CN106211610A - A kind of PCB circuit processing method and spraying equipment - Google Patents
A kind of PCB circuit processing method and spraying equipment Download PDFInfo
- Publication number
- CN106211610A CN106211610A CN201610600315.9A CN201610600315A CN106211610A CN 106211610 A CN106211610 A CN 106211610A CN 201610600315 A CN201610600315 A CN 201610600315A CN 106211610 A CN106211610 A CN 106211610A
- Authority
- CN
- China
- Prior art keywords
- liquid
- insulating substrate
- metal material
- nozzle
- pcb circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/075—Global treatment of printed circuits by fluid spraying, e.g. cleaning a conductive pattern using nozzles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of PCB circuit processing method, including: at one layer of partiting thermal insulation material of insulating substrate surface configuration；On described insulating substrate, spraying melting is the metal material of liquid, and described metal material is set on described insulating substrate formation PCB circuit；Wherein, the fusing point of described partiting thermal insulation material is higher than described metal material.The embodiment of the present invention also provides for corresponding spraying equipment.Technical solution of the present invention, owing to forming PCB circuit with spraying method, can simplify PCB circuit work flow and reduce pollution.
Description
Technical field
The present invention relates to PCB processing technique field, be specifically related to a kind of PCB circuit processing method and spraying equipment.
Background technology
At present, conventional PCB (Printed Circuit Board, printed circuit board) work flow includes: copper-clad plate
Blanking Chemical cleaning---pad pasting figure transfer chemical development etching.
Specifically, the base material such as copper-clad plate that buying is returned, through blanking machine, cut into the size of needs, through chemistry
Solution cleans, and base material is cleaned up, then through laminator pad pasting, is then passed through exposure machine execution figure and shifts, chemical development,
Chemical etching, just can process circuit, obtain pcb board part.
Practice finds, above-mentioned process CIMS is complicated, long through 7 procedures, production cycle, therefore causes entreprise cost to increase
Adding, energy consumption is relatively big, it addition, also can generate multiple chemical liquid, causes environmental pollution.
Summary of the invention
The embodiment of the present invention provides a kind of PCB circuit processing method and spraying equipment, is used for simplifying PCB circuit work flow
And reduce pollution.
First aspect present invention provides a kind of PCB circuit processing method, including: heat insulation insulating substrate surface configuration one layer
Insulant；On described insulating substrate, spraying melting is the metal material of liquid, and described metal material is set in described insulation
PCB circuit is formed on base material；Wherein, the fusing point of described partiting thermal insulation material is higher than described metal material.
Optionally, described insulating substrate is FR4 material, and described partiting thermal insulation material is pottery, and described metal material is copper.
Optionally, described include at one layer of partiting thermal insulation material of insulating substrate surface configuration: in insulating substrate surface-coated
One layer of ceramic coating.
Optionally, described on described insulating substrate spraying melting be that the metal material of liquid includes: heat fusing will be added
Liquid copper transmits to nozzle through transmission pipeline, and described nozzle is by numerical control device control；Utilize described numerical control device, according to designing
Line pattern, described liquid copper is sprayed on described insulating substrate through nozzle.
Second aspect present invention provides a kind of spraying equipment, including: it is provided with the liquid tank of heater, is provided with force (forcing) pump
Transmission pipeline, one end of described transmission pipeline connects described liquid tank, and the other end connects nozzle, and described nozzle is by numerical control device
Control；The described liquid tank being provided with heater, for being molten into liquid by metal material heating；The described force (forcing) pump of being provided with
Transmission pipeline, for transmitting the metal material of liquid to described nozzle；Described nozzle, for the control at described numerical control device
Under, the metal material of liquid is sprayed on insulating substrate formation PCB circuit.
Optionally, described transmission pipeline is tungsten alloy pipeline, and described nozzle is wolfram steel nozzle.
Optionally, it is provided with the liquid tank of heater, specifically for solid copper heating is molten into liquid copper described in.
Optionally, described transmission pipeline being provided with valve, described valve is positioned at the upstream of described force (forcing) pump.
Therefore, in some feasible embodiments of the present invention, use the most common insulating substrate surface configuration one
Layer partiting thermal insulation material, then direct spraying is molten into the metal material of liquid, thus forms the technical scheme of PCB circuit, tool
There is a following technique effect:
First, simplify circuit work flow, the production cycle can be shortened, reduce energy consumption, reduce cost；
Secondly as circuit direct spraying forms, it is not necessary to steps such as etchings, it is possible to reduce or avoid pollution
Chemical liquid, reduces environmental pollution.
Accompanying drawing explanation
In order to be illustrated more clearly that embodiment of the present invention technical scheme, below will be to institute in embodiment and description of the prior art
The accompanying drawing used is needed to be briefly described, it should be apparent that, the accompanying drawing in describing below is only some enforcements of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtains according to these accompanying drawings
Obtain other accompanying drawing.
Fig. 1 is the schematic flow sheet of a kind of PCB circuit processing method that the embodiment of the present invention provides；
Fig. 2 is the structural representation of a kind of spraying equipment that the embodiment of the present invention provides.
In figure, reference includes:
20, spraying equipment；21, heater；22, liquid tank；23, force (forcing) pump；24, transmission pipeline；25, nozzle；26, valve
Door；30, numerical control device；40、PCB.
Detailed description of the invention
The embodiment of the present invention provides a kind of PCB circuit processing method, is used for simplifying PCB circuit work flow and reducing dirt
Dye.The embodiment of the present invention also provides for corresponding spraying equipment.
In order to make those skilled in the art be more fully understood that the present invention program, below in conjunction with in the embodiment of the present invention
Accompanying drawing, is clearly and completely described the technical scheme in the embodiment of the present invention, it is clear that described embodiment is only
The embodiment of a present invention part rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under not making creative work premise, all should belong to the model of present invention protection
Enclose.
Below by specific embodiment, it is described in detail respectively.
Refer to Fig. 1, the embodiment of the present invention provides a kind of PCB circuit processing method, it may include:
110, at one layer of partiting thermal insulation material of insulating substrate surface configuration；
120, on described insulating substrate, spraying melting is the metal material of liquid, described metal material be set in described absolutely
PCB circuit is formed on edge base material；
Wherein, the fusing point of described partiting thermal insulation material is higher than described metal material.
Visible, the thinking of the inventive method is, is molten into the metal material of liquid by direct spraying, by prior art
The chemical process of circuit processing, is converted to the physical process of the present invention program, thus, Optimizing Flow, by excellent for existing 7 procedures
It is melted into 2 procedures to complete, meanwhile, reduces the pollution that waste liquid causes.
PCB is important electronic unit, is the supporter of electronic devices and components, is the carrier of electronic devices and components electrical connection.
PCB includes insulating substrate and the circuit being formed on insulating substrate.According to the difference of the circuit number of plies, can be divided into lamina or
Doubling plate or multi-layer sheet etc..
Generally, the insulating substrate of PCB can be selected for FR4 material, and FR-4 is the code name of a kind of flame resistant material grade, representative
The meaning is that resin material allows for a kind of material specification of self-extinguish through fired state, and it is a kind of material rate, because of
This FR-4 grade material used by current general circuit plate just has very many kinds, but majority is all with so-called four functions
(Tera-Function) composite that epoxy resin is made plus filler (Filler) and glass fibre.FR-4
Epoxy glass cloth laminated board, different according to the purposes used, industry is commonly referred to as: FR-4Epoxy Glass Cloth, insulation
Plate, epoxy plate, epoxy resin board, brominated epoxy resin plate, FR-4, glass mat, glass-fiber-plate, FR-4 stiffening plate, FPC reinforcement
Plate, stiffening plate for flexible circuit board, FR-4 epoxy resin board, fire retardant insulating plate, FR-4 laminated plates, epoxy plate, FR-4 tabula rasa, FR-4
Glass-fiber-plate, epoxy resin bonded fiber, epoxy glass cloth laminated board, drilling liner plate of circuit board.
Circuit on pcb board namely forms different circuit with metal material on FR4 insulating substrate.Generally, institute
State insulant and may select copper, including fine copper or copper alloy, it is of course also possible to select other metal materials golden, silver, stannum
Deng.From performance, price angularly considers, the commonly used copper of industry.
The core thinking of the present invention program is, directly on insulating substrate, spraying melting is the insulation material of the high temperature of liquid
Material, such as the liquid copper after fusing, forms circuit.Owing to the fusing point of conventional FR4 material is about 300 degrees Celsius, and copper
Fusing point the chances are 1038 degrees Celsius, i.e. the fusing point of copper is far above the fusing point of FR4 material, for avoiding the liquid copper of fusing to destroy
FR4 material, the present invention program uses first at one layer of partiting thermal insulation material of insulating substrate surface configuration, sprays,
Namely utilize partiting thermal insulation material to protect FR4 material, improve the fusing point of whole insulating substrate, this just require described heat insulation absolutely
The fusing point of edge material is higher than used metal material.
In the embodiment of the present invention, the optional pottery of described partiting thermal insulation material.Pottery fusing point more than 3000 degrees Celsius,
Far above the fusing point of copper, so, by arranging one layer of pottery at FR4 material surface, it is possible to when the liquid copper of spraying high temperature,
Realize the protection to FR4 material.Concrete, can select to use existing ceramic coating, by the way of coating, at insulation base
One layer of ceramic coating of material surface configuration.
Needs based on processing method, the embodiment of the present invention also provides for corresponding equipment.
Refer to Fig. 2, the embodiment of the present invention also provides for a kind of spraying equipment, is used for realizing said method.
As in figure 2 it is shown, this spraying equipment 20 comprises the steps that
It is provided with the liquid tank 22 of heater 21, is provided with the transmission pipeline 24 of force (forcing) pump 23, described transmission pipeline 24
One end connects described liquid tank 22, and the other end connects nozzle 25, and described nozzle 25 is controlled by numerical control device 30；Wherein,
The described liquid tank 22 being provided with heater 21, for being molten into liquid by metal material heating；
The described transmission pipeline 24 being provided with force (forcing) pump 23, for transmitting the metal material of liquid to described nozzle 25；
Described nozzle 25, under the control of described numerical control device 30, is sprayed on insulation base by the metal material of liquid
PCB circuit is formed on material.Thus prepare required PCB, as shown in figure 40.
Optionally, the upper metal material forming circuit of PCB is generally copper, described in be provided with the liquid tank 22 of heater 21,
Specifically for solid copper heating is molten into liquid copper.
Optionally, described transmission pipeline 24 is tungsten alloy pipeline, such as tungsten-copper alloy pipeline, and the fusing point of tungsten-copper alloy is about
3000 degrees Celsius, can be used to transmit the liquid copper of the high temperature after dissolving.
Optionally, described nozzle 25 is wolfram steel nozzle, and the fusing point of wolfram steel, more than 2500 degrees Celsius, can be used to transmit and dissolves
After the liquid copper of high temperature.
Optionally, described transmission pipeline 24 can be provided with valve 26, be used for controlling to transmit break-make, generally, described valve
Door 26 can be located at the upstream of described force (forcing) pump 23, i.e. between force (forcing) pump 23 and liquid tank 22.
Utilizing above-mentioned spraying equipment 20, on insulating substrate, spraying melting is that the step of the metal material of liquid is the most permissible
Including:
S1, being transmitted to nozzle 25 through transmission pipeline 24 by the liquid copper adding heat fusing, described nozzle 25 is by numerical control device 30
Control；
S2, utilize described numerical control device 30, according to the line pattern designed, described liquid copper is sprayed through described nozzle 25
It is coated on described insulating substrate.Thus form circuit, prepare PCB40.
Visible, in the embodiment of the present invention, by one layer of pottery of FR4 insulating substrate applied atop, increasing its fusing point, and
Heat insulation non-conductive, it is molten into liquid copper through 21 solid coppers of heater, under force (forcing) pump 23 acts on, through special transmission pipeline
24 are transferred at the nozzle 25 that numerical control device 30 controls, and nozzle 25 is through existing numerical control device technology, according to the figure designed
Line pattern on paper, is sprayed directly into liquid copper above FR4 insulating substrate, and the FR4 that liquid copper is attached to scribble pottery is exhausted
Adhere with base material above edge base material and solidify, forming the circuit designed.
What deserves to be explained is, Numeric Control Technology is the technology using computer to realize Digital Program Control, and numerical control device refers to
Apply the equipment of this technology.Numeric Control Technology is also computer numerical control technology (CNC, Compute Numerical Control),
It is the technology using computer to realize Digital Program Control at present.This technology computer is by the control program of storage in advance
Perform the time sequential routine logic control function of the movement locus to equipment and peripheral hardware.Original with hard owing to using computer to substitute
The numerical control device of part logic circuit composition, the various control machines such as the storage making to enter the operating instructions, process, computing, logical judgment
The realization of energy, all can be completed by computer software, and the microcosmic instruction that process generates sends servo drive to and drives electric
Machine or hydraulic actuator drive equipment to run.
In the embodiment of the present invention, existing numerical control device technical controlling shower nozzle 25, the line pattern figure designed can be passed through
Paper can be introduced directly into numerical control device program, and numerical control device controls the trend of shower nozzle according to setting drawing.Concrete for numerical control device
Illustrating to refer to prior art, I will not elaborate.
From the above mentioned, embodiment of the present invention technical scheme has a following key point:
1.PCB circuit processing method, is converted into physical method by chemical method, directly sprays FR4 insulation with liquid copper
Circuit is formed above base material.
2. chemical method is converted into physical method, can reduce the pollution that waste liquid causes.
3. ceramic coated can increase fusing point, partiting thermal insulation on FR4 base material.
Therefore, in some feasible embodiments of the present invention, disclose a kind of PCB circuit processing method, use existing
At common one layer of partiting thermal insulation material of insulating substrate surface configuration, then direct spraying is molten into the metal material of liquid, from
And form the technical scheme of PCB circuit, have the following technical effect that
First, simplify circuit work flow, the production cycle can be shortened, reduce energy consumption, reduce cost；Secondly as
Circuit direct spraying forms, it is not necessary to the steps such as etching, it is possible to reduce or avoid the chemical liquid of pollution, reduce environment
Pollute.
In other feasible embodiments of the present invention, disclosing a kind of spraying equipment, this spraying equipment can be by solid
Copper etc. are metal material melting for liquid, are painted on insulating substrate by nozzle, form PCB circuit, utilize this kind of spraying
Equipment carrys out processing PCB circuit, can simplify circuit work flow, shortens the production cycle, reduces energy consumption, reduces cost；Can also subtract
Less or avoid the chemical liquid of pollution, environmental pollution is reduced.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in certain embodiment
Part, may refer to the associated description of other embodiments.
It should be noted that for aforesaid each method embodiment, in order to be briefly described, therefore it is all expressed as a series of
Combination of actions, but those skilled in the art should know, the present invention is not limited by described sequence of movement, because depending on
According to the present invention, some step can use other order or carry out simultaneously.Secondly, those skilled in the art also should know,
Embodiment described in this description belongs to preferred embodiment, and involved action and module the not necessarily present invention musted
Must.
The PCB circuit processing method provided the embodiment of the present invention above and spraying equipment are described in detail, but
The explanation of above example is only intended to help to understand method and the core concept thereof of the present invention, should not be construed as the present invention's
Limit.Those skilled in the art, according to the thought of the present invention, in the technical scope that the invention discloses, can think easily
The change arrived or replacement, all should contain within protection scope of the present invention.
Claims (8)
1. a PCB circuit processing method, it is characterised in that including:
At one layer of partiting thermal insulation material of insulating substrate surface configuration；
On described insulating substrate, spraying melting is the metal material of liquid, and described metal material is set on described insulating substrate
Form PCB circuit；
Wherein, the fusing point of described partiting thermal insulation material is higher than described metal material.
Method the most according to claim 1, it is characterised in that:
Described insulating substrate is FR4 material, and described partiting thermal insulation material is pottery, and described metal material is copper.
Method the most according to claim 2, it is characterised in that described at one layer of partiting thermal insulation material of insulating substrate surface configuration
Material includes:
At one layer of ceramic coating of insulating substrate surface-coated.
Method the most according to claim 2, it is characterised in that described on described insulating substrate spraying melting be liquid
Metal material includes:
Being transmitted to nozzle through transmission pipeline by the liquid copper adding heat fusing, described nozzle is by numerical control device control；
Utilize described numerical control device, according to the line pattern designed, by described liquid copper through described nozzle be sprayed on described absolutely
On edge base material.
5. a spraying equipment, it is characterised in that including:
Being provided with the liquid tank of heater, be provided with the transmission pipeline of force (forcing) pump, one end of described transmission pipeline connects described liquid
Body groove, the other end connects nozzle, and described nozzle is by numerical control device control；
The described liquid tank being provided with heater, for being molten into liquid by metal material heating；
The described transmission pipeline being provided with force (forcing) pump, for transmitting the metal material of liquid to described nozzle；
Described nozzle, under the control of described numerical control device, is sprayed on insulating substrate formation by the metal material of liquid
PCB circuit.
Spraying equipment the most according to claim 5, it is characterised in that:
Described transmission pipeline is tungsten alloy pipeline, and described nozzle is wolfram steel nozzle.
Spraying equipment the most according to claim 5, it is characterised in that:
The described liquid tank being provided with heater, specifically for being molten into liquid copper by solid copper heating.
Spraying equipment the most according to claim 5, it is characterised in that:
Being provided with valve on described transmission pipeline, described valve is positioned at the upstream of described force (forcing) pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600315.9A CN106211610A (en) | 2016-07-27 | 2016-07-27 | A kind of PCB circuit processing method and spraying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610600315.9A CN106211610A (en) | 2016-07-27 | 2016-07-27 | A kind of PCB circuit processing method and spraying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106211610A true CN106211610A (en) | 2016-12-07 |
Family
ID=57496441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610600315.9A Pending CN106211610A (en) | 2016-07-27 | 2016-07-27 | A kind of PCB circuit processing method and spraying equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106211610A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315118A (en) * | 2020-04-02 | 2020-06-19 | 江西兆信精密电子有限公司 | Electronic contest pen electronic keyboard circuit board and preparation method thereof |
| CN113593777A (en) * | 2021-07-30 | 2021-11-02 | 长春捷翼汽车零部件有限公司 | Method for producing wire harness, nozzle, and wire harness |
| CN115637428A (en) * | 2022-10-28 | 2023-01-24 | 东莞仁海科技股份有限公司 | Preparation process of glass-based PCB (printed circuit board) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020086189A1 (en) * | 1998-12-23 | 2002-07-04 | The Regents Of The University Of California | Colloidal spray method for low cost thin coating deposition |
| JP2006013321A (en) * | 2004-06-29 | 2006-01-12 | Chubu Electric Power Co Inc | Apparatus and method for manufacturing printed circuit board |
| KR20100004475A (en) * | 2008-07-04 | 2010-01-13 | 재단법인서울대학교산학협력재단 | Manufacturing method and apparatus for insulation circuit using cross printing method |
| CN105097611A (en) * | 2014-05-22 | 2015-11-25 | 三菱电机株式会社 | Molten metal discharging device and method for discharging molten metal |
| US20160148726A1 (en) * | 2014-11-20 | 2016-05-26 | Elwha Llc | Printing of micro wires |
| CN105704917A (en) * | 2016-04-18 | 2016-06-22 | 张艺 | Circuit board manufactured through SnPbBi ternary alloy material additive method, and manufacturing process |
| CN105744748A (en) * | 2016-04-26 | 2016-07-06 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for carving type liquid metal circuit |
-
2016
- 2016-07-27 CN CN201610600315.9A patent/CN106211610A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020086189A1 (en) * | 1998-12-23 | 2002-07-04 | The Regents Of The University Of California | Colloidal spray method for low cost thin coating deposition |
| JP2006013321A (en) * | 2004-06-29 | 2006-01-12 | Chubu Electric Power Co Inc | Apparatus and method for manufacturing printed circuit board |
| KR20100004475A (en) * | 2008-07-04 | 2010-01-13 | 재단법인서울대학교산학협력재단 | Manufacturing method and apparatus for insulation circuit using cross printing method |
| CN105097611A (en) * | 2014-05-22 | 2015-11-25 | 三菱电机株式会社 | Molten metal discharging device and method for discharging molten metal |
| US20160148726A1 (en) * | 2014-11-20 | 2016-05-26 | Elwha Llc | Printing of micro wires |
| CN105704917A (en) * | 2016-04-18 | 2016-06-22 | 张艺 | Circuit board manufactured through SnPbBi ternary alloy material additive method, and manufacturing process |
| CN105744748A (en) * | 2016-04-26 | 2016-07-06 | 北京梦之墨科技有限公司 | Manufacturing method and apparatus for carving type liquid metal circuit |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111315118A (en) * | 2020-04-02 | 2020-06-19 | 江西兆信精密电子有限公司 | Electronic contest pen electronic keyboard circuit board and preparation method thereof |
| CN113593777A (en) * | 2021-07-30 | 2021-11-02 | 长春捷翼汽车零部件有限公司 | Method for producing wire harness, nozzle, and wire harness |
| CN115637428A (en) * | 2022-10-28 | 2023-01-24 | 东莞仁海科技股份有限公司 | Preparation process of glass-based PCB (printed circuit board) |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106211610A (en) | A kind of PCB circuit processing method and spraying equipment | |
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| CN104267848B (en) | A kind of contact panel and preparation method thereof | |
| KR100598274B1 (en) | Embedded resistor printed circuit board and method for fabricating the same | |
| CN104716081B (en) | Flexible apparatus and preparation method thereof | |
| CN103987201B (en) | Precursor substrate, flexible printed circuit board and manufacturing method thereof | |
| CN104904326B (en) | For producing the semi-finished product, printed circuit board and its production method of printed circuit board | |
| CN103037640B (en) | Art utilizing common equipment and material to manufacture High Density Interconnect (HDI) laminated plate | |
| CN104812171A (en) | Printed circuit board and processing method thereof | |
| CN106664792A (en) | Extensible flexible printed circuit board and method for manufacturing extensible flexible printed circuit board | |
| CN104582319A (en) | Metallized semi-hole forming method and printed circuit board manufacturing method | |
| CN104519680A (en) | Ecological method for constructing circuit boards | |
| CN105491819A (en) | Rigid-flex board with different flexible appearances and preparation method of rigid-flex board | |
| CN103096647B (en) | The manufacture method of folding type printed circuit board (PCB) | |
| CN101938885A (en) | The manufacture method of printed circuit board (PCB) and the printed circuit board (PCB) that utilizes this method to make | |
| CN103987185A (en) | Multi-layer flexible printed circuit board and manufacturing method thereof | |
| CN203930765U (en) | Capacitance type touch-control panel | |
| US20170135220A1 (en) | Printable Films for Printed Circuit Boards and Processes for Making Same | |
| CN108834337A (en) | A kind of production method and PCB of PCB | |
| CN108376042A (en) | Metal grill sensor and touch screen and preparation method thereof and equipment | |
| CN104582278B (en) | A kind of circuit board and preparation method thereof | |
| CN109587935B (en) | Manufacturing method of circuit board | |
| KR20010074011A (en) | Method of manufacturing for rigid flexible pwb | |
| KR20110110664A (en) | Manufacturing method of double-sided printed circuit board | |
| CN103607849A (en) | Method for manufacturing metal base stepped slot |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161207 |