CN111398789A - Probe card fine-tuning device, coupling device and method for photonic integrated chip test system - Google Patents
Probe card fine-tuning device, coupling device and method for photonic integrated chip test system Download PDFInfo
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- CN111398789A CN111398789A CN202010351487.3A CN202010351487A CN111398789A CN 111398789 A CN111398789 A CN 111398789A CN 202010351487 A CN202010351487 A CN 202010351487A CN 111398789 A CN111398789 A CN 111398789A
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- fine
- probe card
- fine adjustment
- supporting rod
- tuning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
Abstract
The invention provides a probe card fine-tuning device of a photonic integrated chip test system, which comprises a first angle adjusting mechanism and a second angle adjusting mechanism which are vertically arranged, wherein the fine-tuning device can drive a probe card arranged on the fine-tuning device to be clamped in two vertical directions to realize angle fine tuning. The invention also provides a probe card coupling device of the photonic integrated chip test system, which comprises a fine adjustment device and a main adjustment device fixedly connected with the fine adjustment device, wherein the main adjustment device can realize the position adjustment of the probe card in three directions in space. Based on the coupling method of the probe card of the photonic integrated chip test system, each probe on the probe card can well contact with a welding pad or a lug of the photonic integrated chip, so that the test process is more stable, and the result is more accurate.
Description
Technical Field
The invention relates to the technical field of photonic integrated chip testing, in particular to a probe card fine-tuning device, a coupling device and a method of a photonic integrated chip testing system.
Background
With the increase of the network upgrading pressure and the increasing enhancement of green emission reduction calls, an operator needs to realize the network upgrading at a lower cost and pay less energy consumption cost. Similar to electronic integrated circuit technology, the gradual maturity of photonic integrated circuit technology will certainly lead to another revolution in the field of optical information technology. Semiconductor chips including photonic devices and microcircuits configured to relay signals through optical transmission are referred to as "photonic integrated chips". To ensure manufacturing quality and performance, each photonic integrated chip must be tested to evaluate its functionality before being packaged and shipped to a customer and installed in various electronic systems, ensuring that it is not defective. In order to perform the test, manufacturers mostly implement the test effect by means of coupling a probe card, which serves as an interface between a tester and a chip, and the probe of the probe card can contact with a pad or a bump on the chip, and the pad or the bump is rubbed by a mechanical rubbing action of a probe tip during the test, so that the test signal exchange between the tester and the chip to be tested can be realized.
During the testing process, the stability of the test and the accuracy of the result can be ensured only by ensuring the stable contact between the probe tip and the welding pad or the bump on the chip. However, in order to improve the detection efficiency, most manufacturers test a plurality of pads or bumps at the same time by using a probe card with a plurality of probes in an array, and the design of the plurality of probes often prevents all the probes from being stably contacted with the pads or bumps, so that even though the manufacturers move and adjust the probe card by using a displacement table with three degrees of freedom in position, the requirements of the test cannot be met.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a probe card fine-tuning device, a coupling device and a method for a photonic integrated chip test system.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the invention provides a probe card fine-tuning device of a photonic integrated chip test system, which comprises a first angle adjusting mechanism and a second angle adjusting mechanism which are vertically arranged, wherein the fine-tuning device can drive a probe card arranged on the fine-tuning device to be clamped in two vertical directions to realize angle fine tuning.
Preferably, the first angle adjusting mechanism comprises a first support and a first rotating frame, the first rotating frame is rotatably arranged on the first support through a first rotating shaft, a first fine adjustment mechanism is arranged at the other end of the first support, and the first rotating frame is driven to rotate around the first rotating shaft relative to the first support through adjustment of the first fine adjustment mechanism.
Preferably, the first rotating frame comprises a first supporting rod, a second supporting rod and a third supporting rod which are arranged in parallel; the third supporting rod is rotatably arranged on the first support through a first rotating shaft, and a first fine adjustment mechanism is arranged on the first supporting rod.
Preferably, the first fine adjustment mechanism comprises a first knob and a first spring, the first knob penetrates through the first support rod and is in threaded connection with the first support, and the first spring is sleeved on the first knob and is arranged between the first support rod and the first support.
Preferably, the second angle adjusting mechanism comprises a second rotating frame, the second rotating frame is rotatably arranged below the first rotating frame through a second rotating shaft, a second fine adjustment mechanism is arranged on the second rotating frame, and the second rotating frame is driven by adjusting the second fine adjustment mechanism to rotate relative to the first rotating frame around the second rotating shaft.
Preferably, a fourth supporting rod extends out of the second rotating frame, and a second fine adjustment mechanism is arranged on the fourth supporting rod.
Preferably, the second fine adjustment mechanism comprises a second knob and a second spring, the second knob penetrates through a fourth supporting rod and is in threaded connection with the second supporting rod, and the second spring is sleeved on the second knob and is arranged between the fourth supporting rod and the second supporting rod.
The invention provides a probe card coupling device of a photonic integrated chip test system, which comprises a probe card fine-tuning device of a photonic integrated chip test system, a probe card arranged on the fine-tuning device and a main adjusting device fixedly connected with the fine-tuning device.
Preferably, the main adjusting device comprises a transverse adjusting mechanism, a longitudinal adjusting mechanism and a height adjusting mechanism which are fixedly connected.
The invention also provides a probe card coupling method of the photonic integrated chip test system, which comprises the following steps:
(1) adjusting the position of the fine adjustment device and the probe on the fine adjustment device by adjusting the main adjustment device;
(2) and the probe is adjusted around the X-axis rotating direction through a first fine adjustment mechanism on the fine adjustment device, and the probe is adjusted around the Z-axis rotating direction through a second fine adjustment mechanism on the fine adjustment device.
The invention has the advantages and positive effects that:
(1) based on the mutual matching of the main adjusting device and the fine adjusting device, the probe card can be adjusted in three directions and two angles in space, so that each probe on the probe card can be in good contact with a welding pad or a lug of the photonic integrated chip, the test process is more stable, and the result is more accurate.
(2) The first fine adjustment mechanism and the second fine adjustment mechanism adopt the knob and the spring to be matched to realize angle adjustment of the probe card, and effectively replace a driving mechanism with large volume and large consumption of a motor and a cylinder, so that the use space and the manufacturing cost of the detection equipment can be effectively reduced.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a rear view of the present invention;
FIG. 3 is a schematic side view of the present invention;
FIG. 4 is a schematic view of the fine tuning device of the present invention;
FIG. 5 is a schematic view of another aspect of the fine adjustment apparatus of the present invention;
in the figure: 1. a probe card; 2. a first angle adjustment mechanism; 3. a second angle adjustment mechanism; 4. a connecting plate; 5. a column; 6. a lateral adjustment mechanism; 7. a longitudinal adjustment mechanism; 8. a height adjustment mechanism; 9. a limiting sheet; 10. a limit bolt;
11. a probe;
21. a first bracket; 22. a first rotating frame; 23. a third support bar; 24. a first support bar; 25. a second support bar; 26. a first knob; 27. a first spring; 28. a first rotating shaft;
31. a second rotating frame; 32. a second rotation shaft; 33. a fourth strut; 34. a second knob; 35. a second spring;
61. a first micrometer head; 62. a first sliding table; 63. a first slider;
71. a second micrometer head; 72. a second sliding table; 73. a second slide carriage;
81. a third micrometer head; 82. a third sliding table; 83. a third slide carriage;
91. and (4) a long hole.
Detailed Description
The embodiments of the invention will be described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, the present invention provides a probe card fine-tuning device of a photonic integrated chip test system, which uses a technical means of coupling a probe card 1 to achieve a test effect, the probe card 1 is used as an interface between a tester and a chip, probes 11 of the probe card 1 can contact pads or bumps on the chip, and the pads or bumps are rubbed by a mechanical rubbing action of tips of the probes 11 during a test, so that an exchange of test signals between the tester and the chip to be tested can be achieved. The probe card fine-tuning device of the photonic integrated chip testing system comprises a first angle adjusting mechanism 2 and a second angle adjusting mechanism 3 which are vertically arranged, and the fine-tuning device can drive a probe card 1 arranged on the fine-tuning device to realize angle fine tuning in two vertical directions. It should be added that the first angle adjusting mechanism 2 is used for driving the probe card 1 to rotate around the X-axis direction, the second angle adjusting mechanism 3 is used for driving the probe card 1 to rotate around the Z-axis direction, and the probe card 1 is fixedly connected with the second angle adjusting mechanism 3. It is emphasized that the rotatable direction between the first angle adjusting mechanism 2 and the second angle adjusting mechanism 3 is a horizontal direction. In addition, the probe 11 on the probe card 1 is a one-dimensional array, so that the adjustment of the pitching direction is not needed, and the fine adjustment device of the probe card of the photonic integrated chip test system does not provide the adjustment of the pitching degree of freedom, and only has two angle adjustment mechanisms.
Further, as shown in fig. 2, fig. 3, fig. 4, and fig. 5, the first angle adjusting mechanism 2 includes a first bracket 21 and a first rotating frame 22, the first rotating frame 22 is rotatably disposed on the first bracket 21 through a first rotating shaft 28, a first fine adjustment mechanism is disposed at the other end of the first bracket 21, and the first rotating frame 22 is driven to rotate around the first rotating shaft 28 relative to the first bracket 21 by adjusting the first fine adjustment mechanism.
Further, as shown in fig. 2, 3, 4, and 5, the first rotating frame 22 includes a first supporting rod 24, a second supporting rod 25, and a third supporting rod 23, which are arranged in parallel, the third supporting rod 23 is rotatably arranged on the first supporting frame 21 through a first rotating shaft 28, and a first fine adjustment mechanism is arranged on the first supporting rod 24. it should be noted that the second supporting rod 25 and the third supporting rod 23 are both L-shaped structures, it is to be supplemented that the middle of the first rotating shaft 28 is smooth shaft-shaped, the bottom is a threaded column, the first rotating shaft 28 sequentially passes through the first supporting frame 21 and the third supporting rod 23, and the bottom of the first rotating shaft 28 is fixed through a nut.
Further, as shown in fig. 2, 3, and 5, the first fine adjustment mechanism includes a first knob 26 and a first spring 27, the first knob 26 is screwed with the first bracket 21 through the first support rod 24, and the first spring 27 is sleeved on the first knob 26 and is disposed between the first support rod 24 and the first bracket 21. The first spring 27 is used to always urge the first supporting rod 24 against the head of the screw of the first knob 26, so that the moving distance of the first supporting rod 24 and the first knob 26 is always kept equal. The first knob 26 is used for driving the first rotating frame 22 to rotate around the X-axis direction. Since the first angle adjusting mechanism 2 and the second angle adjusting mechanism 3 are not relatively movable in the Z-axis direction, the first rotating frame 22 can drive the second angle adjusting mechanism 3 and the probe card 1 to rotate around the X-axis direction simultaneously while rotating around the X-axis direction. It should be added that the first bracket 21 is provided with a threaded hole matching with the screw of the first knob 26.
Further, as shown in fig. 2, fig. 3, fig. 4, and fig. 5, the second angle adjusting mechanism 3 includes a second rotating frame 31, the second rotating frame 31 is rotatably disposed below the first rotating frame 22 through a second rotating shaft 32, a second fine adjustment mechanism is disposed on the second rotating frame 31, and the second fine adjustment mechanism is adjusted to drive the second rotating frame 31 to rotate around the second rotating shaft 32 relative to the first rotating frame 22. It should be added that the middle part of the second rotating shaft 32 is smooth shaft-shaped, the bottom part is threaded column, the second rotating shaft 32 sequentially passes through the first rotating frame 22 and the second rotating frame 31, and the bottom part of the second rotating shaft 32 is fixed by a nut, so that the rotating connection between the second rotating frame 31 and the first rotating frame 22 is realized.
Further, as shown in fig. 5, a fourth supporting rod 33 extends from the second rotating frame 31, and a second fine adjustment mechanism is disposed on the fourth supporting rod 33.
Further, as shown in fig. 3, 4, and 5, the second fine adjustment mechanism includes a second knob 34 and a second spring 35, the second knob 34 passes through the fourth support rod 33 and is screwed with the second support rod 25, and the second spring 35 is sleeved on the second knob 34 and is disposed between the fourth support rod 33 and the second support rod 25. The second spring 35 is used to always urge the fourth rod 33 against the head of the screw of the second knob 34, so that the moving distance between the fourth rod 33 and the second knob 34 is always kept equal. The second knob 34 is used for driving the first rotating frame 22 to rotate around the X-axis direction. It should be added that the second support rod 25 is provided with a threaded hole matching with the screw of the second knob 34. Meanwhile, the first spring 27 and the second spring 35 also have a damping function.
It should be emphasized that the first support rod 24 is provided with a first through hole for the screw rod of the first knob 26 to pass through, the fourth support rod 33 is provided with a second through hole for the screw rod of the second knob 34 to pass through, the inner diameter of the first through hole is larger than that of the screw rod of the first knob 26, the inner diameter of the second through hole is larger than that of the screw rod of the second knob 34, and the inner walls of the first through hole and the second through hole are smooth. The design of the inner diameter size of the first through hole and the smooth inner wall is used for ensuring that the first supporting rod 24 can normally deflect when rotating around the X-axis direction, and the design of the inner diameter size of the second through hole and the smooth inner wall is used for ensuring that the fourth supporting rod 33 can normally deflect when rotating around the Z-axis direction.
It should be added that four columns 5 are arranged below one end of the second rotating frame 31 in a rectangular arrangement, and the probe card 1 can be fixedly connected with the second rotating frame 31 through the four columns 5.
Specifically, when the probe card 1 needs to be rotated around the X-axis direction by the first angle adjustment mechanism 2, if the probe card 1 is rotated around the X-axis counterclockwise, that is, one end of the probe card 1 moves downward, at this time, the first knob 26 is twisted downward along the threaded hole on the first bracket 21, and while the first knob 26 is twisted downward, the displacement distance of the first support rod 24 is consistent with that of the first knob 26 due to the limitation of the first spring 27 below, at this time, the other end of the first rotation bracket 22 is fixedly rotated along the hinge joint, so that the rotation operation of the first rotation bracket 22 is realized, that is, the rotation operation of the probe card 1 by the first rotation bracket 22 is also realized. On the contrary, if the probe card 1 is rotated clockwise around the X-axis, that is, one end of the probe card 1 moves upward, the first knob 26 is turned upward, and the working principle is the same as that of the first knob 26, which is turned downward, and thus, the description thereof is omitted here.
Specifically, the working process of the second angle adjusting mechanism 3 is as follows: when the probe card 1 needs to be rotated around the Z-axis direction by the second angle adjustment mechanism 3, if the probe card 1 is rotated around the Z-axis counterclockwise, the second knob 34 is twisted back to the deep along the threaded hole on the second support rod 25, while the second knob 34 is twisted back to the deep, the displacement distance of the fourth support rod 33 is kept consistent with that of the second knob 34 due to the limitation of the second spring 35 disposed in the opposite direction of the second knob 34, and at this time, the other end of the second rotary frame 31 is fixed and rotated along the hinge joint, so that the rotation operation of the second rotary frame 31 is realized, that is, the rotation operation of the probe card 1 by the second rotary frame 31 is also realized. On the contrary, if the probe card 1 is intended to rotate clockwise around the Z axis, the second knob 34 is only required to be twisted to the outer side along the direction of the threaded hole on the second support rod 25, and the working principle of the probe card is the same as that of the second knob 34 twisted to the deep position along the direction of the threaded hole on the second support rod 25, so the description is omitted here.
As shown in fig. 1, fig. 2 and fig. 3, the invention further provides a multi-electrode probe card coupling device for a photonic integrated chip test system, which comprises a trimming device for a probe card of a photonic integrated chip test system, a probe card 1 arranged on the trimming device, and a main adjusting device fixedly connected with the trimming device.
Further, as shown in the figure, the main adjusting device comprises a transverse adjusting mechanism 6, a longitudinal adjusting mechanism 7 and a height adjusting mechanism 8 which are fixedly connected, the transverse adjusting mechanism 6 is arranged on a base, the longitudinal adjusting mechanism 7 is fixedly arranged on the transverse adjusting mechanism 6, the height adjusting mechanism 8 is fixedly arranged on the longitudinal adjusting mechanism 7, and the height adjusting mechanism 8 is connected with the fine adjusting device. The transverse adjusting mechanism 6 is used for driving the fine adjusting device and the probe card 1 to move in the X-axis direction, the longitudinal adjusting mechanism 7 is used for driving the fine adjusting device and the probe card 1 to move in the Y-axis direction, and the height adjusting mechanism 8 is used for driving the fine adjusting device and the probe card 1 to move in the Z-axis direction.
It needs to be supplemented that one end of the first support 21, which is far away from the first rotating frame 22, is fixedly connected with a connecting plate 4, the first angle adjusting mechanism 2 is fixedly connected with the height adjusting mechanism 8 through the connecting plate 4, and the connecting plate 4 is used for realizing the effect that the main adjusting device moves to drive the fine adjusting device.
In an embodiment of the present invention, each of the transverse adjusting mechanism 6, the longitudinal adjusting mechanism 7, and the height adjusting mechanism 8 includes a micrometer head and a sliding table, and the micrometer head and the sliding table are disposed on the sliding base, and the micrometer head can drive the sliding table to move on the sliding base through the sliding base. The transverse adjusting mechanism 6, the longitudinal adjusting mechanism 7 and the height adjusting mechanism 8 are completely the same in structure. It needs to be supplemented that the micrometer head is fixedly connected with the sliding seat, and the sliding table is in sliding connection with the sliding seat.
Specifically, horizontal adjustment mechanism 6 is including first micrometer head 61, first slip table 62 and first slide 63, first micrometer head 61 all sets up on first slide 63 with first slip table 62, vertical adjustment mechanism 7 is including second micrometer head, second slip table and second slide, second micrometer head all sets up on the second slide with the second slip table, vertical adjustment mechanism is including third micrometer head, third slip table and third slide, third micrometer head and third slip table all set up on the third slide. The second slide and the first slip table 62 fixed connection, the third slide and the second slip table fixed connection, the third slip table passes through connecting plate 4 and is connected with first angle adjustment mechanism 2.
Taking the transverse adjusting mechanism 6 as an example, the first micrometer head 61 includes a micrometer screw, and the specific structure and connection relationship of the first micrometer head 61 are the prior art, so that the description is not repeated here. First micrometer head 61 and first slide 63 fixed connection, first slide 63 inside be equipped with first micrometer head 61's micrometer screw rod matched with drive mechanism, drive mechanism cooperatees with first slip table 62 simultaneously, thereby makes first micrometer head 61 accessible first slide 63 drives the slip table and moves on first slide 63. It should be noted that the transmission mechanism indicated here is not exemplified in the drawings, but the structure thereof may be selected from a gear transmission and a screw transmission. It needs to supplement that one side is equipped with spacing piece 9 on the first slide 63, on first spacing piece 9 one end was fixed in first slide 63, the other end set up in first slip table 62 one side, be close to first slip table 62 one side on the first spacing piece 9 and be equipped with a rectangular hole 91, have a spacing bolt 10 to pass first rectangular hole 91 and first slip table 62 spiro union, be equipped with on the first slip table 62 with spacing bolt 10 assorted screw thread. The limiting bolt 10 is used for limiting the adjusting range of the first sliding table 62, and when the limiting bolt 10 is screwed down, the limiting bolt can be matched with one side of the first sliding table 62 to clamp the limiting sheet 9, so that the auxiliary fixing effect is realized.
The longitudinal adjusting mechanism 7, the vertical adjusting mechanism and the transverse adjusting mechanism 6 have the same structure, so the longitudinal adjusting mechanism 7 and the vertical adjusting mechanism are respectively provided with a limiting sheet 9 and a limiting bolt 10 which have the same structure and working principle as the transverse adjusting mechanism 6, and the working process of the limiting sheet is not described herein.
It should be emphasized that the structures and connection relations of the transverse adjusting mechanism 6, the longitudinal adjusting mechanism 7 and the height adjusting mechanism 8 are the prior art, which is embodied in a precision slide table, in the manufacturing process of the fine tuning apparatus of the probe card of the photonic integrated chip test system, the transverse adjusting mechanism 6, the longitudinal adjusting mechanism 7 and the height adjusting mechanism 8 may be directly selected from precision slide tables having three adjusting directions of X-axis, Y-axis and Z-axis, which may be specifically selected from 3580 series precision slide tables of heroes electromechanical technologies, limited in su, such as L AM-805C or L AM-805W or L AM-805R, and the specific selection of the precision slide table model is not limited to the aforementioned L AM-805C or L AM-805W or L AM-805R, and other precision slide tables having three adjusting directions of X-axis, Y-axis and Z-axis may be selected according to practical situations, and are not listed here.
The invention also provides a coupling method of the multi-electrode probe card coupling device based on the photonic integrated chip test system, which comprises the following steps:
(1) adjusting the position of the fine adjustment device and the probe on the fine adjustment device by adjusting the main adjustment device;
(2) and the probe is adjusted around the X-axis rotating direction through a first fine adjustment mechanism on the fine adjustment device, and the probe is adjusted around the Z-axis rotating direction through a second fine adjustment mechanism on the fine adjustment device.
The working process of the invention is as follows:
one side of a probe card fine-tuning device of the photonic integrated chip testing system is fixed with a chip to be detected, firstly, a worker manually controls a first micrometer head 61, a second micrometer head or a third micrometer head to move a first sliding table 62, a second sliding table and a third sliding table, so that the fine-tuning device is driven to move by sequentially driving a second sliding seat, a third sliding seat and a connecting plate 4, the fine-tuning device is fixedly connected with a probe card 1 for testing the chip to be detected, and the probe card 1 is subjected to position adjustment in three directions of an X axis, a Y axis and a Z axis by controlling a transverse adjusting mechanism 6, a longitudinal adjusting mechanism 7 and a height adjusting mechanism 8. When an operator adjusts the probe card 1 in three spatial directions through the main adjusting device, the operator can rotate the first knob 26 to control the probe card 1 to rotate around the X-axis direction, and rotate the second knob 34 to control the probe card 1 to rotate around the Z-axis direction, and the operator continuously uses the first knob 26 and the second knob 34 to finely adjust the probe card 1 in two angular directions until the probes 11 on the probe card 1 are all in stable contact with the bonding pads or bumps on the chip, and then the operator stops adjusting and starts detecting. Therefore, the probe card 1 can be adjusted in three directions and two angles in space, each probe 11 on the probe card 1 can be in good contact with a welding pad or a lug of a photonic integrated chip, the test process is more stable, and the result is more accurate.
It should be emphasized that the embodiments described herein are illustrative rather than restrictive, and thus the present invention is not limited to the embodiments described in the detailed description, but other embodiments derived from the technical solutions of the present invention by those skilled in the art are also within the scope of the present invention.
Claims (10)
1. The fine tuning device of the probe card of the photonic integrated chip testing system is characterized in that: the fine adjustment device comprises a first angle adjustment mechanism (2) and a second angle adjustment mechanism (3) which are vertically arranged, and the fine adjustment device can drive a probe card (1) arranged on the fine adjustment device to realize angle fine adjustment in two vertical directions.
2. The apparatus of claim 1, wherein: first angle adjustment mechanism (2) including first support (21) and first swivel mount (22), first swivel mount (22) through first rotation axis (28) rotatory set up in on first support (21), the other end of first support (21) is provided with first fine-tuning, through adjusting first fine-tuning drives first swivel mount (22) centers on first rotation axis (28) for first support (21) rotates.
3. The apparatus of claim 2, wherein: the first rotating frame (22) comprises a first supporting rod (24), a second supporting rod (25) and a third supporting rod (23) which are arranged in parallel; the third supporting rod (23) is rotatably arranged on the first support (21) through a first rotating shaft (28), and a first fine adjustment mechanism is arranged on the first supporting rod (24).
4. The apparatus of claim 3, wherein: the first fine adjustment mechanism comprises a first knob (26) and a first spring (27), the first knob (26) penetrates through the first support rod (24) to be in threaded connection with the first support (21), and the first spring (27) is sleeved on the first knob (26) and arranged between the first support rod (24) and the first support (21).
5. The apparatus of claim 3, wherein: second angle adjustment mechanism (3) are including second swivel mount (31), second swivel mount (31) set up in first swivel mount (22) below through a second rotation axis (32) rotation, be provided with second fine-tuning on second swivel mount (31), through adjusting second fine-tuning drives second swivel mount (31) centers on second rotation axis (32) carries out for first swivel mount (22) is rotatory.
6. The apparatus of claim 5, wherein: and a fourth supporting rod (33) extends out of the second rotating frame (31), and a second fine adjustment mechanism is arranged on the fourth supporting rod (33).
7. The apparatus of claim 6, wherein: the second fine adjustment mechanism comprises a second knob (34) and a second spring (35), the second knob (34) penetrates through a fourth supporting rod (33) to be in threaded connection with the second supporting rod (25), and the second spring (35) is sleeved on the second knob (34) and arranged between the fourth supporting rod (33) and the second supporting rod (25).
8. The probe card coupling device of the photonic integrated chip test system is characterized in that: the probe card fine-tuning device comprises the probe card fine-tuning device of the photonic integrated chip test system according to any one of claims 1 to 7, a probe card (1) arranged on the fine-tuning device, and a main adjusting device fixedly connected with the fine-tuning device.
9. The method of claim 8, wherein: the main adjusting device comprises a transverse adjusting mechanism (6), a longitudinal adjusting mechanism (7) and a height adjusting mechanism (8) which are fixedly connected.
10. The probe card coupling method of the photonic integrated chip test system is characterized in that: the coupling method of the multi-electrode probe card coupling device of the photonic integrated chip test system according to any one of claims 8 to 9 comprises the following steps:
(1) adjusting the position of the fine adjustment device and the probe on the fine adjustment device by adjusting the main adjustment device;
(2) and the probe is adjusted around the X-axis rotating direction through a first fine adjustment mechanism on the fine adjustment device, and the probe is adjusted around the Z-axis rotating direction through a second fine adjustment mechanism on the fine adjustment device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010351487.3A CN111398789A (en) | 2020-04-28 | 2020-04-28 | Probe card fine-tuning device, coupling device and method for photonic integrated chip test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010351487.3A CN111398789A (en) | 2020-04-28 | 2020-04-28 | Probe card fine-tuning device, coupling device and method for photonic integrated chip test system |
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| CN111398789A true CN111398789A (en) | 2020-07-10 |
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| CN202010351487.3A Pending CN111398789A (en) | 2020-04-28 | 2020-04-28 | Probe card fine-tuning device, coupling device and method for photonic integrated chip test system |
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| CN112904054A (en) * | 2021-02-04 | 2021-06-04 | 上海泽丰半导体科技有限公司 | Clamping jaw type probe clamp and probe clamping equipment |
| CN112904053A (en) * | 2021-02-04 | 2021-06-04 | 上海泽丰半导体科技有限公司 | Probe clamp and probe inserting and holding equipment |
| CN113030109A (en) * | 2021-03-23 | 2021-06-25 | 广西师范大学 | Microprobe system for detecting object surface |
| CN114280455A (en) * | 2021-12-28 | 2022-04-05 | 国芯微(重庆)科技有限公司 | Probe regulating mechanism |
| CN114535916A (en) * | 2022-04-01 | 2022-05-27 | 长鑫存储技术有限公司 | Welding alignment equipment and method for welding by adopting same |
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- 2020-04-28 CN CN202010351487.3A patent/CN111398789A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112904054A (en) * | 2021-02-04 | 2021-06-04 | 上海泽丰半导体科技有限公司 | Clamping jaw type probe clamp and probe clamping equipment |
| CN112904053A (en) * | 2021-02-04 | 2021-06-04 | 上海泽丰半导体科技有限公司 | Probe clamp and probe inserting and holding equipment |
| CN113030109A (en) * | 2021-03-23 | 2021-06-25 | 广西师范大学 | Microprobe system for detecting object surface |
| CN114280455A (en) * | 2021-12-28 | 2022-04-05 | 国芯微(重庆)科技有限公司 | Probe regulating mechanism |
| CN114280455B (en) * | 2021-12-28 | 2024-04-09 | 国芯微(重庆)科技有限公司 | Probe adjusting mechanism |
| CN114535916A (en) * | 2022-04-01 | 2022-05-27 | 长鑫存储技术有限公司 | Welding alignment equipment and method for welding by adopting same |
| CN114535916B (en) * | 2022-04-01 | 2023-12-22 | 长鑫存储技术有限公司 | Welding alignment device and welding method using same |
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