CN112289716A - Silicon chip processing is with removing phosphorus silicon glass acid dip pickle - Google Patents
Silicon chip processing is with removing phosphorus silicon glass acid dip pickle Download PDFInfo
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- CN112289716A CN112289716A CN202011243705.8A CN202011243705A CN112289716A CN 112289716 A CN112289716 A CN 112289716A CN 202011243705 A CN202011243705 A CN 202011243705A CN 112289716 A CN112289716 A CN 112289716A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a dephosphorization silicate glass pickling device for silicon wafer processing, which belongs to the field of silicon wafer processing and comprises a cleaning box, a hydrofluoric acid solution tank and an ionic water tank, wherein a support is arranged in the cleaning box, a lifting rod is arranged on the lower surface of an electric moving block, an output shaft of a rotating motor is connected with a rotating shaft, a plurality of groups of fixing clamps are arranged on a clamping plate, the cleaning box is divided into a pickling tank, a cleaning tank, a fine cleaning tank and a drying tank by three groups of partition plates, the ionic water tank is arranged on the cleaning box, the outlet end of a first water conveying branch pipe is communicated with the pickling tank, the outlet end of a hydrofluoric acid conveying pipe is arranged in the middle position in the pickling tank, the outlet end of a second water conveying branch pipe is provided with a spray pipe, the outlet end of a third water. The invention is convenient for the pickling solution to fully contact with the silicon wafer, is beneficial to removing the surface containing phosphorus on the silicon wafer, improves the pickling effect and efficiency, simultaneously ensures that the workers do not contact hydrofluoric acid in the whole process, and ensures the health of the workers.
Description
Technical Field
The invention relates to the field of silicon wafer processing, in particular to a dephosphorization silicate glass pickling device for silicon wafer processing.
Background
The chip made of silicon chip has remarkable calculation ability, and the chip is a modern miniature 'knowledge base' which has mythical storage ability, so that the fact that the microelectronic technology has no power in aerospace, national defense and industrial automation is well known. Under the control of a large-scale electronic computer, the unmanned plane can fly freely in the blue sky; the artificial satellite, the spacecraft and the space shuttle can accurately lift off, fly and position and automatically send back various information to the ground. Under the command of an electronic computer, artillery and missile can accurately hit target without firing, even quickly moving target in the air, including missile of enemy in flight. The computer and various sensing technologies are widely used in industry, so that the labor can be saved, the automation degree and the processing precision can be improved, and the labor production efficiency can be greatly improved. Robots have emerged in many industrial fields. They are not only complained about by labor, but also have high working speed and high precision, can collapse even in some high-temperature, underwater and dangerous working section workers, and the intelligent robot begins to show extraordinary hands before all. In the diffusion process in the chip manufacturing process, even if back-to-back diffusion is used, all surfaces of the silicon wafer, including the edges, will inevitably be diffused with phosphorus. Photo-generated electrons collected by the front surface of the PN junction can flow to the back surface of the PN junction along the region with phosphorus diffused at the edge, so that short circuit is caused, and the use of a silicon wafer is influenced.
The existing chips are generally soaked in hydrofluoric acid solution to remove phosphorosilicate glass, residual hydrofluoric acid on the silicon chips is easy to splash out when the existing phosphorosilicate glass is removed, the hydrofluoric acid has a strong corrosion effect on skin, and bronchitis, pneumonia, eye and upper respiratory tract irritation symptoms can occur to influence the safety of workers.
Disclosure of Invention
In view of the problems in the prior art, the present invention is directed to a device for pickling dephosphorized silicate glass for silicon wafer processing, which solves the problems set forth in the background art.
In order to achieve the purpose, the invention provides the following technical scheme:
a dephosphorization silicate glass pickling device for silicon wafer processing comprises a cleaning box, a hydrofluoric acid solution tank and an ionic water tank, wherein the side walls of two sides of the cleaning box are respectively provided with a feeding door and a discharging door, a support is arranged in the cleaning box, an electric moving block is arranged on the support, a lifting rod is arranged on the lower surface of the electric moving block, a rotating motor is arranged at the bottom end of the lifting rod, an output shaft of the rotating motor is connected with a rotating shaft, a clamping plate is arranged on the rotating shaft, a plurality of groups of fixing clamps are arranged on the clamping plate, three groups of clapboards are arranged in the cleaning box, the cleaning box is divided into a pickling tank, a cleaning tank, a fine cleaning tank and a drying tank by the three groups of clapboards, the ionic water tank is arranged on the cleaning box, a water pipe is arranged at the bottom end of the ionic water tank, the outlet end of the water pipe is respectively communicated with a, be equipped with hydrofluoric acid transmission pipe on the hydrofluoric acid solution jar, be equipped with the flowmeter on the hydrofluoric acid transmission pipe, hydrofluoric acid transmission pipe exit end sets up at the inside intermediate position of descaling bath, second water delivery branch pipe exit end is equipped with the spray rinsing pipe, the spray rinsing pipe sets up inside the washing tank, third water delivery branch pipe exit end is equipped with the spray disk, the inside drying apparatus that is equipped with of drying tank, stoving groove and jet plane intercommunication are equipped with the breather pipe on the jet plane, be equipped with a plurality of exit ends on the breather pipe, the exit end of breather pipe is equipped with the wind gap.
As a further scheme of the invention: the bottom end of the pickling tank is obliquely provided with a water guide plate, and the lowest end of the water guide plate is provided with a pickling solution discharge pipe.
As a further scheme of the invention: the side wall of the pickling tank is provided with an overflow pipe, and the outlet end of the overflow pipe is communicated with a pickling solution discharge pipe.
As a further scheme of the invention: a check valve is arranged between the fine cleaning tank and the cleaning tank, and a cleaning liquid discharge pipe is arranged at the bottom end of the cleaning tank.
As a further scheme of the invention: the washing tank in be equipped with the drinking-water pipe, drinking-water pipe one end is equipped with the filter screen, the filter screen setting is in the inside bottom of washing tank, the drinking-water pipe other end and second water delivery branch pipe lateral wall intercommunication, the last water pump of installing of drinking-water pipe.
As a further scheme of the invention: the support passes through the feeding door and the discharging door.
As a further scheme of the invention: and the third water delivery branch pipes and the spraying discs are provided with two groups, and the two groups of spraying discs are obliquely and internally arranged in the fine washing tank.
Compared with the prior art, the invention has the beneficial effects that: the silicon wafer cleaning device is convenient for moving the silicon wafer into the pickling tank, the pickling solution is convenient to stir during rotation, impact between the pickling solution and the silicon wafer is facilitated, contact between the silicon wafer and the pickling solution is facilitated, the surface containing phosphorus on the silicon wafer is favorably removed, the pickling effect and efficiency are improved, meanwhile, workers are guaranteed not to be in contact with hydrofluoric acid in the whole process, completion of cleaning work is guaranteed, meanwhile, the safety of the workers is prevented from being affected by the hydrofluoric acid, the health of the workers is guaranteed, residual hydrofluoric acid on the silicon wafer is conveniently removed through multiple times of washing, the silicon wafer is prevented from being corroded too much, and the use safety of subsequent silicon wafers is guaranteed. Through heating and drying, wind blowing at different angles and swinging during rotation, water stains on the silicon wafer are conveniently removed, the safety is guaranteed, and the use of subsequent silicon wafers is facilitated.
Drawings
FIG. 1 is a schematic structural diagram of a device for pickling dephosphorized silicon glass for processing silicon wafers.
FIG. 2 is a schematic view of the installation of a spray plate in a dephosphorization silicate glass pickling device for silicon wafer processing.
FIG. 3 is a schematic structural view of a tuyere in a dephosphorization and silicification pickling apparatus for silicon wafer processing.
In the figure: 1. the cleaning device comprises a cleaning box, 2, a support, 3, a feeding door, 4, an electric moving block, 5, a lifting rod, 6, a rotating motor, 7, a rotating shaft, 8, a clamping plate, 9, a fixing clamp, 10, a hydrofluoric acid solution tank, 11, a hydrofluoric acid delivery pipe, 12, a flowmeter, 13, an overflow pipe, 14, a water guide plate, 15, a pickling solution discharge pipe, 16, a partition plate, 17, an ionic water tank, 18, a filter screen, 19, a water delivery pipe, 20, a first water delivery branch pipe, 21, a second water delivery branch pipe, 22, a third water delivery branch pipe, 23, a spray pipe, 24, a water pumping pipe, 25, a water pump, 26, a spray tray, 27, a dryer, 28, an air jet, 29, an air port, 30, a discharge door, 31, a one-way valve, 32 and a cleaning solution discharge pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected" and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The first embodiment is as follows: referring to fig. 1-3, a phosphorus-removed silicate glass pickling device for silicon wafer processing comprises a cleaning box 1, a hydrofluoric acid solution tank 10 and an ionized water tank 17, wherein the side walls of two sides of the cleaning box 1 are respectively provided with a feed door 3 and a discharge door 30, a support 2 is arranged in the cleaning box 1, the support 2 passes through the feed door 3 and the discharge door 30, an electric moving block 4 is arranged on the support 2, the lower surface of the electric moving block 4 is provided with a lifting rod 5, the bottom end of the lifting rod 5 is provided with a rotating motor 6, an output shaft of the rotating motor 6 is connected with a rotating shaft 7, a clamping plate 8 is arranged on the rotating shaft 7, a plurality of groups of fixing clamps 9 are arranged on the clamping plate 8, the rotating motor 6 and the clamping plate 8 are controlled by the electric moving block 4 to pass through the feed door 3 to move to the outer side of the cleaning box 1 before work, a silicon, avoid the pickling of the two sides of centre gripping silicon chip to lead to the part of centre gripping to be unsuccessful to descale simultaneously, guarantee the thorough of follow-up silicon chip pickling descale, guarantee the security, it moves on support 2 to drive rotating electrical machines 6 and grip block 8 through electric movable block 4 simultaneously, conveniently remove the silicon chip on the fixation clamp 9 to each position of wasing 1 inside of case, conveniently carry out the washing of a plurality of steps, guarantee abluent thoroughly, make things convenient for workman's whole journey contactless hydrofluoric acid simultaneously, guarantee the completion of cleaning work, avoid hydrofluoric acid to influence workman's security simultaneously, guarantee workman's is healthy, and convenient to use.
Three groups of partition plates 16 are arranged inside the cleaning box 1, the cleaning box 1 is divided into a pickling tank, a cleaning tank, a fine cleaning tank and a drying tank by the three groups of partition plates 16, an ionic water tank 17 is arranged on the cleaning box 1, a water conveying pipe 19 is arranged at the bottom end of the ionic water tank 17, the outlet end of the water conveying pipe 19 is respectively communicated with a first water conveying branch pipe 20, a second water conveying branch pipe 21 and a third water conveying branch pipe 22, the outlet end of the first water conveying branch pipe 20 is communicated with the pickling tank, the cleaning box 1 is communicated with a hydrofluoric acid solution tank 10, a hydrofluoric acid conveying pipe 11 is arranged on the hydrofluoric acid solution tank 10, a flowmeter 12 is arranged on the hydrofluoric acid conveying pipe 11, the outlet end of the hydrofluoric acid conveying pipe 11 is arranged at the middle position inside the pickling tank, the ionic water in the ionic water tank 17 can be conveniently introduced into a half position inside the pickling tank through the water conveying pipe 19 and the first water conveying branch pipe 20, the amount of hydrofluoric acid is conveniently controlled through the flowmeter 12, and the ionized water is added above the pickling tank through the water conveying pipe 19 and the first water conveying branch pipe 20 again, so that pickling solution is conveniently prepared, follow-up cleaning of the silicon wafer is facilitated, meanwhile, the whole-course non-contact hydrofluoric acid of workers is facilitated, the harm of the hydrofluoric acid to the workers is avoided, the safety is ensured, the cleaning work is facilitated, and the use is facilitated. In the first cleaning step, the electric moving block 4 is used for conveniently controlling the rotating motor 6 and the clamping plate 8 to move, so that the silicon wafer clamped on the fixing clamp 9 is conveniently moved to the upper part of the pickling tank, the lifting rod 5 controls the rotating motor 6 and the clamping plate 8 to descend, so that the silicon wafer is conveniently immersed in the pickling solution of the pickling tank, the rotating motor 6 is started to rotate to drive the rotating shaft 7 and the clamping plate 8 to rotate during working, the silicon wafer clamped on the fixing clamp 9 is conveniently rotated in the pickling solution, the contact between the silicon wafer and the pickling solution is facilitated, meanwhile, the pickling solution is convenient to stir during rotation, the silicon wafer is convenient to impact with the pickling solution, the silicon wafer is soaked in the hydrofluoric acid solution through a chemical corrosion method, and the silicon wafer is enabled to generate a chemical reaction to generate soluble complex hexafluorosilicic acid, so that the surface containing phosphorus on the silicon wafer is favorably removed, the pickling effect and efficiency are improved, the safety is ensured, and the use is convenient.
Second water delivery branch pipe 21 exit end is equipped with spray rinsing pipe 23, spray rinsing pipe 23 sets up inside the washing tank, let in appropriate amount water in toward the washing tank through raceway 19 and second water delivery branch pipe 21, control lifter 5 drives the silicon chip and rises after the pickling, it drives the washing tank top to remove through electric movable block 4, the decline of secondary control lifter 5, the convenience is with the silicon chip submergence in the inside aquatic of washing tank, it rotates through rotating electrical machines 6 and drives the silicon chip and rotate, make things convenient for the water in silicon chip and the washing tank to fully contact, do benefit to and wash the silicon chip, it is overweight to avoid remaining hydrofluoric acid corruption silicon chip on the silicon chip, guarantee the safety in utilization of follow-up silicon chip.
Third water delivery branch pipe 22 exit end is equipped with spray disc 26, third water delivery branch pipe 22 is equipped with two sets ofly with spray disc 26, two sets of spray disc 26 slope inside settings are in the fine purifiation inslot, the silicon chip washs the back of accomplishing through lifter 5 and electric movable block 4 convenient with the silicon chip removal to the fine purifiation inslot at the washing tank, when rotating electrical machines 6 drive the silicon chip pivoted, spray disc 26 through both sides sprays the washing to the silicon chip, the pickle on the silicon chip is conveniently further detached, avoid hydrofluoric acid's on the silicon chip remaining, guarantee to wash the security, facilitate the use.
Drying inslot portion is equipped with drying apparatus 27, drying groove and jet-propelled machine 28 intercommunication, be equipped with the breather pipe on the jet-propelled machine 28, be equipped with a plurality of exit ends on the breather pipe, the exit end of breather pipe is equipped with wind gap 29, the angle of slope is different when the installation of multiunit wind gap 29, the during operation silicon chip sprays to wash the completion back and conveniently removes the drying inslot with the silicon chip through lifter 5 and electric moving block 4 in the fine purifiation groove, dry the silicon chip through drying apparatus 27, blow through jet-propelled machine 28 and multiunit wind gap 29 different angles to the silicon chip simultaneously, conveniently get rid of the water stain on the silicon chip, rotating electrical machines 6 rotates and drives the silicon chip and rotates simultaneously, conveniently spin-dry the drop of water on the silicon chip under the effect of centrifugal force, do. The silicon chip is conveniently passed discharge door 30 through lifter 5 and electronic movable block 4 after the stoving is accomplished and is removed to washing case outside, does benefit to and takes off the silicon chip on the fixation clamp 9, and the convenience is to the pickling of descaling of silicon chip, and the completion of cleaning work is guaranteed to whole contactless hydrofluoric acid of workman, avoids hydrofluoric acid to influence workman's security simultaneously, and guarantee workman's is healthy, facilitates the use.
Example two: on the basis of embodiment one, the bottom end slope of descaling bath is equipped with water guide plate 14, and water guide plate 14 minimum is equipped with pickle discharge pipe 15, through water guide plate 14 convenient water gathering with the descaling bath inside after the pickling is accomplished, discharges through pickle discharge pipe 15, does benefit to the change of the inside pickle of descaling bath, facilitates the use.
The lateral wall of the pickling tank is provided with an overflow pipe 13, the outlet end of the overflow pipe 13 is communicated with a pickling solution discharge pipe 15, the height of the pickling solution in the pickling tank can be conveniently controlled through the overflow pipe 13 during work, the completion of subsequent cleaning work is facilitated, the safety is guaranteed, and the use is convenient.
Be equipped with check valve 31 between essence washing tank and the washing tank, the washing tank bottom is equipped with washing liquid discharge pipe 32, and the water after the silicon chip sprays in the essence washing tank passes through check valve 31 and transmits the washing tank in, and the convenience is replenished the first washing water of silicon chip, and convenient resources are saved avoids extravagant, and the water after the first washing passes through washing liquid discharge pipe 32 and discharges, and convenient the change guarantees the security.
Be equipped with drinking-water pipe 24 in the washing tank, 24 one ends of drinking-water pipe are equipped with filter screen 18, filter screen 18 sets up in the inside bottom of washing tank, the drinking-water pipe 24 other end and the 21 lateral walls of second water delivery branch pipe intercommunication, install water pump 25 on the drinking-water pipe 24, water through drinking-water pipe 24 and water pump 25 conveniently take out in the washing tank, conveniently urge the silicon chip to wash through drinking-water pipe 24 and spray-wash pipe 23, improve abluent effect and efficiency, avoid the remaining of pickle on the silicon chip, guarantee the security, and convenient use. The filter screen 18 prevents the introduction of impurities, and ensures the safety of the pipeline.
The working principle of the invention is as follows: before the work of the invention starts, the electric moving block 4 controls the rotating motor 6 and the clamping plate 8 to pass through the feeding door 3 and move to the outer side of the cleaning box 1, the silicon wafer to be pickled is clamped on the side wall of the cleaning box 1 through the fixing clamp 9 on the clamping plate 8, the subsequent pickling is convenient to be carried out, the problem that the clamped part cannot be successfully pickled and descaled due to the clamping of the two sides of the silicon wafer is avoided, the thorough pickling and descaling of the subsequent silicon wafer is ensured, the safety is ensured, meanwhile, the electric moving block 4 drives the rotating motor 6 and the clamping plate 8 to move on the bracket 2, the silicon wafer on the fixing clamp 9 is convenient to move to each position in the cleaning box 1, the cleaning of multiple steps is convenient to be carried out, the cleaning is ensured to be thorough, the whole process of a worker is convenient to not contact with hydrofluoric acid, the cleaning work is ensured, the safety of the worker is prevented from being influenced, the health of the worker is ensured, and the ionized Let in the inside half position of descaling bath, the hydrofluoric acid of rethread hydrofluoric acid transmission pipe 11 in with hydrofluoric acid solution jar 10 lets in the descaling bath, through the volume of flowmeter 12 convenient control hydrofluoric acid, add the descaling bath top through raceway 19 and first water delivery branch pipe 20 with ionized water once more, conveniently prepare the descaling bath, do benefit to follow-up washing to the silicon chip, make things convenient for workman's whole journey contactless hydrofluoric acid simultaneously, avoid hydrofluoric acid to workman's harm, guarantee the security, do benefit to going on of cleaning work, and convenient to use. The cleaning method comprises the steps that in the first cleaning step, the electric moving block 4 is used for conveniently controlling the rotating motor 6 and the clamping plate 8 to move, the silicon wafer clamped on the fixing clamp 9 is conveniently moved to the upper part of a pickling tank, the lifting rod 5 is used for controlling the rotating motor 6 and the clamping plate 8 to descend, the silicon wafer is conveniently immersed in a pickling solution of the pickling tank, the rotating motor 6 is started to rotate to drive the rotating shaft 7 and the clamping plate 8 to rotate during working, the silicon wafer clamped on the fixing clamp 9 is conveniently rotated in the pickling solution to facilitate the contact of the silicon wafer and the pickling solution, the pickling solution is conveniently stirred during rotation, the pickling solution and the silicon wafer are convenient to impact, the silicon wafer is soaked in a hydrofluoric acid solution through a chemical corrosion method, a soluble complex hexafluorosilicic acid is generated through chemical reaction, the removal of the surface containing phosphorus on the silicon wafer is facilitated, the pickling effect and the pickling efficiency are improved, a proper amount of water is introduced into the cleaning tank, control lifter 5 drives the silicon chip and rises after the pickling, moves through electric movable block 4 and drives the washing tank top, and control lifter 5 descends once more, conveniently drives the silicon chip rotation through rotating electrical machines 6 rotation with the silicon chip submergence in the inside aquatic of washing tank, makes things convenient for the water in silicon chip and the washing tank to fully contact, does benefit to and washs the silicon chip, avoids remaining hydrofluoric acid on the silicon chip to corrode the silicon chip overweight, guarantees the safety in utilization of follow-up silicon chip. The silicon chip washs through lifter 5 and electric movable block 4 after accomplishing the washing tank and conveniently removes the silicon chip to the fine purifiation inslot, when rotating electrical machines 6 drives the silicon chip pivoted, spray the dish 26 through both sides and spray the silicon chip and wash, the pickle on the silicon chip is conveniently further detached, avoid the remaining of hydrofluoric acid on the silicon chip, guarantee to wash the security, water after the silicon chip sprays in the fine purifiation inslot passes through check valve 31 and transmits to the washing tank in, conveniently supply the first washing water of silicon chip, convenient resources are saved, avoid extravagant, water after the first washing passes through washing liquid discharge pipe 32 and discharges, convenient the change, guarantee the security. The water in the cleaning tank is conveniently pumped out through the water pumping pipe 24 and the water pump 25, the silicon wafer is conveniently urged to be washed through the water pumping pipe 24 and the spray cleaning pipe 23, the cleaning effect and efficiency are improved, the residue of a pickling solution on the silicon wafer is avoided, the safety is ensured, and the use is facilitated. The filter screen 18 prevents the introduction of impurities, and ensures the safety of the pipeline. The angle of slope is different when the multiunit wind gap 29 is installed, the during operation silicon chip sprays to wash and conveniently removes the silicon chip to the stoving inslot through lifter 5 and electric movable block 4 after accomplishing in the fine purifiation groove, dry the silicon chip through drying apparatus 27, blow to the different angles of silicon chip through air jet 28 and multiunit wind gap 29 simultaneously, conveniently get rid of the water stain on the silicon chip, rotating electrical machines 6 rotates simultaneously and drives the silicon chip and rotate, the convenience is spin-dried the drop of water on the silicon chip under the effect of centrifugal force, do benefit to and guarantee the security, the use of convenient follow-up silicon chip. The silicon chip is conveniently passed discharge door 30 through lifter 5 and electronic movable block 4 after the stoving is accomplished and is removed to washing case outside, does benefit to and takes off the silicon chip on the fixation clamp 9, and the convenience is to the pickling of descaling of silicon chip, and the completion of cleaning work is guaranteed to whole contactless hydrofluoric acid of workman, avoids hydrofluoric acid to influence workman's security simultaneously, and guarantee workman's is healthy, facilitates the use.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. The utility model provides a silicon chip processing is with removing phosphorus silicate glass acid dip pickle, including wasing case (1), hydrofluoric acid solution tank (10) and ion water jar (17), its characterized in that, wash case (1) both sides lateral wall be equipped with feed door (3) and discharge door (30) respectively, be equipped with support (2) in wasing case (1), install electronic movable block (4) on support (2), electronic movable block (4) lower surface is equipped with lifter (5), lifter (5) bottom is equipped with rotating electrical machines (6), rotating electrical machines (6) output shaft and rotation axis (7) are connected, install grip block (8) on the rotation axis (7), be equipped with multiunit fixation clamp (9) on grip block (8), wash case (1) inside and be equipped with three groups of baffle (16), three groups baffle (16) will wash case (1) and divide into the descaling bath, washing tank, finish washing groove and stoving groove, an ion water tank (17) is arranged on the cleaning tank (1), a water conveying pipe (19) is arranged at the bottom end of the ion water tank (17), the outlet end of the water conveying pipe (19) is respectively communicated with a first water conveying branch pipe (20), a second water conveying branch pipe (21) and a third water conveying branch pipe (22), the outlet end of the first water conveying branch pipe (20) is communicated with a pickling tank, the cleaning tank (1) is communicated with a hydrofluoric acid solution tank (10), a hydrofluoric acid conveying pipe (11) is arranged on the hydrofluoric acid solution tank (10), a flowmeter (12) is arranged on the hydrofluoric acid conveying pipe (11), the outlet end of the hydrofluoric acid conveying pipe (11) is arranged in the middle position inside the pickling tank, a spray cleaning pipe (23) is arranged at the outlet end of the second water conveying branch pipe (21), the spray cleaning pipe (23) is arranged inside the cleaning tank, a spray disc (26) is arranged at the outlet end of the third water conveying branch pipe (22), a dryer (, the air jet (28) is provided with a vent pipe, the vent pipe is provided with a plurality of outlet ends, and the outlet end of the vent pipe is provided with an air port (29).
2. The apparatus for pickling dephosphorization silicon glass for silicon wafer processing according to claim 1, wherein a water guide plate (14) is obliquely arranged at the bottom end of the pickling tank, and a pickling solution discharge pipe (15) is arranged at the lowest end of the water guide plate (14).
3. The silicon wafer processing silicon glass pickling apparatus for removing phosphorus according to claim 2, wherein the side wall of the pickling tank is provided with an overflow pipe (13), and the outlet end of the overflow pipe (13) is communicated with a pickling solution discharge pipe (15).
4. The apparatus for pickling dephosphorized silica glass for silicon wafer processing as defined in claim 3, wherein a check valve (31) is disposed between said cleaning tank and said cleaning tank, and a cleaning solution discharge pipe (32) is disposed at the bottom end of said cleaning tank.
5. The silicon wafer processing silicon glass pickling device for removing phosphorus and silicon as claimed in claim 4, wherein a water pumping pipe (24) is arranged in the cleaning tank, a filter screen (18) is arranged at one end of the water pumping pipe (24), the filter screen (18) is arranged at the bottom end in the cleaning tank, the other end of the water pumping pipe (24) is communicated with the side wall of the second water conveying branch pipe (21), and a water pump (25) is arranged on the water pumping pipe (24).
6. The apparatus for pickling dephosphorized silica glass for silicon wafer processing according to claim 1, wherein said support (2) is installed through said inlet door (3) and said outlet door (30).
7. The apparatus for pickling dephosphorized silica glass for silicon wafer processing according to claim 5, wherein said third water supply branch pipe (22) and said spray plates (26) are provided in two groups, and the two groups of spray plates (26) are disposed in the fine cleaning tank in an inclined manner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011243705.8A CN112289716A (en) | 2020-11-10 | 2020-11-10 | Silicon chip processing is with removing phosphorus silicon glass acid dip pickle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011243705.8A CN112289716A (en) | 2020-11-10 | 2020-11-10 | Silicon chip processing is with removing phosphorus silicon glass acid dip pickle |
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| CN112289716A true CN112289716A (en) | 2021-01-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115254764A (en) * | 2022-09-26 | 2022-11-01 | 苏州卓樱自动化设备有限公司 | Cleaning equipment used after grinding of silicon wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115254764A (en) * | 2022-09-26 | 2022-11-01 | 苏州卓樱自动化设备有限公司 | Cleaning equipment used after grinding of silicon wafer |
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Application publication date: 20210129 |
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