CN111344816A - 用于中压和/或高压机器的缠绕带绝缘的电绝缘材料和/或浸渍树脂、由其形成的绝缘物质以及绝缘体系 - Google Patents
用于中压和/或高压机器的缠绕带绝缘的电绝缘材料和/或浸渍树脂、由其形成的绝缘物质以及绝缘体系 Download PDFInfo
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- CN111344816A CN111344816A CN201880073184.0A CN201880073184A CN111344816A CN 111344816 A CN111344816 A CN 111344816A CN 201880073184 A CN201880073184 A CN 201880073184A CN 111344816 A CN111344816 A CN 111344816A
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- Prior art keywords
- insulation
- nanoparticles
- impregnating resin
- insulation material
- resin
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- 238000009413 insulation Methods 0.000 title claims abstract description 61
- 229920005989 resin Polymers 0.000 title claims abstract description 46
- 239000011347 resin Substances 0.000 title claims abstract description 46
- 238000004804 winding Methods 0.000 title claims abstract description 15
- 239000012772 electrical insulation material Substances 0.000 title abstract description 4
- 239000002105 nanoparticle Substances 0.000 claims abstract description 44
- 239000000654 additive Substances 0.000 claims abstract description 36
- 238000005245 sintering Methods 0.000 claims abstract description 29
- 239000012774 insulation material Substances 0.000 claims abstract description 23
- 239000000203 mixture Substances 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 9
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 9
- 230000000996 additive effect Effects 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 15
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- 229910052618 mica group Inorganic materials 0.000 claims description 15
- 150000002903 organophosphorus compounds Chemical class 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
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- 150000008064 anhydrides Chemical class 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims description 5
- 239000000395 magnesium oxide Substances 0.000 claims description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 5
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- PLDDOISOJJCEMH-UHFFFAOYSA-N neodymium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Nd+3].[Nd+3] PLDDOISOJJCEMH-UHFFFAOYSA-N 0.000 claims description 4
- 229910017464 nitrogen compound Inorganic materials 0.000 claims description 4
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- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims description 4
- 238000005470 impregnation Methods 0.000 claims description 3
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 claims description 2
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- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 claims description 2
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- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 4
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- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
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- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 2
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
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- WOURXYYHORRGQO-UHFFFAOYSA-N Tri(3-chloropropyl) phosphate Chemical compound ClCCCOP(=O)(OCCCCl)OCCCCl WOURXYYHORRGQO-UHFFFAOYSA-N 0.000 description 2
- GTVWRXDRKAHEAD-UHFFFAOYSA-N Tris(2-ethylhexyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OCC(CC)CCCC GTVWRXDRKAHEAD-UHFFFAOYSA-N 0.000 description 2
- LJCFOYOSGPHIOO-UHFFFAOYSA-N antimony pentoxide Chemical compound O=[Sb](=O)O[Sb](=O)=O LJCFOYOSGPHIOO-UHFFFAOYSA-N 0.000 description 2
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- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
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- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
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- GVYLCNUFSHDAAW-UHFFFAOYSA-N mirex Chemical compound ClC12C(Cl)(Cl)C3(Cl)C4(Cl)C1(Cl)C1(Cl)C2(Cl)C3(Cl)C4(Cl)C1(Cl)Cl GVYLCNUFSHDAAW-UHFFFAOYSA-N 0.000 description 1
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- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
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Abstract
本发明涉及用于缠绕带绝缘的电绝缘材料和/或浸渍树脂、由其通过固化形成的绝缘物质以及绝缘体系，例如用于旋转电机、特别是中压或高压机器的绝缘体系。通过本发明，首次提供如下的绝缘材料，即用于形成绝缘物质的可固化混合物的组合物，对于该绝缘材料，在相同条件下运行时使常规体系的使用寿命最多增加8倍。这归因于共生式地结合了至少部分地用形成SiR2‑O骨架的组分对常规环氧树脂的取代连同无机纳米颗粒和烧结添加剂，所述烧结添加剂导致基础树脂中的纳米颗粒的熔融。
Description
本发明涉及用于缠绕带绝缘(或称为绕组带绝缘，Wickelbandisolierung)的电绝缘材料和/或浸渍树脂、由其通过固化形成的绝缘物质以及绝缘体系，例如用于旋转电机、特别是中压或高压机器的绝缘体系。
在功率超过500MVA的高压机器的运行中可获得超过10kV的额定电压。部件相应地承受高的机械、热和电应力。因此，电导体的绝缘体系的可靠性对操作安全性至关重要。
绝缘体系的任务是使电导体例如电线、线圈和绕组棒永久地彼此绝缘，并相对于定子的叠片铁芯或周围环境绝缘。为此，绝缘体系具有在子导体(或称为导体元件)之间的绝缘(子导体绝缘)、在导体或绕组棒之间的绝缘(导体或绕组绝缘)以及在凹槽及绕组头部区域中在导体与接地电位之间的绝缘(主绝缘)。
这种类型的电负载绝缘中的根本问题在于局部放电引起的其中形成“茶环(Teering)”通道的侵蚀，该通道最终导致绝缘的电击穿。通常，将基于云母的绝缘用于旋转机器中的带电压的导体的永久绝缘。
为形成主绝缘，用云母带缠绕由绝缘子导体制成的预制线圈，并在真空压力浸渍(Vacuum-Pressure-Impregnation，VPI工艺)中用树脂浸渍。在此，云母带以云母纸的形式使用。
通过浸渍，用绝缘材料填充了云母纸中的处于各个颗粒和/或带褶皱之间的空腔。由浸渍树脂和云母纸组成的复合材料被固化，形成绝缘物质，然后该绝缘物质被加工成绝缘体系并提供绝缘体系的机械强度。电气强度由云母中大量的固体-固体界面而产生。因此，通过VPI工艺，绝缘体中即使最小的空腔也必须用树脂填充，以最小化内部的气体-固体界面的数量。
总体上，这对绕组导体相对于彼此的绝缘、绕组相对于叠片铁芯的绝缘以及在导体从叠片铁芯的出口处形成的滑动装置提出了极高的电气、热和机械要求。在机器绝缘中，对铜导体组件和高压绝缘体之间的内部电势控制IPS、绕组与叠片铁芯之间的外部电晕屏蔽(AGS)以及绕组棒从叠片铁芯的出口处的末端电晕屏蔽(EGS)进行区分。
迄今为止，作为用于电气绝缘的基础树脂，并且尤其还作为用于缠绕带绝缘的浸渍树脂，优选地使用基于碳的环氧树脂，其以液态形式在基于碳的(-CR2-)n-骨架(主链)上携带所有可能的官能团，例如也携带环氧基。它们与固化剂反应以形成热固性塑料，该热固性塑料形成灌封料和/或例如形成缠绕带绝缘体的浸渍物。
如从DE 10 2014 219765中已知的，已经尝试使用纳米颗粒来通过使用有机和无机纳米颗粒在基础树脂中形成具有防侵蚀作用的烧结桥。
然而，仍然需要通过改进基础树脂内的烧结桥的形成而在基础树脂内形成保护层，该保护层表现出改善的防侵蚀效果。
因此，本发明的目的是提供用于绝缘材料的添加剂，该添加剂在局部放电的情况下通过形成阻挡层来提高由该绝缘材料制成的绝缘体系的耐蚀性并因此提高其局部放电耐受性。
该目的通过本发明的主题来实现，如在说明书和权利要求书中公开的主题那样。
因此，本发明的主题是一种用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其包含至少一种基础树脂、固化剂、至少一种纳米颗粒填料级分和添加剂，其中基础树脂在聚合状态下至少部分地具有-SiR2-O-主链，并提供至少一种添加剂，通过该添加剂在局部放电下进行纳米颗粒的至少部分的烧结以形成阻挡层。此外，本发明的主题是可通过本文所述的绝缘材料的固化而获得的绝缘物质以及由该绝缘物质形成的绝缘体系。
令人惊讶地，已发现，通过至少部分地具有-SiR2-O-骨架的基础树脂与导致基础树脂中的纳米粒子玻璃化的添加剂、尤其是烧结添加剂的组合，实现了绝缘物质的电气寿命的显著提高。据推测，通过在树脂基质中引入(SiR2-O)-基团而使骨架变宽导致烧结添加剂的改善的催化作用，使得在纳米颗粒之间更快地形成玻璃化区域。
因此，绝缘材料包括至少一种选自以下的烧结添加剂：氧化镁(MgO)、碳酸钙(CaO3)、氮化合物、有机磷化合物、氮化铝(AlN)、碳化硅(SiC)、氮化钛(TiN)、氧化钇(Y2O3)、钇铝石榴石(Al3Y5O12)、氧化钕(Nd2O3)、氧化铈(CeO2)。优选的烧结添加剂是氮化合物、有机磷化合物、MgO、CaO3和/或上述组分的混合物。
基于氮的烧结添加剂包括例如黑色素(氰尿酸三酰胺
例如黑色素磷酸盐(MPP)和尿素(羰基二酰胺)。
基于有机磷的烧结添加剂包含至少一种选自以下的化合物：磷酸二苯基甲酚酯(CDP)、磷酸二苯辛酯(DPO)、磷酸三正丁酯(TBP)、磷酸三乙酯(TEP)、磷酸三对甲酚酯(TCP)、磷酸三苯酯(TPP)、异丙基化的磷酸三苯酯(ITP)、间苯二酚双(磷酸二苯酯)(RDP)、双酚A-双(磷酸二苯酯)(BDP)、磷酸三(丁氧基乙基)酯(TBEP)、磷酸三(氯乙基)酯(TCEP)、磷酸三(氯丙基)酯(TCPP)、磷酸三(二氯异丙基)酯(TDCP)、磷酸三-(2-乙基己基)酯(TEHP)、9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物(DOPO)。
在另一种实施方式中，添加剂例如烧结添加剂和/或阻燃剂以在1nm至50nm、优选1nm至5nm、且特别优选1nm至3nm的范围内的平均粒径存在，或以粒径小于1nm的分子分散溶液的形式存在。
有利地，相对于纳米颗粒部分，在绝缘材料中包含0.1至50重量％、优选1至47重量％、特别优选10至40重量％的烧结添加剂和/或阻燃剂。由于高含量的烧结添加剂和/或阻燃剂，烧结桥的形成被加速至这样的程度，使得即使在少量的纳米颗粒下也可实现改善的介电强度。
最新的电气测试，即，其中使固化的绝缘材料(所谓的绝缘物)处于操作条件下以进行试验的测试表明，通过基础树脂与硅氧烷组分和烧结添加剂的上述组合，使用寿命提高最多至如下的值，该值比由纯的环氧树脂(不含硅氧烷并且不含烧结添加剂)制成的绝缘物的相应测量值高8倍。
有利地，绝缘材料的基础树脂包括可固化的化合物，其对应于常规使用的可固化的化合物的50摩尔％以上、尤其是75摩尔％以上，如环氧树脂，例如双酚F-二缩水甘油醚(BFDGE)和/或双酚A-二缩水甘油醚(BADGE)、聚氨酯和/或其混合物。优选的是基于双酚F-二缩水甘油醚(BFDGE)、双酚A-二缩水甘油醚(BADGE)或其混合物的环氧树脂。
例如在绝缘材料中以单体或低聚物形式存在的可固化的化合物的剩余摩尔％作为包括(-SiR2-O-)基团的官能化的化合物提供。在此，它例如可为缩水甘油基和/或缩水甘油氧基(也称为环氧丙氧基)官能化的硅氧烷化合物，可为环氧封端的芳基和/或烷基硅氧烷，可为1,3-双(3-缩水甘油氧基烷基-四甲基二硅氧烷)及其任何混合物。在此，基团R表示所有类型的适于固化和/或交联以形成可用于绝缘体系的绝缘物质的有机基团。更特别地，R可为相同或不同，并且代表：
R＝-芳基、-烷基、-杂环，氮、氧和/或硫取代的芳基和/或烷基。
更特别地，R可代表以下基团：
-烷基，例如-甲基、-丙基、-异丙基、-丁基、-异丁基、-叔丁基、-戊基、-异戊基、-环戊基以及所有其他类似基团，直至十二烷基，即具有12个碳原子的同系物；
-芳基，例如：苄基-、苯甲酰基-、联苯基-、甲苯基-、二甲苯等，尤其是，例如其结构符合Hückel的芳香性定义的所有芳基基团；
-杂环：尤其是含硫的杂环，例如噻吩、四氢噻吩、1,4-噻
烷(Thioxan)及其同系物和/或其衍生物；
-含氧杂环，例如二
烷；
-含氮杂环，例如-CN、-CNO、CNS、-N3(叠氮化物)等；
-硫取代的芳基和/或烷基：例如噻吩，还有硫醇。
针对芳族化合物的Hückel规则涉及以下相关性：平面的、环状贯穿共轭(cyclischdurchkonjugierte)的、包括多个可以4n+2的形式表示的π电子的分子具有特别的稳定性，该稳定性也被称为芳香性。
为了固化，将常规的固化剂添加到基质材料中。合适的固化剂是酸酐，例如甲基四氢邻苯二甲酸酐或甲基六氢邻苯二甲酸酐，芳族胺，脂族胺及其混合物。基于甲基四氢邻苯二甲酸酐、甲基六氢邻苯二甲酸酐或其混合物的酸酐是优选的。然而，它们的毒理学目前不是没有争议的。
此外，作为固化剂合适的是阳离子和阴离子固化催化剂，例如：有机盐，如有机铵盐、锍盐、碘鎓盐、鏻盐和/或咪唑鎓盐，和胺，例如叔胺，吡唑和/或咪唑化合物。实例在此提及4,5-二羟基甲基-2-苯基咪唑和/或2-苯基-4-甲基-5-羟基甲基咪唑。然而，也可使用含有环氧乙烷基团的化合物，例如缩水甘油醚作为固化剂。最后，根据本发明还设想，存在于绝缘材料中的一部分固化剂也是如下化合物，其在完成固化之后作为具有SiR2-O-骨架的官能化的化合物存在于基质树脂中。相应地，绝缘材料中提供的用于取代基于碳的基础树脂的所有单体和低聚物也可用作固化剂。在此，可设有不同固化剂的混合物。
根据本发明的有利的实施方式，在绝缘材料中还存在阻燃剂。可使用无机和有机阻燃剂。
无机阻燃剂包含例如无机磷化合物如红磷、磷酸铵((NH4)3PO4)或聚磷酸铵(APP)，金属氧化物化合物，特别是锑化合物如三氧化锑(Sb2O3)或五氧化二锑(Sb2O5)，金属氢氧化物如三氢氧化铝(Al(OH)3)、氢氧化镁(Mg(OH)2)或氢氧化钙(Ca(OH)2)，金属盐化合物如硫酸铵((NH4)2SO4)或它们的混合物。
此外，无机阻燃剂可包含硼化合物例如硼酸锌或硼酸钠，硅化合物例如聚硅氮烷，或石墨。
优选的阻燃剂是基于有机或无机磷化合物的阻燃剂，尤其是基于铵化合物的阻燃剂，例如聚磷酸铵(APP)。
在另一实施方式中，组合物包含有机阻燃剂、无机阻燃剂或其混合物。有机阻燃剂包括例如卤化(或称为卤代)化合物，尤其是溴化和/或氯化化合物，氮化合物，有机磷化合物及其混合物。
溴化阻燃剂包含至少一种选自以下的化合物：多溴联苯(PBB)，多溴二苯醚(PBDE)如五溴二苯醚、八溴二苯醚和十溴二苯醚，四溴双酚A(TBBPA)，溴化聚苯乙烯例如溴苯乙烯或二溴苯乙烯，2,4,6-三溴苯氧基丙烯-2(2,4,6-Tribromphenoxypropen-2，TBPP)和六溴环十二烷(HBCD)。氯化阻燃剂包括例如氯石蜡或灭蚁灵。
此外，可将促进剂添加到基质材料中。合适的促进剂是例如环烷酸盐(酯)、叔胺或其混合物。
绝缘材料以这样的方式设计，使得在完成对绝缘物质的固化和绝缘体系的制造之后，通过热量供应而在纳米颗粒之间形成烧结桥。因此，烧结桥通过在中压或高压机器运行期间产生的热量形成。
纳米颗粒优选具有球形或层状形状。球形纳米颗粒在三个空间方向上在其延伸(尺寸)方面没有实质性差异，而层状纳米颗粒具有高的长宽比。
填充有球形纳米颗粒的绝缘材料的可加工性比填充有层状纳米颗粒的绝缘材料的可加工性更好。
纳米颗粒优选以0.1至50体积％、特别是1至45体积％、且特别优选3至40体积％的量被包含在绝缘材料中。有利地，纳米颗粒以不连贯的分布存在于基质材料中。也就是说，纳米颗粒以均匀的分散体形式溶解并且彼此不接触。
在另一实施方式中，纳米颗粒以单峰、双峰或多峰尺寸分布存在。例如，纳米颗粒的平均直径D50可为0.1至50nm、优选1至25nm、特别优选5至20nm、并且非常特别优选8至17nm。这导致纳米颗粒的比表面积为至少50m2/g。随着纳米颗粒直径的减小和比表面积的增加，它们的反应性和初始粘度增加。由此也增加了使表面能最小化并且局部地通过形成烧结桥而熔化的趋势。
在另一实施方式中，纳米颗粒包括有机和无机成分、以及金属氧化物、半金属氧化物或它们的混合物。例如，纳米颗粒可包含氧化硅(SiO2)、氧化铝(Al2O3)、二氧化钛(TiO2)及其混合物。
根据一种有利的实施方式，纳米颗粒以实心或空心的纳米玻璃球的形式存在。
绝缘体系尤其可被设计成高压机器的绕组棒上的主绝缘。在此，用绝缘带包裹绕组棒，在所述绝缘带上施加有上述组合物。绝缘带可包括其上设置有云母颗粒的载体织物，例如聚酯织物或玻璃织物。在此，将该组合物用于浸渍绝缘带。取决于一种或多种烧结添加剂的反应性，在绝缘材料固化以形成绝缘物质的过程中，烧结添加剂可作为液态的并且可加工的由具有硅氧烷部分的单体或低聚基础树脂和固化剂组成的配制物的一部分存在和/或作为云母带的一部分。在最后提到的情况下，一种或多种烧结添加剂可沉积在例如具有孔的云母带中，并且仅在固化之前才与基础树脂和固化剂接触。
储存稳定性的问题可能出现并且不能一概而论，因为这可能主要取决于由基础树脂和/或固化剂上的官能团触发的反应性上的较小差异。然而，根据纳米颗粒和具有常规和基于硅氧烷的组分的基础树脂，可不同地选择所述或所述多种烧结添加剂。
烧结添加剂也可存在于可固化配制物和云母带两者中。
根据一种有利的实施方式，绝缘物质单独地是如此耐局部放电的，以至于对于主绝缘可省去云母带，因为绝缘物质的浇铸提供了足够的绝缘。
通过在放电存在下使纳米颗粒、特别是金属氧化物纳米颗粒例如SiO2颗粒熔融来实现寿命的改善。在此，在绝缘物质中产生玻璃化区域，该玻璃化区域用作阻挡层并且是耐局部放电的。
特别地，可提供如下的绝缘材料，其包括以下重量百分比的各组分：
0.3至0.7重量％的有机磷化合物作为烧结添加剂，
57至63重量％的云母作为形成阻挡层的填料，
3至15重量％的纳米颗粒，例如无机纳米颗粒，尤其是基于石英的那些，
10至20重量％的酸酐固化剂，
10至20重量％的常规的基于碳的树脂，例如环氧树脂，
0.5至10的硅氧烷，例如环氧化的硅氧烷。
实施例
0.5重量％的有机磷化合物
3.2重量％的环氧化硅氧烷
59.5重量％的云母
8重量％的SiO2纳米颗粒
16重量％的MHHPA(酸酐固化剂)
12.8重量％的环氧树脂。
本发明首次提供如下的绝缘材料，即，用于形成绝缘物质的可固化的混合物的组合物，对于该绝缘材料，在相同条件下运行时使常规体系的使用寿命最多增加8倍。这归因于共生式地结合了至少部分地用形成SiR2-O骨架的组分对常规环氧树脂的取代连同无机纳米颗粒和烧结添加剂，所述烧结添加剂导致基础树脂中的纳米颗粒的熔融。
Claims (15)
1.用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其包括至少一种基础树脂、固化剂、至少一种纳米颗粒填料级分和添加剂，其中基础树脂在聚合状态下至少部分地具有-SiR2-O-骨架，并提供至少一种添加剂，通过所述添加剂在局部放电下进行纳米颗粒的至少部分的烧结以形成阻挡层。
2.根据权利要求1所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中提供烧结添加剂，所述烧结添加剂使纳米颗粒玻璃化。
3.根据前述权利要求1或2所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中所述烧结添加剂选自以下的烧结添加剂：氧化镁(MgO)、碳酸钙(CaO3)、氮化合物、有机磷化合物、氮化铝(AlN)、碳化硅(SiC)、氮化钛(TiN)、氧化钇(Y2O3)、钇铝石榴石(Al3Y5O12)、氧化钕(Nd2O3)、氧化铈(CeO2)。
4.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中所述至少一种烧结添加剂是有机磷化合物。
5.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中至少一种纳米颗粒级分包括无机纳米颗粒。
6.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中至少一种无机纳米颗粒级分包括二氧化硅颗粒。
7.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中添加剂以1nm至50nm的粒径存在。
8.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中纳米颗粒以在0.1至50体积％的范围内的量被包含在绝缘材料中。
9.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中相对于纳米颗粒部分，一种或多种添加剂以0.1至50重量％的量存在。
10.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中纳米颗粒以0.1至50nm的平均直径D50存在。
11.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中基础树脂包括至多50摩尔％的在完成固化后形成-SiR2-O-骨架的化合物。
12.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，其中纳米颗粒以纳米玻璃球的形式提供。
13.根据前述权利要求之一所述的用于缠绕带绝缘的绝缘材料和/或浸渍树脂，具有以下的大致组成：
0.3至0.7重量％的有机磷化合物作为烧结添加剂，
57至63重量％的云母作为形成阻挡层的填料，
3至15重量％的纳米颗粒，例如无机纳米颗粒，尤其是基于二氧化硅的那些，
10至20重量％的酸酐固化剂，
10至20重量％的常规的基于碳的树脂，例如环氧树脂，
0.5至10的硅氧烷，例如环氧化的硅氧烷。
14.绝缘物质，其能通过根据前述权利要求1至13之一所述的绝缘材料的固化获得。
15.绝缘体系，包括根据权利要求14所述的绝缘物质。
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| EP17192062.2A EP3460809A1 (de) | 2017-09-20 | 2017-09-20 | Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine, isolationsstoff sowie isolationssystem daraus |
| EP17192062.2 | 2017-09-20 | ||
| PCT/EP2018/074772 WO2019057604A1 (de) | 2017-09-20 | 2018-09-13 | Elektrisches isolationsmaterial und/oder imprägnierharz für die wickelbandisolierung einer mittel- und/oder hochspannungsmaschine, isolationsstoff sowie isolationssystem daraus |
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| US11916448B2 (en) | 2021-02-01 | 2024-02-27 | The Timken Company | Small-fraction nanoparticle resin for electric machine insulation systems |
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| CN116844795B (zh) * | 2023-07-24 | 2024-03-05 | 浙江荣泰电工器材股份有限公司 | 防爆云母带 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20200220409A1 (en) | 2020-07-09 |
| EP3460809A1 (de) | 2019-03-27 |
| CN111344816B (zh) | 2022-07-22 |
| WO2019057604A1 (de) | 2019-03-28 |
| KR20200055759A (ko) | 2020-05-21 |
| EP3685410A1 (de) | 2020-07-29 |
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