CN111251354A - Plate cutting method - Google Patents

Plate cutting method Download PDF

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Publication number
CN111251354A
CN111251354A CN202010053886.1A CN202010053886A CN111251354A CN 111251354 A CN111251354 A CN 111251354A CN 202010053886 A CN202010053886 A CN 202010053886A CN 111251354 A CN111251354 A CN 111251354A
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CN
China
Prior art keywords
cut
cutting
plate
identification code
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010053886.1A
Other languages
Chinese (zh)
Inventor
丁欣欣
丁泽成
王文广
钟诚
张伟伟
郑晓峰
朱开放
洪振东
翟纪强
姚鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Yasha Decoration Co Ltd
Original Assignee
Zhejiang Yasha Decoration Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Yasha Decoration Co Ltd filed Critical Zhejiang Yasha Decoration Co Ltd
Priority to CN202010053886.1A priority Critical patent/CN111251354A/en
Publication of CN111251354A publication Critical patent/CN111251354A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D5/00Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08Means for treating work or cutting member to facilitate cutting
    • B26D7/10Means for treating work or cutting member to facilitate cutting by heating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18Means for removing cut-out material or waste

Abstract

The embodiment of the invention discloses a plate cutting method, which comprises the following steps: reading an identification code on a plate to be cut; identifying the identification code, and acquiring cutting processes and cutting parameters corresponding to the cutting processes; and cutting the board to be cut according to the cutting flow and the cutting parameters. By utilizing the embodiment of the invention, the orderly progress of the cutting processing flow can be ensured, the problem of repeated processing is reduced, the error processing rate is reduced, the automatic cutting of the plate to be cut is realized, the processing efficiency of the plate to be cut is improved, the working intensity of operators can be reduced, and the labor cost is reduced.

Description

Plate cutting method
Technical Field
The invention relates to the technical field of decoration and fitment, in particular to a plate cutting method.
Background
Before the decoration process, the plate needs to be cut to meet different decoration requirements. The existing plate processing mainly comprises that an operator sets a cutting procedure according to the task amount of cutting equipment, the cutting procedure is disordered, the problem of repeated cutting is easy to occur, and the cutting efficiency is low.
Disclosure of Invention
In view of the above, an embodiment of the invention provides a method for cutting a sheet material to solve the above technical problems.
The embodiment of the invention provides a plate cutting method, which comprises the following steps: reading an identification code on a plate to be cut; identifying the identification code, and acquiring cutting processes and cutting parameters corresponding to the cutting processes; and cutting the board to be cut according to the cutting flow and the cutting parameters.
Optionally, cutting the board to be cut according to the cutting process and the cutting parameters includes: longitudinally cutting the plate to be cut; and transversely cutting the plate to be cut after the longitudinal cutting.
Optionally, after transversely cutting the plate to be cut after the longitudinally cutting, the method further includes: cutting off the excess materials at the two transverse ends of the plate to be cut; the remainder is removed as waste.
Optionally, after removing the remainder as waste, the method further comprises: judging whether the plate to be cut needs secondary cutting or not; if so, transferring the plate to be cut to a position where the plate to be cut reads the identification code; and carrying out secondary cutting on the plate to be cut.
Optionally, after removing the remainder as waste material, the method further comprises: judging whether the plate to be cut needs secondary cutting or not; if not, turning over the plate to be cut; and carrying out longitudinal trimming or 45-degree longitudinal trimming on the plate to be cut.
Optionally, after the longitudinal trimming or 45 ° longitudinal trimming is performed on the plate to be cut, the method further includes: turning over the plate to be cut; and carrying out special-shaped cutting on the plate to be cut after the plate is turned over.
Optionally, after carrying out the dysmorphism cutting to waiting to cut panel after overturning again, still include: and removing dust on the plate to be cut.
Optionally, after removing the dust on the board to be cut, the method further includes: carrying out hot air drying on the plate to be cut; and removing dust on the plate to be cut after being dried by hot air.
Optionally, the identification code is a two-dimensional code.
Optionally, the two-dimensional code is read by an automatic code reader.
According to the plate cutting method provided by the embodiment of the invention, the cutting process and the cutting parameters are obtained by identifying the identification codes on the cut plates, and the plates to be cut are sequentially cut and processed according to the cutting process and the cutting parameters, so that the ordered proceeding of the cutting process is ensured, the problem of repeated processing is reduced, the error processing rate is reduced, the automatic cutting of the plates to be cut is realized, the processing efficiency of the plates to be cut is improved, the working strength of operators can be reduced, and the labor cost is reduced.
Drawings
Fig. 1 is a flowchart of a plate material cutting method according to an embodiment of the present invention.
Fig. 2 is a flowchart of a plate material cutting method according to another embodiment of the present invention.
Fig. 3 is a flow chart of a composite panel processing method according to an embodiment of the present invention.
Fig. 4 is a flow chart of a composite panel processing method according to another embodiment of the present invention.
Detailed Description
The technical solution of the present invention is described in detail below with reference to the accompanying drawings and specific embodiments. In which like parts are designated by like reference numerals. It should be noted that the terms "front," "back," "left," "right," "upper" and "lower" used in the following description refer to directions in the drawings, and the terms "inner" and "outer" refer to directions toward and away from, respectively, the geometric center of a particular component.
Fig. 1 shows a flowchart of a plate material cutting method according to an embodiment of the present invention, and as shown in fig. 1, the plate material cutting method according to the embodiment of the present invention includes:
s100, reading an identification code on a plate to be cut;
the identification code on the plate to be cut can be attached to the plate to be cut in a printing or pasting mode and the like. In this embodiment, the identification code may be a two-dimensional code, and the two-dimensional code is read by an automatic code reader.
S200, identifying the identification code, and acquiring cutting processes and cutting parameters corresponding to the cutting processes;
the identification code is internally provided with plate marks, cutting processes, cutting parameters corresponding to the cutting processes and the like, and each plate to be cut corresponds to the identification code one by one. The cutting flow corresponds to the cutting parameters one by one. Wherein the cutting parameters include length, width, etc.
And S300, cutting the board to be cut according to the cutting process and the cutting parameters.
In this embodiment, the existing cutting machine is adopted to automatically cut the board to be cut in sequence according to the acquired cutting flow and the cutting parameters corresponding to each cutting flow.
According to the plate cutting method provided by the embodiment of the invention, the cutting process and the cutting parameters are obtained by identifying the identification codes on the cut plates, and the plates to be cut are sequentially cut and processed according to the cutting process and the cutting parameters, so that the ordered proceeding of the cutting process is ensured, the problem of repeated processing is reduced, the error processing rate is reduced, the automatic cutting of the plates to be cut is realized, the processing efficiency of the plates to be cut is improved, the working strength of operators can be reduced, and the labor cost is reduced.
Further, as shown in fig. 2, S300 is performed to cut the board to be cut according to the cutting process and the cutting parameters, and specifically, the method includes:
s301, longitudinally cutting the plate to be cut;
in this embodiment, treat that the cutting board is the ceramic tile composite sheet, is rectangular shaped plate. Wherein the longitudinal direction is the manner in which the cut is made along the longer length of the board to be cut.
S302, transversely cutting the plate to be cut after longitudinally cutting.
Wherein the cross cutting is a cutting along a shorter length of the board to be cut.
The suitable sheet material is obtained by slitting and crosscutting the sheet to be cut.
Further, as shown in fig. 2, after the transversely cutting the plate to be cut after the longitudinally cutting, S302 further includes:
s303, cutting off excess materials at the two transverse ends of the plate to be cut;
wherein, the two transverse ends refer to the two ends with shorter length of the plate to be cut.
And S304, removing the residual materials as waste materials.
And materials at the two transverse ends are cut off and moved away, so that the subsequent processing of the plate can be facilitated, and the plate cutting efficiency is further improved.
Preferably, as shown in fig. 2, S304, after removing the remainder as the waste material, further includes:
s305, judging whether the plate to be cut needs secondary cutting;
and identifying through the identification code to obtain a cutting flow of the plate to be cut, and if the cutting flow contains a secondary cutting program, performing secondary cutting on the plate to be cut.
S306, if needed, the plate to be cut is moved to the position where the identification code is read by the plate to be cut;
and resetting the plate to be cut to the position where the plate to be cut reads the identification code, and carrying out secondary cutting on the plate to be cut according to the cutting parameters.
S307, carrying out secondary cutting on the plate to be cut;
and carrying out secondary cutting on the plate to be cut so as to improve the processing precision of the plate to be cut.
S308, if not, turning over the plate to be cut;
in this embodiment, the sheet to be cut is turned 180 °.
S309, longitudinally trimming or 45-degree longitudinally trimming the plate to be cut.
In this embodiment, a longitudinal edger may be used to longitudinally edge and longitudinally trim 45 ° the board to be cut.
The longitudinal trimming and the longitudinal 45-degree trimming of the ceramic tile composite plate are finished in the same process, so that the process flow can be simplified, the cutting efficiency is improved, the trimming is carried out after the ceramic tile composite plate is turned over, the edge breakage is prevented, and the trimming effect is ensured.
Preferably, as shown in fig. 2, S309, after performing longitudinal trimming or 45 ° longitudinal trimming on the plate to be cut, the method further includes:
s310, turning over the plate to be cut;
and turning the plate to be cut after the longitudinal trimming or the 45-degree longitudinal trimming again by 180 degrees.
And S311, performing special-shaped cutting on the turned plate to be cut.
In this embodiment, the opposite-sex cutting can be performed by using a profile cutter.
Through carrying out special-shaped cutting to the ceramic tile composite sheet to satisfy different cutting demands.
Further, as shown in fig. 2, S311, after performing the special-shaped cutting on the board to be cut after being turned over again, the method further includes:
and S312, removing dust on the plate to be cut.
To waiting to cut panel behind the dysmorphism cutting, carry out preliminary dust and clear away, avoid dust to fly upward, improve operation environmental quality.
Further, as shown in fig. 2, S312, after removing the dust on the board to be cut, the method further includes:
s313, drying the plate to be cut by hot air;
the existing hot air dryer can be adopted to carry out hot air drying on the board to be cut.
And S314, removing dust on the plate to be cut after hot air drying.
Through waiting to cut panel hot air drying and remove dust once more, not only can guarantee to wait to cut the aridity of panel, prevent to wait to cut the follow-up deformation of panel, but also can further reduce and wait to cut dust on the panel to reduce dust in transportation and the assembling process, improve site environment quality, still can reduce artificial dust removal work load simultaneously, reduce intensity of labour.
Fig. 3 is a flowchart illustrating a composite board processing method according to an embodiment of the present invention, and as shown in fig. 3, the composite board processing method according to the embodiment of the present invention includes:
s410, sanding the composite surface of the substrate;
in this embodiment, the composite surface of the substrate can be obtained by sanding with a sander.
S420, coating an adhesive on the sanded composite surface;
the adhesive can be the existing adhesive, and can be coated on the composite surface after sanding by a glue spreader.
And S430, compounding the decorative plate on the adhesive to form the composite plate.
The adhesive bonds the decorative plate and the substrate together to form the composite plate. Because the compound surface is sanded, the compound surface is smooth, the surface strength is increased, and the bonding is firmer.
According to the composite board processing method provided by the embodiment of the invention, the composite surface of the substrate is subjected to sanding treatment, then the decorative board is adhered to the substrate by the adhesive, and the surface strength of the sanded composite surface is increased under the condition of improving the smoothness, so that the substrate and the decorative board are adhered more firmly, glue is not easy to open, the defective rate of the composite board is reduced, the rework probability is reduced, the production cost is reduced, the process is simple, the automation degree is high, and the labor intensity is low.
Further, as shown in fig. 4, before attaching the decorative plate to the adhesive to form the composite plate, S430, the method further includes:
s422, positioning the substrate to acquire the position information of the substrate;
in this embodiment, the substrate may be positioned by using a positioning platform, and the positioning platform obtains the position coordinates of the substrate, for example, the substrate is rectangular, and obtains the position coordinates of four corners of the rectangle.
And S424, determining the position of the decorative plate according to the position information of the substrate.
For example, the position of the decorative plate is adjusted according to the position coordinates of the four corners of the rectangle, so that the coordinates of the four corners of the decorative plate are consistent with the coordinates of the base plate.
And determining the position of the decorative plate according to the position information of the substrate so as to ensure the accuracy of the bonding of the substrate and the decorative plate.
Preferably, S422, determining the position of the decoration plate according to the position information of the substrate, specifically includes:
s4222, monitoring whether the decorative plate is damaged or not;
the breakage of the decorative sheet can be monitored by existing monitoring equipment, such as a ceramic tile monitor.
S4224, if yes, removing the damaged decorative plate;
s4226, if not, determining the position of the decorative plate according to the position information of the substrate.
Through monitoring whether the decorative board is damaged, the processing quality of the composite board can be ensured, and the generation of defective products is reduced. Besides, the damage of the decorative plate is monitored by equipment without manual monitoring, so that the objectivity and accuracy of monitoring can be improved, and the processing quality of the composite plate is further improved.
Preferably, S424, determining the position of the decorative plate according to the position information of the substrate, comprises:
monitoring whether the decorative plates are arranged in a single row;
if the decorative plate is arranged in a single row, the decorative plate is adjusted from the single row arrangement to the double row arrangement.
By adjusting the decorative plates into double rows, two composite plates can be manufactured at one time, and the processing efficiency is further improved.
Further, S4222, before monitoring whether the decorative panel is damaged, further includes:
and (5) removing dust from the decorative plate.
Through removing dust to the decorative board, can avoid the interference of dust, improve the accuracy of monitoring.
Preferably, S430, after the decorative plate is combined with the adhesive to form the composite plate, the method further includes:
and S440, performing cold pressing on the composite board.
The composite board is cold-pressed by the cold press, so that the base plate and the decorative plate are bonded more firmly, and the glue is prevented from being broken.
Further, S440, after the cold pressing the composite board, further includes:
s450, circularly heating the cold-pressed composite board.
Through carrying out circulation heating to the composite sheet, the stability of performance of multiplicable composite sheet improves the plasticity of panel.
More preferably, S450, after the cold-pressed composite board is subjected to cyclic heating, further includes:
and (4) sequentially stacking the composite boards output one by one.
In this embodiment, the composite boards are automatically stacked after being output to facilitate movement of the composite boards.
In a specific embodiment, S410, the sanding process is performed on the composite surface of the substrate, specifically including:
s411, monitoring whether the substrate is damaged or not;
the substrate can also be monitored by a ceramic tile damage meter.
And S412, sanding the composite surface of the substrate if the composite surface is not damaged.
By monitoring whether the substrate is damaged or not, the defective rate of the composite board can be further reduced, and the qualified rate is improved.
The technical solutions of the present invention have been described in detail with reference to specific embodiments, which are used to help understand the ideas of the present invention. The derivation and modification made by the person skilled in the art on the basis of the specific embodiment of the present invention also belong to the protection scope of the present invention.

Claims (10)

1. A method of cutting a sheet material, comprising:
reading an identification code on a plate to be cut;
identifying the identification code, and acquiring cutting processes and cutting parameters corresponding to the cutting processes;
and cutting the board to be cut according to the cutting flow and the cutting parameters.
2. The method of claim 1, wherein cutting the board to be cut according to the cutting procedure and cutting parameters comprises:
longitudinally cutting the plate to be cut;
and transversely cutting the plate to be cut after the longitudinal cutting.
3. The method of claim 2, wherein after the cross-cutting the longitudinally cut sheet of material to be cut, further comprising:
cutting off the excess materials at the two transverse ends of the plate to be cut;
the remainder is removed as waste.
4. The method of claim 3, wherein after removing the slug as waste, further comprising:
judging whether the plate to be cut needs secondary cutting or not;
if so, transferring the plate to be cut to a position where the plate to be cut reads the identification code;
and carrying out secondary cutting on the plate to be cut.
5. The method of claim 3, wherein after removing the slug as waste, further comprising:
judging whether the plate to be cut needs secondary cutting or not;
if not, turning over the plate to be cut;
and carrying out longitudinal trimming or 45-degree longitudinal trimming on the plate to be cut.
6. The method according to claim 5, characterized in that, after the longitudinal trimming or 45 ° longitudinal trimming of the sheet to be cut, it further comprises:
turning over the plate to be cut;
and carrying out special-shaped cutting on the plate to be cut after the plate is turned over.
7. The method of claim 6, wherein after the performing the profile cutting on the sheet to be cut after the re-turning, further comprising:
and removing dust on the plate to be cut.
8. The method of claim 6, after removing dust from the sheet of material to be cut, further comprising:
carrying out hot air drying on the plate to be cut;
and removing dust on the plate to be cut after being dried by hot air.
9. The method of any one of claims 1-8, wherein the identification code is a two-dimensional code.
10. The method of claim 9, wherein the two-dimensional code is read by an automatic code reader.
CN202010053886.1A 2020-01-17 2020-01-17 Plate cutting method Pending CN111251354A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010053886.1A CN111251354A (en) 2020-01-17 2020-01-17 Plate cutting method

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Application Number Priority Date Filing Date Title
CN202010053886.1A CN111251354A (en) 2020-01-17 2020-01-17 Plate cutting method

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CN111251354A true CN111251354A (en) 2020-06-09

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114559485A (en) * 2022-02-28 2022-05-31 成都固迪新型建材有限公司 Cutting method, yield value acquisition method, cutting system and storage medium

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0441075B1 (en) * 1989-12-14 1994-08-17 Saint-Gobain Vitrage Making glass-sheets on a line comprising several working stations
CN104858537A (en) * 2015-05-29 2015-08-26 北京林克曼数控技术股份有限公司 Method and device for controlling groove of workpiece cut by robot
CN106827249A (en) * 2016-12-25 2017-06-13 山东赫峰石材高端装备研究院有限公司 Quartzite slate processing technology
CN207090508U (en) * 2017-07-18 2018-03-13 福建省神安建材有限公司 A kind of glass processing device
CN109905967A (en) * 2017-12-07 2019-06-18 捷惠自动机械有限公司 A kind of circuit board sawing sheet Processes and apparatus
CN110027762A (en) * 2019-05-15 2019-07-19 深圳市程捷模架科技有限公司 Aluminum alloy pattern plate processing method and equipment based on two dimensional code transmitting Machining Instruction

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0441075B1 (en) * 1989-12-14 1994-08-17 Saint-Gobain Vitrage Making glass-sheets on a line comprising several working stations
CN104858537A (en) * 2015-05-29 2015-08-26 北京林克曼数控技术股份有限公司 Method and device for controlling groove of workpiece cut by robot
CN106827249A (en) * 2016-12-25 2017-06-13 山东赫峰石材高端装备研究院有限公司 Quartzite slate processing technology
CN207090508U (en) * 2017-07-18 2018-03-13 福建省神安建材有限公司 A kind of glass processing device
CN109905967A (en) * 2017-12-07 2019-06-18 捷惠自动机械有限公司 A kind of circuit board sawing sheet Processes and apparatus
CN110027762A (en) * 2019-05-15 2019-07-19 深圳市程捷模架科技有限公司 Aluminum alloy pattern plate processing method and equipment based on two dimensional code transmitting Machining Instruction

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114559485A (en) * 2022-02-28 2022-05-31 成都固迪新型建材有限公司 Cutting method, yield value acquisition method, cutting system and storage medium
CN114559485B (en) * 2022-02-28 2023-12-12 成都固迪新型建材有限公司 Cutting method, production value acquisition method, cutting system and storage medium

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Application publication date: 20200609