CN111366183A - Mobile probe of integrated piezoelectric wafer with adjustable pressing force - Google Patents
Mobile probe of integrated piezoelectric wafer with adjustable pressing force Download PDFInfo
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- CN111366183A CN111366183A CN202010174700.8A CN202010174700A CN111366183A CN 111366183 A CN111366183 A CN 111366183A CN 202010174700 A CN202010174700 A CN 202010174700A CN 111366183 A CN111366183 A CN 111366183A
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- piezoelectric wafer
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
- G01D11/30—Supports specially adapted for an instrument; Supports specially adapted for a set of instruments
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/12—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable using electric or magnetic means
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention belongs to the field of active piezoelectric element detection, and discloses a movable probe of an integrated piezoelectric wafer with adjustable pressing force, which takes an arched connecting piece as a base, is connected with a vacuum adsorption device through two symmetrical connecting bolts, and is connected with a piezoelectric actuator on the lower end surface of the top of the arched connecting piece; the piezoelectric actuator is connected to the fixture housing through a ball bearing connection, in which the pressure sensor and the piezoelectric wafer are placed. The vacuum adsorption device ensures that the structure is reliably adsorbed on the surface of a tested piece, and meanwhile, the vacuum adsorption device can be suitable for piezoelectric wafers with different thicknesses by adjusting the position of the connecting bolt; the pressing force between the piezoelectric wafer and the tested piece can be detected and adjusted; the piezoelectric actuator is utilized to apply pressing force between the piezoelectric wafer and the tested piece, and meanwhile, the uniformity of the stress of the piezoelectric wafer and the uniformity of the thickness of a coupling layer between the piezoelectric wafer and the tested piece can be ensured through the fine adjustment effect of the ball bearing connecting piece.
Description
Technical Field
The invention belongs to the field of active piezoelectric element detection, and particularly relates to a movable probe of an integrated piezoelectric wafer with adjustable pressing force.
Background
At present, an active piezoelectric element detection technology (such as an electrical impedance method, an ultrasonic method and the like) belongs to a better detection method which has higher measurement precision and can detect the integrity of a structure without damaging the integrity of the structure. Of particular importance, however, is the structural mounting of the piezoelectric element. The current common approach is to stick the piezoelectric element to the surface of the structure. However, this method has the following problems:
1) during installation, due to improper operation, the piezoelectric element may be damaged, resulting in performance defects;
2) the pasting operation needs an experienced operator, and needs to maintain pressure for a long time to ensure the installation performance, and the waiting time is long;
3) the performance of the adhesive layer is greatly influenced by environmental factors (temperature and humidity), and the adhesion quality is difficult to ensure;
4) the piezoelectric element has a falling risk in the using process, and equipment failure can be caused under extreme conditions;
in the prior patent similar to the present patent, 201010244359.5, the pressing force between the piezoelectric wafer and the structure to be measured is achieved by a spring, while the pressing force in the present patent is achieved by loading the piezoelectric actuator, which can be continuously and precisely adjusted in the adsorption state. And this patent has adopted the bulb head spare, can guarantee that piezoelectric wafer atress direction is parallel rather than the axis, guarantees piezoelectric wafer atress homogeneity and its and the homogeneity of being tested coupling layer thickness between the piece.
Disclosure of Invention
The invention aims to solve the problem that a piezoelectric element needs to be pasted in the existing active piezoelectric element detection method, and provides a movable probe suitable for the active piezoelectric element detection method. The vacuum adsorption device can ensure that the structure is reliably adsorbed on the surface of a tested piece, and meanwhile, the vacuum adsorption device can be suitable for piezoelectric wafers with different thicknesses by adjusting the position of the connecting bolt; the clamping force between the piezoelectric wafer and the tested piece can be detected and adjusted; the piezoelectric actuator is utilized to apply pressing force between the piezoelectric wafer and the tested piece, and meanwhile, the uniformity of the stress of the piezoelectric wafer and the uniformity of the thickness of a coupling layer between the piezoelectric wafer and the tested piece can be ensured through the fine adjustment effect of the ball bearing connecting piece.
The technical scheme of the invention is as follows:
a movable probe of an integrated piezoelectric wafer with adjustable pressing force comprises an arch-shaped connecting piece 1, a piezoelectric actuator 2, a ball bearing connecting piece 3, a clamp shell 4, a pressure sensor 5, a connecting bolt 6, a piezoelectric wafer 7 and a vacuum adsorption device 8; the top end of the arched connecting piece 1 is provided with bolt holes and is connected with the piezoelectric actuator 2 through bolts, one end of the arched connecting piece 1, which is far away from the bolt holes at the top end, is provided with two bolt holes and is connected with the vacuum adsorption device 8 through a connecting bolt 6, the relative position of the connecting bolt 6 and the arched connecting piece 1 is fixed, and the relative height between the lower surface of the piezoelectric wafer 7 and the adsorption action surface of the vacuum adsorption device 8 is adjusted by adjusting the position of the connecting bolt 6 in a chute of the vacuum adsorption device 8 so as to adapt to the piezoelectric wafers 7 with different thicknesses; the upper end of the ball bearing connecting piece 3 is connected with the piezoelectric actuator 2 through threads, and the lower end of the ball bearing connecting piece is connected with the clamp shell 4 through a bolt; the pressure sensor 5 and the piezoelectric wafer 7 are placed in the jig housing 4, wherein the upper surface of the piezoelectric wafer 7 is in contact with the lower surface of the pressure sensor 5.
The implementation steps of the invention are as follows:
1) sequentially mounting an arch-shaped connecting piece 1, a piezoelectric actuator 2, a ball bearing connecting piece 3, a clamp shell 4, a pressure sensor 5 and a piezoelectric wafer 7;
2) smearing coupling agent on the bottom of the piezoelectric wafer 7, then enabling the piezoelectric wafer to be in contact with the surface of a tested piece, and placing the piezoelectric wafer above the tested piece;
3) connecting the installed clamp with a vacuum adsorption device 8 through a connecting bolt 6, adjusting the relative position of the clamp and the vacuum adsorption device 8 and the swing angle of the ball bearing connecting piece 3 to ensure that the piezoelectric wafer 7 is in contact with the surface of a tested piece, enabling the axis of the piezoelectric wafer 7 to be vertical to the surface of the tested piece, starting the vacuum adsorption device 8, and adsorbing a movable probe on the surface of the tested piece;
4) on the basis of the completion, the driver is controlled by the PC end to drive the piezoelectric actuator 2, and closed-loop control is performed according to the return value of the pressure sensor 5 to ensure that the pressing force reaches the required value;
5) and (5) confirming that all parts of the mobile probe are stably connected and work normally, and then starting testing.
The invention has the beneficial effects that: the movable probe of the integrated piezoelectric wafer with adjustable pressing force can be attached to the surface of any object to be detected without additional clamping equipment. The pressing force between the piezoelectric wafer and the tested piece can be adjusted by adjusting the driving voltage of the piezoelectric actuator while the adsorption is stabilized, the pressing force can be guaranteed to accurately reach a required value, meanwhile, the piezoelectric wafer is guaranteed to be in contact with the surface of the tested piece by adjusting the swing angle of the ball bearing connecting piece, the axis of the piezoelectric wafer is perpendicular to the surface of the tested piece, and finally the effects of guaranteeing the uniformity of the stress of the piezoelectric wafer and the uniformity of the thickness of a coupling layer between the piezoelectric wafer and the tested piece are achieved.
Drawings
FIG. 1 is a front view of a piezo-electric wafer integrated mobile probe of the present invention with adjustable clamping force;
FIG. 2 is a left side view of a piezo wafer integrated mobile probe of the present invention with adjustable clamping force;
FIG. 3 is a cross-sectional view of the adjustable clamping force integrated piezoelectric wafer traveling probe of the present invention taken along the line A-A of FIG. 2;
FIG. 4 is a cross-sectional view of a piezo-electric wafer integrated traveling probe of the present invention with adjustable clamping force taken along the line B-B in FIG. 2;
in the figure: 1, an arch-shaped connecting piece; 2 a piezoelectric actuator; 3 a ball bearing connection; 4, a clamp shell; 5 a pressure sensor; 6, connecting a bolt; 7 a piezoelectric wafer; 8, an empty adsorption device; and 9, a nut.
Detailed Description
The following further describes a specific embodiment of the present invention with reference to the drawings and technical solutions.
A movable probe of an integrated piezoelectric wafer with adjustable pressing force comprises an arch-shaped connecting piece 1, a piezoelectric actuator 2, a ball bearing connecting piece 3, a clamp shell 4, a pressure sensor 5, a connecting bolt 6, a piezoelectric wafer 7 and a vacuum adsorption device 8. Based on the bow-shaped connecting piece 1, the top end of the bow-shaped connecting piece is provided with a bolt hole and is connected with the piezoelectric actuator 2 through a bolt, one end far away from the bolt hole at the top end is provided with two bolt holes and is connected with the vacuum adsorption device 8 through the connecting bolt 6, the relative position of the connecting bolt 6 and the bow-shaped connecting piece 1 is fixed, and the relative height of the lower surface of the piezoelectric wafer 7 and the adsorption action surface of the vacuum adsorption device 8 is adjusted by adjusting the position of the connecting bolt 6 in a sliding chute of the vacuum adsorption device 8 so as to be suitable for the piezoelectric wafers 7 with different. The upper end of the ball bearing connecting piece 3 is connected with the piezoelectric actuator 2 through threads, and the lower end of the ball bearing connecting piece is connected with the clamp shell 4 through bolts. The pressure sensor 5 and the piezoelectric wafer 7 are placed in the jig housing 4, wherein the upper surface of the piezoelectric wafer 7 is in contact with the lower surface of the pressure sensor 5.
The implementation steps of the invention are as follows:
1) placing a pressure sensor 5 and a piezoelectric wafer 7 in a clamp shell 4, placing the pressure sensor 5 according to the using mode of the pressure sensor and placing the pressure sensor at the upper side in the clamp shell 4, and placing the piezoelectric wafer 7 at the lower side; connecting the flange end of the ball bearing connecting piece 3 to the corresponding position of the clamp shell 4 by using a bolt; then the lower end of the piezoelectric actuator 2 is connected to the threaded end of the ball bearing connecting piece 3; the upper end of the bow connector 1 is then connected to the upper end of the piezoelectric actuator 2.
2) A certain amount of couplant is smeared on the bottom of the piezoelectric wafer 7, then the couplant is contacted with the surface of a tested piece and is placed above the tested piece.
3) And connecting the partially-mounted clamp subjected to the two steps with a vacuum adsorption device 8 through a connecting bolt 6, adjusting the relative position of the clamp and the vacuum adsorption device and adjusting the swing angle of the ball bearing connecting piece 3 to ensure that the piezoelectric wafer 7 is in contact with the surface of the tested piece, enabling the axis of the piezoelectric wafer 7 to be perpendicular to the surface of the tested piece, starting the vacuum connection device 8, and adsorbing the movable probe on the surface of the tested piece.
4) On the basis of the completion, the driver is controlled by the PC end to drive the piezoelectric actuator 2, the pressing force is transmitted along the path of the piezoelectric actuator 2, the ball bearing connecting piece 3, the clamp shell 4, the pressure sensor 5 and the piezoelectric wafer 7, and meanwhile, closed-loop control is performed according to the pressing force value returned by the pressure sensor 5 in real time, so that the pressing force is ensured to accurately reach a required value, and the uniformity of the stress of the piezoelectric wafer 7 and the uniformity of the thickness of a coupling layer between the piezoelectric wafer and a tested piece are ensured.
5) After the operation is completed, the connection stability of all parts of the movable probe is confirmed, and the test can be started when the operation is normal.
Claims (1)
1. The movable probe of the integrated piezoelectric wafer with adjustable pressing force is characterized by comprising an arched connecting piece (1), a piezoelectric actuator (2), a ball bearing connecting piece (3), a clamp shell (4), a pressure sensor (5), a connecting bolt (6), a piezoelectric wafer (7) and a vacuum adsorption device (8); the top end of the arched connecting piece (1) is provided with bolt holes and is connected with the piezoelectric actuator (2) through bolts, one end of the arched connecting piece (1) far away from the bolt holes at the top end is provided with two bolt holes and is connected with the vacuum adsorption device (8) through a connecting bolt (6), the connecting bolt (6) and the arched connecting piece (1) are fixed in relative position, and the relative height between the lower surface of the piezoelectric wafer (7) and the adsorption action surface of the vacuum adsorption device (8) is adjusted by adjusting the position of the connecting bolt (6) in a chute of the vacuum adsorption device (8) so as to adapt to the piezoelectric wafers (7) with different thicknesses; the upper end of the ball head bearing connecting piece (3) is connected with the piezoelectric actuator (2) through threads, and the lower end of the ball head bearing connecting piece is connected with the clamp shell (4) through a bolt; the pressure sensor (5) and the piezoelectric wafer (7) are placed in the clamp shell (4), wherein the upper surface of the piezoelectric wafer (7) is in contact with the lower surface of the pressure sensor (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010174700.8A CN111366183A (en) | 2020-03-13 | 2020-03-13 | Mobile probe of integrated piezoelectric wafer with adjustable pressing force |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010174700.8A CN111366183A (en) | 2020-03-13 | 2020-03-13 | Mobile probe of integrated piezoelectric wafer with adjustable pressing force |
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| Publication Number | Publication Date |
|---|---|
| CN111366183A true CN111366183A (en) | 2020-07-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010174700.8A Withdrawn CN111366183A (en) | 2020-03-13 | 2020-03-13 | Mobile probe of integrated piezoelectric wafer with adjustable pressing force |
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| Country | Link |
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| CN (1) | CN111366183A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008038234A1 (en) * | 2007-12-20 | 2009-07-02 | Selic, Heinz A., Dr. | Sensor for integrated muscle power display, for measuring muscle strain and muscle power at e.g. biceps, has pressure transducer and adjusting mechanism adjusting initial pressure at muscle |
| CN101793579A (en) * | 2010-02-08 | 2010-08-04 | 东南大学 | Calibration device of miniature pressure sensor |
| CN101915678A (en) * | 2010-08-04 | 2010-12-15 | 大连理工大学 | Method and device for mounting piezoelectric wafer used for structure health monitoring |
| CN104931589A (en) * | 2015-07-16 | 2015-09-23 | 常州市常超电子研究所有限公司 | Angle-adjustable ultrasonic probe |
| CN107764443A (en) * | 2017-09-20 | 2018-03-06 | 中铝材料应用研究院有限公司 | Portable ultraphonic residual stress detector |
| CN108217587A (en) * | 2017-12-16 | 2018-06-29 | 渤海大学 | For the four-axle type seat excitation apparatus of MEMS micro-structure dynamic characteristics test |
| CN209992441U (en) * | 2019-02-26 | 2020-01-24 | 山东省特种设备检验研究院有限公司 | Acoustic emission sensor fixing device |
-
2020
- 2020-03-13 CN CN202010174700.8A patent/CN111366183A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102008038234A1 (en) * | 2007-12-20 | 2009-07-02 | Selic, Heinz A., Dr. | Sensor for integrated muscle power display, for measuring muscle strain and muscle power at e.g. biceps, has pressure transducer and adjusting mechanism adjusting initial pressure at muscle |
| CN101793579A (en) * | 2010-02-08 | 2010-08-04 | 东南大学 | Calibration device of miniature pressure sensor |
| CN101915678A (en) * | 2010-08-04 | 2010-12-15 | 大连理工大学 | Method and device for mounting piezoelectric wafer used for structure health monitoring |
| CN104931589A (en) * | 2015-07-16 | 2015-09-23 | 常州市常超电子研究所有限公司 | Angle-adjustable ultrasonic probe |
| CN107764443A (en) * | 2017-09-20 | 2018-03-06 | 中铝材料应用研究院有限公司 | Portable ultraphonic residual stress detector |
| CN108217587A (en) * | 2017-12-16 | 2018-06-29 | 渤海大学 | For the four-axle type seat excitation apparatus of MEMS micro-structure dynamic characteristics test |
| CN209992441U (en) * | 2019-02-26 | 2020-01-24 | 山东省特种设备检验研究院有限公司 | Acoustic emission sensor fixing device |
Non-Patent Citations (1)
| Title |
|---|
| 魏秀军 等: "《混凝土强度预测与推定》", 30 November 2007, 辽宁大学出版社 * |
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