CN108874105A - A kind of CPU radiator for highly dense server - Google Patents

Abstract

The invention discloses a kind of CPU radiators for highly dense server, including condenser, communicating pipe, evaporator, it is connected between the condenser and evaporator by communicating pipe, refrigerant is equipped in condenser and evaporator, the evaporator is set to the upper end of CPU, heat dissipating silicone grease is equipped between evaporator and CPU, evaporator is connect with machine box for server with condenser.The present invention takes away the heat of CPU generation by the transformation of refrigerant condition, instead of the original cooling fin cooling method of CPU, solve the problems, such as that cold wind temperature raising after first cpu heat causes second CPU heat dissipation effect poor, the heat dissipation effect of two CPU is improved simultaneously, the radiator can satisfy the cooling requirements of the CPU of 205W, CPU thermal damage is prevented, guarantees its speed of service, it is ensured that CPU gives full play to performance.

Description

A CPU cooling device for high-density server

technical field

The invention relates to the technical field of CPU cooling, in particular to a CPU cooling device for high-density servers.

Background technique

Upgrading the Purley node CPU to Cascade Lake-SP needs to support a 205W CPU, but the current CPU cooler can only support 165W, which cannot be supported in a 1U form. The Purley motherboard adopts a half-width structure, and the CPU is placed front and back, which limits the cooling air volume of the rear CPU to a certain extent. After being preheated by the first CPU radiator, the cold air enters the second CPU radiator, reducing the heat dissipation of the second CPU. In addition, there are 4 hard disks on both sides of the CPU, which require a certain amount of air intake to solve the heat dissipation problem of the hard disk, which further leads to poor cooling effect of the CPU.

Contents of the invention

The present invention aims at the above-mentioned deficiencies in the prior art, and provides a CPU cooling device for high-density servers, which takes away the heat generated by the CPU through the transition of the refrigerant state, replaces the original cooling method of the CPU heat sink, and solves the problem of cold wind. The heat dissipation effect of the second CPU is poor due to the temperature rise after passing through the first CPU radiator. At the same time, the heat dissipation effect of the two CPUs is improved. The heat dissipation device can meet the heat dissipation requirements of the 205W CPU, prevent CPU thermal damage, and ensure Its running speed ensures that the CPU can give full play to its performance.

To achieve the above object, the invention provides the following technical solutions:

A CPU cooling device for high-density servers, comprising a condenser, a communication pipe, and an evaporator, the condenser and the evaporator are communicated through a communication pipe, refrigerant is provided in the condenser and the evaporator, and the evaporator It is arranged on the upper end of the CPU, and heat-dissipating silicon grease is provided between the evaporator and the CPU, and both the evaporator and the condenser are connected to the server chassis.

Preferably, the CPU includes a front CPU and a rear CPU, and the CPU cooling device includes a first cooling device and a second cooling device, the first cooling device is connected to the front CPU, the second cooling device is connected to the rear CPU, and the second cooling device is connected to the rear CPU. The condenser of the first heat dissipation device and the condenser of the second heat dissipation device are arranged on two sides of the server cabinet respectively, and the condenser of the first heat dissipation device is aligned with the condenser of the second heat dissipation device.

Preferably, the condenser includes a condensation box, heat dissipation fins, and a connecting plate. The condensation box is a cuboid structure, and a first connection box is provided on the lower end surface of the condensation box, and the first connection box and the condensation box are integrated. , the first connection box communicates with the condensation box, one side of the first connection box is connected with the communication pipe, the connection plate is arranged under the condensation box, and heat dissipation fins are uniformly arranged between the connection plate and the condensation box, so The cooling fins are respectively welded and fixed to the condensation box and the connecting plate, and the connecting plate is connected to the server chassis by screws.

Preferably, the evaporator includes an evaporation box, the upper end of the evaporation box is provided with a second connection box, the second connection box is integrated with the evaporation box, the second connection box communicates with the evaporation box, and the second The connection box is connected with the communication pipe, the lower end surface of the evaporation box is connected with the upper end surface of the CPU, and the periphery of the evaporation box is connected with the server chassis by screws.

Preferably, a liquid injection nozzle is provided on one side of the first connection box.

Preferably, the communication pipe includes an air outlet pipe and a return pipe, both of the air outlet pipe and the return pipe are one-way flow pipes, the flow direction of the air outlet pipe is from the evaporation box to the condensation box, and the flow direction of the return pipe is from the condensation box to the evaporation box. box.

Preferably, a positioning hole is provided around the evaporation box, a positioning post is provided on the server chassis, the positioning post is provided around the CPU, and the positioning hole cooperates with the positioning post.

Preferably, the refrigerant is R-134a refrigerant.

Compared with the prior art, the beneficial effects of the invention are:

1. The invention takes away the heat generated by the CPU through the transition of the refrigerant state, replaces the original heat sink cooling method of the CPU, and solves the problem that the temperature rise of the first CPU heat sink after the cold air passes through causes the second CPU heat dissipation effect to be poor The problem is that the heat dissipation effect of the two CPUs is improved at the same time. The heat dissipation device can meet the heat dissipation requirements of the 205W CPU, prevent CPU thermal damage, ensure its running speed, and ensure that the CPU can give full play to its performance.

2. The present invention installs the cooling device of the invention on the two CPUs, which can not only meet the heat dissipation requirements of the rear CPU, but also further improve the heat dissipation effect of the front CPU, reduce the temperature of the server CPU as a whole, and improve the operation of the server Speed and safe use, canceling the cooling method of the heat sink on the front CPU can reduce the heat generated by the fan from the front CPU to the hard disk, and improve the cooling effect of the hard disk.

3. The lower end surface of the evaporator of the present invention is in full contact with the upper end surface of the CPU, which improves the heat absorption efficiency of the evaporator to the CPU. The heat dissipation silicon grease accelerates the heat transfer speed and efficiency, and the refrigerant in the evaporator is heated and evaporates into condensation. The cooling box has a large upper and lower surface area, a small thickness, and fast heat dissipation. At the same time, the cooling fins located at the bottom can speed up the cooling and improve the cooling effect. It realizes the heat generated by the CPU. The temperature in the core area will not be too high, and at the same time, the heat is transferred to the end of the server chassis, which is conducive to the rapid dissipation of heat and speeds up the heat dissipation.

4. The present invention sets positioning holes around the evaporation box. The positioning holes cooperate with the positioning columns on the chassis, which can increase the installation speed and ensure the accuracy of installation, so that the lower end surface of the evaporation box can be fully attached to the upper end surface of the CPU. Guaranteed cooling effect.

5. In the present invention, the injection nozzle is provided on the first connection box, which can conveniently add refrigerant and vacuumize the inside of the device, which is convenient for operation and maintenance.

6. The present invention sets two connecting pipes to separate the gas and liquid, while ensuring one-way circulation, realizing a closed self-circulation circulation mode, ensuring the heat dissipation of the CPU through the transition of the refrigerant state, and saving energy , Protect the environment.

Description of drawings

Fig. 1 is the overall structure schematic diagram that the present invention is installed in the cabinet;

Fig. 2 is a structural schematic diagram of two cooling devices used together;

Fig. 3 is a structural schematic diagram 1 of the present invention;

Fig. 4 is a structural schematic diagram II of the present invention.

In the figure: 1-server chassis; 2-CPU cooling device; 201-first cooling device; 202-second cooling device; 3-CPU; 301-front CPU; 302-rear CPU; 303-positioning column; 4-condensation 401-condensing box; 402-radiating fin; 403-connecting plate; 404-liquid injection nozzle; 405-first connecting box; 5-communicating pipe; 501-outlet pipe; ; 601-positioning hole; 602-evaporation box; 603-screw; 604-the second connection box.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

As shown in Figure 2, a CPU cooling device for high-density servers includes a condenser 4, a communication pipe 5, and an evaporator 6, and the condenser 4 and the evaporator 6 are communicated through a communication pipe 5, and the condenser 4 Refrigerant is provided in the evaporator 6, and the refrigerant is R-134a refrigerant. As shown in Figure 1, the evaporator 6 is arranged on the upper end of the CPU3, and heat dissipation silicon grease is arranged between the evaporator 6 and the CPU3. , the evaporator 6 and the condenser 4 are connected to the server chassis 1 through screws. The heat generated by the CPU3 is taken away by the change of the state of the refrigerant, replacing the original heat sink cooling method of the CPU3, which solves the problem that the temperature rise of the cold air after passing through the first CPU radiator leads to poor heat dissipation of the second CPU, and improves the heat dissipation effect of the second CPU at the same time. The heat dissipation effect of the two CPUs is ensured. The heat dissipation device can meet the heat dissipation requirements of the 205W CPU, prevent the CPU from thermal damage, ensure its running speed, and ensure that the CPU can give full play to its performance.

As shown in Figure 1, the quantity of described CPU3 is two, is recorded as front CPU301, rear CPU302 respectively, and front CPU301 is closer to cooling fan, and the quantity of described CPU cooling device 2 is two, and is respectively recorded as the first cooling fan. device 201, the second cooling device 202, the first cooling device 201 is connected to the front CPU301, the second cooling device 202 is connected to the rear CPU302, the condenser of the first cooling device 201 and the condenser of the second cooling device 202 are respectively set On both sides of the server chassis 1, and the condensers on each side are aligned with the hard disks on the same side, the condensers of the first cooling device 201 and the condensers of the second cooling device 202 are aligned and arranged symmetrically . The heat dissipation device of the invention is installed on both CPUs, which can not only meet the heat dissipation requirements of the rear CPU302, but also further improve the heat dissipation effect of the front CPU301, reduce the temperature of the server CPU as a whole, and improve the running speed and safety of the server , canceling the cooling method of the heat sink on the front CPU301 can reduce the heat generated by the fan from the front CPU301 and blow it between the hard disks, and improve the cooling effect of the hard disks.

As shown in Figures 3 and 4, the condenser 4 includes a condensation box 401, heat dissipation fins 402, and a connecting plate 403. The condensation box 401 is a cuboid structure with a relatively small thickness, a relatively large area, and good heat dissipation effect. The lower end surface of 401 is provided with a first connection box 405, the first connection box 405 is integrated with the condensation box 401, and the inside is vacuumed, the first connection box 405 communicates with the condensation box 401, and the first connection box 405 One side is connected to the communication pipe 5, and one side of the first connection box 405 is provided with a liquid injection nozzle 404 for injecting refrigerant and vacuuming, which is convenient for operation and maintenance. The connection plate 403 is arranged under the condensation box 401, and the heat dissipation fins 402 are uniformly arranged between the connection plate 403 and the condensation box 401, and the heat dissipation fins 402 are respectively welded and fixed with the condensation box 401 and the connection plate 403. The connection plate 403 is connected to the server chassis 1 by screws.

As shown in Figures 3 and 4, the evaporator 6 includes an evaporation box 602, and the inside of the evaporation box 602 is vacuumized. The upper end of the evaporation box 602 is provided with a second connection box 604, and the second connection box 604 and the evaporation box 602 are Integral structure, the second connection box 604 communicates with the evaporation box 602, the second connection box 604 is connected with the communication pipe 5, the lower end surface of the evaporation box 602 is connected with the upper end surface of the CPU3, and the evaporation box 602 is surrounded by The screw 603 is connected with the server chassis 1, the screw 603 is covered with a spring, and the spring is pressed on the upper end of the evaporation box 602 to adjust the pressure between the evaporation box 602 and the CPU3, and a positioning hole 601 is arranged around the evaporation box 602 , the server chassis 1 is provided with a positioning column 303, the positioning column 303 is located around the CPU3, and the positioning hole 601 cooperates with the positioning column 303, which can improve the installation speed, ensure the accuracy of the installation, and make the lower part of the evaporation box 602 The end face and the upper end face of the CPU 3 can be fully bonded to ensure the heat dissipation effect.

As shown in Figures 3 and 4, the number of the communicating pipes 5 is two, which are respectively recorded as an air outlet pipe 501 and a return pipe 502. The air outlet pipe 501 and the return pipe 502 are all one-way flow pipes. The flow direction is from the evaporation box 6 to the condensation box 4, and the flow direction of the return pipe 502 is from the condensation box 4 to the evaporation box 6. The device for preventing backflow is installed in the outlet pipe 501 and the return pipe 502. This technology is very mature and can ensure one-way circulation function. Two connecting pipes 5 are set to separate the gas and liquid, while ensuring one-way circulation, realizing a closed self-circulation circulation mode, ensuring the heat dissipation of the CPU through the transition of the refrigerant state, saving energy and protecting the environment. surroundings.

The lower end surface of the evaporator 6 of the present invention is in full contact with the upper end surface of the CPU3, which improves the heat absorption efficiency of the evaporator 6 to the CPU3, and the heat dissipation silicon grease accelerates the heat transfer speed and efficiency, and the refrigerant in the evaporator 6 is heated and evaporates into the The condensation box 401 has a large upper and lower surface area, a small thickness, and fast heat dissipation. At the same time, the heat dissipation fins 402 arranged at the bottom can speed up the cooling and improve the heat dissipation effect, and realize the heat generated by the CPU3. The temperature in the core area of the server chassis 1 is not too high, and at the same time, the heat is transferred to the end of the server chassis 1, which is beneficial to the rapid loss of heat and speeds up the heat dissipation; vacuumizes the condensation box 401 and the evaporation box 602, which can reduce the heat dissipation. The temperature when the refrigerant changes from liquid to gas, and from gas to liquid, reduces the transition temperature of the refrigerant state, and can cool the CPU when the temperature is not high, preventing the CPU temperature from being too high and ensuring cooling effect and cooling rate.

Working principle: CPU3 generates heat when it is working, and the heat is transferred to the evaporation box 602 through the heat dissipation silicon grease. The refrigerant in the evaporation box 602 is a liquid refrigerant. The outlet pipe 501 enters the first connection box 405, and finally enters the condensation box 401. The gaseous refrigerant cools down in the condensation box 401 and liquefies into a liquid refrigerant, and flows into the first connection box 405 under the action of gravity. Then it flows back into the second connection box 604 through the return pipe 502 and enters into the evaporation box 602 under the action of gravity, and circulates in turn.

Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention also intends to include these modifications and variations.

Claims (8)

1. a kind of CPU radiator for highly dense server, it is characterised in that：Including condenser, communicating pipe, evaporator, institute It states and is connected between condenser and evaporator by communicating pipe, refrigerant is equipped in condenser and evaporator, the evaporator is set to The upper end of CPU, is equipped with heat dissipating silicone grease between evaporator and CPU, evaporator is connect with machine box for server with condenser.

2. a kind of CPU radiator for highly dense server as described in claim 1, it is characterised in that：The CPU includes Preceding CPU, rear CPU, the CPU radiator include the first radiator, the second radiator, and first radiator is with before CPU connection, the second radiator are connect with rear CPU, the condenser point of the condenser of the first radiator and the second radiator Not She Yu two sides in machine box for server, and the condenser of the first radiator is aligned with the condenser of the second radiator and sets It sets.

3. a kind of CPU radiator for highly dense server as described in claim 1, it is characterised in that：The condenser Including condensing box, radiating fin, connecting plate, the condensation box is rectangular parallelepiped structure, and the lower end surface side for condensing box is equipped with first Box is connected, the first connection box is structure as a whole with condensation box, and the first connection box is connected to condensation box, and the one of the first connection box Side is connect with communicating pipe, and the connecting plate is set to the lower section of condensation box, is uniformly provided with radiating fin between connecting plate and condensation box, The radiating fin is welded and fixed with condensation box, connecting plate respectively, and the connecting plate and machine box for server pass through screw connection.

4. a kind of CPU radiator for highly dense server as claimed in claim 3, it is characterised in that：The evaporator Including evaporation box, the upper end of the evaporation box is equipped with the second connection box, and the second connection box is structure as a whole with evaporation box, and described the It is connected between two connection boxes and evaporation box, the second connection box is connect with communicating pipe, and the lower end surface of evaporation box and the upper surface of CPU connect It connects, is connect by screw with machine box for server around the evaporation box.

5. a kind of CPU radiator for highly dense server as claimed in claim 3, it is characterised in that：Described first connects The side for connecing box is equipped with liquid injecting mouth.

6. a kind of CPU radiator for highly dense server as claimed in claim 4, it is characterised in that：The communicating pipe Including escape pipe, return pipe, the escape pipe and return pipe are one-way flow control, and the flow direction of escape pipe is from evaporation box to cold Solidifying box, the flow direction of return pipe are from condensation box to evaporation box.

7. a kind of CPU radiator for highly dense server as claimed in claim 4, it is characterised in that：The evaporation box Around be equipped with location hole, the machine box for server be equipped with positioning column, the positioning column be set to CPU around, location hole with Positioning column cooperation.

8. a kind of CPU radiator for highly dense server as described in claim 1, it is characterised in that：The refrigerant For R-134a refrigerant.