CN111204964A - 贴合基板的分割方法 - Google Patents

贴合基板的分割方法 Download PDF

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Publication number
CN111204964A
CN111204964A CN201911031241.1A CN201911031241A CN111204964A CN 111204964 A CN111204964 A CN 111204964A CN 201911031241 A CN201911031241 A CN 201911031241A CN 111204964 A CN111204964 A CN 111204964A
Authority
CN
China
Prior art keywords
scribing
glass substrate
breaking
substrate
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911031241.1A
Other languages
English (en)
Chinese (zh)
Inventor
田村健太
武田真和
宫川学
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsuboshi Diamond Industrial Co Ltd
Original Assignee
Mitsuboshi Diamond Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co Ltd filed Critical Mitsuboshi Diamond Industrial Co Ltd
Publication of CN111204964A publication Critical patent/CN111204964A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
CN201911031241.1A 2018-11-22 2019-10-28 贴合基板的分割方法 Pending CN111204964A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-218865 2018-11-22
JP2018218865A JP2020083690A (ja) 2018-11-22 2018-11-22 貼り合わせ基板の分断方法

Publications (1)

Publication Number Publication Date
CN111204964A true CN111204964A (zh) 2020-05-29

Family

ID=70785491

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911031241.1A Pending CN111204964A (zh) 2018-11-22 2019-10-28 贴合基板的分割方法

Country Status (4)

Country Link
JP (1) JP2020083690A (ko)
KR (1) KR20200060232A (ko)
CN (1) CN111204964A (ko)
TW (1) TW202023977A (ko)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6439313B2 (ja) 2014-08-07 2018-12-19 三星ダイヤモンド工業株式会社 スクライブ方法およびスクライブ装置
JP6507600B2 (ja) 2014-12-02 2019-05-08 三星ダイヤモンド工業株式会社 脆性材料基板の分断方法及び加工装置

Also Published As

Publication number Publication date
TW202023977A (zh) 2020-07-01
KR20200060232A (ko) 2020-05-29
JP2020083690A (ja) 2020-06-04

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PB01 Publication
PB01 Publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20200529

WD01 Invention patent application deemed withdrawn after publication