CN111180427B - Spectrum dimming packaging structure and manufacturing method thereof - Google Patents
Spectrum dimming packaging structure and manufacturing method thereof Download PDFInfo
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- CN111180427B CN111180427B CN201910639825.0A CN201910639825A CN111180427B CN 111180427 B CN111180427 B CN 111180427B CN 201910639825 A CN201910639825 A CN 201910639825A CN 111180427 B CN111180427 B CN 111180427B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P60/00—Technologies relating to agriculture, livestock or agroalimentary industries
- Y02P60/14—Measures for saving energy, e.g. in green houses
Abstract
The invention relates to a spectrum dimming packaging structure, and also relates to a manufacturing method of the structure, which is characterized in that: the red powder packaging structure comprises a first wavelength blue light chip, a second wavelength blue light chip and a packaging layer, wherein a long wavelength fluorescent powder glue layer is arranged on the surface of the first wavelength blue light chip to form a red powder packaging body in a CSP packaging form, and the packaging layer is used for integrally packaging the red powder packaging body and the second chip. The invention has the advantages that: the light source packaging structure can change the color temperature by changing the proportion of the second chip and the red powder packaging body in the light source. Unlike the conventional package form, the color temperature change is achieved by precisely weighing the phosphor by a high-precision balance and then changing the mixed concentration of the long-wavelength phosphor in the overall package layer.
Description
Technical Field
The invention relates to a spectrum dimming packaging structure and also relates to a manufacturing method of the spectrum dimming packaging structure.
Background
Current white LEDs generally take several forms, as shown in curve (1) of fig. 1, using blue light to excite a single yellow phosphor. In this case, the light efficiency is generally high, but the display index is only about 70, and the display index is not suitable for low-color-temperature application. When middle and low color temperature application is needed, long wavelength fluorescent powder is generally added. If the color rendering index is required to be further increased to 80 or more, it is required to add both red and green phosphors. As shown in curve (2) of FIG. 1, the color rendering index can reach 80 by using both red and green phosphors. However, as can be seen from curve (2) of FIG. 1, the blue and cyan portions of the spectrum between 460-510nm remain missing for full spectrum applications, and thus it is often desirable to add a cyan phosphor having a peak wavelength between 470-505nm for full spectrum applications. For the conventional technical scheme for realizing full spectrum, the blue light chip is basically adopted to excite the mixed fluorescent powder, but the color rendering index and the light efficiency brought by the method can not meet the requirements of high light efficiency and high color rendering index. In order to further improve the color rendering index and the light efficiency of the light source, several schemes are also proposed in industry, such as: the ultraviolet chip is adopted to excite the fluorescent powder, so that the spectrum defect caused by the excitation of the blue light chip can be made up to a certain extent.
The SunLike full spectrum light source is provided by the first-order semiconductor, and the technology combines the first-order semiconductor LED chip patent technology and the Toshiba Materials TRI-R fluorescent powder technology to generate a natural light spectrum. The Sunlike full spectrum implementation technology comprises the following steps: the ultraviolet LED chip is adopted to excite the mixed fluorescent powder of each color in the whole packaging layer. A specific implementation is shown in fig. 2. The disadvantage of this scheme is that all mixed fluorescent powder is excited by using ultraviolet light, but the excitation efficiency of ultraviolet light is very low, so that the high-efficiency excitation of mixed fluorescent powder cannot be realized, and the ultraviolet light is wasted. In addition, the scheme also has the secondary excitation problem that blue light from the blue fluorescent powder excited by the purple light excites other long-wavelength fluorescent powder again, so that the overall display quality is affected, and the light efficiency and the color development of the light source cannot be further improved.
Full spectrum implementation mode of Xinda photoelectric patent technology: (patent number 201810067979.2) adopts a purple light chip, two blue light chips with different dominant wavelength ranges and a light conversion layer coated on the purple light chip and the blue light chip, wherein the light conversion layer is prepared by fluorescent powder and packaging glue. In other words, the adopted green powder with the emission wavelength of 490-505 nm, the green powder with the emission wavelength of 520-540 nm, the dark red powder with the emission wavelength of 640-660 nm and the packaging adhesive are mixed together to form the light conversion layer. A specific implementation is shown in fig. 3. In the scheme, mixed excitation of fluorescent powder is still adopted, except that part of chips are purple light and part of chips are blue light, so that the quality of the full spectrum is improved to a certain extent, but the problem of low excitation efficiency due to secondary excitation of the fluorescent powder still exists. The blue light chip with higher quantum efficiency is adopted, so that the overall light efficiency is improved, but the problem that ultraviolet light is unnecessarily wasted in exciting fluorescent powder except 470-505 wavelengths, and the problem that the blue light fluorescent powder secondarily excites long-wavelength fluorescent powder and the overall excitation efficiency is low exist. In addition, if different color temperatures are to be realized, the concentration of the long-wavelength fluorescent powder in the packaging layer needs to be changed, and especially under the condition of low color temperature, the whole packaging body is very turbid and has deeper color due to the existence of the high-concentration long-wavelength fluorescent powder, so that the overall luminous efficiency and the color rendering index of the light source are limited to a certain extent.
By combining the above schemes, the following common problems are summarized:
first, as can be seen from the spectra of the six phosphors in fig. 4 to 9, the optimal excitation wavelengths of the different phosphors are different, and the mixed phosphor cannot be excited by light with a single wavelength, so that the excitation efficiency of the mixed phosphor is low for a certain phosphor. Therefore, the mixed fluorescent powder can improve the color rendering index, but has larger energy loss and lower luminous efficiency. For example, for a cyan phosphor, because the emission wavelength is relatively close to the excitation wavelength, the excitation efficiency is low, and blue or violet light excitation with shorter wavelength should be used. However, the blue light or the purple light with shorter wavelength is adopted to excite the mixed fluorescent powder, and the excitation efficiency of the cyan fluorescent powder can be improved, but the photon energy consumption of the short-wavelength photons when the yellow and long-wavelength fluorescent powder is excited is increased.
Second, there is also a problem of secondary absorption for the mixed phosphor. It can be seen from the excitation spectra of 655 and 660nm phosphors in fig. 8 and 9 that there is still up to 40% relative absorption of the light emitted by 495nm phosphor, which not only reduces the cyan light component, but also causes a secondary loss of energy. Assuming that the quantum efficiency of the blue phosphor and the long wavelength phosphor is 90%, the blue phosphor is excited by blue light, and the quantum efficiency of the excited long wavelength phosphor is 81%, which is about 10% lower than that of the blue directly excited long wavelength phosphor. Therefore, the secondary absorption has a great influence on both color rendering and luminous efficiency.
Third, for phosphors excited with blue light, one blue photon can excite at most one photon of another color, and the energy difference between the two photons is called Stocks shift. As can be seen from fig. 8 and 9, when the single blue light with short wavelength is used to excite the mixed fluorescent powder, the red light and the blue light have large energy difference, the photon energy is more lost, and the redundant energy is absorbed by the lattice vibration, so that not only is the photon energy wasted, but also the heat energy is generated, and high requirements are put on the heat dissipation of the device.
Fourth, as can be seen from fig. 10, blue light excitation with different wavelengths is used for the same phosphor, and the emission wavelengths are also different. The emission wavelength will move relatively with the excitation wavelength. At present, people are increasingly concerned with healthy illumination, namely, the expected luminescence spectrum is wider, and the color rendering index is higher. Compared with multi-wavelength excitation, the single-wavelength excitation light has narrower light spectrum and lower color rendering index, and can not meet the requirement of wide spectrum and high color rendering index.
In summary, the main preparation methods of the current LED white light source generally adopt the preparation processes of dispensing, spraying, molding, etc., which are all to uniformly mix various fluorescent powders and silica gel and then prepare, and these process methods are limited by the above-mentioned excitation emission spectra of the chip and fluorescent powder, so that it is difficult to obtain the LED white light source with higher color rendering index under the condition of the same materials.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a spectrum light-dimming packaging structure with higher color rendering index and ensured luminous efficiency, and a method for manufacturing the spectrum light-dimming packaging structure.
In order to solve the technical problems, the technical scheme of the invention is as follows: a spectrum light modulation packaging structure is characterized in that: comprising
At least one first chip, wherein the first chip is a first wavelength blue light chip, a long wavelength fluorescent powder adhesive layer is arranged on the surface of the first wavelength blue light chip to form a red powder package body in a CSP package form, and the long wavelength fluorescent powder adhesive layer is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; and the weight ratio of the long-wavelength fluorescent powder to the colloid in the long-wavelength fluorescent powder adhesive layer is 0.2-5: 1, a step of;
at least one second chip, wherein the second chip is a second wavelength blue light chip;
the packaging layer is used for integrally packaging each red powder packaging body and the second chip therein, wherein the packaging layer contains any one or two of green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm, and does not contain blue fluorescent powder with the emission wavelength of 450-500nm and long-wavelength fluorescent powder with the emission wavelength of 600-1000 nm;
the number and the wavelength of the red powder packaging body and the second chip satisfy the following conditions:
(1) When the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
(2) The wavelength of the first chip is denoted as λa, λa=445 to 550nm; the wavelength of the second chip is denoted λb, λb=420-465 nm; and 0.ltoreq.λA- λB.ltoreq.130 nm.
Preferably, the thickness of the long wavelength fluorescent powder adhesive layer arranged on the top surface of the first wavelength blue light chip is 20-400 um, and the thickness of the long wavelength fluorescent powder adhesive layer arranged on the side surface of the first wavelength blue light chip is 20-400 um.
Preferably, the long wavelength phosphor with the emission wavelength of 600-1000nm adopts any one or a mixture of red phosphor and near infrared phosphor.
Preferably, the long wavelength phosphor contains red phosphor with a wavelength of 658-660 nm, and the weight of the red phosphor with a wavelength of 658-660 nm accounts for more than half of the weight of the long wavelength phosphor.
Preferably, the long wavelength fluorescent powder is red fluorescent powder with the wavelength of 605-630 nm, and the fluorescent powder does not contain fluorescent powder with the peak value exceeding 630 nm.
A manufacturing method of a spectrum dimming packaging structure is characterized by comprising the following innovation points: the method comprises the following steps:
step S1: the fabrication of the chip or package body is performed,
the first chip is a first wavelength blue light chip, and a long wavelength fluorescent powder adhesive layer is arranged on the surface of the first wavelength blue light chip to obtain a red powder package body in a CSP package form, wherein the long wavelength fluorescent powder adhesive layer is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; controlling the powder-gel ratio of the colloid in the long-wavelength fluorescent powder adhesive layer to the long-wavelength fluorescent powder to be 0.2-5: 1, a step of;
the second chip is a blue light chip with a second wavelength;
step S2: the number of the chips and the number of the packages are proportioned,
according to the color temperature requirement of the final spectrum dimming packaging structure, selecting the proportion of red powder packaging bodies to the total chip number:
when the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
comparing the color point coordinates corresponding to the red powder package body on the CIE chromaticity diagram after the quantity proportion is selected, and marking the color point coordinates as a red point (X1; Y1);
comparing the color point coordinates corresponding to the second chip on the CIE chromaticity diagram after the quantity proportion is selected, and marking as a blue point (X2; Y2);
step S3: the pre-control of the color temperature is performed,
respectively fixing the red powder packaging body and the second chip to corresponding positions on the supporting piece or the substrate; and lighting to obtain a color point position corresponding to the CIE chromaticity diagram after lighting, which is marked as a mixing point (X3; Y3), and ensuring that Y3 is more than or equal to 0.08 and less than or equal to 0.20,0.22 and X3 is more than or equal to 0.43; thereby pre-controlling the color temperature range; if not, the step S2 is carried out again;
step S4:
searching a color point coordinate corresponding to the color temperature on the Planckian locus of the CIE chromaticity diagram according to the color temperature requirement of the final spectrum dimming packaging structure, and recording the color point coordinate as a white point (X4; Y4);
obtaining specific coordinate values or coordinate ranges of the required green point (X5; Y5) through known red points (X1; Y1), blue points (X2; Y2), mixed points (X3; Y3) and white points (X4; Y4);
then green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm are selected according to the coordinate value or the coordinate range in proper proportion, and then mixed into the colloid to form the packaging colloid;
integrally packaging each red powder packaging body and the second chip on a supporting piece or a substrate through packaging colloid to form a packaging layer;
then the fluorescent powder in the packaging layer is fully settled through a precipitation process, and the temperature is increased to the curing temperature of the colloid for curing, so that a finished product is obtained;
step S5:
detecting whether the light-emitting spectrum and the color temperature of the finished product meet the design requirements, and if the corresponding color point on the CIE chromaticity diagram is deviated upwards or downwards relative to the Planckian locus, respectively correspondingly reducing or increasing the powder amounts of green fluorescent powder and yellow fluorescent powder in the external colloid;
if the color temperature does not meet the requirement, directly adjusting the proportion of the red powder package body to the sum of the numbers of the second chip and the red powder package body, and repeating the steps S3-S5.
According to the spectrum dimming packaging structure, the excitation wavelengths of different fluorescent powder can be considered by adopting the chip excitation with a plurality of different wavelengths, namely the short-wavelength chip can excite the short-wavelength fluorescent powder, the long-wavelength chip can excite the long-wavelength fluorescent powder, and the short-wavelength fluorescent powder generated by the short-wavelength fluorescent powder can be prevented from being re-absorbed due to the fact that the short-wavelength fluorescent powder is excited again; the optimal excitation wavelength realizes the highest quantum efficiency and improves the light efficiency of the light source.
The packaging structure of the chips with different wavelengths is different from the conventional technology in that the long wavelength fluorescent powder is packaged in the local range of the top surface and the side surface of the chip by adopting CSP or WLP technology, and only very little short wavelength and medium wavelength fluorescence can irradiate on the long wavelength fluorescent powder, so that the problem of secondary absorption of the long wavelength fluorescent powder on blue and green fluorescence can be effectively avoided, and the luminous efficiency and the color rendering index are improved.
Meanwhile, according to the Stokes shift phenomenon, when the wavelength of excitation light of the same fluorescent powder moves, the light-emitting wavelength of the same fluorescent powder also moves relatively to the corresponding wavelength direction; therefore, the long wavelength chip adopted by the invention can excite the long wavelength fluorescent powder to obtain red fluorescence with longer wavelength, and the short wavelength chip can excite the blue and green fluorescent powder to obtain blue and green fluorescence with shorter wavelength, so that the fluorescence band spectrum is widened, and the color rendering index is further improved.
More important is: the light source packaging structure can change the color temperature by changing the proportion of the second chip and the red powder packaging body in the light source. Compared with the prior art, the color temperature of the light source needs to be changed by continuously adjusting the proportion and the quantity of the fluorescent powder of the whole fluorescent powder layer, so that the problem that the color of the light emitting surface of the COB package is dark and turbid is caused. The invention is realized by adopting the CSP chip of the full red powder, and the color temperature can be changed by changing the proportion of the red light chip and the blue light chip in the light source, unlike the conventional packaging mode which is required to accurately weigh the fluorescent powder by a high-precision balance, and then the color temperature is changed by changing the mixing concentration of the long-wavelength fluorescent powder in the whole packaging layer.
Drawings
Fig. 1 is a diagram showing the emission spectrum of a conventional white LED.
Fig. 2 is a schematic diagram of the principle of Sunlike full spectrum implementation.
Fig. 3 is a schematic diagram of a full spectrum implementation structure of the Xindao photoelectric patent technology.
FIG. 4 is a graph of excitation and emission spectra of 495 phosphor.
FIG. 5 is a plot of 518 fluorescence excitation and emission spectra.
FIG. 6 is a graph of excitation and emission spectra of 530 phosphors.
Fig. 7 is a graph of 535 phosphor excitation and emission spectra.
FIG. 8 is a graph showing excitation and emission spectra of 655 phosphors.
FIG. 9 is a graph of 660 fluorescence excitation and emission spectra.
FIG. 10 is a graph showing the excitation spectrum and emission spectrum of red phosphors excited by different excitation wavelengths.
Fig. 11 is a schematic diagram of a spectrum dimming package structure according to the present invention.
Fig. 12 is a spectrum diagram of a 4000K spectrum dimming package structure according to a first embodiment of the present invention.
Fig. 13 is a spectrum diagram of a spectrum dimming package structure of a second embodiment 3000K of the present invention.
Fig. 14 is a spectrum diagram of a spectrum light modulation package structure of 6500K according to a third embodiment of the invention.
Fig. 15 is a spectrum diagram of a 2500K spectrum dimming package structure according to a fourth embodiment of the present invention.
Description of the embodiments
As shown in FIG. 11, the spectrum dimming packaging structure of the present invention comprises
At least one first chip, the first chip is a first wavelength blue light chip 11, a long wavelength fluorescent powder adhesive layer 12 is arranged on the surface of the first wavelength blue light chip 11 to form a red powder package body in a CSP package form, and the long wavelength fluorescent powder adhesive layer 12 is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; and the weight ratio of the long-wavelength fluorescent powder to the colloid in the long-wavelength fluorescent powder adhesive layer 12 is 0.2-5: 1, a step of;
at least one second chip, which is a second wavelength blue light chip 2;
the packaging layer 3 is used for integrally packaging the red powder packaging bodies and the second chip, wherein the packaging layer 3 contains any one or two of green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm, and does not contain blue fluorescent powder with the emission wavelength of 450-500nm and long-wavelength fluorescent powder with the emission wavelength of 600-1000 nm;
the number and wavelength of the red powder packaging body and the second chip satisfy the following conditions:
(1) When the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
(2) The wavelength of the first chip is denoted λa, λa=445 to 550nm; the wavelength of the second chip is denoted λb, λb=420-465 nm; and 0.ltoreq.λA- λB.ltoreq.130 nm.
As a preferred embodiment of the present invention,
the long wavelength fluorescent powder adhesive layer 12 is arranged on the top surface of the first wavelength blue light chip, and the thickness of the long wavelength fluorescent powder adhesive layer 12 is 20-400 um on the side surface of the first wavelength blue light chip.
The long wavelength fluorescent powder with the emission wavelength of 600-1000nm adopts any one or the mixture of the red fluorescent powder and the near infrared fluorescent powder.
When the beef-based fluorescent powder is applied to illumination of meat products, the beef-based fluorescent powder preferably contains red fluorescent powder with the wavelength of 658-660 nm, and the weight of the red fluorescent powder with the wavelength of 658-660 nm accounts for more than half of the weight of the long-wavelength fluorescent powder.
The preferable long-wavelength fluorescent powder of the pig meat is red fluorescent powder with the wavelength of 605-630 nm, and does not contain fluorescent powder with the peak value exceeding 630 nm.
The method of the invention comprises the following steps:
step S1: the fabrication of the chip or package body is performed,
the first chip is a first wavelength blue light chip, and a long wavelength fluorescent powder adhesive layer is arranged on the surface of the first wavelength blue light chip to obtain a red powder package body in a CSP package form, wherein the long wavelength fluorescent powder adhesive layer is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; controlling the powder-gel ratio of the colloid in the long-wavelength fluorescent powder adhesive layer to the long-wavelength fluorescent powder to be 0.2-5: 1, a step of;
the second chip is a blue light chip with a second wavelength;
step S2: the number of the chips and the number of the packages are proportioned,
according to the color temperature requirement of the final spectrum dimming packaging structure, selecting the proportion of red powder packaging bodies to the total chip number:
when the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
comparing the color point coordinates corresponding to the red powder package body on the CIE chromaticity diagram after the quantity proportion is selected, and marking the color point coordinates as a red point (X1; Y1);
comparing the color point coordinates corresponding to the second chip on the CIE chromaticity diagram after the quantity proportion is selected, and marking as a blue point (X2; Y2);
step S3: the pre-control of the color temperature is performed,
respectively fixing the red powder packaging body and the second chip to corresponding positions on the supporting piece or the substrate; and lighting to obtain a color point position corresponding to the CIE chromaticity diagram after lighting, which is marked as a mixing point (X3; Y3), and ensuring that Y3 is more than or equal to 0.08 and less than or equal to 0.20,0.22 and X3 is more than or equal to 0.43; thereby pre-controlling the color temperature range; if not, the step S2 is carried out again;
step S4:
searching a color point coordinate corresponding to the color temperature on the Planckian locus of the CIE chromaticity diagram according to the color temperature requirement of the final spectrum dimming packaging structure, and recording the color point coordinate as a white point (X4; Y4);
obtaining specific coordinate values or coordinate ranges of the required green point (X5; Y5) through known red points (X1; Y1), blue points (X2; Y2), mixed points (X3; Y3) and white points (X4; Y4);
then green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm are selected according to the coordinate value or the coordinate range in proper proportion, and then mixed into the colloid to form the packaging colloid;
integrally packaging each red powder packaging body and the second chip on a supporting piece or a substrate through packaging colloid to form a packaging layer;
then the fluorescent powder in the packaging layer is fully settled through a precipitation process, and the temperature is increased to the curing temperature of the colloid for curing, so that a finished product is obtained;
step S5:
detecting whether the light-emitting spectrum and the color temperature of the finished product meet the design requirements, and if the corresponding color point on the CIE chromaticity diagram is deviated upwards or downwards relative to the Planckian locus, respectively correspondingly reducing or increasing the powder amounts of green fluorescent powder and yellow fluorescent powder in the external colloid;
if the color temperature does not meet the requirement, directly adjusting the proportion of the red powder package body to the sum of the numbers of the second chip and the red powder package body, and repeating the steps S3-S5.
Example 1
Manufacturing a spectrum dimming packaging structure with a color temperature of 4000K:
the specification of the first wavelength blue light chip is 14×30 mil, the wavelength λA is 465nm, the peak wavelength 620nm of the long wavelength phosphor in the long wavelength phosphor colloid layer and the peak wavelength 620 of the long wavelength phosphor in the colloid powder long wavelength phosphor colloid layer are 1.7:1, a step of; the thickness of the long wavelength fluorescent powder colloid layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the long wavelength fluorescent powder colloid layer on the side surface of the first wavelength blue light chip is 120 microns;
the specification of the second wavelength blue light chip is 14×30 mil, and the wavelength lambdab is 452nm;
the total number of chips of the whole spectrum dimming packaging structure is 40-50, in the embodiment, the number of red powder packaging bodies is 22, the number of blue light chips with second wavelength is 23, on the CIE chromaticity diagram, the red powder packaging bodies correspond to red point coordinates (0.5,0.28), the blue light chips with second wavelength correspond to blue point coordinates (0.0149,0.0317), the mixed point coordinates (0.2413,0.0877) and the color temperature corresponds to coordinates (0.378,0.377).
The weight ratio of each component in the encapsulation layer of the embodiment is 70% of colloid, 27% of green fluorescent powder and 3% of yellow fluorescent powder.
Example two
The spectrum dimming packaging structure for manufacturing the color temperature of 3000K can be applied to illumination of meat such as beef:
the specification of the first wavelength blue light chip is 14-30 mil, the wavelength lambda A is 465nm, the long wavelength fluorescent powder in the long wavelength fluorescent powder colloid layer adopts mixed fluorescent powder, wherein the weight of red fluorescent powder with the wavelength of 658-660 nm is more than 70%, the rest is red fluorescent powder with the wavelength of 627nm, and the powder-colloid weight ratio of the long wavelength fluorescent powder in the long wavelength fluorescent powder colloid layer to the colloid is 3:1, a step of; the thickness of the long wavelength fluorescent powder colloid layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the long wavelength fluorescent powder colloid layer on the side surface of the first wavelength blue light chip is 120 microns;
the specification of the second wavelength blue light chip is 14×30 mil, and the wavelength lambdab is 452nm;
the total number of chips of the whole spectrum dimming packaging structure is about 50, in this embodiment, the number of red powder packages is 28, the number of blue light chips with second wavelength is 23, on the CIE chromaticity diagram, the red powder packages correspond to red point coordinates (0.54,0.28), the blue light chips with second wavelength correspond to blue point coordinates (0.0149,0.0317), the mixed point coordinates (0.3224,0.1433), and the color temperature correspond to coordinates (0.418,0.4115).
The weight ratio of each component in the encapsulation layer of the embodiment is 65% of colloid, 24% of green fluorescent powder and 16% of yellow fluorescent powder.
Example III
Manufacturing a spectrum dimming packaging structure with a color temperature of 6500K, and applying the spectrum dimming packaging structure to seafood illumination:
the specification of the first wavelength blue light chip is 14-30 mil, the wavelength lambda A is 465nm, the long wavelength fluorescent powder in the long wavelength fluorescent powder colloid layer is red powder with the peak wavelength of 620nm,
the weight ratio of the long wavelength fluorescent powder to the colloid in the long wavelength fluorescent powder colloid layer is 0.2:1, a step of; the thickness of the long wavelength fluorescent powder colloid layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the long wavelength fluorescent powder colloid layer on the side surface of the first wavelength blue light chip is 120 microns;
the specification of the second wavelength blue light chip is 14×30 mil, and the wavelength lambdab is 452nm;
the total number of chips of the whole spectrum dimming packaging structure is about 30, in this embodiment, the number of red powder packages is 8, the number of blue light chips with second wavelength is 20, on the CIE chromaticity diagram, the red powder packages correspond to red point coordinates (0.43,0.21), the blue light chips with second wavelength correspond to blue point coordinates (0.0149,0.0317), the mixed point coordinates (0.2205,0.08017), and the color temperature correspond to coordinates (0.3187,0.3255).
The weight ratio of each component in the encapsulation layer of the embodiment is 69% of colloid, 25% of green fluorescent powder and 6% of yellow fluorescent powder.
Example IV
Manufacturing a spectrum dimming packaging structure with a color temperature of 2500K:
the specification of the first wavelength blue light chip is 14-30 mil, the wavelength lambda A is 465nm, all the long wavelength fluorescent powder in the long wavelength fluorescent powder colloid layer is red powder with the peak wavelength of 650nm, and the weight ratio of the long wavelength fluorescent powder to the colloid in the long wavelength fluorescent powder colloid layer is 5:1, a step of; the thickness of the long wavelength fluorescent powder colloid layer on the top surface of the first wavelength blue light chip is 200 microns, and the thickness of the long wavelength fluorescent powder colloid layer on the side surface of the first wavelength blue light chip is 120 microns;
the specification of the second wavelength blue light chip is 14×30 mil, and the wavelength lambdab is 452nm;
the total number of chips of the whole spectrum dimming packaging structure is about 40, in this embodiment, the number of red powder packages is 8, the number of blue light chips with second wavelength is 20, on the CIE chromaticity diagram, the red powder packages correspond to red point coordinates (0.58,0.305), the blue light chips with second wavelength correspond to blue point coordinates (0.0149,0.0317), the mixed point coordinates (0.4101,0.2073), and the color temperature correspond to coordinates (0.483,0.428).
The weight ratio of each component in the encapsulation layer of the embodiment is colloid 60%, green fluorescent powder 20% and yellow fluorescent powder 20%.
The spectrum dimming packaging structure of 4 embodiments adopting the COB packaging form is compared with the 4000K traditional 1919COB packaging structure, and the test data are as follows (10/sample number):
the spectrum dimming packaging structure of the 4 embodiments adopts a spectrum chart in a COB packaging form, see fig. 12-15. From the above tables and spectrograms, it can be derived that:
according to the spectrum dimming packaging structure, chips in the packaging layer are clear and distinguishable, so that the short-wavelength fluorescence generated by the short-wavelength fluorescent powder is prevented from being re-absorbed due to the fact that the long-wavelength fluorescent powder is excited again, the luminous efficiency of the light source of most embodiments can be improved by more than 11%, and the radiating effect is good; the fluorescence band spectrum is widened, and the color rendering index is slightly improved; the color temperature is changed by changing the proportion of the red light chip to the blue light chip in the light source, so that the fluorescent powder is not only prevented from being accurately weighed by a high-precision balance under the conventional structure, but also the powder consumption is greatly reduced.
Claims (6)
1. A spectrum light modulation packaging structure is characterized in that: comprising
At least one first chip, wherein the first chip is a first wavelength blue light chip, a long wavelength fluorescent powder adhesive layer is arranged on the surface of the first wavelength blue light chip to form a red powder package body in a CSP package form, and the long wavelength fluorescent powder adhesive layer is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; and the weight ratio of the long-wavelength fluorescent powder to the colloid in the long-wavelength fluorescent powder adhesive layer is 0.2-5: 1, a step of;
at least one second chip, wherein the second chip is a second wavelength blue light chip;
the packaging layer is used for integrally packaging each red powder packaging body and the second chip therein, wherein the packaging layer contains any one or two of green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm, and does not contain blue fluorescent powder with the emission wavelength of 450-500nm and long-wavelength fluorescent powder with the emission wavelength of 600-1000 nm;
the number and the wavelength of the red powder packaging body and the second chip satisfy the following conditions:
(1) When the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
(2) The wavelength of the first chip is denoted as λa, λa=445 to 550nm; the wavelength of the second chip is denoted λb, λb=420-465 nm; and 0.ltoreq.λA- λB.ltoreq.130 nm.
2. The spectral dimming package structure of claim 1, wherein: the thickness of the long wavelength fluorescent powder adhesive layer arranged on the top surface of the first wavelength blue light chip is 20-400 um, and the thickness of the long wavelength fluorescent powder adhesive layer arranged on the side surface of the first wavelength blue light chip is 20-400 um.
3. The spectral dimming package structure according to claim 1 or 2, wherein: the long-wavelength fluorescent powder with the emission wavelength of 600-1000nm adopts any one or the mixture of red fluorescent powder and near infrared fluorescent powder.
4. A spectral dimming package structure according to claim 3, wherein: the long wavelength fluorescent powder contains red fluorescent powder with the wavelength of 658-660 nm, and the weight of the red fluorescent powder with the wavelength of 658-660 nm accounts for more than half of the weight of the long wavelength fluorescent powder.
5. A spectral dimming package structure according to claim 3, wherein: the long-wavelength fluorescent powder is red fluorescent powder with the wavelength of 605-630 nm, and does not contain fluorescent powder with the peak value exceeding 630 nm.
6. A method for manufacturing a spectrum dimming packaging structure according to claim 1, which is characterized in that: the method comprises the following steps:
step S1: the fabrication of the chip or package body is performed,
the first chip is a first wavelength blue light chip, and a long wavelength fluorescent powder adhesive layer is arranged on the surface of the first wavelength blue light chip to obtain a red powder package body in a CSP package form, wherein the long wavelength fluorescent powder adhesive layer is formed by mixing colloid and long wavelength fluorescent powder with the emission wavelength of 600-1000 nm; controlling the powder-gel ratio of the colloid in the long-wavelength fluorescent powder adhesive layer to the long-wavelength fluorescent powder to be 0.2-5: 1, a step of;
the second chip is a blue light chip with a second wavelength;
step S2: the number of the chips and the number of the packages are proportioned,
according to the color temperature requirement of the final spectrum dimming packaging structure, selecting the proportion of red powder packaging bodies to the total chip number:
when the color temperature required by the whole spectrum dimming packaging structure is higher than 4500K, the number of red powder packaging bodies accounts for 5-30% of the sum of the numbers of the second chip and the red powder packaging bodies;
when the color temperature required by the whole spectrum dimming packaging structure is lower than or equal to 4500K, the number of red powder packaging bodies accounts for 30-80% of the sum of the numbers of the second chip and the red powder packaging bodies;
comparing the color point coordinates corresponding to the red powder package body on the CIE chromaticity diagram after the quantity proportion is selected, and marking the color point coordinates as a red point (X1; Y1);
comparing the color point coordinates corresponding to the second chip on the CIE chromaticity diagram after the quantity proportion is selected, and marking as a blue point (X2; Y2);
step S3: the pre-control of the color temperature is performed,
respectively fixing the red powder packaging body and the second chip to corresponding positions on the supporting piece or the substrate; and lighting to obtain a color point position corresponding to the CIE chromaticity diagram after lighting, which is marked as a mixing point (X3; Y3), and ensuring that Y3 is more than or equal to 0.08 and less than or equal to 0.20,0.22 and X3 is more than or equal to 0.43; thereby pre-controlling the color temperature range; if not, the step S2 is carried out again;
step S4:
searching a color point coordinate corresponding to the color temperature on the Planckian locus of the CIE chromaticity diagram according to the color temperature requirement of the final spectrum dimming packaging structure, and recording the color point coordinate as a white point (X4; Y4);
obtaining specific coordinate values or coordinate ranges of the required green point (X5; Y5) through known red points (X1; Y1), blue points (X2; Y2), mixed points (X3; Y3) and white points (X4; Y4);
then green fluorescent powder with the emission wavelength of 500-550nm and yellow fluorescent powder with the emission wavelength of 550-600nm are selected according to the coordinate value or the coordinate range in proper proportion, and then mixed into the colloid to form the packaging colloid;
integrally packaging each red powder packaging body and the second chip on a supporting piece or a substrate through packaging colloid to form a packaging layer;
then the fluorescent powder in the packaging layer is fully settled through a precipitation process, and the temperature is increased to the curing temperature of the colloid for curing, so that a finished product is obtained;
step S5:
detecting whether the light-emitting spectrum and the color temperature of the finished product meet the design requirements, and if the corresponding color point on the CIE chromaticity diagram is deviated upwards or downwards relative to the Planckian locus, respectively correspondingly reducing or increasing the powder amounts of green fluorescent powder and yellow fluorescent powder in the external colloid;
if the color temperature does not meet the requirement, directly adjusting the proportion of the red powder package body to the sum of the numbers of the second chip and the red powder package body, and repeating the steps S3-S5.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/123375 WO2020114463A1 (en) | 2018-12-07 | 2019-12-05 | Packaging body and preparation method therefor |
| US17/339,944 US20210296294A1 (en) | 2018-12-07 | 2021-06-05 | Packaging body and preparation method therefor |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811495570.7A CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
| CN2018114955707 | 2018-12-07 |
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| CN111180427A CN111180427A (en) | 2020-05-19 |
| CN111180427B true CN111180427B (en) | 2023-06-13 |
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| CN201811495570.7A Withdrawn CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
| CN201910640049.6A Active CN111180429B (en) | 2018-12-07 | 2019-07-16 | Solar spectrum-like plant illumination package and manufacturing method thereof |
| CN201910639866.XA Pending CN111180428A (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof |
| CN201910639825.0A Active CN111180427B (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure and manufacturing method thereof |
| CN201922007924.5U Active CN212277195U (en) | 2018-12-07 | 2019-11-20 | High-color rendering index and high-light efficiency packaging body |
| CN201911139025.9A Pending CN111192868A (en) | 2018-12-07 | 2019-11-20 | High-color rendering index and high-light efficiency packaging body |
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| CN201811495570.7A Withdrawn CN109638005A (en) | 2018-12-07 | 2018-12-07 | A kind of high aobvious finger high photosynthetic efficiency packaging body |
| CN201910640049.6A Active CN111180429B (en) | 2018-12-07 | 2019-07-16 | Solar spectrum-like plant illumination package and manufacturing method thereof |
| CN201910639866.XA Pending CN111180428A (en) | 2018-12-07 | 2019-07-16 | Spectrum dimming packaging structure containing purple light or near ultraviolet chip and manufacturing method thereof |
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| CN201911139025.9A Pending CN111192868A (en) | 2018-12-07 | 2019-11-20 | High-color rendering index and high-light efficiency packaging body |
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| WO2020114463A1 (en) * | 2018-12-07 | 2020-06-11 | 海迪科（南通）光电科技有限公司 | Packaging body and preparation method therefor |
| WO2021147812A1 (en) * | 2020-01-20 | 2021-07-29 | 海迪科（南通）光电科技有限公司 | Spectrum packaging structure and manufacturing method therefor |
| CN113497012B (en) * | 2020-03-20 | 2024-02-23 | 海迪科（南通）光电科技有限公司 | Solar spectrum-like packaging structure and preparation method thereof |
| CN111710773A (en) * | 2020-06-08 | 2020-09-25 | 杭州汉徽光电科技有限公司 | Light emitting device and illumination device for breeding meat poultry |
| CN112289910B (en) * | 2020-10-19 | 2021-06-25 | 刘成禹 | LED stepless color temperature regulation light source and manufacturing process thereof |
| CN113097364A (en) * | 2021-03-23 | 2021-07-09 | 李清 | Manufacturing method of full-spectrum LED light source |
| CN115377274B (en) * | 2022-09-14 | 2023-05-26 | 旭宇光电（深圳）股份有限公司 | Full spectrum LED light source and lamp |
| CN115799434B (en) * | 2023-01-31 | 2023-05-12 | 天津德高化成新材料股份有限公司 | Healthy illumination backlight source and preparation method thereof |
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| CN106090706A (en) * | 2016-08-17 | 2016-11-09 | 江门市赛宁灯饰有限公司 | The full spectrum plant growth lamp that a kind of polycrystalline excites |
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- 2018-12-07 CN CN201811495570.7A patent/CN109638005A/en not_active Withdrawn
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| Publication number | Publication date |
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| CN111180428A (en) | 2020-05-19 |
| CN109638005A (en) | 2019-04-16 |
| CN111180427A (en) | 2020-05-19 |
| CN212277195U (en) | 2021-01-01 |
| CN111192868A (en) | 2020-05-22 |
| CN111180429A (en) | 2020-05-19 |
| CN111180429B (en) | 2023-06-13 |
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