CN111174613A - Thermosiphon heat sink - Google Patents

Thermosiphon heat sink Download PDF

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Publication number
CN111174613A
CN111174613A CN202010120302.8A CN202010120302A CN111174613A CN 111174613 A CN111174613 A CN 111174613A CN 202010120302 A CN202010120302 A CN 202010120302A CN 111174613 A CN111174613 A CN 111174613A
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CN
China
Prior art keywords
pipe
manifold
evaporator
steam pipe
connection hole
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Pending
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CN202010120302.8A
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Chinese (zh)
Inventor
董陈
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Shenzhen Zhihan Heat Transfer Technology Co ltd
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Shenzhen Zhihan Heat Transfer Technology Co ltd
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Application filed by Shenzhen Zhihan Heat Transfer Technology Co ltd filed Critical Shenzhen Zhihan Heat Transfer Technology Co ltd
Priority to CN202010120302.8A priority Critical patent/CN111174613A/en
Publication of CN111174613A publication Critical patent/CN111174613A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Abstract

The invention provides a thermosiphon heat dissipation device, which is characterized in that a first condensing unit and a second condensing unit are arranged, and a first right manifold and a first left manifold of the first condensing unit and a second left manifold and a second right manifold of the second condensing unit are vertical and are fixedly arranged close to an evaporator, so that the space occupation of the thermosiphon heat dissipation device in the vertical direction is reduced; the first steam pipe is communicated with a first right manifold of the first condensing unit and a right steam pipe connection hole arranged on the evaporator, and a second steam pipe is communicated with a second left manifold of the second condensing unit and a left steam pipe connection hole arranged on the evaporator; therefore, compared with the condition that only one side of the evaporator is provided with the collecting pipe for collecting steam, the technical scheme of the invention can reduce the difference between the strokes of the steam in the left area and the steam in the right area of the sealed accommodating cavity of the evaporator to reach the collecting pipe, further reduce the temperature difference between the left side and the right side of the evaporator and ensure that the temperatures of the left side and the right side of the bottom of the evaporator are relatively uniform.

Description

Thermosiphon heat sink
Technical Field
The invention relates to the technical field of heat dissipation of electronic or power equipment, in particular to a thermosiphon heat dissipation device.
Background
The thermosiphon heat radiator consists of a condenser, an evaporator, a steam pipe, a liquid pipe and the like, wherein working medium is filled in the evaporator, the condenser usually consists of two collecting pipes positioned on two sides and a plurality of condensing pipes communicated with the two collecting pipes, the evaporator absorbs heat of a heat source and then heats internal working medium, the working medium heats to generate steam, and the steam enters the condenser through the steam pipe to be condensed into liquid with lower temperature and then flows back to the evaporator through the liquid pipe, so that the heat radiation effect on the heat source is realized.
In the related solution, referring to fig. 1, the condenser is disposed above the evaporator, the collecting pipes are all horizontally disposed, the steam pipe and the liquid pipe are respectively communicated with the evaporator from the top middle position and the bottom middle position of the evaporator, the condenser and the evaporator are substantially located on the same plane, and further occupy a large area, and when the thermosiphon heat dissipation device is applied to electronic equipment to dissipate heat from electronic components, because the internal space of the electronic equipment is limited, the thermosiphon heat dissipation device cannot provide enough space in the up-and-down direction for disposing the condenser. Referring to fig. 2, if both headers of the condenser are arranged perpendicular to the surface of the evaporator, one header must be close to the left and the other header close to the right, i.e. the header for collecting steam is close to the side of the evaporator. The length of the steam pipe arrangement is reduced as much as possible to reduce the flow stroke of the steam, so that the flow resistance of the steam is reduced, under the arrangement scheme, the steam pipe can only be communicated with one side of the evaporator, which is close to the collecting pipe for collecting the steam, and the steam at one side of the evaporator, which is far away from the collecting pipe for collecting the steam, can reach the collecting pipe by a long flowing distance, so that the heat absorption capacity of the left side and the right side of the evaporator are greatly different.
Disclosure of Invention
The invention aims to provide a thermosiphon heat dissipation device which can avoid occupying a larger space in the vertical direction, has a more compact structure, can reduce the temperature difference between the left side and the right side of an evaporator and can relatively uniformly ensure the temperature of the left side and the right side of the bottom of the evaporator.
In order to solve the technical problems, the invention adopts the technical scheme that: a thermosiphon heat sink includes an evaporator, a first condensing unit, a second condensing unit, a first steam pipe, a second steam pipe, a first liquid pipe and a second liquid pipe; the evaporator is provided with a sealed accommodating cavity for accommodating working media, and a right steam pipe connecting hole, a left steam pipe connecting hole, a right liquid pipe connecting hole and a left liquid pipe connecting hole which are communicated with the sealed accommodating cavity; the right steam pipe connection hole is positioned on the right side of the left steam pipe connection hole; the right liquid pipe connection hole is positioned on the right side of the left liquid pipe connection hole; the first condensing unit is provided with a first right collecting cavity, a first left collecting cavity and a plurality of first condensing pipes which are arranged in parallel; said first condenser tube communicating said first right manifold and said first left manifold; said first right manifold is located on the right side of said evaporator near the top with its axis perpendicular to the surface of said evaporator; the first left manifold is located on the left side of the evaporator near the top with its axis perpendicular to the surface of the evaporator; the second condensing unit is provided with a second left collecting cavity, a second right collecting cavity and a plurality of second condensing pipes which are arranged in parallel; said second condenser tube communicating said second left manifold and said second right manifold; the second left manifold is located on the left side of the evaporator near the top with its axis perpendicular to the surface of the evaporator; said second right manifold is located on the right side of said evaporator near the top with its axis perpendicular to the surface of said evaporator; one end of the first steam pipe is communicated with the first right manifold, and the other end of the first steam pipe is communicated with the right steam pipe connection hole; one end of the second steam pipe is communicated with the second left manifold, and the other end of the second steam pipe is communicated with the left steam pipe connection hole; one end of the first liquid pipe is communicated with the first left manifold, and the other end of the first liquid pipe is communicated with the left liquid pipe connection hole; one end of the second liquid pipe is communicated with the second right manifold, and the other end of the second liquid pipe is communicated with the right liquid pipe connecting hole.
Further, the axis of the first right manifold is collinear with the axis of the second right manifold; the axis of the first left manifold is collinear with the axis of the second left manifold.
Further, the first condensing unit and the second condensing unit are integrated on the same condenser, and the condenser comprises a left collecting pipe and a right collecting pipe which are spaced left and right; the left collecting pipe and the right collecting pipe are fixedly arranged close to the evaporator; a first partition plate is arranged in the right collecting pipe to divide the inner cavity of the right collecting pipe into a first right collecting cavity and a second right collecting cavity; and a second partition plate is arranged in the left collecting pipe to divide the inner cavity of the left collecting pipe into a first left collecting cavity and a second left collecting cavity.
Further, the first condensing unit and the second condensing unit are arranged in parallel in the vertical direction; the first condensing unit is a condenser and comprises a first right collecting pipe and a first left collecting pipe, a first right manifold is formed in the first right collecting pipe, and a first left manifold is formed in the first left collecting pipe; the first right collecting pipe and the first left collecting pipe are fixedly arranged close to the evaporator; the second condensing unit is a condenser and comprises a second right collecting pipe and a second left collecting pipe, a second right manifold is formed in the second right collecting pipe, and a second left manifold is formed in the second left collecting pipe; the second right collecting pipe and the second left collecting pipe are fixedly arranged close to the evaporator.
Further, the left liquid connection hole is positioned right below the left steam connection hole; the right liquid pipe connecting hole is positioned right below the right steam pipe connecting hole.
Further, the right steam pipe connection hole and the right liquid pipe connection hole are both arranged close to the right side of the evaporator; the left steam pipe connecting hole and the left liquid pipe connecting hole are both close to the left side of the evaporator.
Furthermore, the device also comprises a right additional steam pipe and a left additional steam pipe; the first condensing unit is positioned above the second condensing unit; the evaporator is also provided with a right additional steam pipe connecting hole and a left additional steam pipe connecting hole; the right additional steam pipe connection hole and the left additional steam pipe connection hole are both communicated with the sealed accommodating cavity, and the right additional steam pipe connection hole is positioned on the right side of the left additional steam pipe connection hole; one end of the right additional steam pipe is communicated with the first right collecting cavity, the right additional steam pipe bypasses the second right collecting pipe, and the other end of the right additional steam pipe is communicated with the right additional steam pipe connecting hole; one end of the left additional steam pipe is communicated with the second left manifold, and the other end of the left additional steam pipe is communicated with the left additional steam pipe connection hole.
Furthermore, a groove matched with the outer side wall of the right additional steam pipe is formed in the second right collecting pipe, and the right additional steam pipe is embedded into the groove.
Furthermore, the first condensing unit and the second condensing unit are arranged in a left-right staggered mode, so that the first right collecting pipe and the right side of the evaporator form a residual space and the first steam pipe is arranged in the residual space, the second left collecting pipe and the left side of the evaporator form a residual space and the second steam pipe is arranged in the residual space.
Furthermore, the evaporator is fixedly provided with switching tubes which are correspondingly communicated with the right steam pipe connecting hole, the left steam pipe connecting hole, the right liquid pipe connecting hole and the left liquid pipe connecting hole one by one; the first steam pipe, the second steam pipe, the first liquid pipe and the second liquid pipe are communicated with the sealed accommodating cavity through corresponding switching pipes respectively.
According to the technical scheme, the invention has at least the following advantages and positive effects:
the invention provides a thermosiphon heat dissipation device, which is characterized in that a first condensing unit and a second condensing unit are arranged, a first right manifold and a first left manifold of the first condensing unit and a second left manifold and a second right manifold of the second condensing unit are both vertical to an evaporator, so that the space occupation of the thermosiphon heat dissipation device in the vertical direction is reduced, then a first steam pipe is used for communicating the first right manifold of the first condensing unit with a right steam pipe connection hole arranged on the evaporator, a second steam pipe is used for communicating the second left manifold of the second condensing unit with a left steam pipe connection hole arranged on the evaporator, and the left steam pipe connection hole is positioned on the left side of the right steam pipe connection hole, and the second left manifold is positioned on the left side of the first right manifold; therefore, compared with the condition that only one side of the evaporator is provided with the collecting pipe for collecting steam, the technical scheme of the invention can reduce the difference between the strokes of the steam in the left area and the steam in the right area of the sealed accommodating cavity of the evaporator to the collecting pipe, further reduce the temperature difference between the left side and the right side of the evaporator and ensure that the temperatures of the left side and the right side of the bottom of the evaporator are relatively uniform; and can arrange steam pipe and liquid pipe respectively in the both sides of evaporimeter, reduce the pipe diameter of steam pipe, the pipeline of being convenient for is arranged.
Drawings
Fig. 1 and 2 are schematic perspective views of a thermosiphon heat sink according to the related art.
Fig. 3, 5 and 6 are schematic perspective views of thermosiphon heat sinks arranged at the same height, in particular, of a first condensation unit and a second condensation unit according to an embodiment of the present invention.
Fig. 4 is a schematic perspective view of a heat source at the bottom of an evaporator according to an embodiment of the present invention.
Fig. 7, 8 and 9 are schematic perspective views of thermosiphon heat dissipation devices in which the first condensation unit and the second condensation unit are arranged in parallel in the vertical direction according to an embodiment of the present invention.
Fig. 10 is a schematic perspective view of a thermosiphon heat dissipation device with right and left additional steam pipes according to an embodiment of the present invention.
Fig. 11 and 12 are schematic perspective views of the thermosiphon heat dissipation device after the second right collecting pipe is grooved according to an embodiment of the present invention.
The reference numerals are explained below: 1. an evaporator; 2. a first condensing unit; 21. a first condenser pipe; 22. a first right header; 23. a first left header; 3. a second condensing unit; 31. a second condenser pipe; 32. a second right header; 321. a groove; 33. a second left header; 4. a first steam pipe; 5. a second steam pipe; 6. a first liquid pipe; 7. a second liquid pipe; 8. a transfer tube; 9. a transfer seat; 10. a heat source; 11. a left header pipe; 12. a right header pipe; 13. a first partition plate; 14. a second partition plate; 15. a steam pipe is additionally arranged on the right side; 16. the left side is additionally provided with a steam pipe.
Detailed Description
Exemplary embodiments that embody features and advantages of the invention are described in detail below in the specification. It is to be understood that the invention is capable of other embodiments and that various changes in form and details may be made therein without departing from the scope of the invention and the description and drawings are to be regarded as illustrative in nature and not as restrictive.
In the description of the present invention, it should be understood that the terms "above" and "below" refer to the orientation relationship of the thermosiphon heat sink in the use state, and in addition, other terms indicating the orientation or positional relationship, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., are based on the orientation or positional relationship shown in the drawings, and are only for convenience of describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. Either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 3, an embodiment of the present invention provides a thermosiphon heat dissipation device, which can be applied to heat dissipation of a heating element in an electronic or power device. The thermosiphon heat sink includes an evaporator 1, a first condensing unit, a second condensing unit, a first steam pipe 4, a second steam pipe 5, a first liquid pipe 6, and a second liquid pipe 7.
Referring to fig. 4, a sealed accommodating cavity is arranged inside the evaporator 1, and a proper amount of working medium is filled in the sealed accommodating cavity after the sealed accommodating cavity is vacuumized. In a use state, the evaporator 1 is vertically arranged, the surface of the evaporator 1 is tightly attached to a heat source 10 such as a heating electronic element, and heat of the heat source 10 enters the evaporator 1 through heat conduction and is finally dissipated by a first condensing unit and a second condensing unit of the thermosiphon heat dissipation device.
One side of the evaporator 1 close to the condenser is provided with a right steam pipe connecting hole, a left steam pipe connecting hole, a right liquid pipe connecting hole and a left liquid pipe connecting hole (not shown in the figure) which are communicated with the sealed accommodating cavity. The right steam pipe connection hole and the left steam pipe connection hole are close to the top of the evaporator 1 and used for communicating the upper part of the sealed accommodating cavity. The left steam pipe connection hole is positioned on the left side of the right steam pipe connection hole. The right liquid connection hole and the left liquid connection hole are close to the bottom of the evaporator 1 and are used for communicating the lower part of the sealed accommodating cavity. The right liquid tube connecting hole is positioned on the right side of the left liquid tube connecting hole.
Referring to fig. 5, the evaporator 1 is fixedly provided with the switching tubes 8 which are correspondingly communicated with the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole one by one. The adapter tube 8 is fixed in advance integrally with the evaporator 1. The internal diameter of the adapter tube 8 is slightly larger than the external diameters of the first steam tube 4, the second steam tube 5, the first liquid tube 6 and the second liquid tube 7, so that during subsequent assembly, one end of the first steam tube 4, one end of the second steam tube 5, one end of the first liquid tube 6 and one end of the second liquid tube 7 can be inserted into the adapter tube 8, and gas welding is facilitated.
The specific method for fixing the adapter tube 8 and the evaporator 1 into a whole in advance is to weld the adapter tube 8 and each component forming the evaporator 1 into a whole at one time through furnace welding.
Through above-mentioned scheme, can avoid in the in-process of assembly, directly weld each steam pipe and liquid pipe to the steam pipe of evaporimeter 1 and connect the hole with the liquid pipe, because evaporimeter 1's local the surface deformation that causes that is heated. The evaporator 1 can be prevented from being integrally heated before the steam pipe and the liquid pipe are welded, so that the longer heating time is consumed, the production efficiency is improved, and the complexity of the manufacturing process is reduced.
In practical application, the number and the arrangement positions of the adapter tubes 8 are determined according to the number and the positions of the actual steam tube connecting holes and the actual liquid tube connecting holes, that is, the number of the adapter tubes 8 is equal to the sum of the numbers of the steam tubes and the liquid tubes.
The first condensing unit has a first right manifold, a first left manifold, and a plurality of first condensing tubes 21 arranged in parallel. The first condenser pipe 21 communicates the first right manifold and the first left manifold. The first right manifold is located on the right side of the evaporator 1 near the top with its axis perpendicular to the surface of the evaporator 1. The first left manifold is located on the left side of the evaporator 1 near the top with its axis perpendicular to the surface of the evaporator 1.
The second condensing unit has a second left manifold, a second right manifold, and a plurality of second condensing tubes 31 arranged in parallel. The second condenser pipe 31 communicates the second left manifold and the second right manifold. The second left manifold is located on the left side of the evaporator 1 near the top with its axis perpendicular to the surface of the evaporator 1. The second right manifold is located on the right side of the evaporator 1 near the top with its axis perpendicular to the surface of the evaporator 1.
The first right manifold, the first left manifold, the second left manifold and the second right manifold are all internal cavities of a tubular object, and the axial direction is also the length direction of the tubular object.
Through the arrangement, the thermosiphon heat dissipation device can avoid occupying a large arrangement area caused by the arrangement mode (shown in fig. 1) that the condenser and the evaporator 1 are arranged in parallel up and down, namely, the large space in the up-and-down direction is avoided. In addition, the length and the occupied space of the steam pipe and the liquid pipe are also shortened, so that the whole heat dissipation device is more compact.
With continued reference to fig. 3, 5, and 6, the particular arrangement of the first and second condensing units may be at the same height, with the expanded arrangement, such as the axis of the first right manifold being collinear with the axis of the second right manifold. The axis of the first left manifold is collinear with the axis of the second left manifold. In this way, the first condensing unit and the second condensing unit are located on the same elevation plane, and the first condensing unit and the second condensing unit do not generate mutual interference.
Specifically, the first condensing unit and the second condensing unit may be separated by the same condenser. The condenser comprises a left collecting pipe 11 and a right collecting pipe 12 which are spaced left and right. The axes of the left collecting pipe 11 and the right collecting pipe 12 are perpendicular to the surface of the evaporator 1, and one end of the left collecting pipe is fixedly arranged close to the surface of the evaporator 1. Here, "close to" means that one end of the left header 11 and one end of the right header 12 are in the vicinity of the surface of the evaporator 1 or abut on the surface of the evaporator 1. A first partition plate 13 is provided inside the right manifold 12 to divide the internal cavity of the right manifold 12 into a first right manifold and a second right manifold. A second partition plate 14 is disposed within the left header 11 to divide the internal cavity of the left header 11 into a first left manifold and a second left manifold. The first condensing unit may be disposed on a side of the second condensing unit away from the evaporator 1, and the second condensing unit is directly close to the evaporator 1.
The first right collecting cavity and the second left collecting cavity are used for collecting steam, and the collected steam is respectively introduced into the first condensing pipe 21 and the second condensing pipe 31 to be cooled and liquefied.
The first and second condensation ducts 21 and 31 may be in the form of flat tubes, circular tubes, or the like.
The first left manifold and the second right manifold are respectively communicated with the outlet of the first condensation pipe 21 and the outlet of the second condensation pipe 31, so that the liquids condensed from the first condensation pipe 21 and the second condensation pipe 31 are respectively collected.
Arrows in fig. 6 indicate the flowing direction of the working medium in the first condenser pipe 21 and the second condenser pipe 31, and the vaporous working medium is gradually condensed into liquid working medium in the flowing process.
The first condensing unit and the second condensing unit can also be two independent condensers, the two independent condensers are arranged on the same height in an unfolding mode, and the two independent condensers can also be spaced at a certain distance.
Two adapter seats 9 are respectively fixedly arranged on the left collecting pipe 11 and the right collecting pipe 12, and the adapter seats 9 are provided with internal channels. The two adapter seats 9 on the right collecting pipe 12 are respectively communicated with a first right manifold and a second right manifold, and the two adapter seats 9 on the left collecting pipe 11 are respectively communicated with a first left manifold and a second left manifold.
One end of the first steam pipe 4 is communicated with the first right manifold through the corresponding adapter 9, and the other end of the first steam pipe is communicated with the right steam pipe connection hole, so that steam close to the right side in the evaporator 1 can be transmitted to the first right manifold.
One end of the first liquid pipe 6 is communicated with the first left collecting cavity through the corresponding adapter 9, and the other end is communicated with the left liquid pipe connection hole, so that condensed liquid in the first left collecting cavity can flow back to the evaporator 1 again.
Similarly, the adapter 9 corresponding to one end of the second steam pipe 5 is communicated with the second left manifold, and the other end of the second steam pipe is communicated with the left steam pipe connection hole, so that steam near the left side in the evaporator 1 can be transmitted to the second left manifold.
One end of the second liquid pipe 7 is communicated with the second right collecting cavity through the corresponding adapter 9, and the other end of the second liquid pipe is communicated with the right liquid pipe connection hole, so that condensed liquid in the second left collecting cavity can flow back to the evaporator 1 again.
In some embodiments, the adapters 9 may not be disposed on the left header 11 and the right header 12, and the first steam pipe 4, the second steam pipe 5, the first liquid pipe 6, and the second liquid pipe 7 are directly connected to the first right manifold, the first left manifold, the second left manifold, and the second right manifold, respectively.
First steam pipe 4, second steam pipe 5, first liquid pipe 6 and second liquid pipe 7 set up respectively in left and right sides, reduce the pipe diameter of steam pipe, can alleviate the problem of pipeline arrangement difficulty.
Referring to fig. 7, 8 and 9, the first condensing unit 2 and the second condensing unit 3 may be arranged in parallel in the vertical direction, such that the first condensing unit 2 and the second condensing unit 3 are independent condensers. The first condensing unit 2 may be located above the second condensing unit 3. The first condensing unit 2 and the second condensing unit 3 may be disposed closely to each other, or may be spaced apart from each other.
The first condensing unit 2 includes a first right collecting pipe 22, a first left collecting pipe 23, and a first condensing pipe 21 connected between the first right collecting pipe 22 and the first left collecting pipe 23. The first right manifold is formed within the first right manifold 22. The first left header 23 forms the first left manifold described above. One end of the first right collecting pipe 22 and one end of the first left collecting pipe 23 are fixedly arranged near the surface of the evaporator 1, and the axes are perpendicular to the surface of the evaporator 1.
The second condensing unit 3 is a condenser and comprises a second right collecting pipe 32, a second left collecting pipe 33 and a second condensing pipe 31 communicated between the second right collecting pipe 32 and the second left collecting pipe 33. A second right manifold is formed within the second right header 32 and a second left manifold is formed within the second left header 33. One end of the second right collecting pipe 32 and one end of the second left collecting pipe 33 are fixedly arranged near the surface of the evaporator 1, and the axes are perpendicular to the surface of the evaporator 1.
Arrows in fig. 7 indicate the flowing direction of the working medium in the first condenser pipe 21 and the second condenser pipe 31, and the vaporous working medium is gradually condensed into liquid working medium in the flowing process.
In specific implementation, the first condensing unit 2 and the second condensing unit 3 are arranged in a left-right staggered manner, that is, the first condensing unit 2 and the second condensing unit 3 are not completely opposite up and down, so that the first right collecting pipe 22 and the right side of the evaporator 1 form a remaining space and the first steam pipe 4 is arranged in the remaining space, and the second left collecting pipe 33 and the left side of the evaporator 1 form a remaining space and the second steam pipe 5 is arranged in the remaining space. Therefore, the arrangement of the steam pipe is more reasonable, the structure is more compact, and the stroke of the steam in the steam pipe is shortened as much as possible so as to achieve better heat dissipation effect.
The first condensing unit 2 and the second condensing unit 3 have the same size, and the first left collecting pipe 23 of the first condensing unit 2 is located above and to the left of the second left collecting pipe 33 of the second condensing unit 3. Thus, the first liquid pipe 6 can be arranged closer to the evaporator 1, so that the first liquid pipe 6 can be communicated to the left steam pipe connection hole from the side of the second steam pipe 5 remote from the evaporator 1, across the second steam pipe 5.
In practical use, a heat radiation fan matched with the thermosiphon heat radiation device is arranged. If the wind generated by the cooling fan flows through the second condensing unit 3 and then flows through the first condensing unit 2, a part of the heat of the second condensing unit 3 is brought into the first condensing unit 2, so that the temperature of the first condensing unit 2 is higher than that of the second condensing unit 3. Then, the heat source control temperature of the first steam pipe 4 of the evaporator 1 close to the first condensing unit 2 is higher than the heat source control temperature of the second steam pipe 5 of the evaporator 1 close to the second condensing unit 3, that is, the right side temperature of the evaporator 1 is higher than the left side temperature, because the heat source control temperature rise is mainly based on the condenser temperature under the condition that the heat exchange areas of the condensing units are equal.
To address this problem, this embodiment performs a setting in which the left liquid connection hole is provided directly below the left vapor connection hole, and the right liquid connection hole is provided directly below the right vapor connection hole. Therefore, the liquid working medium with lower temperature flowing out of the second condensing unit 3 with better condensing effect flows into the right side inside the evaporator 1, so as to compensate the problem of higher temperature on the right side of the evaporator 1. Similarly, the liquid working medium with higher temperature flowing out of the first condensing unit 2 flows into the left side inside the evaporator 1, so as to compensate the problem of lower temperature at the left side of the evaporator 1. The temperature on the left and right sides of the evaporator 1 is thus relatively equalized by this compensation design.
Here, "directly under" is not absolute, and a certain manufacturing error is allowed. The left liquid pipe connection hole is arranged in the area near the position right below the left steam pipe connection hole, and the right liquid pipe connection hole is arranged in the area near the position right below the right steam pipe connection hole, so that a good effect can be achieved.
Further, the right steam pipe connection hole and the right liquid pipe connection hole are both arranged close to the right side of the evaporator 1. The left steam pipe connecting hole and the left liquid pipe connecting hole are both arranged close to the left side of the evaporator 1. That is, the left-right distance between the right steam pipe connection hole and the left steam pipe connection hole and the distance between the right liquid pipe connection hole and the left liquid pipe connection hole are increased as far as possible, so that the compensation mechanism has more obvious effect, and the temperatures of the heat sources on the left side and the right side of the evaporator 1 are controlled more uniformly.
Referring to fig. 10, it is difficult to continue increasing the diameters of the first steam pipe 4 and the second steam pipe under the restriction of the installation space, and it is difficult for an excessively large pipe diameter to turn in a limited space. When the power of the heat source is larger, the steam amount is larger, in order to ensure that the steam in the evaporator 1 flows into the first condensation unit 2 and the second condensation unit 3 more smoothly, the thermosiphon heat dissipation device is also provided with a right additional steam pipe 15 and a left additional steam pipe 16, and the evaporator 1 is provided with a corresponding right additional steam pipe connection hole and a corresponding left additional steam pipe connection hole. The right-added steam pipe connection hole and the left-added steam pipe connection hole are communicated with the sealed accommodating cavity, and the right-added steam pipe connection hole is located on the right side of the left-added steam pipe connection hole. One end of the right additional steam pipe 15 is communicated with the first right collecting chamber, the right additional steam pipe 15 bypasses the second right collecting pipe 32, and the other end of the right additional steam pipe 15 is communicated with the right additional steam pipe connecting hole, so that part of steam on the right side in the evaporator 1 can enter the first right collecting pipe 22 of the first condensing unit 2 through the right additional steam pipe 15. One end of the left additional steam pipe 16 is communicated with the second left collecting chamber, and the other end of the left additional steam pipe 16 is communicated with the left additional steam pipe connection hole, so that a part of steam on the left side in the evaporator 1 can enter the second left collecting pipe 33 of the second condensing unit 3 through the left additional steam pipe 16.
Through the above arrangement scheme, the channel for steam to flow into the first condensation unit 2 and the second condensation unit 3 is increased, so that the steam in the evaporator 1 flows into the first condensation unit 2 and the second condensation unit 3 more smoothly, the flow resistance is reduced, and the heat dissipation capacity can be further improved.
Referring to fig. 11 and 12, the second right header 32 is provided with a groove 321 adapted to an outer sidewall of the right additional steam pipe 15, and the right additional steam pipe 15 is embedded in the groove 321. It will be appreciated that the recess 321 defined in the second right header 32 is only for receiving the right extension steam pipe 15, and that the second right manifold in the second right header 32 is still a sealed chamber for the right extension steam pipe 15 to pass through. Therefore, when the second right header 32 is disposed close to the right side of the evaporator 1, it is avoided that the right additional steam pipe 15 protrudes from the right side of the evaporator 1 and cannot satisfy the installation space limitation of the thermosiphon heat sink.
In the scheme that the first condensing unit 2 and the second condensing unit 3 are arranged in parallel in the up-down direction, reference may be made to the above implementation scheme that the first condensing unit 2 and the second condensing unit 3 are arranged at the same height, corresponding adapters 8 are respectively arranged at the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole and the left liquid pipe connection hole of the evaporator 1, corresponding adapters 9 are arranged on the first right collecting pipe 22, the first left collecting pipe 23, the second right collecting pipe 32 and the second left collecting pipe 33, and each liquid pipe and steam pipe is communicated with the corresponding adapter 8 and adapter 9, so as to realize the communication between the sealed accommodating cavity in the evaporator 1 and the collecting cavity in the corresponding collecting pipe, and the detailed description is omitted here.
In practical applications, the first condensing unit 2 and the second condensing unit 3 are disposed at the same height (shown in fig. 3 to 5) and the first condensing unit 2 and the second condensing unit 3 are disposed in parallel in the up-down direction (shown in fig. 7 to 9), and may be mixed to use, for example, three condensers are disposed in a thermosiphon heat dissipation device. One of the condensers is divided into two condensing units according to the solutions shown in fig. 3 to 5, i.e. by providing baffles in the headers on both sides. The other two condensers, according to the solutions shown in fig. 7 to 9, are arranged one above the other as two independent condensing units. Through the scheme of the mixed arrangement, a plurality of condensers are arranged, and the heat dissipation requirement of higher thermal power can be met.
The solution shown in fig. 3 to 5 for dividing the condenser into two condensing units can also be implemented by extending over a plurality of condensers placed up and down, taking two condensers as an example, the two condensers are divided into two condensing units in advance, the left side of one condensing unit of the first condenser is communicated with the left side of one condensing unit of the second condenser, the right side of one condensing unit of the first condenser is communicated with the right side of one condensing unit of the second condenser, the left side of the other condensing unit of the first condenser is communicated with the left side of the other condensing unit of the second condenser, and the right side of the other condensing unit of the first condenser is communicated with the right side of the other condensing unit of the second condenser, so as to form the combined first condensing unit 2 and second condensing unit 3 as a whole.
While the present invention has been described with reference to several exemplary embodiments, it is understood that the terminology used is intended to be in the nature of words of description and illustration, rather than of limitation. As the present invention may be embodied in several forms without departing from the spirit or essential characteristics thereof, it should also be understood that the above-described embodiments are not limited by any of the details of the foregoing description, but rather should be construed broadly within its spirit and scope as defined in the appended claims, and therefore all changes and modifications that fall within the meets and bounds of the claims, or equivalences of such meets and bounds are therefore intended to be embraced by the appended claims.

Claims (10)

1. A thermosiphon heat sink, comprising:
the evaporator is provided with a sealed accommodating cavity for accommodating working media, and a right steam pipe connecting hole, a left steam pipe connecting hole, a right liquid pipe connecting hole and a left liquid pipe connecting hole which are communicated with the sealed accommodating cavity; the right steam pipe connection hole is positioned on the right side of the left steam pipe connection hole; the right liquid pipe connection hole is positioned on the right side of the left liquid pipe connection hole; the positions of the right steam pipe connecting hole and the left steam pipe connecting hole are higher than the positions of the right liquid pipe connecting hole and the left liquid pipe connecting hole;
a first condensing unit having a first right manifold, a first left manifold, and a plurality of first condensing tubes arranged in parallel; said first condenser tube communicating said first right manifold and said first left manifold; said first right manifold is located on the right side of said evaporator near the top with its axis perpendicular to the surface of said evaporator; the first left manifold is located on the left side of the evaporator near the top with its axis perpendicular to the surface of the evaporator;
a second condensing unit having a second left manifold, a second right manifold, and a plurality of second condensing tubes arranged in parallel; said second condenser tube communicating said second left manifold and said second right manifold; the second left manifold is located on the left side of the evaporator near the top with its axis perpendicular to the surface of the evaporator; said second right manifold is located on the right side of said evaporator near the top with its axis perpendicular to the surface of said evaporator;
one end of the first steam pipe is communicated with the first right manifold, and the other end of the first steam pipe is communicated with the right steam pipe connection hole;
one end of the second steam pipe is communicated with the second left manifold, and the other end of the second steam pipe is communicated with the left steam pipe connection hole;
one end of the first liquid pipe is communicated with the first left manifold, and the other end of the first liquid pipe is communicated with the left liquid pipe connection hole;
and one end of the second liquid pipe is communicated with the second right manifold, and the other end of the second liquid pipe is communicated with the right liquid pipe connecting hole.
2. The thermosiphon heat sink of claim 1, wherein an axis of the first right manifold is collinear with an axis of the second right manifold; the axis of the first left manifold is collinear with the axis of the second left manifold.
3. The thermosiphon heat sink of claim 2, wherein the first condensing unit and the second condensing unit are integrated on a same condenser, the condenser comprising a left header and a right header spaced left and right; the left collecting pipe and the right collecting pipe are fixedly arranged close to the evaporator;
a first partition plate is arranged in the right collecting pipe to divide the inner cavity of the right collecting pipe into a first right collecting cavity and a second right collecting cavity;
and a second partition plate is arranged in the left collecting pipe to divide the inner cavity of the left collecting pipe into a first left collecting cavity and a second left collecting cavity.
4. The thermosiphon heat sink according to claim 1, wherein the first condensation unit and the second condensation unit are arranged in parallel in an up-down direction;
the first condensing unit is a condenser and comprises a first right collecting pipe and a first left collecting pipe, a first right manifold is formed in the first right collecting pipe, and a first left manifold is formed in the first left collecting pipe; the first right collecting pipe and the first left collecting pipe are fixedly arranged close to the evaporator;
the second condensing unit is a condenser and comprises a second right collecting pipe and a second left collecting pipe, a second right manifold is formed in the second right collecting pipe, and a second left manifold is formed in the second left collecting pipe; the second right collecting pipe and the second left collecting pipe are fixedly arranged close to the evaporator.
5. The thermosiphon heat sink of claim 4, wherein the left liquid connection hole is located directly below the left vapor connection hole; the right liquid pipe connecting hole is positioned right below the right steam pipe connecting hole.
6. The thermosiphon heat sink of claim 5, wherein the right vapor connection hole and the right liquid connection hole are both disposed proximate a right side of the evaporator; the left steam pipe connecting hole and the left liquid pipe connecting hole are both close to the left side of the evaporator.
7. The thermosiphon heat sink of claim 6, further comprising a right extension vapor tube and a left extension vapor tube; the first condensing unit is positioned above the second condensing unit; the evaporator is also provided with a right additional steam pipe connecting hole and a left additional steam pipe connecting hole; the right additional steam pipe connection hole and the left additional steam pipe connection hole are both communicated with the sealed accommodating cavity, and the right additional steam pipe connection hole is positioned on the right side of the left additional steam pipe connection hole; one end of the right additional steam pipe is communicated with the first right collecting cavity, the right additional steam pipe bypasses the second right collecting pipe, and the other end of the right additional steam pipe is communicated with the right additional steam pipe connecting hole; one end of the left additional steam pipe is communicated with the second left manifold, and the other end of the left additional steam pipe is communicated with the left additional steam pipe connection hole.
8. The thermosiphon heat sink according to claim 7, wherein the second right collecting pipe has a groove matching with an outer sidewall of the right extra steam pipe, and the right extra steam pipe is inserted into the groove.
9. The thermosiphon heat sink according to claim 6, wherein the first condensing unit and the second condensing unit are disposed in a staggered manner in a left-right direction, such that the first right header pipe and the right side of the evaporator form a remaining space and the first steam pipe is disposed in the remaining space, and the second left header pipe and the left side of the evaporator form a remaining space and the second steam pipe is disposed in the remaining space.
10. The thermosiphon heat sink of claim 1, wherein the evaporator is fixedly provided with adapter tubes in one-to-one correspondence communication with the right steam pipe connection hole, the left steam pipe connection hole, the right liquid pipe connection hole, and the left liquid pipe connection hole; the first steam pipe, the second steam pipe, the first liquid pipe and the second liquid pipe are communicated with the sealed accommodating cavity through corresponding switching pipes respectively.
CN202010120302.8A 2020-02-26 2020-02-26 Thermosiphon heat sink Pending CN111174613A (en)

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CN202010120302.8A CN111174613A (en) 2020-02-26 2020-02-26 Thermosiphon heat sink

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111752359A (en) * 2020-06-30 2020-10-09 联想(北京)有限公司 Electronic equipment
CN113316361A (en) * 2021-05-21 2021-08-27 浙江酷灵信息技术有限公司 Thermosiphon heat sinks, systems and applications
CN113686185A (en) * 2021-09-15 2021-11-23 浙江挚领科技有限公司 Two-phase flow thermosiphon heat sink

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111752359A (en) * 2020-06-30 2020-10-09 联想(北京)有限公司 Electronic equipment
CN113316361A (en) * 2021-05-21 2021-08-27 浙江酷灵信息技术有限公司 Thermosiphon heat sinks, systems and applications
CN113316361B (en) * 2021-05-21 2022-08-12 浙江酷灵信息技术有限公司 Thermosiphon heat sinks, systems and applications
CN113686185A (en) * 2021-09-15 2021-11-23 浙江挚领科技有限公司 Two-phase flow thermosiphon heat sink

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