprises the following steps: firstly, fixing the piezoelectric ceramic sheet subjected to secondary polarization treatment on an inclined table, plating metal with the thickness of 80-120nm on one side of the multi-actuation-wall structure and in a welding wire groove by using an evaporation method, then rotating the piezoelectric ceramic sheet by 180 degrees, and plating metal on the other side of the multi-actuation-wall structure and in the welding wire groove by using the evaporation method; and grinding electrodes on the upper surface and the lower surface of the piezoelectric ceramic plate to form a complete multi-actuation wall structure.
6. The method of fabricating a piezoceramic multi-actuation wall structure of claim 1, wherein,
the bonding wire process comprises the following steps: and placing a wire with the diameter smaller than that of the wire bonding groove in the wire bonding groove, heating to 150-250 degrees, and completing the wire bonding process after the wire is completely and reliably and mechanically electrically connected with the electrode.
7. The method of manufacturing a piezoceramic multi-actuation wall structure of claim 6, wherein,
and a tinned copper wire is selected as a wire for connecting the electrode and a driving power supply, and the wire is connected with the electrode through a height Wen Rongxi.
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| CN1299319A (en) * | 1998-03-11 | 2001-06-13 | 萨尔技术有限公司 | Droplet deposition apparatus and method of mfg. same |
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