WO2014180250A1

WO2014180250A1 - Touch control panel and manufacturing method therefor

Info

Publication number: WO2014180250A1
Application number: PCT/CN2014/075921
Authority: WO
Inventors: 林桂婷; 谭百安; 许毅中
Original assignee: 宸正光电（厦门）有限公司
Priority date: 2013-05-09
Filing date: 2014-04-22
Publication date: 2014-11-13
Also published as: CN203480450U

Abstract

A touch control panel, comprising: a substrate (101), which is provided with at least one peripheral area (101B) arranged at one side of an induction area (101A); a sensing electrode layer (102), which extends to the peripheral area (101B) from the induction area (101A); a light shading layer (103), which is arranged in the peripheral area (101B) and covers the sensing electrode layer (102) located in the peripheral area (101B), wherein the light shading layer (103) is provided with a plurality of through holes (105) to expose a part of the sensing electrode layer (102) located in the peripheral area (101B), and the light shading layer (103) is made of an ultraviolet-proof material; a conductive filling layer, which fills the through holes (105) of the light shading layer (103), wherein the conductive filling layer (1061) is made of an ultraviolet-cured material; a signal transmission line (107), which is arranged on the light shading layer (103), and the signal transmission line (107) is electrically connected to the sensing electrode layer (102) via the conductive filling layer (1061). Additionally provided is a method for manufacturing the touch control panel. By means of this structure, the requirements of the prior art to the high printing accuracy of the touch control panel are satisfied, and the problems such as abnormal functions due to printing are solved.

Description

Touch panel and manufacturing method thereof

技术领域 Technical field

The present invention relates to touch technology, and more particularly to a touch panel and a method of fabricating the same.

背景技术 Background technique

Because the touch panel can be applied to portable products and has the advantages of user-friendly operation, it can be widely applied to various electronic products, including personal digital assistants (personal digital). Assistant, PDA), palm sized PC, mobile phone, handwriting input device, information appliance (Information Appliance), automated teller machine (ATM), and storefront teller (point of Sale, POS), etc. The number of portable communication and consumer electronic products is increasing, and such products will use a large number of touch panels as their input devices. Therefore, in recent years, many companies have invested in technology related to touch panels.

With the demand for cost reduction and thickness in the touch panel market, the printing technology is more and more widely used in touch panels, and the printed conductive layer is overlapped with the upper/lower circuit layer, and the touch panel of various structures is also popularized. product. As the resolution of the product increases, the size and accuracy of the conductive lines of the touch panel are becoming higher and higher.

The conventional technology uses a printing technology to form a conductive circuit by first forming a sensing electrode layer on a substrate, and then forming a light shielding layer with a through hole in a peripheral region of the sensing electrode layer by a printing technique, and then conducting the conductive material by alignment. The filling is performed into the through holes, thereby achieving electrical conduction between the sensing electrode layer and the peripheral leads.

However, the problem that the production process has the greatest influence on the process is that the printing alignment is very high, and the conductive material and the through-hole offset are prone to occur, which affects the electrical conduction between the sensing electrode layer and the peripheral leads. In turn, it affects product yield.

发明内容 Summary of the invention

In view of the above, in order to prevent the electrical conduction problem caused by the misalignment between the filled conductive material and the through hole, the present invention provides a touch panel, characterized in that: a substrate having a sensing area and at least a peripheral region disposed on one side of the sensing region; a sensing electrode layer disposed on the substrate and extending from the sensing region to the peripheral region; a light shielding layer disposed in the peripheral region and covering the peripheral region On the sensing electrode layer, the light shielding layer has a plurality of through holes to expose a portion of the sensing electrode layer located in the peripheral region, wherein the light shielding layer is an ultraviolet shielding material; a conductive filling layer filling the light shielding layer The through hole, wherein the conductive filling layer is an ultraviolet curing type material; and a signal transmission line disposed on the light shielding layer, and the signal transmission line is electrically connected to the sensing electrode layer through the conductive filling layer.

The present invention further provides a method for fabricating the touch panel, which is characterized in that: a substrate is provided, The substrate has a sensing area and at least one peripheral area disposed on one side of the sensing area; Forming a sensing electrode layer on the substrate, the sensing electrode layer extending from the sensing region to the peripheral region on the substrate; forming a light shielding layer on the peripheral region of the substrate, and the light shielding layer covers the substrate On the sensing electrode layer of the peripheral region, the first light shielding layer has a plurality of through holes to expose a portion of the sensing electrode layer located in the peripheral region, wherein the light shielding layer is an ultraviolet shielding material; forming a conductive filling layer, Filling in the through hole of the light shielding layer, wherein the conductive filling layer is an ultraviolet curing type material; and forming a signal transmission line on the light shielding layer, and the signal transmission line is electrically connected to the sensing layer through the conductive filling layer The electrode layer.

The touch panel and the touch panel manufacturing method thereof have the advantages of reducing the printing precision of the conductive filling layer by using the structure and the alignment mode of the present invention, and improving the electrical property caused by the printing offset. Problems such as abnormal connection (such as short circuit or open circuit).

In order to make the features of the present invention more comprehensible, the following detailed description of the embodiments and the accompanying drawings

附图说明 DRAWINGS

1A-1J are cross-sectional views showing stages of a method of fabricating a touch panel according to an embodiment of the invention.

Figure 2 shows a plan view of Figure 1B.

Figure 3 shows a plan view of Figure 1C.

Figure 4 shows a plan view of Figure 1D.

Figure 5 shows a plan view of Figure 1F.

具体实施方式 detailed description

The present invention will be further described in detail below in conjunction with the drawings and specific embodiments. It will be appreciated that the embodiments provide many applicable inventive concepts that can be implemented in a wide variety of variations. The specific embodiments discussed are merely illustrative of specific ways of using the embodiments and are not intended to limit the scope of the disclosure.

In the following, "an embodiment" means a specific pattern, structure or feature relating to at least one embodiment of the present invention. Therefore, the following "in one embodiment" does not refer to the same embodiment. In addition, specific patterns, structures, or features in one or more embodiments may be combined in a suitable manner. It is noted that the drawings of the present specification are not drawn to scale and are merely used to disclose the invention.

1A to 1J are cross-sectional views showing stages of a method of fabricating a touch panel according to an embodiment of the present invention. The following with Figure 1A ~ FIG. 1J illustrates a method of fabricating a touch panel according to an embodiment of the present invention. First, a substrate 101 is provided. The substrate 101 includes a first side 1011 and a second side 1012 opposite to the first side 1011. The first side 1011 is a touch component that carries various stacks (described in detail later). ), while the second side 1012 is in contact with the user, such as with a finger or a stylus. The substrate 101 may have a sensing area 101A and at least one peripheral area 101B disposed on one side of the sensing area. In the embodiment, the peripheral area 101A is disposed around the sensing area 101B. In this embodiment, the substrate 101 may be composed of any material that can be penetrated by light. For example, the substrate may be made of glass, polymethylmethacrylate (PMMA) or polycarbonate (PC). 2 is a plan view showing the next stage of the touch panel fabrication according to an embodiment of the present invention. FIG. 1B is a cross-sectional view taken along line II' of FIG. 2. Referring to FIG. 1B and FIG. 2, a sensing electrode layer 102 is formed. On the first side 1011 of the substrate 101, in an embodiment, the sensing electrode layer 102 can be composed of any transparent conductive material, such as indium tin oxide (ITO) or indium zinc oxide (IZO). The method of forming the sensing electrode layer 102 may be screen printing or the like. 3 is a plan view showing the next stage of the touch panel fabrication according to an embodiment of the present invention, and FIG. 1C is a cross-sectional view taken along line II' of FIG. 3, referring to FIG. 1C and FIG. 3, on the first side of the substrate 101. A light shielding layer 103 is formed on the periphery of the 1011, wherein the light shielding layer 103 is disposed in the peripheral region and covers the sensing electrode layer 102 located in the peripheral region 101B, so that the uncovered sensing electrode layer constitutes a sensing region 101A, shielding Layer 103 can block ultraviolet light 104. The light shielding layer 103 has a plurality of through holes 105 to expose a portion of the sensing electrode layer 102 located in the peripheral region 101B, and the size and position of the through holes 105 are configured to fill the conductive filling layer 1061 in a subsequent step, the signal transmission line The 107 is disposed on the light shielding layer 103, and the signal transmission line 107 is electrically connected to the sensing electrode layer 102 through the conductive filling layer 1061 in the through hole 105.

In one embodiment, the material of the light shielding layer has an optical density value greater than 3, wherein the optical density is lg (1/trans), and trans is the light transmittance of the light shielding layer, and thus, when the optical density value is greater than 3, The light transmittance is less than 0.1%, and the transmittance of the ultraviolet light 104 will be less than 0.1%. The optical density value of the light shielding layer can be achieved by adjusting the thickness of the light shielding layer 103, such as when the light shielding layer 103 is a black ink material. When the thickness of the layer 103 is greater than 10 um, the optical density value is greater than 3.

In another embodiment, the light shielding layer 103 can also achieve an ultraviolet shielding function by the characteristics of its own material, such as adding an ultraviolet shielding agent. The ultraviolet shielding agent may be an inorganic ultraviolet shielding agent, and the inorganic ultraviolet shielding agent is mainly a ceramic fine powder, and the powder includes kaolin, calcium carbonate, talc powder or a mixture thereof, and the ultraviolet rays are combined with the light shielding layer material. It acts to reflect or scatter ultraviolet shielding, thereby preventing ultraviolet rays from penetrating through the light shielding layer 103. The ultraviolet shielding agent added may also be an organic ultraviolet shielding agent including salicylates, benzophenones, benzotriazoles, substituted acrylonitriles or triazines and hindered amines. A mixture of such substances mainly functions to absorb ultraviolet rays and perform energy conversion, and prevents ultraviolet rays from penetrating through the light shielding layer 103 by changing ultraviolet rays into low-energy thermal energy or short-wavelength electromagnetic waves. The ultraviolet shielding agent added thereto may also be a mixture of an inorganic compound and an organic compound, and prevent ultraviolet rays from being caused by reflecting or scattering incident ultraviolet rays and converting ultraviolet rays into low-energy thermal energy or short-wavelength electromagnetic waves. Through the light shielding layer 103.

4 is a plan view showing the next stage of the manufacture of the touch panel according to an embodiment of the present invention, and FIG. 1D is a cross-sectional view taken along line I-I' of FIG. 4. Referring to FIG. 1D and FIG. 4, a UV reaction can be formed. The conductive layer 106 is formed on the light-shielding layer 103 and filled in the through-holes 105. The conductive layer 106 is strip-shaped. The portion of the conductive layer 106 filled in the through-holes is a conductive filling layer 1061, which is directly formed. The portion on the light shielding layer 103 is a conductive surface layer 1062.

In this embodiment, the material of the conductive layer 106 is an ultraviolet curable conductive material, and further, the ultraviolet curable conductive material is an ultraviolet conductive adhesive, and the ultraviolet conductive adhesive mainly comprises a monomer and a photoinitiator, wherein the monomer mainly includes Acrylate, cyanoacrylate, epoxy resin, silicone.

The photoinitiator in the ultraviolet conductive paste generates activated radicals under the irradiation of ultraviolet rays, and the surface-activated radicals react with oxygen under ultraviolet (250 nm) to form a dioxide group and a monomer, and the internal activation The free radical reacts with the monomer under ultraviolet (365 nm) irradiation to form a monomer radical, which is chemically reacted with the monomer under ultraviolet (365 nm) irradiation, and so on, and finally becomes a polymer. Cured.

The step of forming the conductive layer 106 in this embodiment does not need to accurately align each of the through holes 105. The specific alignment method is as follows. As shown in FIG. 4, the conductive layer 106 formed may be a length covering a plurality of through holes 105. A strip structure which can form a frame structure on the light shielding layer 103 (as shown in FIG. 4). Next, as shown in FIG. 1E, an ultraviolet ray 104 (ultraviolet wavelength range of 200 to 400 nm) is used to illuminate the conductive layer 106 from the second side 1012 of the substrate 101 through the through holes 105 in the substrate 101 and the light shielding layer 103. Since the optical density value of the light shielding layer 103 is greater than 3 and the light transmittance is less than 0.1%, according to the light solid energy=illuminance*time* light transmittance, the light-solid energy obtained by directly forming the conductive surface layer 1062 on the light shielding layer 103 is obtained. Not as much as 0.1% of the conductive filling layer 1061, the conductive surface layer 1061 does not undergo reactive curing after the conductive filling layer 1061 is cured.

In another embodiment, when the light shielding layer 103 is added with an ultraviolet shielding agent, the ultraviolet rays 104 are absorbed or reflected by the ultraviolet shielding agent in the light shielding layer 103, so that the ultraviolet rays 104 cannot be irradiated to the conductive surface layer 1062 through the light shielding layer 103, and thus are electrically conductive. The surface layer 1062 does not undergo reactive solidification. Since the light shielding layer 103 to which the ultraviolet shielding agent is added does not exist in the through hole 105, the ultraviolet ray 104 is not absorbed or reflected, and can be directly irradiated to the conductive filling layer 1061 located in the through hole 105 to be solidified.

5 is a plan view showing the next stage of the manufacture of the touch panel according to an embodiment of the present invention, and FIG. 1F is a cross-sectional view taken along line I-I' of FIG. 5. Referring to FIG. 1F and FIG. Performing a cleaning step in which the cleaning is performed by a cleaning machine to remove the uncured conductive surface layer 1062, leaving only the conductive filling layer 1161 located in the through hole and cured by the above ultraviolet irradiation, and the conductive layer is actually To the electrical connection.

It should be noted that the present embodiment uses the ultraviolet light 104 to illuminate the conductive layer 106 from the second side 1012 of the substrate 101 through the through hole 105, thereby curing the conductive filling layer 1061 in the through hole, and then removing the uncovered portion by a subsequent cleaning step. The conductive surface layer 1062 adopts the manufacturing method of the present invention, and does not need to be accurately aligned with the through hole 105 when forming the conductive filling layer 1061 compared with the prior art, so that the sensing electrode layer and the signal transmission line are not affected due to the alignment deviation. Electrical conduction between them, which in turn affects product yield.

Next, referring to FIG. 1G, a signal transmission line 122 is formed on the light shielding layer 110, and the conductive filling layer 1161 is electrically connected. The signal transmission line 107 can use the screen printing method to match the screen of the design line, and the signal transmission line 107 is printed on the light shielding layer 103 to be in contact with the conductive filling layer 1061 in the through hole 105, so that the signal transmission line 107 can be transparent. The conductive filling layer 1061 is electrically connected to the sensing electrode layer 102.

Referring to FIG. 1H, an insulating layer 108 is formed on the signal transmission line 107 to prevent the signal transmission line 107 from being exposed to the air to cause oxidation. The insulating layer 108 can be formed by screen printing. The insulating layer 108 is preferably made of a transparent material, for example. The constituent materials of the insulating layer include urethane acrylate and resin. The insulating layer 108 can include an opening 1081 exposing the lower portion of the signal transmission line 108.

Referring again to FIG. 1I, a flexible printed circuit board (flexible printed The circuit (abbreviated as FPC) 109 is adhered to the insulating layer 108 via a conductive adhesive layer 110 to be electrically connected to the signal transmission line 107 through the conductive adhesive layer 110. In one embodiment, a flexible circuit board is used as a conductive adhesive layer 110 by using a heat conductive adhesive, and is pressure-bonded to the signal transmission line 107 exposed by the insulating layer 108.

Subsequently, referring to FIG. 1J, a reinforcing adhesive layer 111 is applied between the flexible circuit board 109 and the substrate 101 to increase the strength of the flexible circuit board 109, thereby avoiding softness caused by improper operation during subsequent processing steps or assembly. The circuit board 109 is detached.

Please refer to FIG. 1J again to further disclose the implementation structure of the touch panel. The touch panel includes a touch panel including: a substrate 101 having a sensing area 101A and at least one disposed in the sensing area. a peripheral area 101B on the 101A side; A sensing electrode layer 102 is disposed on the substrate 101 and extends from the sensing region 101A to the peripheral region 101B. A light shielding layer 103 is disposed on the peripheral region 101B and covers the sensing electrode of the peripheral region 101B. On the layer 102, the light shielding layer has a plurality of through holes 105 for exposing a portion of the sensing electrode layer 103 located in the peripheral region 101B, wherein the light shielding layer 103 is a UV protection material; a conductive filling layer 1061 filling the light shielding layer The through hole 105 of the layer, wherein the conductive filling layer 1061 is an ultraviolet curing material; and a signal transmission line 107 is disposed on the light shielding layer 103, and the signal transmission line 107 is electrically connected through the conductive filling layer 1061 The sensing electrode layer 102.

According to the touch panel and the touch panel manufacturing method thereof, the structure and the alignment method of the present invention reduce the printing precision of the conductive filling layer compared with the prior art, and the printing offset is improved. Problems such as electrical conduction abnormality.

Although the preferred embodiment of the present disclosure is described above, it is not intended to limit the invention, and the present invention may be modified and retouched without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application.

Claims

A touch panel characterized by:

a substrate having a sensing area and at least one peripheral area disposed on a side of the sensing area;

a sensing electrode layer disposed on the substrate and extending from the sensing region to the peripheral region;

a light shielding layer disposed on the peripheral region and covering the sensing electrode layer of the peripheral region, the light shielding layer having a plurality of through holes to expose a portion of the sensing electrode layer located in the peripheral region, wherein the light shielding layer The layer is a UV protection material;

a conductive filling layer filling the through hole of the light shielding layer, wherein the conductive filling layer is an ultraviolet curing type material;

A signal transmission line is disposed on the light shielding layer, and the signal transmission line is electrically connected to the sensing electrode layer through the conductive filling layer.
The touch panel of claim 1 , wherein the light shielding layer has an optical density value of at least greater than 3.
The touch panel of claim 1 , wherein the light shielding layer has a thickness of at least 10 um.
The touch panel according to claim 1, wherein the light shielding layer is provided with an ultraviolet shielding agent.
The touch panel according to claim 4, wherein the ultraviolet shielding agent is an inorganic compound, an organic compound or a mixture thereof.
The touch panel according to claim 5, wherein the inorganic compound comprises calcium carbonate, kaolin, talc or a mixture thereof.
The touch panel according to claim 5, wherein the organic compound comprises a mixture of a salicylate, a benzophenone, a benzotriazole, a substituted acrylonitrile or a triazine and a hindered amine.
The touch panel of claim 1 , wherein the conductive filling layer is made of an ultraviolet conductive paste.
The touch panel according to claim 1, wherein the ultraviolet conductive paste comprises a monomer and a photoinitiator.
A method for manufacturing a touch panel, comprising:

Providing a substrate having a sensing area and at least one peripheral area disposed on a side of the sensing area;

Forming a sensing electrode layer on the substrate, the sensing electrode layer extending from the sensing region to the peripheral region on the substrate;

Forming a light shielding layer on the peripheral region of the substrate, and the light shielding layer covers the sensing electrode layer of the peripheral region, the first light shielding layer having a plurality of through holes to expose a portion of the peripheral region a test electrode layer, wherein the light shielding layer is a UV protection material;

Forming a conductive filling layer filled in the through hole of the light shielding layer, wherein the conductive filling layer is an ultraviolet curing type material;

Forming a signal transmission line on the light shielding layer, and the signal transmission line is electrically connected to the sensing electrode layer through the conductive filling layer.
The method of fabricating a touch panel according to claim 10, wherein the step of forming the conductive fill layer comprises:

Forming a conductive layer, the conductive layer includes a portion of the conductive filling layer filled in the through holes, and the other portion is a conductive surface layer directly formed on the light shielding layer;

Irradiating an ultraviolet ray from the substrate to the conductive layer on the other side of the sensing electrode layer, wherein the conductive filling layer is photocured by direct irradiation, and the conductive surface layer is shielded by the light shielding layer without being cured ;as well as

The conductive surface layer is removed.
The method of manufacturing a touch panel according to claim 11, wherein the conductive layer is strip-shaped.
The method of manufacturing a touch panel according to claim 11, wherein the method of removing the conductive surface layer comprises cleaning with a cleaning machine.
The method of manufacturing a touch panel according to claim 10, wherein the ultraviolet light has a wavelength in the range of 200 nm to 400 nm.