CN111315118A

CN111315118A - Electronic contest pen electronic keyboard circuit board and preparation method thereof

Info

Publication number: CN111315118A
Application number: CN202010254673.5A
Authority: CN
Inventors: 郭兆华
Original assignee: Jiangxi Zhaoxin Precision Electronics Co Ltd
Current assignee: Jiangxi Zhaoxin Precision Electronics Co Ltd
Priority date: 2020-04-02
Filing date: 2020-04-02
Publication date: 2020-06-19

Abstract

The invention discloses a circuit board of a power-competition pen power-operated keyboard and a preparation method thereof, and aims to solve the problem that the existing circuit board of the power-competition pen power-operated keyboard is high in manufacturing cost. This product includes the substrate, the conducting layer has all been laid to the upper surface and the lower surface of substrate, be provided with electrically conductive hole on the substrate and the both sides of electrically conductive hole extend to the tip of two conducting layers respectively, the solder mask has all been laid to the conducting layer of substrate upper surface and the conducting layer of substrate lower surface, the character layer has all been laid in the outside of two solder masks, the solder mask adopts the preparation of polyimide film material, utilize the solid-state and insulating property collocation laser of polyimide film material to generally apply to manufacturing enterprise and do the technological maturity of accurate cutting, can realize adopting the polyimide film to reach the purpose that accurate windowing was hindered in the hardboard hinders the solder process, realize cost reduction and the requirement of way environmental protection. The product can ensure the electrical performance of the product under the condition of no dead fold, has less manufacturing procedures, and does not produce organic wastewater and waste gas.

Description

Electronic contest pen electronic keyboard circuit board and preparation method thereof

Technical Field

The invention relates to a computer luminous panel, in particular to a circuit board of an electronic competition pen electronic keyboard.

Background

With the increase of income and the improvement of living standard of people, more and more people have own computers. In order to meet the use requirements of people, people can install various accessories on a computer, and a circuit board of an electronic competition pen and an electronic keyboard is a common one.

The circuit board of the electronic keyboard of the electronic contest pen is used for the purpose that the upper cover plate generates cool and dazzling optical images when a computer is powered on. Although the existing electronic competition pen electric keyboard circuit board can meet the use requirements, the printing ink exposure and development process is required to be used for windowing, the printing, pre-baking, alignment, exposure, development and post-baking 6 processes are required, the energy consumption is high, the generation amount of waste water and waste gas is large, and the production cost is high.

Disclosure of Invention

An embodiment of the present invention provides a circuit board for an electronic keyboard to solve the above problems in the background art.

In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions:

the utility model provides an electricity contest pen electricity keyboard circuit board, which comprises a substrate, the conducting layer has all been laid to the upper surface and the lower surface of substrate, be provided with electrically conductive hole on the substrate and the both sides in electrically conductive hole extend to the tip of two conducting layers respectively, the solder mask has all been laid to the conducting layer of substrate upper surface and the conducting layer of substrate lower surface, the character layer has all been laid in the outside of two solder masks, the solder mask adopts polyimide film material preparation, utilize polyimide film material's solid-state and insulating property collocation laser generally to be applied to the manufacturing enterprise and do the technological maturity of accurate cutting, can realize adopting the polyimide film to reach the purpose that the accurate window of opening hinders the solder in the hardboard hinders the solder process, realize cost reduction and the requirement of way environmental protection.

As a further scheme of the embodiment of the invention: the base material is made of FR4 material, FR-4 is a code number of a flame-resistant material grade, and the expression means a material specification that the resin material must be self-extinguishing after burning, and is not a material name but a material grade.

As a further scheme of the embodiment of the invention: the conducting layer is made of copper foil materials, the materials are easy to obtain, the processing is convenient, and the using effect is good.

As a further scheme of the embodiment of the invention: the thickness of the conducting layer is 0.01-0.02mm, and the conducting layer is suitable for different working environments.

As a further scheme of the embodiment of the invention: the length of conducting layer is unanimous with the length of substrate, and the one end of solder mask and character layer all aligns with the one end of substrate, and the length of solder mask and character layer all is less than the length of substrate, and the result of use is better.

As a further scheme of the embodiment of the invention: and a bonding pad is arranged on one side of the conducting layer and is arranged on the conducting layer by adopting a nickel-gold process, so that the processing requirement is met.

The preparation method of the electronic competition pen electronic keyboard circuit board comprises the following specific steps:

step one, carrying out laser cutting on each layer according to an image, carrying out accurate alignment and hot melting pressurization on the solder mask layer, the conducting layer, the character layer and the base material, and attaching each layer;

and step two, pressing each layer to ensure that each layer is fully sealed, then curing, and fully aging the solder mask to obtain a finished product. The existing method for obtaining accurate pad windowing in an ink exposure and development mode comprises the following specific steps: 1. screen printing photosensitive ink is printed on the base material in a yellow light dust-free chamber by using a screen plate; 2. pre-baking the ink (at 70 ℃ for 30 minutes); 3. accurately aligning the film negative (with shielding and light-transmitting patterns) with the substrate after the ink is pre-baked; 4. exposing the product (ultraviolet light is utilized to perform a light reaction with the photosensitive ink through the light-transmitting part of the film); 5. developing the product (using a sodium carbonate developer to swell and remove the part of the ink image which is not irradiated by the ultraviolet light, thereby forming a precise solder-resisting window on the product); 6. after inking, the cured (150 ℃ C., 1 hour). The preparation method only needs 4 working procedures, has fewer relative working procedures, does not generate organic wastewater and waste gas, and has more advantages in environmental protection.

As a further scheme of the embodiment of the invention: and in the second step, a fast press is adopted for pressing, the curing temperature is 140-170 ℃, and the curing time is 0.8-1.5 hours.

Compared with the prior art, the embodiment of the invention has the beneficial effects that:

this product reasonable in design adopts the substrate to combine the polyimide film of soft board material, except can realizing that SMT makes a piece completely and hinders the function of welding, still possesses certain flexibility, under the condition of not turning over firmly, can guarantee the electrical property of product, and the preparation process is less, and does not produce organic waste water and waste gas, and the feature of environmental protection has more the advantage, and use prospect is wide.

Drawings

Fig. 1 is a schematic structural diagram of a circuit board of an electronic pen-shaped electronic keyboard.

Wherein: 1-character layer, 2-solder mask layer, 3-conductive layer, 4-substrate, 5-conductive hole.

Detailed Description

The technical solution of the present patent will be described in further detail with reference to the following embodiments.

Example 1

The utility model provides an electricity contest a keyboard circuit board, including substrate 4, conducting layer 3 has all been laid to the upper surface and the lower surface of substrate 4, be provided with electrically conductive hole 5 on substrate 4 and electrically conductive hole 5's both sides extend to the tip of two conducting layers 3 respectively, solder mask 2 has all been laid to the conducting layer 3 of 4 upper surfaces of substrate and the conducting layer 3 of 4 lower surfaces of substrate, character layer 1 has all been laid in the outside of two solder mask 2, solder mask 2 adopts the preparation of polyimide film material, utilize the solid-state and insulating property collocation laser of polyimide film material to generally be applied to the manufacturing enterprise and do the technological maturity of accurate cutting, can realize adopting the polyimide film to reach the purpose that accurate windowing hinders welding in hardboard hinders welding process, realize cost reduction and the requirement of way environmental protection.

In order to further ensure the flame retardant effect, the base material 4 is made of FR4 material, FR-4 is a code of a flame-retardant material grade, and the expression means a material specification that the resin material must be capable of self-extinguishing after passing through a combustion state, and the material specification is not a material name but a material grade.

Furthermore, the conducting layer 3 is made of a copper foil material, so that the material is easy to obtain, convenient to process and good in using effect.

Furthermore, the thickness of the conducting layer 3 is 0.01-0.02mm, and the conducting layer is suitable for different working environments.

step one, carrying out laser cutting on each layer according to an image, carrying out accurate alignment and hot melting pressurization on the solder mask layer 2, the conducting layer 3, the character layer 1 and the base material 4, and attaching each layer;

and step two, pressing each layer to ensure that each layer is fully sealed, then curing at the curing temperature of 140 ℃ for 1.3 hours, and fully aging the solder mask layer 2 to obtain a finished product.

Example 2

In order to ensure the using effect, the length of the conducting layer 3 is consistent with that of the substrate 4, one ends of the solder mask layer 2 and the character layer 1 are aligned with one end of the substrate 4, and the lengths of the solder mask layer 2 and the character layer 1 are smaller than that of the substrate 4, so that the using effect is better.

Furthermore, a bonding pad is arranged on one side of the conducting layer 3, and the bonding pad is mounted on the conducting layer 3 through a nickel-gold process, so that the processing requirement is met.

and step two, pressing each layer by adopting a quick press to ensure that each layer is fully sealed, then curing at the curing temperature of 150 ℃ for 1 hour, and fully aging the solder mask layer 2 to obtain a finished product.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides an electricity is competed for a keyboard circuit board, includes substrate (4), conducting layer (3) have all been laid to the upper surface and the lower surface of substrate (4), be provided with electrically conductive hole (5) on substrate (4) and the both sides of electrically conductive hole (5) extend to the tip of two conducting layers (3) respectively, solder mask (2) have all been laid in conducting layer (3) of substrate (4) upper surface and conducting layer (3) of substrate (4) lower surface, character layer (1) have all been laid in the outside of two solder mask (2), a serial communication port, solder mask (2) adopt the preparation of polyimide film material.

2. The electronic card for pen-shaped electronic keyboard of claim 1, wherein the substrate (4) is made of FR4 material.

3. The electronic competition pen keyboard circuit board according to claim 1 or 2, wherein the conductive layer (3) is made of a copper foil material.

4. The electronic card for pen-shaped electronic keyboard of claim 1, wherein the thickness of the conductive layer (3) is 0.01-0.02 mm.

5. The electronic contest pen keyboard circuit board of claim 1, characterized in that, the length of conducting layer (3) is unanimous with the length of substrate (4), and the solder mask (2) and the one end of character layer (1) all align with the one end of substrate (4), and the length of solder mask (2) and character layer (1) are all less than the length of substrate (4).

6. The electronic contest pen electronic keyboard circuit board of claim 1 or 5, characterized in that, one side of conducting layer (3) is provided with the pad, and the pad adopts nickel gold technology to install on conducting layer (3).

7. The preparation method of the electronic competition pen electronic keyboard circuit board as claimed in any one of claims 1 to 6, which is characterized by comprising the following specific steps:

firstly, carrying out laser cutting on each layer according to an image, and carrying out accurate alignment and hot melting pressurization on the solder mask layer (2), the conductive layer (3), the character layer (1) and the base material (4);

and step two, laminating the layers, and then curing to obtain a finished product.

8. The method for preparing a circuit board of an electronic competition pen and keyboard as claimed in claim 7, wherein a rapid press is used for pressing in the second step, the curing temperature is 140 ℃ and 170 ℃, and the curing time is 0.8-1.5 hours.