CN111231134A - Scribing method - Google Patents

Scribing method Download PDF

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Publication number
CN111231134A
CN111231134A CN201910917895.8A CN201910917895A CN111231134A CN 111231134 A CN111231134 A CN 111231134A CN 201910917895 A CN201910917895 A CN 201910917895A CN 111231134 A CN111231134 A CN 111231134A
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section
line
substrate
dicing
dicing method
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Granted
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CN201910917895.8A
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Chinese (zh)
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CN111231134B (en
Inventor
张喜童
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Top Engineering Co Ltd
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Top Engineering Co Ltd
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Publication of CN111231134A publication Critical patent/CN111231134A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/08—Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082—Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

A dicing method according to an embodiment of the present invention is a method of forming a scribe line on a substrate along a virtual predetermined cutting line including a first section and a second section which are continuously connected, wherein the dicing method includes: a step of irradiating a laser beam along the cutting predetermined line in the first section to form a spot; and forming a scribe line by pressing the substrate with a scribing wheel in the first section and the second section and moving the scribing wheel along the line to cut, wherein the pressing force of the scribing wheel in the first section is smaller than the pressing force of the scribing wheel in the second section.

Description

Scribing method
Technical Field
The present invention relates to a scribing method for forming a scribe line on a substrate.
Background
In general, a liquid crystal display panel, an organic electroluminescence display panel, an inorganic electroluminescence display panel, a transmission type projector substrate, a reflection type projector substrate, and the like used for a flat panel display screen use a unit glass panel (hereinafter, referred to as a "unit substrate") obtained by cutting a brittle mother glass panel such as glass (hereinafter, referred to as a "substrate") into a predetermined size.
The step of cutting the substrate includes: a scribing step of pressing and moving a scribing wheel made of a material such as diamond toward the substrate along the virtual predetermined cutting line to form a scribe line; and a breaking step of dividing the substrate into unit substrates by pressing the substrate along the scribe lines.
In order to easily divide the substrate into unit substrates, it is necessary to pressurize the substrate with a large pressurizing force by the dicing wheel in the process of forming the scribe lines on the substrate. However, when the dicing wheel presses the substrate with a large pressing force, there is a problem that cracks or substrate breakage progresses in an unexpected direction in the substrate, and the substrate cannot be properly divided.
Therefore, the scribing wheel is pressed against the substrate with a large pressing force to easily divide the substrate and the pressing force of the scribing wheel applied to the substrate is reduced to prevent the substrate from being broken, which contradict each other. Therefore, it is necessary to provide a solution capable of preventing the substrate from being broken and easily dividing the substrate.
Disclosure of Invention
The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a dicing method capable of preventing a substrate from being damaged and easily dividing the substrate.
In order to achieve the above object, a dicing method according to an embodiment of the present invention is a method of forming a scribe line on a substrate along a virtual predetermined cutting line including a first section and a second section which are continuously connected, wherein the dicing method includes: a step of irradiating a laser beam along the cutting predetermined line in the first section to form a spot; and a step of forming a scribe line by pressing the substrate with a scribing wheel in the first section and the second section and moving the scribing wheel along the line to cut, wherein a pressing force of the scribing wheel in the first section may be smaller than a pressing force of the scribing wheel in the second section.
The first section may include a start point, an end point, or both of the start point and the end point of the predetermined cutting line.
Preferably, the number of points per unit length of the predetermined cutting line gradually increases toward the start point, the end point, or the start point and the end point.
The first section may include a portion where a plurality of the predetermined cutting lines overlap or intersect.
Preferably, the number of dots per unit length of the predetermined cutting lines gradually increases toward a portion where a plurality of the predetermined cutting lines overlap or intersect.
The first section may include a bent portion of the predetermined cutting line.
Preferably, the number of points per unit length of the line gradually increases toward a center of the curved portion of the line.
The step of forming the scribe line may form the scribe line continuously in the first and second sections.
The second section may be irradiated with a relatively weak laser beam compared to the first section.
Effects of the invention
According to the dicing method of the embodiment of the invention, for a portion where there is a fear of breakage due to pressurization of the dicing wheel, the laser beam is irradiated in advance before the pressurization with the dicing wheel to reduce the pressurization force of the dicing wheel compared to other portions to form the scribe line at the corresponding portion. Therefore, the substrate can be easily divided while preventing damage to the substrate.
Drawings
Fig. 1 is a plan view schematically showing a dicing apparatus applicable to a dicing method according to an embodiment of the present invention.
Fig. 2 is a side view schematically showing a head unit of a scribing apparatus applicable to the scribing method according to the embodiment of the present invention.
Fig. 3 is a diagram showing the cutting lines to be scribed and the dots to be scribed by the scribing method according to the first embodiment of the present invention.
Fig. 4 is a graph schematically showing the change in the number of points per unit length of the line to cut and the change in the pressing force of the dicing wheel according to the dicing method of the first embodiment of the present invention.
Fig. 5 is a diagram showing the cutting lines to be scribed and the dots to be scribed by the dicing method according to the second embodiment of the invention.
Fig. 6 is a graph schematically showing the change of the number of points per unit length of the lines to be cut and the change of the pressing force of the dicing wheel according to the dicing method of the second embodiment of the present invention.
Fig. 7 is a diagram showing the cutting lines to be scribed and the dots to be scribed by the scribing method according to the third embodiment of the present invention.
Fig. 8 is a graph schematically showing the change in the number of points per unit length of the lines to be cut and the change in the pressing force of the dicing wheel according to the dicing method of the third embodiment of the present invention.
Description of the reference numerals
10: supporting table
20: substrate transfer unit
30: scribing unit
40: frame body
50: marking head
Detailed Description
Hereinafter, a dicing method according to an embodiment of the present invention will be described with reference to the accompanying drawings.
Referring to fig. 1 and 2, a direction in which the substrate S to be subjected to the dicing process is transferred is defined as a Y-axis direction, and a direction perpendicular to the direction in which the substrate S is transferred (Y-axis direction) is defined as an X-axis direction. In addition, a direction perpendicular to the direction of the X-Y plane on which the substrate S is placed is defined as a Z-axis direction. The term "scribe line" refers to a groove and/or a crack formed on the surface of the substrate so as to extend in a predetermined direction. The term "line to cut" refers to a virtual line on which a scribe line is to be formed.
As shown in fig. 1 to 2, a dicing apparatus to which a dicing method according to an embodiment of the present invention is applied may include: a support table 10 on which a substrate S is mounted; a substrate transfer unit 20 configured to grip a rear end of the substrate S, which is a rear side end in a transfer direction of the substrate S, to transfer the substrate S; the scribing unit 30 is configured to form a scribe line in the X-axis direction and/or the Y-axis direction on the substrate S transferred by the substrate transfer unit 20.
The support table 10 functions to support the substrate S during its movement toward the scribing unit 30. Further, the support table 10 may function to support the substrate S in forming the scribing lines on the substrate S.
For example, the support table 10 may include a plurality of belts 13. The plurality of belts 13 may be disposed at intervals in the X-axis direction. Each belt 13 is supported by a plurality of pulleys (not shown), and at least one of the plurality of pulleys may be a drive pulley for providing a driving force for rotating the belt 13.
The present invention is not limited to the structure in which the support table 10 includes the plurality of belts 13, and the present invention may be applied to a structure such as an air table configured to eject gas from the support table 10 to float the substrate S.
The substrate transfer unit 20 may include: a holding module 21 for holding the rear end of the substrate S; and a guide rail 22 extending in the Y-axis direction to guide the movement of the grip module 21.
The gripping module 21 and the guide rail 22 may be provided with a linear movement mechanism such as an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. Therefore, in a state where the gripping module 21 grips the trailing end of the substrate S, the substrate S can be transferred in the Y-axis direction as the gripping module 21 is moved in the Y-axis direction along the guide rail 22 by the linear movement mechanism. In this case, the belt 13 is synchronized with the movement of the grip module 21. Thereby, the belt 13 can be driven at the same speed as the holding module 21 and stably support the bottom surface of the substrate S.
The holding module 21 may be a jig that physically pressurizes and holds the trailing end of the substrate S. However, the present invention is not limited to this, and the present invention may be applied to a configuration in which the gripping module 21 includes a vacuum hole connected to a vacuum source so as to be able to suck the trailing end of the substrate S.
A plurality of guide rails 22 may be provided in the X-axis direction. The plurality of guide rails 22 may be spaced apart from each other in the X-axis direction. A plurality of guide rails 22 may be disposed between the plurality of belts 13. The guide rail 22 functions to guide the movement of the grip module 21 in the Y-axis direction.
The scribing unit 30 may include: a frame body 40 extending in the X-axis direction; the scribe head 50 is movably provided in the X-axis direction on the frame 40.
As shown in fig. 2, the scribing head 50 may include: a horizontal movement member 51 configured to be horizontally movable along a virtual line to cut on the surface of the substrate S; a vertical moving member 52 connected to the horizontal moving member 51 and configured to be vertically movable relative to the horizontal moving member 51; a scribing wheel support 53 connected to the vertical moving member 52 and configured to be vertically movable relative to the vertical moving member 52; a dicing wheel 54 mounted on the dicing wheel holder 53 and configured to be in contact with the surface of the substrate S; a vertical movement module 55 connected to the vertical movement member 52 and configured to vertically move the vertical movement member 52; a carriage moving module 58 connected to the scribing wheel carriage 53 and vertically moving the scribing wheel carriage 53; the laser beam irradiation module 59 is provided on the vertical movement member 52 and configured to irradiate a laser beam toward the substrate S.
The horizontal movement member 51 is configured to be movable in the X-axis direction along the housing 40. For this purpose, an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a linear movement mechanism such as a ball screw mechanism may be provided between the housing 40 and the horizontal movement member 51.
In a state where the dicing wheel 54 presses the surface of the substrate S, the dicing wheel 54 is moved in the X-axis direction by the horizontal moving member 51, and thereby a scribe line can be formed in the X-axis direction on the surface of the substrate S. In addition, the substrate S is moved in the Y-axis direction by the substrate transfer unit 20 in a state where the dicing wheel 54 presses the surface of the substrate S, whereby scribing lines in the Y-axis direction can be formed on the surface of the substrate S. In the dicing apparatus according to the embodiment of the present invention, the horizontal movement of the horizontal moving member 51 includes not only the movement of the moving member 51 in the X-axis direction but also the relative movement of the horizontal moving member 51 in the Y-axis direction with respect to the substrate S as the substrate S moves in the Y-axis direction.
The vertical moving member 52 is connected to the horizontal moving member 51 so as to be horizontally movable in accordance with the horizontal movement of the horizontal moving member 51. For example, the vertical moving member 52 may move in the Z-axis direction along a guide rail 511 provided in the horizontal moving member 51. By the movement of the vertical movement member 52 in the Z-axis direction, the scribing wheel holder 53 and the scribing wheel 54 can be moved in the Z-axis direction. The scribing wheel 54 can move in the Z-axis direction toward the substrate S, so that pressure can be applied to the surface of the substrate S.
The vertical moving module 55 is connected to the horizontal moving member 51 so as to be horizontally movable according to the horizontal movement of the horizontal moving member 51. The vertical movement module 55 may include a linear movement mechanism such as an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. As the vertical moving member 52 is moved in the Z-axis direction by the vertical moving module 55, the positions of the saw wheel support 53 and the saw wheel 54 in the Z-axis direction can be adjusted.
The scribing wheel support 53 is connected to the horizontal moving member 51 through the vertical moving member 52 so as to be horizontally movable in accordance with the horizontal movement of the horizontal moving member 51. For example, the scribing wheel support 53 can move in the Z-axis direction along the guide rail 521 provided on the vertical movement member 52.
The scribing wheel 54 may be rotatably mounted to the scribing wheel holder 53 centering on the Z axis. Therefore, when the horizontal moving member 51 moves horizontally in the X-axis direction, the dicing wheel 54 in a state of contacting the surface of the substrate S rotates due to friction with the surface of the substrate S, so that the cutting direction of the cutting blade of the dicing wheel 54 can be parallel to the X-axis direction. In addition, when the horizontal movement member 51 moves horizontally in the Y-axis direction relative to the substrate S, the dicing wheel 54 in a state of contacting the surface of the substrate S rotates due to friction with the surface of the substrate S, and the cutting direction of the cutting blade of the dicing wheel 54 may be parallel to the Y-axis direction.
The carriage movement module 58 may include a linear movement mechanism such as an actuator operated by air pressure or oil pressure, a linear motor operated by electromagnetic interaction, or a ball screw mechanism. The carriage moving module 58 is connected to the saw wheel carriage 53, thereby serving to vertically move the saw wheel carriage 53 and finely adjust the vertical position of the saw wheel 54.
Therefore, in a state where the scribing wheel frame 53 is vertically moved by the frame moving module 58 so that the vertical position of the scribing wheel 54 is adjusted, as the vertical moving member 52 is moved in the Z-axis direction toward the substrate S by the vertical moving module 55, the scribing wheel 54 is moved in the Z-axis direction toward the substrate S to press on the substrate S. Further, the pressing force of the dicing wheel 54 against the substrate S varies depending on the amount of movement of the dicing wheel 54 in the Z-axis direction, and the cutting depth of the dicing wheel 54 against the surface of the substrate S varies.
The laser beam irradiation module 59 is connected to the horizontal movement member 51 through the vertical movement member 52 so as to be horizontally movable in accordance with the horizontal movement of the horizontal movement member 51. In addition, as the vertical moving member 52 is moved in the Z-axis direction by the vertical moving module 55, the laser beam irradiation module 59 is moved in the Z-axis direction, and the interval between the laser beam irradiation module 59 and the substrate S can be adjusted.
The laser beam irradiated from the laser beam irradiation module 59 may denature at least a portion of the inside of the substrate S. The denatured portion inside the substrate S is weak against external impact, and in the case where external impact is applied to the substrate S, the substrate S may be divided along the denatured portion inside the substrate S. The laser beam irradiation module 59 may be connected to a laser source (not shown) capable of generating a laser beam. The laser source may be a CO2 laser (carbon dioxide laser), a YAG (yttrium aluminum garnet) laser, a pulsed laser, a femtosecond laser, or the like. In addition, optical elements such as a beam expander and a collimator may be included between the laser source and the laser beam irradiation module 59 as necessary.
Hereinafter, a scribing method for forming a scribing line on the substrate S using the scribing apparatus as described above will be described with reference to fig. 3 to 8.
The dicing method according to the embodiment of the invention can irradiate a laser beam in advance before pressing with the dicing wheel 54 for a portion where there is a fear of breakage due to pressing of the dicing wheel, thereby enabling to reduce the pressing force of the dicing wheel 54 at the corresponding portion.
Hereinafter, a dicing method according to a first embodiment of the present invention will be described with reference to fig. 3 and 4.
As shown in fig. 3 and 4, the dicing method according to the first embodiment of the invention is a method of forming a scribe line on a substrate S along a virtual cutting line L including a first section S1 and a second section S2, the dicing method including: a step of irradiating a laser beam along the line L to cut in the first section S1 to form a point P; and a step of pressing the dicing wheel 54 against the substrate S in the first section S1 and the second section S2, moving the dicing wheel 54 along the lines to cut L, and forming the scribe lines.
Since the portion of the substrate S corresponding to the first section S1 is partially irradiated with the laser beam, the substrate S can be easily divided even when the scribing wheel 54 is pressed with a small pressing force to form the scribe line in the first section S1.
As a first example, as shown in fig. 3, only the first section S1 may be locally irradiated with the laser beam, and the second section S2 may be not irradiated with the laser beam. However, the present invention is not limited thereto, and as a second example, the first section S1 may be irradiated with a laser beam having a relatively strong intensity, and the second section S2 may be irradiated with a laser beam having a relatively weak intensity. As a third example, the laser beam may be irradiated to the first section S1 so that the interval between the plurality of dots P is relatively small, and the laser beam may be irradiated to the second section S so that the interval between the plurality of dots P is relatively large. In addition, any two or more of the first, second, and third examples may be combined.
In this way, since the laser beam is irradiated only locally to the first section S1, time and energy required for irradiating the laser beam can be saved as compared with the case of irradiating the laser beam to the entire section of the line L to be cut.
As shown in fig. 3 and 4, the first section S1 may include a start point SP, an end point EP, or a start point SP and an end point EP of the line L to be cut.
The starting point SP of the line L is the edge portion of the substrate S which the dicing wheel 54 first contacts. When the dicing wheel 54 is pressed at a large pressing force at the start point SP of the line L to cut, the edge portion of the substrate S may be broken to the outside. Therefore, it is preferable to reduce the pressing force of the dicing wheel 54 at the start point SP of the line L to be cut. For this reason, it is preferable that the laser beam is locally irradiated in the vicinity of the start point SP of the cutting scheduled line L.
The laser beam may be irradiated while keeping the interval between the plurality of points P constant in the vicinity of the start point SP of the line L to cut. However, in order to be able to save time and energy required for irradiating the laser beam, it is preferable that the irradiation of the laser beam is concentrated at a portion adjacent to the start point SP of the line L to be cut. Therefore, the intervals of the plurality of points P are preferably gradually decreased toward the start point SP of the line L. That is, the number of points P per unit length of the line L preferably gradually increases toward the start point SP of the line L.
The end point EP of the line L is the edge portion of the substrate S separated from the substrate S after the dicing wheel 54 finally contacts the substrate. When the dicing wheel 54 is pressed with a large pressing force at the end point EP of the line to cut L, there is a possibility that the edge portion of the substrate S may be broken to the outside. Therefore, it is preferable to reduce the pressing force of the dicing wheel 54 at the end point EP of the line L to be cut, and for this reason, it is preferable to locally irradiate a laser beam in the vicinity of the end point EP of the line L to be cut.
The laser beam may be irradiated while keeping the interval between the plurality of points P constant in the vicinity of the end point EP of the line L to cut. However, in order to be able to save time and energy required for irradiating the laser beam, it is preferable to intensively irradiate the laser beam at a portion adjacent to the end point EP of the predetermined cutting line L. Therefore, it is preferable that the intervals of the plurality of points P gradually decrease toward the end point EP of the line L to cut. That is, the number of points P per unit length of the line L preferably gradually increases toward the end point EP of the line L.
According to the scribing method of the first embodiment of the present invention, the laser beam is locally irradiated to the first section S1 before the process of forming the scribing line using the scribing wheel 54. Therefore, as shown in fig. 4, the pressing force of the dicing wheel 54 at the first section S1 may be reduced compared to the pressing force of the dicing wheel 54 at the second section S2. Therefore, the substrate S can be prevented from being damaged by the pressing force of the dicing wheel 54, and the substrate S can be easily divided.
Hereinafter, referring to fig. 5 and 6, a dicing method according to a second embodiment of the present invention will be described.
As shown in fig. 5 and 6, in the dicing method according to the second embodiment of the invention, the first section S1 includes a portion where two or more cutting lines L overlap or intersect. The portion where the lines L to be cut overlap or intersect is a portion where the dicing wheel 54 passes twice or more, that is, a portion where pressure is applied twice or more by the dicing wheel 54. Therefore, the pressure of the dicing wheel 54 is repeatedly applied to the portion where the plurality of lines to cut L overlap or intersect, and thus the portion is more likely to be broken or chipped than the other portion of the substrate S. Therefore, it is preferable to reduce the pressing force of the dicing wheel 54 on a portion where the plurality of lines L to cut overlap or intersect. Therefore, it is preferable that the laser beam is locally irradiated on a portion where the plurality of cutting lines L overlap or intersect.
The laser beam may be irradiated while keeping the interval between the plurality of points P constant in the vicinity of the portion where the plurality of lines L overlap or intersect. However, in order to be able to save time and energy required for irradiating the laser beam, it is preferable that the irradiation of the laser beam be concentrated at a portion where adjacent plural lines L to be cut overlap or intersect. Therefore, it is preferable that the intervals of the plurality of points P gradually decrease toward the portion where the plurality of lines L overlap or intersect. That is, the number of points P per unit length of the line L preferably increases gradually toward a portion where a plurality of lines L overlap or intersect.
According to the scribing method of the second embodiment of the present invention, the laser beam is locally irradiated to the first section S1 before the process of forming the scribing line using the scribing wheel 54. Therefore, as shown in fig. 6, the pressing force of the dicing wheel 54 at the first section S1 may be reduced compared to the pressing force of the dicing wheel 54 at the second section S2. Therefore, the substrate S can be prevented from being damaged by the pressing force of the dicing wheel 54, and the substrate S can be easily divided.
Hereinafter, referring to fig. 7 and 8, a dicing method according to a third embodiment of the present invention will be described.
As shown in fig. 7 and 8, according to the dicing method of the third embodiment of the invention, the first section S1 includes a curved portion of the cutting predetermined line L. At the bent portion of the line L, the horizontal moving member 51 moves horizontally in the X-axis direction and also moves horizontally in the Y-axis direction relative to the substrate S. Therefore, the curved portion of the line L is a portion where the dicing wheel 54 rotates about the Z axis and the direction of the dicing blade of the dicing wheel 54 is gradually changed.
At the bent portion of the line L, the dicing wheel 54 rotates about the Z axis and is cut at both sides of the dicing wheel 54 orthogonal to the proceeding direction of the line L, and thus the possibility of breakage or chipping is high. Therefore, it is preferable to reduce the pressing force of the dicing wheel 54 at the portion of the curved portion of the predetermined cutting line L. Therefore, it is preferable that the laser beam is irradiated locally at the bent portion of the predetermined cutting line L.
The laser beam may be irradiated while keeping the interval between the plurality of points P constant in the vicinity of the bent portion of the line L to cut. However, in order to be able to save time and energy required for irradiating the laser beam, it is preferable to intensively irradiate the laser beam at a portion adjacent to the curved portion of the predetermined cutting line L. Therefore, the intervals of the plurality of points P are preferably gradually decreased toward the center of the curved portion of the line L. That is, the number of points P per unit length of the line L preferably gradually increases toward the center of the curved portion of the line L.
According to the scribing method of the third embodiment of the present invention, the first section S1 is locally irradiated with the laser beam before the process of forming the scribing line using the scribing wheel 54. Therefore, as shown in fig. 8, the pressing force of the dicing wheel 54 at the first section S1 may be reduced compared to the pressing force of the dicing wheel 54 at the second section S2. Therefore, the substrate S can be prevented from being damaged by the pressing force of the dicing wheel 54, and the substrate S can be easily divided.
The preferred embodiments of the present invention have been described by way of example, but the scope of the present invention is not limited to such specific embodiments, and may be modified as appropriate within the scope of the claims.

Claims (9)

1. A dicing method of forming a scribe line on a substrate along a virtual predetermined cutting line including a first section and a second section which are continuously connected, wherein the dicing method includes:
a step of irradiating a laser beam along the cutting predetermined line in the first section to form a spot; and
a step of pressing the substrate with a scribing wheel in the first section and the second section and moving the scribing wheel along the line to cut to form a scribing line,
the pressing force of the scribing wheel in the first section is smaller than the pressing force of the scribing wheel in the second section.
2. The dicing method according to claim 1,
the first section includes a start point, an end point, or both of the start point and the end point of the predetermined cutting line.
3. The dicing method according to claim 2, wherein,
the number of points per unit length of the line increases gradually toward the start point, the end point, or the start point and the end point.
4. The dicing method according to claim 1,
the first section includes a portion where a plurality of the predetermined cutting lines overlap or intersect.
5. The dicing method according to claim 4,
the number of dots per unit length of the line gradually increases toward a portion where a plurality of lines overlap or intersect.
6. The dicing method according to claim 1,
the first section includes a bent portion of the predetermined cutting line.
7. The dicing method according to claim 6,
the number of points per unit length of the planned cutting line gradually increases toward a center of the curved portion of the planned cutting line.
8. The dicing method according to claim 1,
the step of forming the scribe line forms a scribe line continuously in the first and second sections.
9. The dicing method according to claim 1,
the second section irradiates a relatively weak laser beam compared to the first section.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836939A (en) * 1981-08-26 1983-03-04 Toshiba Corp Cutting method for glass wafer
CN101296787A (en) * 2005-10-28 2008-10-29 三星钻石工业股份有限公司 Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
CN102343629A (en) * 2010-07-26 2012-02-08 澁谷工业株式会社 Device and method for cutting fragile material
CN102964059A (en) * 2011-08-30 2013-03-13 三星钻石工业股份有限公司 Glass substrate scribing method and processing device
CN103979784A (en) * 2013-02-07 2014-08-13 三星钻石工业股份有限公司 Tempered glass substrate marking method and marking device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5836939A (en) * 1981-08-26 1983-03-04 Toshiba Corp Cutting method for glass wafer
CN101296787A (en) * 2005-10-28 2008-10-29 三星钻石工业股份有限公司 Method of forming scribe line on substrate of brittle material and scribe line forming apparatus
CN102343629A (en) * 2010-07-26 2012-02-08 澁谷工业株式会社 Device and method for cutting fragile material
CN102964059A (en) * 2011-08-30 2013-03-13 三星钻石工业股份有限公司 Glass substrate scribing method and processing device
CN103979784A (en) * 2013-02-07 2014-08-13 三星钻石工业股份有限公司 Tempered glass substrate marking method and marking device

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