CN111273752B - Computer chip cooling device - Google Patents
Computer chip cooling device Download PDFInfo
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- CN111273752B CN111273752B CN202010055457.8A CN202010055457A CN111273752B CN 111273752 B CN111273752 B CN 111273752B CN 202010055457 A CN202010055457 A CN 202010055457A CN 111273752 B CN111273752 B CN 111273752B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a computer chip cooling device which comprises a liquid storage assembly, a refrigerating assembly and a pumping assembly. The liquid storage assembly consists of a refrigerating surface and a radiating surface; a plurality of heat dissipation bags are arranged on the heat dissipation surface; each heat dissipation bag is used for containing the cold accumulation liquid injected into the heat dissipation bag in a controlled manner; the refrigerating assembly is arranged between the radiating surface and the radiating fan so that the cold accumulating liquid absorbs cold from the refrigerating assembly; the pumping assembly is configured to controllably pump the cold storage fluid in the refrigeration assembly into each heat dissipation packet and to pump the cold storage fluid in each heat dissipation packet into the refrigeration assembly. The computer chip cooling device provided by the invention uses double cooling, adopts the heat dissipation bag to contain the cold accumulation liquid which is injected into the heat dissipation bag in a controlled manner, and adopts the liquid storage component to contain the cold accumulation liquid, so that the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of computer cooling, in particular to a computer chip cooling device.
Background
An important problem in high power electronic devices such as personal computers, workstations, and notebook computers is how to stabilize the chip at a reasonable operating temperature even if the high density heat generated by the chip is quickly and efficiently dissipated. The difficulty in cooling a tiny system such as a computer chip is: with existing cooling approaches and architectures, firstly, too high a cooling air rate can cause large acoustic noise; secondly, the compactness requirements of the electronic device architecture allow only a limited cooling space to be reserved; third, mounting large size heat sinks on the module should be avoided as much as possible. These problems all illustrate the importance of developing high power density heat dissipation devices, and the small size and high efficiency are two of the most important criteria. With the development of the microelectronic industry, it is always a goal pursued by people to find a heat dissipation method with high heat transport efficiency for a relatively high heat source density in various electronic devices.
At present, people generally adopt forced convection air to cool a heating device, namely, a fan is used for pumping cooling air to the surface of a heat dissipation device to dissipate heat at the surface of the heat dissipation device, but the heat dissipation amount is limited in the mode, the cooling efficiency is in direct proportion to the speed of the fan, and remarkable noise is generated when the speed of the fan is too high; furthermore, the micro-devices have high heat density and air cooling is difficult to be sufficient. With the development of computer chip technology, the size of a chip is reduced, the integration level and the power consumption are further increased, the requirement on the heat exchange strength of a radiator is higher and higher, the mode of water cooling or heat pipe heat dissipation is proposed on schedule, and corresponding products are sporadically appeared on the market. Although the water cooling method has high heat dissipation efficiency, in operation, factors such as evaporation, condensation and scale can cause aging and corrosion of local devices, so that the requirements on water quality and pipelines are high, leakage can be caused due to poor sealing, and the reliability of the water cooling method needs to be improved. The key reason for the water cooling mode adopted at present is reported to be that the chip is easy to burn out, the water cooling system is unreliable, once the water circulation stops due to some faults, the heat generated by the chip cannot be discharged, and the temperature of the chip can rise rapidly until the chip is burnt out.
Disclosure of Invention
The invention aims to provide a computer chip cooling device, which at least solves part of defects in the prior art.
A further object of the present invention is to provide dual cooling, which improves cooling efficiency.
It is a further object of the present invention to reduce the size of the desuperheating cooling device.
Particularly, the invention provides a computer chip cooling device, which comprises:
the liquid storage assembly consists of a refrigerating surface and a radiating surface; a plurality of heat dissipation bags are arranged on the heat dissipation surface; each heat dissipation bag is used for containing the cold accumulation liquid injected into the heat dissipation bag in a controlled manner; a cooling fan is arranged above the cooling surface of the liquid storage component;
the refrigerating assembly is arranged between the radiating surface and the radiating fan so that the cold accumulating liquid absorbs cold from the refrigerating assembly; and
and the pumping assembly is configured to controllably pump the cold storage liquid in the refrigeration assembly into each heat dissipation package and pump the cold storage liquid in each heat dissipation package into the refrigeration assembly.
Preferably, each heat dissipation pack is a collapsible reservoir bag or cartridge of variable volume that expands when containing the cold storage fluid and contracts when the cold storage fluid therein is evacuated.
Preferably, each heat dissipation pack is configured to: when the cold storage liquid is contained, the heat dissipation surface is flat and vertically unfolded away from the heat dissipation surface; and when the cold storage liquid is pumped out, the cold storage liquid is attached to the side wall of the radiating surface in a shrinking state with reduced volume.
Preferably, the pumping assembly is further configured to:
when the ambient temperature of the chip is set within the cooling temperature range, the cold storage liquid in the refrigeration assembly is pumped into each heat dissipation package, and
when the temperature of the heat dissipation package is set within the high temperature threshold range, the cold storage fluid in each heat dissipation package is pumped into the refrigeration assembly.
Preferably, the cooling temperature ranges from 8 ℃ to 15 ℃; the high temperature threshold range is greater than or equal to 16 ℃.
Preferably, the reservoir assembly is adapted to contain a cold storage fluid that is controllably injected therein.
Preferably, the pumping assembly is further configured to controllably pump cold storage fluid from the refrigeration assembly into the liquid storage assembly and to pump cold storage fluid from the liquid storage assembly into the refrigeration assembly.
Preferably, the pumping assembly is further configured to:
when the ambient temperature of the chip is set within the cooling temperature range, the cold storage liquid in the refrigeration assembly is pumped into each heat dissipation package, and
and when the temperature of the liquid storage assembly is set within the high-temperature threshold range, pumping the cold storage liquid in each heat dissipation bag into the refrigeration assembly.
Preferably, the cold accumulation liquid is a salt mixture, wherein the solute salt is ammonium nitrate, and the solvent salt is a mixture of sodium carbonate, sodium phosphate and water.
Compared with the prior art, the cooling device for the computer chip provided by the invention has the following beneficial effects:
the computer chip cooling device provided by the invention uses double cooling, adopts the heat dissipation bag to contain the cold accumulation liquid which is injected into the heat dissipation bag in a controlled manner, adopts the liquid storage component to contain the cold accumulation liquid, and utilizes the pumping component to pump the cold accumulation liquid in the refrigeration component into each heat dissipation bag when the environmental temperature of the chip is set in a cooling temperature range, and pump the cold accumulation liquid in each heat dissipation bag into the refrigeration component when the temperature of the heat dissipation bag is set in a high-temperature threshold range; and the cold accumulation liquid in the refrigerating assembly can be pumped into the liquid storage assembly in a controlled manner, and the cold accumulation liquid in the liquid storage assembly is pumped into the refrigerating assembly, so that the cooling effect is finally improved.
Furthermore, the volume of the heat dissipation bag adopted in the invention can be changed according to the cold storage liquid amount, and the volume of the cooling device can be reduced when the heat dissipation bag is not used.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
FIG. 1 is a schematic structural diagram of a computer chip cooling device according to the present invention in one state;
FIG. 2 is a schematic structural diagram of another state of the cooling device for cooling down a computer chip according to the present invention.
In the figure: 10. computer chip cooling device 100, stock solution subassembly, 110, refrigeration face, 120, cooling surface, 121, heat dissipation package, 200, refrigeration subassembly, 300, pump sending subassembly, 400, radiator fan.
Detailed Description
The present invention will be further described with reference to the following examples. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Please refer to fig. 1 and fig. 2, which are schematic structural diagrams of the computer chip cooling device 10 provided by the present invention in different states, respectively. In one embodiment, the present invention provides a computer chip cooling device 10, generally comprising a liquid storage assembly 100, a refrigeration assembly 200, and a pumping assembly 300. The liquid storage assembly 100 is composed of a cooling surface 110 and a heat dissipation surface 120, and the cooling surface 110 and the heat dissipation surface 120 may form a closed space to contain a cold storage liquid. Specifically, the cooling surface 110 is attached to or disposed proximate to the computer chip to cool the computer chip. The heat dissipating surface 120 is mounted with a plurality of heat dissipating packs 121, wherein each heat dissipating pack 121 is used for containing a cold storage liquid injected therein in a controlled manner. A heat dissipation fan 400 is installed above the heat dissipation surface 120 of the liquid storage assembly 100, and the heat dissipation fan 400 assists in discharging heat from the heat dissipation surface to the outside of the computer. The cooling module 200 is disposed between the heat dissipating surface 120 and the heat dissipating fan 400, and the cold storage liquid absorbs cold from the cooling module 200. Pumping assembly 300 is configured to controllably pump cold storage fluid from refrigeration assembly 200 into each heat dissipation packet 121 and to pump cold storage fluid from each heat dissipation packet 121 into refrigeration assembly 200.
Further, each heat dissipating pack 121 is a collapsible pouch or cartridge of variable volume that expands when it contains a cold storage fluid (as shown in FIG. 1) and contracts when the cold storage fluid therein is evacuated (as shown in FIG. 2). Each heat dissipation pack 121 is configured to be unfolded in a flat shape perpendicularly away from the heat dissipation surface 121 when containing the cold storage liquid; when the cold storage liquid is pumped out, the cold storage liquid is attached to the side wall of the radiating surface 121 in a shrinking state with reduced volume, so that the space state occupied by the radiating bag is reduced, and the volume of the cooling device for cooling the computer chip can be reduced when the radiating bag is not used for radiating.
The pumping assembly 300 is further configured to: the cold storage fluid in the cooling module 200 is pumped into each heat dissipation package 121 when the ambient temperature of the chip is set within the cooling temperature range, and the cold storage fluid in each heat dissipation package 121 is pumped into the cooling module 200 when the temperature of the heat dissipation package 121 is set within the high temperature threshold range. Specifically, the cooling temperature range is 8-15 ℃; the high temperature threshold range is greater than or equal to 16 ℃. At 8-15 deg.c, the high efficiency operation of the computer chip is ensured and the energy utilization is maximized. When the heat absorbed by the heat dissipation packages 121 raises the temperature thereof to above 16 ℃, the pumping assembly 300 may pump the cold storage fluid in each heat dissipation package 121 to the refrigeration assembly 200 to cool the cold storage fluid.
The pumping assembly 300 comprises two pumping lines, one is used for communicating the cooling assembly 200 with the heat dissipation bag 121 of the liquid storage assembly 100, and the other is used for communicating the closed space of the cooling assembly 200 with the closed space of the liquid storage assembly 100.
In some preferred embodiments, the reservoir assembly 100 is used to contain a cold accumulating fluid that is controllably injected into its enclosed space. Pumping assembly 300 is also configured to controllably pump cold storage fluid from refrigeration assembly 200 into the enclosed space of liquid storage assembly 100 and to pump cold storage fluid from the enclosed space of liquid storage assembly 100 into refrigeration assembly 200. Specifically, pumping assembly 200 is still further configured to: when the ambient temperature of the chip is set within the cooling temperature range, the cold storage fluid in refrigeration assembly 200 is pumped into the closed space of liquid storage assembly 100, and when the temperature of liquid storage assembly 100 is set within the high temperature threshold range, the cold storage fluid in each heat dissipation package 121 is pumped into refrigeration assembly 200. Similarly, the cooling temperature range is 8-15 ℃; the high temperature threshold range is greater than or equal to 16 ℃.
The cold accumulation liquid is a salt mixture, wherein the solute salt is ammonium nitrate, and the solvent salt is a mixture of sodium carbonate, sodium phosphate and water. Practice proves that the refrigeration effect is better when the mixture of sodium carbonate and sodium phosphate is used as the solvent salt than when the sodium phosphate is used as the solvent salt alone. In a specific embodiment, the mass ratio of the carbonate to the phosphate is 1: 3-3: 1, and when the mass ratio of the carbonate to the phosphate is 2:1, the refrigeration effect is best; the mass ratio of ammonium nitrate and carbonate to phosphate is 1: 1. In practical application, the ratio of the salts to the water can be adjusted according to the required refrigeration effect.
The computer chip cooling device 10 provided by the invention uses double cooling, adopts the heat dissipation package 121 to contain the cold accumulation liquid which is injected into the heat dissipation package in a controlled manner, adopts the liquid storage component 100 to contain the cold accumulation liquid, and utilizes the pumping component 300 to pump the cold accumulation liquid in the refrigeration component 100 into each heat dissipation package 121 when the environmental temperature of the chip is set in a cooling temperature range, and pump the cold accumulation liquid in each heat dissipation package 121 into the refrigeration component 200 when the temperature of the heat dissipation package 121 is set in a high temperature threshold range; and the cold accumulation liquid in the refrigeration assembly 200 can be controllably pumped into the liquid storage assembly 100, and the cold accumulation liquid in the liquid storage assembly 100 can be pumped into the refrigeration assembly 200, so that the cooling effect is finally improved.
Further, the volume of the heat dissipation package 121 employed in the present invention can be changed according to the amount of the cold storage fluid, and the volume of the cooling device 10 can be reduced when the heat dissipation package 121 is not used.
Thus, it should be appreciated by those skilled in the art that while a number of exemplary embodiments of the invention have been illustrated and described in detail herein, many other variations or modifications consistent with the principles of the invention may be directly determined or derived from the disclosure of the present invention without departing from the spirit and scope of the invention. Accordingly, the scope of the invention should be understood and interpreted to cover all such other variations or modifications.
Claims (6)
1. The utility model provides a computer chip cooling device which characterized in that: the cooling device includes:
the liquid storage assembly consists of a refrigerating surface and a radiating surface; a plurality of heat dissipation bags are arranged on the heat dissipation surface; each heat dissipation bag is used for containing a cold accumulation liquid injected into the heat dissipation bag in a controlled manner; a heat radiation fan is arranged above the heat radiation surface of the liquid storage assembly;
the refrigerating assembly is arranged between the heat radiating surface and the heat radiating fan so that the cold accumulating liquid absorbs cold from the refrigerating assembly;
a pumping assembly configured to controllably pump cold storage fluid from the refrigeration assembly into each of the heat dissipation packets and to pump cold storage fluid from each of the heat dissipation packets into the refrigeration assembly;
each heat dissipation bag is a telescopic liquid storage bag or box body with variable volume, and the telescopic liquid storage bag or box body extends when containing cold storage liquid and contracts when the cold storage liquid in the telescopic liquid storage bag or box body is pumped out;
the liquid storage component is used for containing the cold accumulation liquid which is injected into the liquid storage component in a controlled manner; the pumping assembly comprises two pumping pipelines, one is used for communicating the cooling assembly with the heat dissipation bag of the liquid storage assembly, and the other is used for communicating the closed space of the cooling assembly with the closed space of the liquid storage assembly; the pumping assembly is further configured to controllably pump cold storage fluid from the refrigeration assembly into the liquid storage assembly and to pump cold storage fluid from the liquid storage assembly into the refrigeration assembly.
2. The computer chip cooling device of claim 1, wherein: each said heat dissipation pack configured to: when the cold storage liquid is contained, the heat dissipation surface is flat and is unfolded away from the heat dissipation surface; and when the cold storage liquid is pumped out, the cold storage liquid is attached to the side wall of the heat dissipation surface in a shrinking state with reduced volume.
3. The computer chip cooling device of claim 1, wherein: the pumping assembly is further configured to:
when the environmental temperature of the chip is set within the cooling temperature range, the cold storage liquid in the refrigeration assembly is pumped into each heat dissipation bag, and
pumping the cold storage fluid in each heat dissipation package into the refrigeration assembly when the temperature of the heat dissipation package is set within a high temperature threshold range.
4. The computer chip cooling device of claim 3, wherein:
the cooling temperature range is 8-15 ℃;
the high temperature threshold range is greater than or equal to 16 ℃.
5. The computer chip cooling device of claim 1, wherein: the pumping assembly is further configured to:
when the environmental temperature of the chip is set within the cooling temperature range, the cold storage liquid in the refrigeration assembly is pumped into each heat dissipation bag, and
and pumping the cold accumulation liquid in each heat dissipation package into the refrigeration assembly when the temperature of the liquid storage assembly is set within a high-temperature threshold range.
6. The computer chip cooling device according to claim 1, wherein: the cold accumulation liquid is a salt mixture, wherein the solute salt is ammonium nitrate, and the solvent salt is a mixture of sodium carbonate, sodium phosphate and water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055457.8A CN111273752B (en) | 2020-01-17 | 2020-01-17 | Computer chip cooling device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010055457.8A CN111273752B (en) | 2020-01-17 | 2020-01-17 | Computer chip cooling device |
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| CN111273752A CN111273752A (en) | 2020-06-12 |
| CN111273752B true CN111273752B (en) | 2021-07-13 |
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| CN202010055457.8A Expired - Fee Related CN111273752B (en) | 2020-01-17 | 2020-01-17 | Computer chip cooling device |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1612084A (en) * | 2003-10-31 | 2005-05-04 | 中国科学院理化技术研究所 | Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature |
| CN104703437A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Cooling device and cooling system |
| CN206497885U (en) * | 2016-12-26 | 2017-09-15 | 向岚 | A kind of radiating device of chip for computer |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1380594A (en) * | 2001-09-27 | 2002-11-20 | 胡维明 | Portable cipher box type computer and its machine box |
| JP4020725B2 (en) * | 2002-07-29 | 2007-12-12 | 富士通株式会社 | Electronic equipment with energy-saving cooling system |
| US9343436B2 (en) * | 2010-09-09 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked package and method of manufacturing the same |
| US9329643B2 (en) * | 2013-06-17 | 2016-05-03 | Michael R. Tobias | Apparatus for holding a semiconductor module |
| CN109121353A (en) * | 2017-06-22 | 2019-01-01 | 中航光电科技股份有限公司 | A kind of portable liquid cool equipment pumping equipment and its inflation mechanism, drainage mechanism |
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- 2020-01-17 CN CN202010055457.8A patent/CN111273752B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1612084A (en) * | 2003-10-31 | 2005-05-04 | 中国科学院理化技术研究所 | Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature |
| CN104703437A (en) * | 2013-12-09 | 2015-06-10 | 中冶长天国际工程有限责任公司 | Cooling device and cooling system |
| CN206497885U (en) * | 2016-12-26 | 2017-09-15 | 向岚 | A kind of radiating device of chip for computer |
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| CN111273752A (en) | 2020-06-12 |
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