CN111354662A - Pickling device for removing phosphorus and silicon glass from silicon wafer for preparing solar cell - Google Patents
Pickling device for removing phosphorus and silicon glass from silicon wafer for preparing solar cell Download PDFInfo
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- CN111354662A CN111354662A CN202010162896.9A CN202010162896A CN111354662A CN 111354662 A CN111354662 A CN 111354662A CN 202010162896 A CN202010162896 A CN 202010162896A CN 111354662 A CN111354662 A CN 111354662A
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- pickling
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- 238000005554 pickling Methods 0.000 title claims abstract description 80
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 61
- 239000010703 silicon Substances 0.000 title claims abstract description 61
- 239000011521 glass Substances 0.000 title claims abstract description 30
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 239000011574 phosphorus Substances 0.000 title claims abstract description 14
- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 14
- 238000004140 cleaning Methods 0.000 claims abstract description 72
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims abstract description 70
- 239000002253 acid Substances 0.000 claims abstract description 66
- 238000002360 preparation method Methods 0.000 claims abstract description 60
- 238000005406 washing Methods 0.000 claims abstract description 41
- 238000007789 sealing Methods 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 238000001914 filtration Methods 0.000 claims abstract description 15
- ABTOQLMXBSRXSM-UHFFFAOYSA-N silicon tetrafluoride Chemical compound F[Si](F)(F)F ABTOQLMXBSRXSM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 235000012431 wafers Nutrition 0.000 claims description 35
- 230000001681 protective effect Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 4
- 239000003973 paint Substances 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000007788 liquid Substances 0.000 claims description 3
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 2
- HIVGXUNKSAJJDN-UHFFFAOYSA-N [Si].[P] Chemical compound [Si].[P] HIVGXUNKSAJJDN-UHFFFAOYSA-N 0.000 claims 1
- 235000021110 pickles Nutrition 0.000 claims 1
- 239000007789 gas Substances 0.000 abstract description 15
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 239000002341 toxic gas Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000005360 phosphosilicate glass Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- -1 hexafluorosilicic acid Chemical compound 0.000 description 2
- XLUBVTJUEUUZMR-UHFFFAOYSA-B silicon(4+);tetraphosphate Chemical compound [Si+4].[Si+4].[Si+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O XLUBVTJUEUUZMR-UHFFFAOYSA-B 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000005574 cross-species transmission Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a silicon chip phosphorus and silicon removing glass pickling device for solar cell preparation, which belongs to the technical field of solar cell preparation, and the device can disperse and store hydrofluoric acid solution in advance through the matching of a pickling box and a corrosive acid preparation box, when a cleaning basket containing silicon chips is placed in a cleaning tank, the cleaning basket is fixed through a fixing mechanism, a sealing plate seals the pickling box, then the hydrofluoric acid solution in the corrosive acid preparation box is introduced into the pickling box, technicians cannot contact the hydrofluoric acid solution to play a role in protection when the silicon chips are placed, and the cleaning basket rotates along with a rotating motor during pickling, so that the pickling impact force of the hydrofluoric acid solution on the silicon chips is easily improved, and the removal efficiency of the phosphorus and silicon glass on the silicon chips is favorably improved, and gaseous silicon tetrafluoride generated by the reaction is introduced into the gas filtering tank in the acid washing process, so that toxic gas is easily treated.
Description
Technical Field
The invention relates to the technical field of solar cell preparation, in particular to a silicon phosphate and silicon glass removing and pickling device for a silicon wafer for solar cell preparation.
Background
In the production and manufacturing process of the solar cell, the production process flow of the solar cell is divided into the process flows of silicon wafer detection, surface texture making, diffusion and knot making, phosphorosilicate glass removal, plasma etching, antireflection film plating, screen printing, rapid sintering and the like.
The dephosphorized silica glass is an unimportant process flow, and a layer of SiO2 containing phosphorus elements is formed on the surface of a silicon wafer in the phosphorus diffusion process, so that the silicon wafer is called as phosphorosilicate glass (PSG). The formed phosphosilicate glass increases the recombination of electrons in an emission region, resulting in the reduction of minority carrier lifetime; is easily affected by moisture in the air, resulting in reduced current and power decay; the phosphorosilicate glass is easy to cause chromatic aberration after PECVD coating, so that the phosphorosilicate glass on the surface of a silicon wafer needs to be removed, the phosphorosilicate glass on the silicon wafer is most commonly removed by a phosphorosilicate glass removing process through a chemical corrosion method, and the silicon wafer is soaked in a hydrofluoric acid solution in a specific operation.
At present, a silicon wafer to be processed is generally placed in a cleaning tank containing hydrofluoric acid solution to generate a chemical reaction to generate soluble complex hexafluorosilicic acid, and the silicon wafer is soaked in the hydrofluoric acid solution to generate the chemical reaction to generate the soluble complex hexafluorosilicic acid, so that the acid cleaning efficiency of the simple acid cleaning and cleaning operation is still to be improved; meanwhile, the hydrofluoric acid solution has certain corrosivity, so that the operation is not easy to be simple and convenient for technicians; in addition, the hydrofluoric acid solution reacts with the phosphorosilicate glass to generate gaseous silicon tetrafluoride, which is toxic, so that the gaseous silicon tetrafluoride is collected and treated when the phosphorosilicate glass is removed.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a silicon chip phosphorus-silicon-removing glass pickling device for solar cell preparation, wherein a hydrofluoric acid solution can be dispersed and stored in advance through the matching of a pickling box and a corrosive acid preparation box, when a cleaning basket provided with silicon chips is placed in a cleaning tank in the pickling box, the cleaning basket is fixed with the cleaning basket through a fixing mechanism at the driving end of a rotating motor, a sealing plate seals the opening of a second protection box, then the hydrofluoric acid solution in the corrosive acid preparation box is introduced into the pickling box, when the silicon chips are placed, a technician cannot contact the corrosive hydrofluoric acid solution, the technical personnel are protected, the operation is simplified, when the pickling is carried out, the cleaning basket rotates along with the rotating motor, the cleaning impact force of the hydrofluoric acid solution on the silicon chips is easy to improve, thereby be favorable to improving efficiency and the thoroughness of getting rid of the phosphosilicate glass on the silicon chip, in addition, leading-in gaseous silicon tetrafluoride that will react and produce to the gas filtration pond in the pickling process, easily handle toxic gas.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A silicon wafer removing phosphorosilicate glass pickling device for solar cell preparation comprises an operation table and a pickling box fixedly mounted on the front side of the upper end of the operation table, wherein a plurality of cleaning grooves are formed in the pickling box, the adjacent cleaning grooves are communicated with each other through a plurality of through holes, a corrosive acid preparation box is fixedly mounted on the rear side of the upper end of the operation table and is located above the side of the pickling box, a plurality of communicating pipes with electromagnetic valves are fixedly connected to the bottom end of the corrosive acid preparation box along the horizontal direction of the bottom end of the corrosive acid preparation box, the bottom ends of the communicating pipes are respectively communicated with the inner walls of the plurality of cleaning grooves, a first protection box with a feed inlet is fixedly connected to the top end of the corrosive acid preparation box, a second protection box with an opening is fixedly mounted on the pickling box, and a sealing mechanism for sealing the opening is fixedly connected to the front end of the operation table, it is a plurality of all the cover is equipped with the washing basket in the washing tank, the top of second protective housing is followed its horizontal direction fixed mounting and is had a plurality of rotating electrical machines that correspond with the washing tank position, and is a plurality of rotating electrical machines's drive end runs through the top of second protective housing and fixedly connected with carries out fixed establishment to the washing basket, one side of operation panel is equipped with the gas filtration pond, first air duct of fixedly connected with and second air duct respectively on the lateral wall of first protective housing and second protective housing, and the bottom of first air duct and second air duct all extends to the gas filtration pond in.
Furthermore, the pickling case and the corrosive acid preparation case are respectively an ultrasonic cleaning machine and an ultrasonic dispersion machine, and the inner walls of the pickling case and the corrosive acid preparation case are coated with high-strength anticorrosive coatings.
Further, the top face of first protective housing is provided with transparent observation window, equal fixedly connected with fixture block on the left and right sides lateral wall that first protective housing is close to the lower extreme, corrosive acid preparation box all rotates on being close to the left and right sides lateral wall of upper end and is connected with the buckle of establishing with the fixture block card, and first protective housing can be followed corrosive acid preparation box and demolishd, easily cleans corrosive acid preparation incasement portion.
Further, the cleaning basket is a cylindrical charging basket with a charging hole at the upper end, the cylindrical charging basket is of a hollow structure, a connecting rod is fixedly connected to the inner bottom of the cleaning basket, separating nets are fixedly connected to the side walls of the two sides of the connecting rod, the top ends of the connecting rods extend to the upper portions of the separating nets, high-strength anticorrosive coatings are coated on the cleaning basket in the same way, the hollow cleaning basket is used for containing silicon wafers to be treated, and the silicon wafers are easy to contact with corrosive acid in a cleaning tank.
Further, fixed establishment includes fixed connection in the electric putter of rotating electrical machines drive end, electric putter's flexible end front portion threaded connection has fixed cover, the bottom fixedly connected with thread bush of fixed cover.
Further, thread bush threaded connection is on the lateral wall of connecting rod, electric putter's flexible end extends to the thread bush outside, and the screw rod cover is under rotating electrical machines and electric putter's mating reaction, downstream and rotation to can the screw-thread bush on the connecting rod of washing basket, wash the basket owing to have certain weight, thereby easily threaded connection between the two, to a certain extent when threaded connection, electric putter drives and washs the basket and breaks away from the washing tank bottom, when rotating electrical machines continues to rotate, the washing basket then can carry out synchronous revolution along with rotating electrical machines.
Further, sealing mechanism establishes the riser of connecting in the operation panel front end including fixed the inlaying, the inside activity of riser is inserted and is equipped with the closing plate, the electric telescopic handle that promotes the closing plate is installed to the bottom of riser, after the washing basket location, upwards drives the closing plate, and the opening part of closing plate to the second protective box seals to the realization is sealed the pickling box, prevents that toxic gas from revealing.
Furthermore, the bottom of pickling case and corrosive acid preparation case all is connected with the fluid-discharge tube that has the valve, and the fluid-discharge tube is connected with external treatment facility.
A silicon wafer phosphorosilicate glass removing acid pickling device for solar cell preparation comprises the following steps:
s1: the technical personnel firstly carry out water washing and drying treatment on the interiors of the pickling tank and the corrosive acid preparation tank, introduce a certain amount of pickling solution (hydrofluoric acid solution) into the corrosive acid preparation tank through a feed inlet on the first protection tank, and carry out dispersion treatment on the hydrofluoric acid solution through the corrosive acid preparation tank;
s2: placing a certain amount of silicon wafers to be processed in a cleaning basket, placing the cleaning basket in a cleaning tank, positioning a connecting rod in the cleaning basket under a fixing mechanism, synchronously starting a rotating motor and an electric push rod at the moment, driving a threaded sleeve on a telescopic end of the electric push rod to move downwards by the electric push rod, connecting the threaded sleeve outside the connecting rod, and enabling the threaded sleeve to be in threaded connection with the outer wall of the connecting rod under the rotation of the rotating motor;
s3: after the cleaning basket is fixed, the sealing plate is pushed upwards, the sealing plate seals the opening of the second protection box, at the moment, dispersed hydrofluoric acid solution is introduced into the pickling box through the communicating pipes, and meanwhile, the rotating motor continues to rotate, so that the cleaning basket is driven to rotate, and the pickling degree of the silicon wafers in the cleaning basket is effectively improved;
s4: meanwhile, in the acid cleaning process, the hydrofluoric acid solution and the phosphorosilicate glass react to generate gaseous silicon tetrafluoride, the gaseous silicon tetrafluoride is guided into the gas filter tank through the first gas guide pipe and the second gas guide pipe, and the sodium hydroxide solution is filled in the gas filter tank, so that the gaseous silicon tetrafluoride is effectively removed.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) the scheme can disperse hydrofluoric acid solution and store the hydrofluoric acid solution in advance through the matching of the pickling tank and the corrosive acid preparation tank, when the cleaning basket provided with the silicon wafer is placed in a cleaning tank in the pickling tank, the cleaning basket is fixed through a fixing mechanism at the driving end of the rotating motor, the sealing plate seals the opening of the second protection tank, then the hydrofluoric acid solution in the corrosive acid preparation tank is guided into the pickling tank, technicians cannot contact with the corrosive hydrofluoric acid solution when placing the silicon wafer and can protect technicians, the operation is simplified, when pickling is carried out, the cleaning basket rotates along with the rotating motor, the cleaning impact force of the hydrofluoric acid solution on the silicon wafer is easily improved, so that the removal efficiency and the thoroughness of phosphorosilicate glass on the silicon wafer can be improved, in addition, gaseous silicon tetrafluoride generated by reaction is guided into the gas filtering tank in the pickling process, it is easy to treat toxic gas.
(2) Fixed establishment includes fixed connection in the electric putter of rotating electrical machines drive end, electric putter's the anterior threaded connection of flexible end has fixed cover, the bottom fixedly connected with thread bush of fixed cover, thread bush threaded connection is on the lateral wall of connecting rod, electric putter's flexible end extends to the thread bush outside, the screw rod cover is under rotating electrical machines and electric putter's mating reaction, downstream and rotation, thereby can the screw thread cup joint on the connecting rod of washing basket, the washing basket is owing to have certain weight, thereby easily threaded connection between the two, to a certain extent when threaded connection, electric putter drives the washing basket and breaks away from the washing tank bottom, when the rotating electrical machines continues to rotate, the washing basket then can carry out synchronous revolution along with the rotating electrical machines, easily improve the contact impact force of corrosive acid and silicon chip.
(3) Sealing mechanism establishes the riser of connecting in the operation panel front end including fixed the inlaying, and the inside activity of riser is inserted and is equipped with the closing plate, and the electric telescopic handle that promotes the closing plate is installed to the bottom of riser, after wasing basket location, upwards drives the closing plate, and the closing plate seals the opening part of second protective box to the realization is sealed the pickling box, prevents that toxic gas from revealing.
Drawings
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a perspective view of the junction of the pickling tank and the corrosive acid preparation tank of the present invention;
FIG. 3 is a perspective view of a second protective enclosure of the present invention;
FIG. 4 is a perspective view of the present invention at a wash basket;
FIG. 5 is a schematic view of the structure of the joint between the rotating electric machine and the fixing mechanism according to the present invention;
fig. 6 is an external perspective view of the present invention.
The reference numbers in the figures illustrate:
1 operation panel, 2 pickling case, 201 washing tank, 202 through-holes, 3 corrosive acid preparation casees, 4 communicating pipes, 5 first guard boxes, 501 feed inlet, 6 second guard boxes, 7 rotating electrical machines, 8 washing baskets, 801 connecting rod, 802 separation net, 9 electric putter, 10 fixed cover, 11 thread bush, 12 riser, 13 sealing plate, 14 first air duct, 15 second air duct, 16 gas filtration pond.
Detailed Description
The drawings in the embodiments of the invention will be combined; the technical scheme in the embodiment of the invention is clearly and completely described; obviously; the described embodiments are only some of the embodiments of the invention; but not all embodiments, are based on the embodiments of the invention; all other embodiments obtained by a person skilled in the art without making any inventive step; all fall within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1:
referring to fig. 1-2, a silicon phosphate silicate glass pickling device is removed with silicon chip for solar wafer preparation, including operation panel 1 and pickling case 2 of fixed mounting in the front side of operation panel 1 upper end, pickling case 2 is inside to be seted up a plurality of washing tanks 201, link together through a plurality of through-holes 202 between two adjacent washing tanks 201, be used for separating the silicon chip that treats to handle and place the processing, operation panel 1's upper end rear side fixed mounting has corrosive acid preparation case 3, corrosive acid preparation case 3 is located the side top of pickling case 2, corrosive acid preparation case 3's bottom is along its horizontal direction fixedly connected with a plurality of communicating pipes 4 that have the solenoid valve, the bottom of a plurality of communicating pipes 4 is linked together with the inner wall of a plurality of washing tanks 201 respectively.
Pickling case 2 and corrosive acid preparation case 3 are ultrasonic cleaner and ultrasonic wave dispenser respectively, all coating has high strength anticorrosive paint on the inner wall of pickling case 2 and corrosive acid preparation case 3, corrosive acid preparation case 3 can carry out decentralized processing to hydrofluoric acid solution and save in advance, place back in washing tank 201 when the silicon chip of treating, again will realize dispersing complete hydrofluoric acid solution leading-in to pickling case 2 in, realize subsequent pickling, thereby effectively avoid the technical staff can contact the hydrofluoric acid solution that has the corrosivity when placing the silicon chip, play the guard action to the technical staff.
Top fixedly connected with of corrosive acid preparation case 3 has first guard box 5 of feed inlet 501, the top face of first guard box 5 is provided with transparent observation window, it is leading-in to corrosive acid preparation case 3 with corrosive acid solution through feed inlet 501, in addition, first guard box 5 is close to equal fixedly connected with fixture block on the left and right sides lateral wall of lower extreme, corrosive acid preparation case 3 is close to all to rotate on the left and right sides lateral wall of upper end and is connected with the buckle of being connected with the fixture block card, first guard box 5 can be followed corrosive acid preparation case 3 and demolishd, easily clean 3 insides of corrosive acid preparation case, and first guard box 5 plays sealed effect to corrosive acid preparation case 3, effectively avoid technical staff to receive the corruption influence of corrosive acid.
Please refer to fig. 1 and fig. 3, fixed mounting has open-ended second guard box 6 in the front side on the pickling case 2, the front end fixedly connected with of operation panel 1 carries out the sealing mechanism sealed to the opening, all the cover is equipped with cleaning basket 8 in a plurality of washing tanks 201, cleaning basket 8 is used for holding the silicon chip, play and conclude and separate the pickling effect, place cleaning basket 8 in washing tank 201 after, seal through the opening part of sealing mechanism to second guard box 6, the realization is sealed the pickling case 2 and is handled, thereby effectively avoid the toxic gas that the pickling in-process produced to spill over.
Specifically, wash basket 8 and be equipped with the cylindrical charging basket of charging hole for the upper end, cylindrical charging basket is hollow out construction, wash basket 8's interior bottom fixedly connected with connecting rod 801, equal fixedly connected with separates net 802 on connecting rod 801's the both sides lateral wall, connecting rod 801's top extends to the upper portion that separates net 802, also the coating has high strength anticorrosive paint on wash basket 8, the wash basket 8 of fretwork form is used for treating the silicon chip and carries out the splendid attire, easily the silicon chip contacts with the corrosive acid in the washing tank 201.
The top of second protective box 6 has a plurality of rotating electrical machines 7 that correspond with washing tank 201 position along its horizontal direction fixed mounting, and the drive end of a plurality of rotating electrical machines 7 runs through the top of second protective box 6 and fixedly connected with carries out the fixed establishment to washing basket 8, and is concrete, and fixed establishment includes fixed connection in the electric putter 9 of rotating electrical machines 7 drive end, and the anterior threaded connection of the flexible end of electric putter 9 has fixed cover 10, and the bottom fixedly connected with thread bush 11 of fixed cover 10.
11 threaded connection of thread bush on connecting rod 801's lateral wall, electric putter 9's flexible end extends to 11 outsides of thread bush, screw bush 11 is under rotating electrical machines 7 and electric putter 9's mating reaction, downstream and rotation, thereby can the screw thread cup joint on washing basket 8's connecting rod 801, wash basket 8 owing to have certain weight, thereby easily threaded connection between the two, to a certain extent when threaded connection, electric putter 9 drives washing basket 8 and breaks away from washing tank 201 bottom, when rotating electrical machines 7 continues to rotate, washing basket 8 then can carry out synchronous revolution along with rotating electrical machines 7, effectively improved the pickling degree of silicon chip in the washing basket 8.
After washing basket 8 is fixed in the fixed establishment bottom, protect next 6 openings through sealing mechanism to the second and carry out sealed processing, it is concrete, sealing mechanism establishes the riser 12 of connecting in the 1 front end of operation panel including fixed the inlaying, riser 12 inside activity is inserted and is equipped with closing plate 13, the electric telescopic handle who promotes closing plate 13 is installed to the bottom of riser 12, after washing basket 8 location, upwards drive closing plate 13, closing plate 13 seals the opening part of second protecting box 6, thereby realize sealing pickling box 2, prevent that toxic gas from revealing.
One side of operation panel 1 is equipped with gaseous filtration pond 16, do not be fixedly connected with first air duct 14 and second air duct 15 on the lateral wall of first guard box 5 and second guard box 6, and the bottom of first air duct 14 and second air duct 15 all extends to in the gaseous filtration pond 16, at the in-process of pickling, hydrofluoric acid solution can generate gaseous silicon tetrafluoride with phosphosilicate glass after the pickling incasement 2 internal reaction, and hydrofluoric acid solution also can produce poisonous violent pungent smell when corrosive acid prepares incasement 3 internal dispersion, thereby through first air duct 14 and second air duct 15, handle toxic gas leading-in to filtration pond 16.
In addition, the bottom of pickling case 2 and corrosive acid preparation case 3 all is connected with the fluid-discharge tube that has the valve, and the fluid-discharge tube is connected with external treatment facility, is used for discharging the unnecessary liquid in pickling case 2 and the corrosive acid preparation case 3 through the fluid-discharge tube.
It should be emphasized here that, when the technical staff is operating, wear the protective clothing according to actual need, wear protective gloves and gas mask, avoid directly contacting the silicon chip with the hand, after pickling is accomplished, at first, drive washing basket 8 through electric putter 11 and move a certain distance upwards, washing basket 8 breaks away from with washing tank 201 mutually, second guard box 6 has a certain height, it is dry to be enough to promote washing basket 8 to a certain height after, retrieve sealing plate 13 downwards again, connecting rod 801 in washing basket 8 has a certain height, it does not contact with corrosive acid, technical staff's accessible contact connecting rod 801 takes, technical staff takes washing basket 8 out and cleans and dries with the pure water, this process is prior art, do not do too much here and describe again.
A silicon wafer phosphorosilicate glass removing acid pickling device for solar cell preparation comprises the following steps:
s1: a technician firstly carries out water washing and drying treatment on the interiors of the pickling tank 2 and the corrosive acid preparation tank 3, introduces a certain amount of pickling solution (hydrofluoric acid solution) into the corrosive acid preparation tank 3 through a feed port 501 on the first protection tank 5, and carries out dispersion treatment on the hydrofluoric acid solution through the corrosive acid preparation tank 3;
s2: placing a certain amount of silicon wafers to be processed in a cleaning basket 8, placing the cleaning basket 8 in a cleaning tank 201, positioning a connecting rod 801 in the cleaning basket 8 under a fixing mechanism, synchronously starting a rotating motor 7 and an electric push rod 9 at the moment, driving a threaded sleeve 11 on a telescopic end of the electric push rod 9 to move downwards by the electric push rod 9, sleeving the threaded sleeve 11 on the outer side of the connecting rod 801, enabling the threaded sleeve 11 to be in threaded connection with the outer wall of the connecting rod 801 under the rotation of the rotating motor 7, driving the cleaning basket 8 to move upwards by the electric push rod 9 after the connection is completed, enabling the bottom end of the cleaning basket 8 to have a certain distance with the bottom of the cleaning tank 201, and then enabling the rotating motor 7 to rotate without affecting the connection position of the cleaning basket 8;
s3: after the cleaning basket 8 is fixed, the sealing plate 13 is pushed upwards, the opening of the second protection box 6 is sealed by the sealing plate 13, at the moment, the dispersed hydrofluoric acid solution is introduced into the pickling box 2 through the communicating pipes 4, and meanwhile, the rotating motor 11 continues to rotate, so that the cleaning basket 8 is driven to rotate, and the pickling degree of silicon wafers in the cleaning basket 8 is effectively improved;
s4: meanwhile, in the acid cleaning process, gaseous silicon tetrafluoride can be generated after the hydrofluoric acid solution reacts with the phosphorosilicate glass, the gaseous silicon tetrafluoride is guided into the gas filtering tank 16 through the first gas guide pipe 14 and the second gas guide pipe 15, and the gas filtering tank 16 is internally provided with a sodium hydroxide solution, so that the gaseous silicon tetrafluoride is effectively removed.
The above; but are merely preferred embodiments of the invention; the scope of the invention is not limited thereto; any person skilled in the art is within the technical scope of the present disclosure; the technical scheme and the improved concept of the invention are equally replaced or changed; are intended to be covered by the scope of the present invention.
Claims (9)
1. The utility model provides a phosphorus silicon glass acid dip pickle is got rid of to silicon chip for solar wafer preparation, includes operation panel (1) and fixed mounting in the pickling case (2) of operation panel (1) upper end front side, its characterized in that: a plurality of cleaning tanks (201) are arranged inside the pickling tank (2), two adjacent cleaning tanks (201) are communicated with each other through a plurality of through holes (202), a corrosive acid preparation tank (3) is fixedly mounted on the rear side of the upper end of the operating platform (1), the corrosive acid preparation tank (3) is located above the pickling tank (2), a plurality of communicating pipes (4) with electromagnetic valves are fixedly connected to the bottom end of the corrosive acid preparation tank (3) along the horizontal direction of the bottom end of the corrosive acid preparation tank, the bottom ends of the communicating pipes (4) are respectively communicated with the inner walls of the plurality of cleaning tanks (201), and a first protection tank (5) with a feeding hole (501) is fixedly connected to the top end of the corrosive acid preparation tank (3);
a second protective box (6) with an opening at the front side is fixedly arranged on the pickling box (2), the front end of the operating platform (1) is fixedly connected with a sealing mechanism for sealing the opening, a plurality of cleaning tanks (201) are all sleeved with cleaning baskets (8), a plurality of rotating motors (7) corresponding to the cleaning tank (201) are fixedly arranged at the top end of the second protection box (6) along the horizontal direction, the driving ends of the rotating motors (7) penetrate through the top end of the second protection box (6) and are fixedly connected with a fixing mechanism for fixing the cleaning basket (8), a gas filtering tank (16) is arranged on one side of the operating platform (1), a first gas guide pipe (14) and a second gas guide pipe (15) are respectively and fixedly connected to the side walls of the first protective box (5) and the second protective box (6), and the bottom ends of the first air duct (14) and the second air duct (15) both extend into the gas filtering tank (16).
2. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the pickling tank (2) and the corrosive acid preparation tank (3) are respectively an ultrasonic cleaning machine and an ultrasonic dispersion machine, and the inner walls of the pickling tank (2) and the corrosive acid preparation tank (3) are coated with high-strength anticorrosive paint.
3. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the top end face of first protective housing (5) is provided with transparent observation window, equal fixedly connected with fixture block on the left and right sides lateral wall that first protective housing (5) is close to the lower extreme, all rotate on the left and right sides lateral wall that corrosive acid preparation box (3) is close to the upper end and be connected with the buckle of being connected with the fixture block card.
4. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the cleaning basket (8) is a cylindrical charging basket with a charging hole at the upper end, the cylindrical charging basket is of a hollow structure, a connecting rod (801) is fixedly connected to the inner bottom of the cleaning basket (8), separating nets (802) are fixedly connected to the side walls of the two sides of the connecting rod (801), the top ends of the connecting rods (801) extend to the upper portions of the separating nets (802), and high-strength anticorrosive paint is coated on the cleaning basket (8) in the same way.
5. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the fixing mechanism comprises an electric push rod (9) fixedly connected to the driving end of the rotating motor (7), the front part of the telescopic end of the electric push rod (9) is in threaded connection with a fixing sleeve (10), and the bottom end of the fixing sleeve (10) is fixedly connected with a threaded sleeve (11).
6. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 5, wherein: the threaded sleeve (11) is in threaded connection with the outer side wall of the connecting rod (801), and the telescopic end of the electric push rod (9) extends to the outside of the threaded sleeve (11).
7. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the sealing mechanism comprises a vertical plate (12) fixedly embedded and connected to the front end of the operating platform (1), a sealing plate (13) is movably inserted in the vertical plate (12), and an electric telescopic rod for pushing the sealing plate (13) is installed at the bottom of the vertical plate (12).
8. The device for removing phosphorus and silicon glass pickling by the silicon wafer for preparing the solar cell as claimed in claim 1, wherein: the bottom of the pickling tank (2) and the bottom of the corrosive acid preparation tank (3) are both connected with a liquid discharge pipe with a valve, and the liquid discharge pipe is connected with external processing equipment.
9. The device for removing phosphorus and silicon glass pickling by silicon wafers for preparing solar cells according to any one of claims 1 to 8, characterized in that: the using method comprises the following steps:
s1: the technical personnel firstly carry out water washing and drying treatment on the interiors of the pickling tank (2) and the corrosive acid preparation tank (3), introduce a certain amount of pickling solution (hydrofluoric acid solution) into the corrosive acid preparation tank (3) through a feed inlet (501) on the first protection tank (5), and carry out dispersion treatment on the hydrofluoric acid solution through the corrosive acid preparation tank (3);
s2: placing a certain amount of silicon wafers to be processed in a cleaning basket (8), placing the cleaning basket (8) in a cleaning tank (201), positioning a connecting rod (801) in the cleaning basket (8) right below a fixing mechanism, synchronously starting a rotating motor (7) and an electric push rod (9), driving a threaded sleeve (11) on a telescopic end of the electric push rod (9) to move downwards by the electric push rod (9), sleeving the threaded sleeve (11) on the outer side of the connecting rod (801), connecting the threaded sleeve (11) with the outer wall of the connecting rod (801) in a threaded manner under the rotation of the rotating motor (7), driving the cleaning basket (8) to move upwards by the electric push rod (9) after connection is completed, enabling the bottom end of the cleaning basket to have a certain distance with the bottom of the cleaning tank (201), and not influencing the connection position of the cleaning basket (8) due to the rotation of the rotating motor (7);
s3: after the cleaning basket (8) is fixed, the sealing plate (13) is pushed upwards, the opening of the second protective box (6) is sealed by the sealing plate (13), at the moment, dispersed hydrofluoric acid solution is introduced into the pickling box (2) through the communicating pipes (4), and meanwhile, the rotating motor (11) continues to rotate, so that the cleaning basket (8) is driven to rotate, and the pickling degree of silicon wafers in the cleaning basket (8) is effectively improved;
s4: meanwhile, in the acid cleaning process, gaseous silicon tetrafluoride can be generated after the hydrofluoric acid solution reacts with the phosphorosilicate glass, the gaseous silicon tetrafluoride is led into the gas filtering tank (16) through the first gas guide pipe (14) and the second gas guide pipe (15), and the gas filtering tank (16) is internally provided with a sodium hydroxide solution, so that the gaseous silicon tetrafluoride is effectively removed.
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| CN202010162896.9A CN111354662A (en) | 2020-03-10 | 2020-03-10 | Pickling device for removing phosphorus and silicon glass from silicon wafer for preparing solar cell |
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| CN202010162896.9A CN111354662A (en) | 2020-03-10 | 2020-03-10 | Pickling device for removing phosphorus and silicon glass from silicon wafer for preparing solar cell |
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| CN110479688A (en) * | 2019-08-05 | 2019-11-22 | 马鞍山致青工业设计有限公司 | A kind of rotary type acid dip pickle that silicon wafer production is recycled with pickling solution |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3964957A (en) * | 1973-12-19 | 1976-06-22 | Monsanto Company | Apparatus for processing semiconductor wafers |
| JP2004119417A (en) * | 2002-09-24 | 2004-04-15 | Tadahiro Omi | Rotary silicon wafer cleaning equipment |
| CN101838851A (en) * | 2010-03-22 | 2010-09-22 | 浙江明峰电子科技有限公司 | Acid washing process of monocrystalline or polycrystalline silicon wafer |
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