CN111344859A - 一种半导体器件及太阳能电池 - Google Patents

一种半导体器件及太阳能电池 Download PDF

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Publication number
CN111344859A
CN111344859A CN201980004450.9A CN201980004450A CN111344859A CN 111344859 A CN111344859 A CN 111344859A CN 201980004450 A CN201980004450 A CN 201980004450A CN 111344859 A CN111344859 A CN 111344859A
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China
Prior art keywords
semiconductor device
mole
polyimide
formula
bis
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Pending
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CN201980004450.9A
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English (en)
Inventor
徐芳荣
李平
池田武史
弓场智之
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Toray Advanced Materials Research Laboratories China Co Ltd
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Toray Advanced Materials Research Laboratories China Co Ltd
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Publication of CN111344859A publication Critical patent/CN111344859A/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Abstract

一种半导体器件，所述半导体器件中包含绝缘材料(3)；所述绝缘材料(3)为热固性树脂组合物。使用该树脂组合物可以实现漏电减少而带来的器件性能提升。而且，由于该材料的良好稳定性，可以大幅度提高器件的使用寿命。并且，该材料不仅可以高温固化，还可以实现较低温的固化，对于制作过程需要低温条件的器件更具优异性。

Description

PCT国内申请，说明书已公开。

Claims (17)

  1. PCT国内申请，权利要求书已公开。
CN201980004450.9A 2018-07-19 2019-07-17 一种半导体器件及太阳能电池 Pending CN111344859A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201810794371X 2018-07-19
CN201810794371 2018-07-19
PCT/CN2019/096270 WO2020015665A1 (zh) 2018-07-19 2019-07-17 一种半导体器件及太阳能电池

Publications (1)

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CN111344859A true CN111344859A (zh) 2020-06-26

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CN201980004450.9A Pending CN111344859A (zh) 2018-07-19 2019-07-17 一种半导体器件及太阳能电池

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CN (1) CN111344859A (zh)
TW (1) TW202008603A (zh)
WO (1) WO2020015665A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202203472A (zh) * 2020-07-14 2022-01-16 單伶寶 一種用於單面或雙面太陽能電池圖形化掩膜和太陽能電池的製作方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1416452A (zh) * 2000-03-06 2003-05-07 日立化成工业株式会社 树脂组合物、耐热性树脂膏及使用该树脂组合物及耐热性树脂膏的半导体器件及其制造方法
CN1993498A (zh) * 2004-08-05 2007-07-04 株式会社钟化 溶液、镀覆用材料、绝缘片、叠层体以及印刷布线板
JP2008156603A (ja) * 2006-12-01 2008-07-10 Toray Ind Inc 熱硬化性樹脂組成物
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2009203414A (ja) * 2008-02-29 2009-09-10 Toray Ind Inc 熱硬化性樹脂組成物
CN102850726A (zh) * 2012-09-07 2013-01-02 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法
CN103250259A (zh) * 2010-09-21 2013-08-14 株式会社Pi技术研究所 太阳能电池内的绝缘膜形成用聚酰亚胺树脂组合物以及使用其的太阳能电池内的绝缘膜形成方法
CN103403879A (zh) * 2010-09-21 2013-11-20 株式会社Pi技术研究所 太阳能电池的背面反射层形成用聚酰亚胺树脂组合物以及使用其的背面反射层形成方法
CN105745274A (zh) * 2013-11-27 2016-07-06 东丽株式会社 半导体用树脂组合物及半导体用树脂膜以及使用了它们的半导体器件
CN106256853A (zh) * 2015-06-22 2016-12-28 味之素株式会社 模塑底部填充用树脂组合物
CN107531902A (zh) * 2015-04-28 2018-01-02 可隆工业株式会社 聚酰亚胺树脂和使用该聚酰亚胺树脂的薄膜

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101679721A (zh) * 2007-06-12 2010-03-24 住友电木株式会社 树脂组合物、填埋材料、绝缘层以及半导体装置
JP2011222946A (ja) * 2010-03-26 2011-11-04 Sumitomo Bakelite Co Ltd 回路基板、半導体装置、回路基板の製造方法および半導体装置の製造方法
KR101799499B1 (ko) * 2014-12-24 2017-12-20 주식회사 엘지화학 반도체 접착용 수지 조성물, 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP6924000B2 (ja) * 2016-05-20 2021-08-25 日鉄ケミカル＆マテリアル株式会社 エポキシ樹脂組成物及びその硬化物

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1416452A (zh) * 2000-03-06 2003-05-07 日立化成工业株式会社 树脂组合物、耐热性树脂膏及使用该树脂组合物及耐热性树脂膏的半导体器件及其制造方法
CN1993498A (zh) * 2004-08-05 2007-07-04 株式会社钟化 溶液、镀覆用材料、绝缘片、叠层体以及印刷布线板
JP2008156603A (ja) * 2006-12-01 2008-07-10 Toray Ind Inc 熱硬化性樹脂組成物
JP2008214413A (ja) * 2007-03-01 2008-09-18 Toray Ind Inc 熱硬化性樹脂組成物
JP2009203414A (ja) * 2008-02-29 2009-09-10 Toray Ind Inc 熱硬化性樹脂組成物
CN103250259A (zh) * 2010-09-21 2013-08-14 株式会社Pi技术研究所 太阳能电池内的绝缘膜形成用聚酰亚胺树脂组合物以及使用其的太阳能电池内的绝缘膜形成方法
CN103403879A (zh) * 2010-09-21 2013-11-20 株式会社Pi技术研究所 太阳能电池的背面反射层形成用聚酰亚胺树脂组合物以及使用其的背面反射层形成方法
CN102850726A (zh) * 2012-09-07 2013-01-02 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法
CN105745274A (zh) * 2013-11-27 2016-07-06 东丽株式会社 半导体用树脂组合物及半导体用树脂膜以及使用了它们的半导体器件
CN107531902A (zh) * 2015-04-28 2018-01-02 可隆工业株式会社 聚酰亚胺树脂和使用该聚酰亚胺树脂的薄膜
CN106256853A (zh) * 2015-06-22 2016-12-28 味之素株式会社 模塑底部填充用树脂组合物

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WO2020015665A1 (zh) 2020-01-23

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