CN111253866A - Composite board processing method - Google Patents

Composite board processing method Download PDF

Info

Publication number
CN111253866A
CN111253866A CN202010053847.1A CN202010053847A CN111253866A CN 111253866 A CN111253866 A CN 111253866A CN 202010053847 A CN202010053847 A CN 202010053847A CN 111253866 A CN111253866 A CN 111253866A
Authority
CN
China
Prior art keywords
composite
substrate
plate
decorative
decorative plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010053847.1A
Other languages
Chinese (zh)
Other versions
CN111253866B (en
Inventor
丁欣欣
丁泽成
王文广
钟诚
张伟伟
郑晓峰
朱开放
洪振东
高博文
颜炜峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Yasha Decoration Co Ltd
Original Assignee
Zhejiang Yasha Decoration Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Yasha Decoration Co Ltd filed Critical Zhejiang Yasha Decoration Co Ltd
Priority to CN202010053847.1A priority Critical patent/CN111253866B/en
Publication of CN111253866A publication Critical patent/CN111253866A/en
Application granted granted Critical
Publication of CN111253866B publication Critical patent/CN111253866B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/02Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving pretreatment of the surfaces to be joined
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • EFIXED CONSTRUCTIONS
    • E04BUILDING
    • E04FFINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
    • E04F13/00Coverings or linings, e.g. for walls or ceilings
    • E04F13/07Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor
    • E04F13/08Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements
    • E04F13/0866Coverings or linings, e.g. for walls or ceilings composed of covering or lining elements; Sub-structures therefor; Fastening means therefor composed of a plurality of similar covering or lining elements composed of several layers, e.g. sandwich panels or layered panels

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Finishing Walls (AREA)

Abstract

The embodiment of the invention discloses a composite board processing method, which comprises the steps of sanding a composite surface of a substrate; coating an adhesive on the composite surface of the substrate; and compounding the decorative plate on the adhesive to form the composite plate. The embodiment of the invention can reduce the defective rate of the composite board, reduce the rework probability and reduce the production cost, and has simple process, high automation degree and low labor intensity.

Description

Composite board processing method
Technical Field
The invention relates to the technical field of plate processing, in particular to a composite plate processing method.
Background
At present, the ceramic tile composite board is formed by manual processing, and the concrete process is as follows: firstly, coating glue solution on a substrate, then covering the ceramic tile with the glue solution, and airing the glue solution to realize the processing of the ceramic tile composite board. The inventor finds that the ceramic tile composite board manufactured by the method is easy to crack glue, so that the defective rate is high, the ceramic tile composite board needs to be manufactured again, and the production efficiency is low.
Disclosure of Invention
In view of this, an embodiment of the present invention provides a method for processing a composite board to solve the above technical problems.
The embodiment of the invention provides a composite board processing method, which comprises the following steps: sanding the composite surface of the substrate; coating adhesive on the sanded composite surface; and compounding the decorative plate on the adhesive to form the composite plate.
Optionally, before attaching the decorative plate to the adhesive to form the composite plate, the method further includes: positioning the substrate to acquire the position information of the substrate; and determining the position of the decorative plate according to the position information of the substrate.
Optionally, determining the position of the decorative plate according to the position information of the substrate includes: monitoring whether the decorative plate is damaged or not; if so, removing the broken decorative plate; if not, the position of the decorative plate is determined according to the position information of the substrate.
Optionally, determining the position of the decorative plate before according to the position information of the substrate comprises: monitoring whether the decorative plates are arranged in a single row; if the decorative plate is in a single row, the decorative plate is adjusted from single-row arrangement to double-row arrangement.
Optionally, before monitoring whether the decorative board has a breakage, the method further comprises: and (5) removing dust from the decorative plate.
Optionally, after the decorative plate is combined with the adhesive to form the composite plate, the method further includes: and (5) carrying out cold pressing on the composite board.
Optionally, after cold pressing the composite board, the method further includes: and circularly heating the cold-pressed composite board.
Optionally, after the cold-pressed composite board is subjected to cyclic heating, the method further comprises: and (5) stacking the composite boards output one by one.
Optionally, the sanding treatment of the composite surface of the substrate includes: monitoring whether the substrate is damaged; if the substrate is not damaged, the composite surface of the substrate is sanded.
Optionally, the decorative panel is a tile.
According to the composite board processing method provided by the embodiment of the invention, the composite surface of the substrate is subjected to sanding treatment, then the decorative board is adhered to the substrate by the adhesive, and the surface strength of the sanded composite surface is increased under the condition of improving the smoothness, so that the substrate and the decorative board are adhered more firmly, glue is not easy to open, the defective rate of the composite board is reduced, the rework probability is reduced, the production cost is reduced, the process is simple, the automation degree is high, and the labor intensity is low.
Drawings
Fig. 1 is a flowchart of a plate material cutting method according to an embodiment of the present invention.
Fig. 2 is a flowchart of a plate material cutting method according to another embodiment of the present invention.
Fig. 3 is a flow chart of a composite panel processing method according to an embodiment of the present invention.
Fig. 4 is a flow chart of a composite panel processing method according to another embodiment of the present invention.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Fig. 1 shows a flowchart of a plate material cutting method according to an embodiment of the present invention, and as shown in fig. 1, the plate material cutting method according to the embodiment of the present invention includes:
s100, reading an identification code on a plate to be cut;
the identification code on the plate to be cut can be attached to the plate to be cut in a printing or pasting mode and the like. In this embodiment, the identification code may be a two-dimensional code, and the two-dimensional code is read by an automatic code reader.
S200, identifying the identification code, and acquiring cutting processes and cutting parameters corresponding to the cutting processes;
the identification code is internally provided with plate marks, cutting processes, cutting parameters corresponding to the cutting processes and the like, and each plate to be cut corresponds to the identification code one by one. The cutting flow corresponds to the cutting parameters one by one. Wherein the cutting parameters include length, width, etc.
And S300, cutting the board to be cut according to the cutting process and the cutting parameters.
In this embodiment, the existing cutting machine is adopted to automatically cut the board to be cut in sequence according to the acquired cutting flow and the cutting parameters corresponding to each cutting flow.
According to the plate cutting method provided by the embodiment of the invention, the cutting process and the cutting parameters are obtained by identifying the identification codes on the cut plates, and the plates to be cut are sequentially cut and processed according to the cutting process and the cutting parameters, so that the ordered proceeding of the cutting process is ensured, the problem of repeated processing is reduced, the error processing rate is reduced, the automatic cutting of the plates to be cut is realized, the processing efficiency of the plates to be cut is improved, the working strength of operators can be reduced, and the labor cost is reduced.
Further, as shown in fig. 2, S300 is performed to cut the board to be cut according to the cutting process and the cutting parameters, and specifically, the method includes:
s301, longitudinally cutting the plate to be cut;
in this embodiment, treat that the cutting board is the ceramic tile composite sheet, is rectangular shaped plate. Wherein the longitudinal direction is the manner in which the cut is made along the longer length of the board to be cut.
S302, transversely cutting the plate to be cut after longitudinally cutting.
Wherein the cross cutting is a cutting along a shorter length of the board to be cut.
The suitable sheet material is obtained by slitting and crosscutting the sheet to be cut.
Further, as shown in fig. 2, after the transversely cutting the plate to be cut after the longitudinally cutting, S302 further includes:
s303, cutting off excess materials at the two transverse ends of the plate to be cut;
wherein, the two transverse ends refer to the two ends with shorter length of the plate to be cut.
And S304, removing the residual materials as waste materials.
And materials at the two transverse ends are cut off and moved away, so that the subsequent processing of the plate can be facilitated, and the plate cutting efficiency is further improved.
Preferably, as shown in fig. 2, S304, after removing the remainder as the waste material, further includes:
s305, judging whether the plate to be cut needs secondary cutting;
and identifying through the identification code to obtain a cutting flow of the plate to be cut, and if the cutting flow contains a secondary cutting program, performing secondary cutting on the plate to be cut.
S306, if needed, the plate to be cut is moved to the position where the identification code is read by the plate to be cut;
and resetting the plate to be cut to the position where the plate to be cut reads the identification code, and carrying out secondary cutting on the plate to be cut according to the cutting parameters.
S307, carrying out secondary cutting on the plate to be cut;
and carrying out secondary cutting on the plate to be cut so as to improve the processing precision of the plate to be cut.
S308, if not, turning over the plate to be cut;
in this embodiment, the sheet to be cut is turned 180 °.
S309, longitudinally trimming or 45-degree longitudinally trimming the plate to be cut.
In this embodiment, a longitudinal edger may be used to longitudinally edge and longitudinally trim 45 ° the board to be cut.
The longitudinal trimming and the longitudinal 45-degree trimming of the ceramic tile composite plate are finished in the same process, so that the process flow can be simplified, the cutting efficiency is improved, the trimming is carried out after the ceramic tile composite plate is turned over, the edge breakage is prevented, and the trimming effect is ensured.
Preferably, as shown in fig. 2, S309, after performing longitudinal trimming or 45 ° longitudinal trimming on the plate to be cut, the method further includes:
s310, turning over the plate to be cut;
and turning the plate to be cut after the longitudinal trimming or the 45-degree longitudinal trimming again by 180 degrees.
And S311, performing special-shaped cutting on the turned plate to be cut.
In this embodiment, the opposite-sex cutting can be performed by using a profile cutter.
Through carrying out special-shaped cutting to the ceramic tile composite sheet to satisfy different cutting demands.
Further, as shown in fig. 2, S311, after performing the special-shaped cutting on the board to be cut after being turned over again, the method further includes:
and S312, removing dust on the plate to be cut.
To waiting to cut panel behind the dysmorphism cutting, carry out preliminary dust and clear away, avoid dust to fly upward, improve operation environmental quality.
Further, as shown in fig. 2, S312, after removing the dust on the board to be cut, the method further includes:
s313, drying the plate to be cut by hot air;
the existing hot air dryer can be adopted to carry out hot air drying on the board to be cut.
And S314, removing dust on the plate to be cut after hot air drying.
Through waiting to cut panel hot air drying and remove dust once more, not only can guarantee to wait to cut the aridity of panel, prevent to wait to cut the follow-up deformation of panel, but also can further reduce and wait to cut dust on the panel to reduce dust in transportation and the assembling process, improve site environment quality, still can reduce artificial dust removal work load simultaneously, reduce intensity of labour.
Fig. 3 is a flowchart illustrating a composite board processing method according to an embodiment of the present invention, and as shown in fig. 3, the composite board processing method according to the embodiment of the present invention includes:
s410, sanding the composite surface of the substrate;
in this embodiment, the composite surface of the substrate can be obtained by sanding with a sander.
S420, coating an adhesive on the sanded composite surface;
the adhesive can be the existing adhesive, and can be coated on the composite surface after sanding by a glue spreader.
And S430, compounding the decorative plate on the adhesive to form the composite plate.
The adhesive bonds the decorative plate and the substrate together to form the composite plate. Because the compound surface is sanded, the compound surface is smooth, the surface strength is increased, and the bonding is firmer.
According to the composite board processing method provided by the embodiment of the invention, the composite surface of the substrate is subjected to sanding treatment, then the decorative board is adhered to the substrate by the adhesive, and the surface strength of the sanded composite surface is increased under the condition of improving the smoothness, so that the substrate and the decorative board are adhered more firmly, glue is not easy to open, the defective rate of the composite board is reduced, the rework probability is reduced, the production cost is reduced, the process is simple, the automation degree is high, and the labor intensity is low.
Further, as shown in fig. 4, before attaching the decorative plate to the adhesive to form the composite plate, S430, the method further includes:
s422, positioning the substrate to acquire the position information of the substrate;
in this embodiment, the substrate may be positioned by using a positioning platform, and the positioning platform obtains the position coordinates of the substrate, for example, the substrate is rectangular, and obtains the position coordinates of four corners of the rectangle.
And S424, determining the position of the decorative plate according to the position information of the substrate.
For example, the position of the decorative plate is adjusted according to the position coordinates of the four corners of the rectangle, so that the coordinates of the four corners of the decorative plate are consistent with the coordinates of the base plate.
And determining the position of the decorative plate according to the position information of the substrate so as to ensure the accuracy of the bonding of the substrate and the decorative plate.
Preferably, S422, determining the position of the decoration plate according to the position information of the substrate, specifically includes:
s4222, monitoring whether the decorative plate is damaged or not;
the breakage of the decorative sheet can be monitored by existing monitoring equipment, such as a ceramic tile monitor.
S4224, if yes, removing the damaged decorative plate;
s4226, if not, determining the position of the decorative plate according to the position information of the substrate.
Through monitoring whether the decorative board is damaged, the processing quality of the composite board can be ensured, and the generation of defective products is reduced. Besides, the damage of the decorative plate is monitored by equipment without manual monitoring, so that the objectivity and accuracy of monitoring can be improved, and the processing quality of the composite plate is further improved.
Preferably, S424, determining the position of the decorative plate according to the position information of the substrate, comprises:
monitoring whether the decorative plates are arranged in a single row;
if the decorative plate is arranged in a single row, the decorative plate is adjusted from the single row arrangement to the double row arrangement.
By adjusting the decorative plates into double rows, two composite plates can be manufactured at one time, and the processing efficiency is further improved.
Further, S4222, before monitoring whether the decorative panel is damaged, further includes:
and (5) removing dust from the decorative plate.
Through removing dust to the decorative board, can avoid the interference of dust, improve the accuracy of monitoring.
Preferably, S430, after the decorative plate is combined with the adhesive to form the composite plate, the method further includes:
and S440, performing cold pressing on the composite board.
The composite board is cold-pressed by the cold press, so that the base plate and the decorative plate are bonded more firmly, and the glue is prevented from being broken.
Further, S440, after the cold pressing the composite board, further includes:
s450, circularly heating the cold-pressed composite board.
Through carrying out circulation heating to the composite sheet, the stability of performance of multiplicable composite sheet improves the plasticity of panel.
More preferably, S450, after the cold-pressed composite board is subjected to cyclic heating, further includes:
and (4) sequentially stacking the composite boards output one by one.
In this embodiment, the composite boards are automatically stacked after being output to facilitate movement of the composite boards.
In a specific embodiment, S410, the sanding process is performed on the composite surface of the substrate, specifically including:
s411, monitoring whether the substrate is damaged or not;
the substrate can also be monitored by a ceramic tile damage meter.
And S412, sanding the composite surface of the substrate if the composite surface is not damaged.
By monitoring whether the substrate is damaged or not, the defective rate of the composite board can be further reduced, and the qualified rate is improved.
The technical solutions of the present invention have been described in detail with reference to specific embodiments, which are used to help understand the ideas of the present invention. The derivation and modification made by the person skilled in the art on the basis of the specific embodiment of the present invention also belong to the protection scope of the present invention.

Claims (10)

1. A composite board processing method, comprising:
sanding the composite surface of the substrate;
coating adhesive on the sanded composite surface;
and compounding the decorative plate on the adhesive to form the composite plate.
2. The method of claim 1, wherein attaching the decorative sheet to the adhesive to form the composite panel further comprises:
positioning the substrate to acquire the position information of the substrate;
and determining the position of the decorative plate according to the position information of the substrate.
3. The method of claim 2, wherein determining the position of the trim panel based on the position information of the substrate comprises:
monitoring whether the decorative plate is damaged or not;
if so, removing the broken decorative plate;
if not, the position of the decorative plate is determined according to the position information of the substrate.
4. The method of claim 3, wherein determining the position of the trim panel based on the position information of the substrate comprises, prior to:
monitoring whether the decorative plates are arranged in a single row;
if the decorative plate is in a single row, the decorative plate is adjusted from single-row arrangement to double-row arrangement.
5. The method of claim 4, wherein monitoring the trim panel for breakage further comprises:
and (5) removing dust from the decorative plate.
6. The method of claim 1, wherein after laminating the decorative sheet to the adhesive to form the composite sheet, further comprising:
and (5) carrying out cold pressing on the composite board.
7. The method of claim 6, wherein after cold pressing the composite sheet, further comprising:
and circularly heating the cold-pressed composite board.
8. The method of claim 7, wherein the cold-pressed composite panel, after being subjected to the cyclic heating, further comprises:
and (5) stacking the composite boards output one by one.
9. The method of claim 1, wherein sanding the composite side of the substrate comprises:
monitoring whether the substrate is damaged;
if the substrate is not damaged, the composite surface of the substrate is sanded.
10. A method according to any one of claims 1 to 9, wherein the decorative panels are ceramic tiles.
CN202010053847.1A 2020-01-17 2020-01-17 Composite board processing method Active CN111253866B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010053847.1A CN111253866B (en) 2020-01-17 2020-01-17 Composite board processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010053847.1A CN111253866B (en) 2020-01-17 2020-01-17 Composite board processing method

Publications (2)

Publication Number Publication Date
CN111253866A true CN111253866A (en) 2020-06-09
CN111253866B CN111253866B (en) 2022-07-08

Family

ID=70945345

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010053847.1A Active CN111253866B (en) 2020-01-17 2020-01-17 Composite board processing method

Country Status (1)

Country Link
CN (1) CN111253866B (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106393381A (en) * 2016-11-25 2017-02-15 浙江林昌木业有限公司 Production process of composite door sheet
CN106994722A (en) * 2017-04-10 2017-08-01 南通博泰美术图案设计有限公司 A kind of environmental protection composite board processing technology
CN109278383A (en) * 2018-11-08 2019-01-29 龚剑飞 A kind of composite board and preparation method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106393381A (en) * 2016-11-25 2017-02-15 浙江林昌木业有限公司 Production process of composite door sheet
CN106994722A (en) * 2017-04-10 2017-08-01 南通博泰美术图案设计有限公司 A kind of environmental protection composite board processing technology
CN109278383A (en) * 2018-11-08 2019-01-29 龚剑飞 A kind of composite board and preparation method thereof

Also Published As

Publication number Publication date
CN111253866B (en) 2022-07-08

Similar Documents

Publication Publication Date Title
CN110273517B (en) Automatic production line for heat-insulating decorative composite board
CN106604551A (en) Circuit board production method through automatic pressing and profiling
CN204842560U (en) System of bending of robot
CN103987668A (en) High-strength glass, touch panel, and method for manufacturing high-strength glass
CN106102347B (en) A kind of V-CUT connection printed wiring board transplantation method
CN111251354A (en) Plate cutting method
CN111253866B (en) Composite board processing method
CN1944203B (en) Auxiliary moving, loading assembly
CN103341976A (en) 3D (Three-dimensional) desktop printing method and system
WO2006090252A1 (en) A work table for an automatic machine for cutting leathers and the like
US7926524B2 (en) Utilization of coloration to improve the detection of “hit or miss” defects when using scanner equipment and an automated saw to remove defects in wood pieces
CN104908105A (en) Automatic material cutting and forming method and system thereof
CN103936274B (en) The working method of the glass mirror of camera
CN112025903A (en) Manufacturing method of wood carving film pressing embedded door plate
CN107623983A (en) The EMI fitting preparation methods of FPC
CN108858631B (en) Multilayer solid wood floor surface scab repairing process
CN101962882B (en) Construction waste wood formwork and industrial sewing machine table manufactured by pressing production formwork leftover material
CN108253844B (en) Automatic manufacturing method of bulletproof helmet
CN113543460B (en) PCB and identification method thereof
CN112008824A (en) Efficient manufacturing method of wood carving film pressing door plate
JP2000210909A (en) Manufacture of building material
CN108381690B (en) Method for high-efficiency automatic typesetting of plywood laminates
CN108214731B (en) Automatic typesetting method for plywood laminates
US20230019907A1 (en) Stone slab transfer and processing system and methods
EP3685978B1 (en) Apparatus and method for the production of panel

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant