CN111885814B - 一种复合导热pcb线路板 - Google Patents
一种复合导热pcb线路板 Download PDFInfo
- Publication number
- CN111885814B CN111885814B CN202010758700.2A CN202010758700A CN111885814B CN 111885814 B CN111885814 B CN 111885814B CN 202010758700 A CN202010758700 A CN 202010758700A CN 111885814 B CN111885814 B CN 111885814B
- Authority
- CN
- China
- Prior art keywords
- heat
- strips
- heat dissipation
- radiating
- transverse
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002131 composite material Substances 0.000 title claims abstract description 14
- 230000017525 heat dissipation Effects 0.000 claims abstract description 78
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 239000010410 layer Substances 0.000 claims abstract description 30
- 239000011229 interlayer Substances 0.000 claims abstract description 29
- 230000001965 increasing effect Effects 0.000 claims abstract description 6
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000003365 glass fiber Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 239000012943 hotmelt Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000004080 punching Methods 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000009825 accumulation Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 description 11
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010758700.2A CN111885814B (zh) | 2020-07-31 | 2020-07-31 | 一种复合导热pcb线路板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010758700.2A CN111885814B (zh) | 2020-07-31 | 2020-07-31 | 一种复合导热pcb线路板 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111885814A CN111885814A (zh) | 2020-11-03 |
CN111885814B true CN111885814B (zh) | 2024-03-22 |
Family
ID=73204758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010758700.2A Active CN111885814B (zh) | 2020-07-31 | 2020-07-31 | 一种复合导热pcb线路板 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111885814B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112533363A (zh) * | 2020-12-30 | 2021-03-19 | 泰州市博泰电子有限公司 | 一种高效散热的复合线路板 |
CN113905508A (zh) * | 2021-10-22 | 2022-01-07 | 深圳市广诚达电路技术有限公司 | 一种高散热性多层pcb线路板的制备工艺 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006120996A (ja) * | 2004-10-25 | 2006-05-11 | Murata Mfg Co Ltd | 回路モジュール |
JP2012074497A (ja) * | 2010-09-28 | 2012-04-12 | Denso Corp | 回路基板 |
KR101356474B1 (ko) * | 2013-11-28 | 2014-01-28 | 박천수 | 기체용 판형 열교환기 |
CN207283896U (zh) * | 2017-08-16 | 2018-04-27 | 温州市正好电子有限公司 | 一种具有散热结构的多层pcb板 |
CN207927122U (zh) * | 2018-02-07 | 2018-09-28 | 连云港浩森矿产品有限公司 | 一种散热良好的光端机机箱 |
CN209103227U (zh) * | 2018-12-27 | 2019-07-12 | 东莞市誉铭新精密技术股份有限公司 | 一种平板电脑的散热结构 |
CN209218447U (zh) * | 2018-08-24 | 2019-08-06 | 深圳市昶东鑫线路板有限公司 | 一种可高效散热的pcb板 |
CN110113861A (zh) * | 2019-02-22 | 2019-08-09 | 深圳市兴达线路板有限公司 | 一种高效散热的多层线路板 |
CN209994609U (zh) * | 2018-10-22 | 2020-01-24 | 佛山市顺德区铭昆电子科技有限公司 | 一种抗腐蚀性的线路板 |
CN210781511U (zh) * | 2019-09-20 | 2020-06-16 | 江苏运鸿辉电子科技有限公司 | 一种散热型led线路板 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW565918B (en) * | 2002-07-03 | 2003-12-11 | United Test Ct Inc | Semiconductor package with heat sink |
-
2020
- 2020-07-31 CN CN202010758700.2A patent/CN111885814B/zh active Active
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006120996A (ja) * | 2004-10-25 | 2006-05-11 | Murata Mfg Co Ltd | 回路モジュール |
JP2012074497A (ja) * | 2010-09-28 | 2012-04-12 | Denso Corp | 回路基板 |
KR101356474B1 (ko) * | 2013-11-28 | 2014-01-28 | 박천수 | 기체용 판형 열교환기 |
CN207283896U (zh) * | 2017-08-16 | 2018-04-27 | 温州市正好电子有限公司 | 一种具有散热结构的多层pcb板 |
CN207927122U (zh) * | 2018-02-07 | 2018-09-28 | 连云港浩森矿产品有限公司 | 一种散热良好的光端机机箱 |
CN209218447U (zh) * | 2018-08-24 | 2019-08-06 | 深圳市昶东鑫线路板有限公司 | 一种可高效散热的pcb板 |
CN209994609U (zh) * | 2018-10-22 | 2020-01-24 | 佛山市顺德区铭昆电子科技有限公司 | 一种抗腐蚀性的线路板 |
CN209103227U (zh) * | 2018-12-27 | 2019-07-12 | 东莞市誉铭新精密技术股份有限公司 | 一种平板电脑的散热结构 |
CN110113861A (zh) * | 2019-02-22 | 2019-08-09 | 深圳市兴达线路板有限公司 | 一种高效散热的多层线路板 |
CN210781511U (zh) * | 2019-09-20 | 2020-06-16 | 江苏运鸿辉电子科技有限公司 | 一种散热型led线路板 |
Also Published As
Publication number | Publication date |
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CN111885814A (zh) | 2020-11-03 |
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PB01 | Publication | ||
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TA01 | Transfer of patent application right |
Effective date of registration: 20240301 Address after: 518125 East 3rd Floor, Building 9, Hengmingzhu Science and Technology Industrial Park, Xinqiao Tongfu Industrial Zone, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Yinghuida Optoelectronics Co.,Ltd. Country or region after: China Address before: 510000 1st and 2nd floor, 2nd building, 1st and 2nd floor, 3rd building, zhaofuda Industrial Zone, hongqiaotou, Songgang street, Bao'an District, Shenzhen City, Guangdong Province Applicant before: SHENZHEN XINGDA PCB Co.,Ltd. Country or region before: China |
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