CN111306975A - 一种铜铝焊接的换热元件及其加工工艺 - Google Patents
一种铜铝焊接的换热元件及其加工工艺 Download PDFInfo
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- 229910052802 copper Inorganic materials 0.000 claims abstract description 39
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- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
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- 239000003292 glue Substances 0.000 claims abstract description 11
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/02—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to soldering or welding
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/084—Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
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- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
- F28F9/266—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators by screw-type connections
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/26—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators
- F28F9/262—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators
- F28F9/268—Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators for radiators by permanent joints, e.g. by welding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4882—Assembly of heatsink parts
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/20—Fastening; Joining with threaded elements
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Abstract
本发明公开了一种铜铝焊接的换热元件及其加工工艺，包括换热器，换热器内设有冷媒，换热器端面上设有铜块，铜块端面上涂覆有导热胶，导热胶上端粘接有芯片，芯片上端设有压板，压板周围设有多颗穿过压板与换热器连接的螺栓，先将铜与铝的焊接面清理干净，在铜与铝焊接面涂上焊料，然后采用N₂气体保护、加热到580～620℃之间；加热过程保持3‑5分钟，使焊料融化，控制加热温度，铜铝基材没融化，焊料渗入到铜和铝接触面内，形成新的合金层，冷却之后，铜铝焊接固定。本发明的有益效果：改变之前压扁嵌入的低效方式，使快速、高效传热变为可能，芯片温度下降，运算能力提高。
Description
技术领域
本发明涉及换热器技术领域，具体为一种铜铝焊接的换热元件及其加工工艺。
背景技术
目前工艺机械、5G基站、云计算和大型计算机的电子元器件、GBT、电脑芯片、计算量越来越大，换热量也越来越大。要快速把热量传到外部，以便保持低温，使电子元器件更高效工作。如目前常用的图2与图3，芯片热量通过导热胶传递到图2换热器，或通过某板传递到铜换热器图3上，再通过换热器内的冷媒带出热量。图2中芯片导热较慢，图3中虽然有铜的换热器，但由于和基板之间采用压扁嵌入的物理连接，导热效率会大大下降。而铜和铝的焊接技术一直没有突破。
通信基站天线射频用壳体采用铝制，但压铸铝加工设备昂贵，特别是大吨位、大压力的压铸机和模具价格均很高，若采用小件压铸再焊接的方法，可以减少设备投入。
发明内容
本发明的目的在于提供一种铜铝焊接的换热元件及其加工工艺，以解决上述背景技术中提出的问题。
为实现上述目的，本发明提供如下技术方案：一种铜铝焊接的换热元件，包括换热器，所述换热器内设有冷媒，所述换热器端面上设有铜块，所述铜块端面上涂覆有导热胶，所述导热胶上端粘接有芯片，所述芯片上端设有压板，所述压板周围设有多颗穿过所述压板与所述换热器连接的螺栓。
优选的，所述冷媒设置于所述换热器内部。
优选的，所述换热器端面还开设有与所述螺栓连接的螺纹孔。
优选的，所述换热器与所述铜块通过焊接连接。
优选的，所述换热器与所述铜块之间还涂覆有焊料。
优选的，所述压板与所述螺栓用于将所述芯片与所述铜块压紧。
优选的，所述铸铝与铸铝、铸铝与铝，铸铝与铜均可焊接连接。
一种铜铝焊接的换热元件加工工艺，包括以下步骤：
步骤一：先将铜与铝的焊接面清理干净；
步骤二：在铜与铝焊接面涂上焊料，然后采用N2气体保护、加热到580～620℃之间；
步骤三：加热过程保持3-5分钟，使焊料融化；
步骤四：控制加热温度，铜铝基材没融化，焊料渗入到铜和铝接触面内，形成新的合金层，冷却之后，铜铝焊接固定。
有益效果
本发明改变之前压扁嵌入的低效方式，或者有些结构限制不能使用的场合，使快速、高效传热变为可能，芯片温度下降，运算能力提高。
附图说明
图1为本发明的剖视示意图；
图2为现有技术的A例剖视示意图；
图3为现有技术的B例剖视示意图。
附图标记
1-换热器，2-冷媒，3-铜块，4-导热胶，5-芯片，6-压板，7-螺栓，8-基板。
具体实施方式
以下是本发明的具体实施例，对本发明的技术方案作进一步的描述，但本发明并不限于这些实施例。
实施例
如图1-3所示，一种铜铝焊接的换热元件，包括换热器1，换热器1内设有冷媒2，换热器1端面上设有铜块3，铜块3端面上涂覆有导热胶4，导热胶4上端粘接有芯片5，芯片5上端设有压板6，压板6周围设有多颗穿过压板6与换热器1连接的螺栓7。
优选的，冷媒2设置于换热器1内部。
优选的，换热器1端面还开设有与螺栓7连接的螺纹孔。
优选的，换热器1与铜块3通过焊接连接。
优选的，换热器1与铜块3之间还涂覆有焊料。
优选的，压板6与螺栓7用于将芯片5与铜块3压紧。
优选的，铸铝与铸铝、铸铝与铝，铸铝与铜均可焊接连接。
一种铜铝焊接的换热元件加工工艺，包括以下步骤：
步骤一：先将铜与铝的焊接面清理干净；
步骤二：在铜与铝焊接面涂上焊料，然后采用N2气体保护、加热到580～620℃之间；
步骤三：加热过程保持3-5分钟，使焊料融化；
步骤四：控制加热温度，铜铝基材没融化，焊料渗入到铜和铝接触面内，形成新的合金层，冷却之后，铜铝焊接固定。
在换热器和胶水之间焊接一片铜片，铜的导热性和导电性远大于铝，可快速导出热量。焊接采用N2气体保护焊。
最后应说明的是：以上所述仅为本发明的优选实施例而已，并不用于限制本发明，尽管参照前述实施例对本发明进行了详细的说明，对于本领域的技术人员来说，其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明性的保护范围之内的发明内容。
Claims (8)
1.一种铜铝焊接的换热元件，包括换热器(1)，其特征在于：所述换热器(1)内设有冷媒(2)，所述换热器(1)端面上设有铜块(3)，所述铜块(3)端面上涂覆有导热胶(4)，所述导热胶(4)上端粘接有芯片(5)，所述芯片(5)上端设有压板(6)，所述压板(6)周围设有多颗穿过所述压板(6)与所述换热器(1)连接的螺栓(7)。
2.根据权利要求1所述的铜铝焊接换热元件，其特征在于：所述冷媒(2)设置于所述换热器(1)内部。
3.根据权利要求1所述的铜铝焊接换热元件，其特征在于：所述换热器(1)端面还开设有与所述螺栓(7)连接的螺纹孔。
4.根据权利要求1所述的铜铝焊接换热元件，其特征在于：所述换热器(1)与所述铜块(3)通过焊接连接。
5.根据权利要求4所述的铜铝焊接换热元件，其特征在于：所述换热器(1)与所述铜块(3)之间还涂覆有焊料。
6.根据权利要求1所述的铜铝焊接换热元件，其特征在于：所述压板(6)与所述螺栓(7)用于将所述芯片(5)与所述铜块(3)压紧。
7.根据权利要求1所述的铜铝焊接换热元件，其特征在于：所述铸铝与铸铝、铸铝与铝，铸铝与铜均可焊接连接。
8.一种铜铝焊接的换热元件加工工艺，其特征在于，包括以下步骤：
步骤一：先将铜与铝的焊接面清理干净；
步骤二：在铜与铝焊接面涂上焊料，然后采用N气体保护、加热到580～620℃之间；
步骤三：加热过程保持3-5分钟，使焊料融化；
步骤四：控制加热温度，铜铝基材没融化，焊料渗入到铜和铝接触面内，形成新的合金层，冷却之后，铜铝焊接固定。
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| CN205485855U (zh) * | 2015-11-04 | 2016-08-17 | 三匠科技（苏州）有限公司 | 一种用于电脑cpu芯片的水冷散热机构 |
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