CN111366756B - 一种芯片引脚夹具及芯片引脚夹具阵列 - Google Patents
一种芯片引脚夹具及芯片引脚夹具阵列 Download PDFInfo
- Publication number
- CN111366756B CN111366756B CN202010141730.9A CN202010141730A CN111366756B CN 111366756 B CN111366756 B CN 111366756B CN 202010141730 A CN202010141730 A CN 202010141730A CN 111366756 B CN111366756 B CN 111366756B
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- Prior art keywords
- chip pin
- chip
- groove
- array
- elastic sheet
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Links
- 238000005520 cutting process Methods 0.000 claims description 14
- 230000008878 coupling Effects 0.000 claims description 6
- 238000010168 coupling process Methods 0.000 claims description 6
- 238000005859 coupling reaction Methods 0.000 claims description 6
- 239000012634 fragment Substances 0.000 claims description 4
- XBWAZCLHZCFCGK-UHFFFAOYSA-N 7-chloro-1-methyl-5-phenyl-3,4-dihydro-2h-1,4-benzodiazepin-1-ium;chloride Chemical compound [Cl-].C12=CC(Cl)=CC=C2[NH+](C)CCN=C1C1=CC=CC=C1 XBWAZCLHZCFCGK-UHFFFAOYSA-N 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 11
- 238000005259 measurement Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 10
- 230000005489 elastic deformation Effects 0.000 description 6
- 238000010008 shearing Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000003745 diagnosis Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 238000013473 artificial intelligence Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007274 generation of a signal involved in cell-cell signaling Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000002427 irreversible effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0425—Test clips, e.g. for IC's
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010141730.9A CN111366756B (zh) | 2020-03-04 | 2020-03-04 | 一种芯片引脚夹具及芯片引脚夹具阵列 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010141730.9A CN111366756B (zh) | 2020-03-04 | 2020-03-04 | 一种芯片引脚夹具及芯片引脚夹具阵列 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111366756A CN111366756A (zh) | 2020-07-03 |
CN111366756B true CN111366756B (zh) | 2022-08-16 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010141730.9A Active CN111366756B (zh) | 2020-03-04 | 2020-03-04 | 一种芯片引脚夹具及芯片引脚夹具阵列 |
Country Status (1)
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CN (1) | CN111366756B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114859215B (zh) * | 2022-07-06 | 2022-11-11 | 四川明泰微电子有限公司 | 一种半导体集成芯片通用测试工装 |
CN116520137A (zh) * | 2023-06-27 | 2023-08-01 | 北京智芯微电子科技有限公司 | 低噪声芯片引脚干扰测量辅助装置及测量系统 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4768195A (en) * | 1985-07-03 | 1988-08-30 | Stoner Donald W | Chip tester |
US6103553A (en) * | 1996-12-11 | 2000-08-15 | Hyundai Electronics Industries Co., Ltd. | Method of manufacturing a known good die utilizing a substrate |
DE102004033302A1 (de) * | 2004-07-08 | 2006-02-16 | Endress + Hauser Gmbh + Co. Kg | Testvorrichtung für elektronische Schaltungen |
CN205484687U (zh) * | 2015-12-10 | 2016-08-17 | 华测检测认证集团股份有限公司 | 通用型芯片失效分析的测试装置 |
CN207067182U (zh) * | 2017-06-29 | 2018-03-02 | 南京扬贺扬微电子科技有限公司 | 一种集成电路芯片可靠性检测夹具 |
CN109239575B (zh) * | 2018-08-01 | 2020-12-29 | 上海移远通信技术股份有限公司 | 一种检测装置、检测方法及自动化检测系统 |
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2020
- 2020-03-04 CN CN202010141730.9A patent/CN111366756B/zh active Active
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Publication number | Publication date |
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CN111366756A (zh) | 2020-07-03 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20210209 Address after: 311201 No. 602-11, complex building, 1099 Qingxi 2nd Road, Hezhuang street, Qiantang New District, Hangzhou City, Zhejiang Province Applicant after: Zhonghao Xinying (Hangzhou) Technology Co.,Ltd. Address before: 518057 5-15, block B, building 10, science and technology ecological park, Yuehai street, Nanshan District, Shenzhen City, Guangdong Province Applicant before: Shenzhen Xinying Technology Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Chip Pin Fixture and Chip Pin Fixture Array Effective date of registration: 20230721 Granted publication date: 20220816 Pledgee: Hangzhou High-tech Financing Guarantee Co.,Ltd. Pledgor: Zhonghao Xinying (Hangzhou) Technology Co.,Ltd. Registration number: Y2023330001536 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20220816 Pledgee: Hangzhou High-tech Financing Guarantee Co.,Ltd. Pledgor: Zhonghao Xinying (Hangzhou) Technology Co.,Ltd. Registration number: Y2023330001536 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |