CN111752359A - Electronic equipment - Google Patents
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- CN111752359A CN111752359A CN202010622239.8A CN202010622239A CN111752359A CN 111752359 A CN111752359 A CN 111752359A CN 202010622239 A CN202010622239 A CN 202010622239A CN 111752359 A CN111752359 A CN 111752359A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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Abstract
The application discloses electronic equipment includes: a box body; a heat generating device capable of generating heat; heat abstractor sets up in the box, heat abstractor includes: a circulation line through which a refrigerant circulates; a heat absorbing part and a heat emitting part disposed in the circulation line; wherein the refrigerant absorbs heat in the heat absorbing part, is vaporized, flows into the heat radiating part, radiates heat in the heat radiating part, is condensed, and flows into the heat absorbing part, and the refrigerant is in the same working temperature range during circulation. The electronic equipment can realize heat dissipation through the phase change of the refrigerant on the premise that the refrigerant is always in the same working temperature range, has higher heat dissipation capacity compared with water-cooling heat dissipation, and can further improve the heat dissipation effect of the electronic equipment.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to an electronic device.
Background
At present, in order to improve the heat dissipation effect, for example, some electronic devices such as computers adopt a water-cooling heat dissipation method, which improves the heat dissipation effect relative to air-cooling heat dissipation, but still cannot meet the requirements of some electronic devices with higher heat dissipation requirements.
Disclosure of Invention
In view of this, the present application provides an electronic device, which further improves the heat dissipation effect.
In order to achieve the above purpose, the present application provides the following technical solutions:
an electronic device, comprising:
a box body;
a heat generating device capable of generating heat;
heat abstractor sets up in the box, heat abstractor includes: a circulation line through which a refrigerant circulates; a heat absorbing part and a heat emitting part disposed in the circulation line; wherein the refrigerant absorbs heat in the heat absorbing part, is vaporized, flows into the heat radiating part, radiates heat in the heat radiating part, is condensed, and flows into the heat absorbing part, and the refrigerant is in the same working temperature range during circulation.
Optionally, in the electronic device, the refrigerant circulates between the heat absorbing part and the heat releasing part, a gas outlet of the heat absorbing part is communicated with a gas inlet of the heat releasing part through a gas duct, and a liquid outlet of the heat releasing part is communicated with a liquid inlet of the heat absorbing part through a liquid duct.
Alternatively, in the electronic apparatus described above, the temperature change of the refrigerant is realized by absorbing heat generated by the heat generating device in the heat absorbing member and releasing the absorbed heat in the heat releasing member.
Alternatively, in the electronic device, the heat radiating member may be disposed on a front side, a rear side, a top side, a bottom side, a left side, or a right side of the heat absorbing member.
Optionally, in the electronic device, the heat absorbing component is disposed at a position where the heating device is located and is in contact with the heating device, and the heat radiating component may be disposed on different wall surfaces of the box body; the case includes a front wall, a rear wall, a top wall, a bottom wall, a left wall, and a right wall, and the heat radiating member may be provided on any one of the front wall, the rear wall, the top wall, the bottom wall, the left wall, and the right wall.
Optionally, in the electronic device, the heat absorbing member is disposed parallel to the left wall and the right wall, and a gas outlet of the heat absorbing member is higher than a liquid inlet of the heat absorbing member in a direction parallel to the left wall and the right wall.
Optionally, in the electronic device, in a direction parallel to the left wall and the right wall, a setting height of at least a part of the heat radiation member is greater than a setting height of the heat absorption member;
and, in a direction perpendicular to the left wall and the right wall, an installation height of at least a part of the heat radiating member is larger than an installation height of the heat absorbing member.
Optionally, in the electronic device, in a direction perpendicular to the left wall and the right wall, the liquid outlet of the heat-radiating member is located at a bottom of the heat-radiating member.
Optionally, in the electronic device, a plurality of liquid outlets of the heat-radiating component are provided, and each liquid outlet is connected to the liquid guide pipeline, and the heights of the liquid outlets are different in a direction perpendicular to the left wall and the right wall.
Optionally, in the electronic device, the electronic device is a computer, the heating device is a processor, and the heat dissipation device is a thermosiphon heat dissipation device.
The application provides an electronic device, a heat dissipation device for dissipating heat of a heating device in a box body, comprising a circulation pipeline for circulating a refrigerant, and a heat absorption part and a heat dissipation part which are arranged in the circulation pipeline, wherein in the specific heat dissipation process, the refrigerant is vaporized into a gas state after absorbing heat generated by a heater in the heat absorption part, the gas refrigerant carries heat and flows out from the heat absorption part, the heat is directly fed into the heat dissipation part through the flow guide of the circulation pipeline, the heat is released in the heat dissipation part, the gas refrigerator is condensed into a liquid state in the process of releasing heat, the liquid refrigerant directly enters the heat absorption part again through the flow guide of the circulation pipeline after flowing out from the heat dissipation part to repeat the heat absorption process, and the refrigerant is in the same working temperature range in the whole circulation flowing process comprising the steps of heat absorption and heat dissipation, that is, the temperature of the refrigerant is changed only by absorbing and releasing the heat generated by the heat generating device, and the temperature of the refrigerant is not changed in other ways, so that the operating temperature of the refrigerant is always within the same temperature change range caused by the heat transfer. The electronic equipment can realize heat dissipation through the phase change of the refrigerant on the premise that the refrigerant is always in the same working temperature range, has higher heat dissipation capacity compared with water-cooling heat dissipation, and can further improve the heat dissipation effect of the electronic equipment.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, it is obvious that the drawings in the following description are only embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating a principle of a heat dissipation device in an electronic device according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a heat dissipation device;
FIG. 3 is a schematic view of the heat emitting member disposed on a top side of the heat absorbing member;
FIG. 4 is a schematic view of the heat emitting member disposed on the bottom side of the heat absorbing member;
FIG. 5 is a schematic view of the heat emitting member disposed on the left side of the heat absorbing member;
FIG. 6 is a schematic view of the heat emitting member disposed on the right side of the heat absorbing member;
FIG. 7 is a schematic view of the heat sink disposed on the top wall of the case;
FIG. 8 is a schematic view of the heat sink disposed on the bottom wall of the case;
FIG. 9 is a schematic view of the heat sink disposed on the rear wall of the case;
FIG. 10 is a schematic view of the heat sink disposed on the front wall of the case;
FIG. 11 is a schematic view of the heat sink disposed on the left wall or the right wall of the case;
FIG. 12 is a side view of the heat sink with the liquid outlet positioned at the bottom of the heat radiating member;
FIG. 13 is a schematic view of the structure of FIG. 12 when the case is in a reclined position;
FIG. 14 is a schematic structural view of the heat dissipating device with the liquid outlet disposed at the bottom of the heat dissipating member;
FIG. 15 is a schematic view of a first structure of a heat dissipation device with multiple fluid conduits;
FIG. 16 is a side view of FIG. 15;
FIG. 17 is a second structural view of a heat dissipation device with multiple fluid conduits;
FIG. 18 is a side view of FIG. 17;
FIG. 19 is a third structural view of a heat dissipating device with multiple fluid conduits;
fig. 20 is a side view of fig. 19.
In fig. 1-20:
the heat-absorbing and cooling system comprises a box body 1, a heat-absorbing part 2, a heat-radiating part 3, a gas outlet 4, a gas inlet 5, a liquid outlet 6, a liquid inlet 7, a gas guide pipeline 8, a liquid guide pipeline 9 and a fan 10.
Detailed Description
The application provides an electronic equipment, its radiating effect has obtained further promotion.
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
As shown in fig. 1-20, an embodiment of the present application provides an electronic device, which is a device that needs heat dissipation but does not aim at cooling, for example, it may be a computer, a server, etc., but not a refrigerator, an air conditioner, etc., and the electronic device mainly includes a box 1, a heat generating device, and a heat dissipating device, where the box 1 is a housing for mounting electronic devices and devices, such as the heat generating device and the heat dissipating device, and the box 1 may be a case of a desktop computer, for example; the heating device is arranged in the box body 1 and can generate heat in the working process, and the heating device is, for example, a CPU, a display card and the like; the heat dissipation device is a device for dissipating heat generated by a heat generating device, and the main operation mode is to transfer the heat generated by the heat generating device to the outside of the box body 1, the heat dissipation device mainly comprises a circulation pipeline, and a heat absorbing component 2 and a heat dissipation component 3 which are arranged in the circulation pipeline, a refrigerant can circulate in a circulation path formed by the circulation pipeline, the heat absorbing component 2 and the heat dissipation component 3, as shown in fig. 1-20, no other component exists between the heat absorbing component 2 and the heat dissipation component 3, the two components are directly communicated through the pipeline, when the refrigerant enters the heat absorbing component 2, the refrigerant can absorb the heat generated by the heat generating device, the refrigerant can be vaporized into a gas state from a liquid state due to the heat absorption of the refrigerant, and then the gas-state refrigerant flows out from the heat absorbing component 2 and enters the heat dissipation component 3 through the diversion of a section of the circulation pipeline (namely, a gas guide pipeline 8 described later), the heat is released from the heat releasing member 3 (i.e., heat exchange with the air outside the casing), and the refrigerant is condensed into a liquid state due to the heat release, and then the liquid refrigerant flows out of the heat releasing member 3, and is guided by another section of the circulation line (i.e., a liquid guide line 9 described later) to enter the heat absorbing member 2 to absorb the heat again.
In the above-described processes of absorbing and releasing heat, that is, in the process of circulating the refrigerant, the refrigerant is also always in the same operating temperature range, and the meaning that the refrigerant is in the same operating temperature range can be explained by the following example: the electronic device is located at an ambient temperature of, for example, 20 ℃ (i.e., the electronic device is placed in a room with a temperature of 20 ℃), the refrigerant is at the same temperature as the ambient temperature when in a liquid state, i.e., 20 ℃, after the refrigerant absorbs heat generated by the heat generating device and is converted into a gas state, the temperature of the refrigerant carrying the heat is, for example, 25 ℃, and then the refrigerant enters the heat releasing device 3 to release the heat and is converted into a liquid again, at which time the temperature of the refrigerant is reduced back to 20 ℃, and then enters the heat absorbing device 2 to absorb heat … …. The temperature range in which the refrigerant works is a range with a small temperature change difference value, namely the temperature of the refrigerant only fluctuates by a small value around the ambient temperature of the electronic equipment, and the temperature of the refrigerant is in the temperature range no matter whether the refrigerant is in a liquid state or a gas state, so that the refrigerant is always in the same working temperature range in the whole circulating flow process.
Different from the above operation method, the existing refrigerator may make the refrigerant in different operation temperature ranges during the cooling process, which can be illustrated by the following example: the refrigerator is located in an environment with a temperature of 20 ℃ for example (i.e. the refrigerator is placed in a room with a temperature of 20 ℃), the storage chamber inside the refrigerator has a temperature lower than the environment, for example, the storage chamber has a temperature of 10 ℃, in order to keep the storage chamber at a temperature of 10 ℃, the refrigerant needs to continuously absorb heat in the storage chamber, in order to ensure that the refrigerant can absorb heat, the temperature of the refrigerant needs to be lower than the temperature in the storage chamber (the temperature of the refrigerant is reduced to be lower by changing the pressure of the refrigerant), at this time, the temperature of the refrigerant is 0 ℃ for example, the temperature of the refrigerant is increased after the refrigerant absorbs heat in the storage chamber, then the refrigerant needs to release the carried heat to the outside of the refrigerator, namely to the environment where the refrigerator is located, and since the environment temperature is 20 ℃, in order to ensure that the heat-carrying refrigerant can completely release heat to the environment, the temperature of the refrigerant needs to be raised again above ambient temperature on the basis of the rise due to heat absorption, so the temperature of the heat-carrying refrigerant needs to be raised further by changing the pressure of the refrigerant, which is 30 ℃ for example, and the refrigerant flows again to the location of the storage chamber to absorb … … heat after releasing heat. From this process, it can be concluded that the temperature change of the refrigerant, not only caused by heat absorption and heat release, includes the change of its own pressure, and the change of the pressure causes the temperature of the refrigerant to change to a greater extent, the lowest temperature of the refrigerant is not only lower than the ambient temperature and has a large difference with the ambient temperature, but also the highest temperature of the refrigerant has a large difference with the ambient temperature, so the temperature of the refrigerant does not fluctuate only in a small range around the ambient temperature where the refrigerator is located, i.e. the refrigerant is not in the same working temperature range during the whole cycle.
The electronic equipment utilizes the phase change heat dissipation mode of the refrigerant, and compared with the existing water-cooling heat dissipation mode, the electronic equipment not only improves the heat dissipation capacity and breaks through the current heat dissipation bottleneck, but also does not need to be provided with rotating parts such as a water pump and the like, and avoids the leakage and the evapotranspiration of the refrigerant. In addition, compared with the existing working mode of refrigerating the refrigerator, the heat dissipation mode of changing the phase of the refrigerant can enable the refrigerant to be always in the same working temperature range, the change reason of the temperature of the refrigerant is only the absorption and the release of heat, and the temperature change of the refrigerant does not need to be carried out in other modes (such as changing the pressure of the refrigerant) any more, so that the heat dissipation can be realized more simply and conveniently, a power component, a pressure component and the like do not need to be arranged, the structure is simplified, and the manufacturing cost is reduced.
As shown in fig. 1 to 20, the present application makes refrigerant circulate directly between the heat absorbing component 2 and the heat releasing component 3, and no other components are included in the circulation line, specifically: the gas outlet 4 of the heat absorbing member 2 is communicated with the gas inlet 5 of the heat releasing member 3 through a gas conducting pipeline 8, and the liquid outlet 6 of the heat releasing member 3 is communicated with the liquid inlet 7 of the heat absorbing member 2 through a liquid conducting pipeline 9. As mentioned above, the temperature of the refrigerant in the present application changes only because the refrigerant absorbs heat generated by the heat generating device in the heat absorbing component 2 and releases the heat in the heat releasing component 3, the temperature of the refrigerant does not change in other ways, and the absorption and release of the heat can ensure the phase change of the refrigerant, so that there is no need to provide other components to assist the operation, and the heat dissipating device only includes a pipeline for circulating and guiding the refrigerant, the heat absorbing component 2 for absorbing heat, and the heat releasing component 3 for releasing heat. Through such arrangement, under the condition that the normal work of the heat dissipation device is ensured, the structure of the heat dissipation device is simpler, and the heat dissipation device can be suitable for the installation of electronic equipment with smaller volume, such as the installation in a host computer of a desktop computer.
Specifically, as shown in fig. 1 and 2, the heat absorbing component 2 is a plate-shaped component that can be attached to the heat generating device, and the heat releasing component 3 can be a heat exchanger. The heat absorbing component 2 is a plate-shaped member, because the plate-shaped member has a large heat conducting area, the plate-shaped member can be more fully attached to a heating device, and thus the heat absorbing efficiency of the heat dissipating device is improved. The heat exchanger comprises a grid structure formed by conduits as shown in fig. 1, and fins distributed over the surface of the grid structure as shown in fig. 2. Meanwhile, in order to further improve the heat absorption and release efficiency, the heat absorbing member 2 and the heat releasing member 3 are made of a metal having a good heat conductive property, such as copper or aluminum. In order to improve the heat radiation efficiency of the heat radiating member 3, the heat radiating member 3 may further include a fan 10 in addition to the heat exchanger, as shown in fig. 7 to 11.
As shown in fig. 3 to 6, in the present application, the heat absorbing member 2 and the heat radiating member 3 may be fitted in various ways, and particularly, the heat radiating member 3 can be disposed on the front side, the rear side, the top side, the bottom side, the left side or the right side of the heat absorbing member 2. In the multiple matching modes, the heat-radiating component 3 can be matched with the heat-absorbing component 2 well, and different matching modes can be matched and installed with the box body 1 in different modes, that is, as shown in fig. 7-11, the heat-absorbing component 2 is arranged at the position of the heating device and is in contact with the heating device, and the heat-radiating component 3 can be arranged on different wall surfaces of the box body 1; the box body 1 comprises a front wall, a rear wall, a top wall, a bottom wall, a left wall and a right wall, the heat release component 3 can be arranged on any one of the front wall, the rear wall, the top wall, the bottom wall, the left wall and the right wall, a through hole is formed in any one of the front wall, the rear wall, the top wall, the bottom wall, the left wall and the right wall, and the heat release component 3 is embedded in the through hole. That is to say, set up on the different wall of box 1 through exothermic subassembly 3, can realize electronic equipment's top air-out heat dissipation, bottom air-out heat dissipation, anterior air-out heat dissipation, rear portion air-out heat dissipation or lateral part air-out heat dissipation. Meanwhile, on the basis that the box body 1 adopts any one of the air-out heat dissipation methods, the box body 1 is also provided with the fan 10 arranged on the rear wall, so that the heat dissipation device can perform air cooling heat dissipation while dissipating heat, and the heat dissipation effect of the electronic equipment is further improved.
As shown in fig. 7-11, the heat absorbing member 2 may be arranged parallel to the left and right walls in the present application, with the gas outlet 4 of the heat absorbing member 2 being higher than the liquid inlet 7 of the heat absorbing member 2 in a direction parallel to the left and right walls. The shape of the box body 1 can be selected to be a cuboid, two side walls with the largest area are a left wall and a right wall, and the left wall and the right wall are in a normal working posture of the box body 1 when in a vertical state (namely the normal working posture of the box body 1 is the same as the working posture of a host machine of a desktop computer, or the box body 1 is the host machine), when the plate-shaped heat absorbing part 2 is arranged in parallel with the left wall and the right wall, namely the heat absorbing part 2 is in a vertical state, as shown in figure 1, a gas outlet 4 of the heat absorbing part 2 for leading out the gaseous refrigerant is higher than a liquid inlet 7 for leading in the gaseous refrigerant, the arrangement is that because the density and the mass of gas are small, the gas outlet 4 for leading out the gaseous refrigerant is arranged at a higher position, the flow of the gaseous refrigerant to the heat radiating part 3 is facilitated, and simultaneously, because the density and the mass of liquid are large, the liquid inlet 7 is arranged, the liquid refrigerant flowing out of the heat radiating member 3 can flow into the heat absorbing member 2 more rapidly and smoothly, so that the heat radiating efficiency of the heat radiating device can be improved to a certain extent by the arrangement.
As shown in fig. 11 to 20, in a direction parallel to the left and right walls (this direction is denoted as a first direction in fig. 1 and 11 to 20, which is a vertical direction since the left and right walls are in a vertical state), the arrangement height of at least part of the heat radiating member 3 is made larger than the arrangement height of the heat absorbing member 2. That is, in the case where the heat radiating member 3 is disposed on the front side, the rear side, the left side, the right side, or the top side of the heat absorbing member 2, the disposition height of at least a part of the heat radiating member 3 is made larger than the disposition height of the entire heat absorbing member 2, and thus the disposition is made such that the liquid refrigerant formed after heat radiation in the heat radiating member 3 can flow into the heat absorbing member 2 by its own gravity when the heat radiating member 3 is partially or entirely higher than the heat absorbing member 2, i.e., the disposition is made such that the flow smoothness of the refrigerant can be improved, the flow of the refrigerant to the heat absorbing member 2 is promoted, and the retention of the liquid refrigerant in the heat radiating member 3 is reduced or avoided.
The functions of the above components and the mutual cooperation among the components are explained based on the case 1 being in a normal working posture (i.e. the left wall and the right wall are in a vertical state), but in some special cases, the case 1 does not necessarily work in a normal working posture, for example, when the case 1 is the main machine, a user may sometimes lay it on a table for raising a display screen or reducing the occupied space of the table, i.e. the case 1 works with the left wall and the right wall in a horizontal state (one of the left wall or the right wall is attached to the table), in order to ensure that the heat dissipation device can still achieve a good heat dissipation effect under such a use condition, in a direction perpendicular to the left wall and the right wall (this direction is marked as a second direction in fig. 11-20, when the case 1 is laid, as shown in fig. 13, this second direction is a vertical direction perpendicular to the horizontal direction), at least a part of the heat radiating member 3 is also set to a height greater than that of the heat absorbing member 2, as shown in fig. 13 to 20. This arrangement is also intended to allow the liquid refrigerant in the heat radiating member 3 located at a higher position when the case 1 is laid down to flow more smoothly and sufficiently into the heat absorbing member 2, thereby promoting the flow of the refrigerant into the heat absorbing member 2 and reducing or preventing the liquid refrigerant from remaining in the heat radiating member 3.
As shown in fig. 13 and 14, the liquid outlet 6 of the heat radiating member 3 is located at the bottom of the heat radiating member 3 in a direction perpendicular to the left and right walls (i.e., in the second direction). That is, when the case 1 is laid down, the liquid outlet 6 for guiding the liquid refrigerant out of the heat radiating member 3 is located at the bottom of the entire heat radiating member 3, so that the liquid refrigerant in the heat radiating member 3 can flow out of the liquid outlet 6 located at the lowest position, thereby preventing the liquid refrigerant from remaining in the heat radiating member 3 and maximally promoting the flow of the refrigerant to the heat absorbing member 2.
Further, it is also possible to make the liquid outlet 6 of the heat radiating member 3 plural, and each of the liquid outlets 6 is connected with the liquid guiding pipe 9, and the heights of the different liquid outlets 6 are different in the direction perpendicular to the left and right walls, and the structure in which the plural liquid outlets 6 and the plural liquid guiding pipes 9 are provided may be various, as shown in fig. 15 to 20. With this arrangement, the liquid refrigerant in the heat radiating member 3 can be made to flow into the heat absorbing member 2 through a plurality of paths, thereby better promoting the flow of the refrigerant to the heat absorbing member 2, while the heights of the liquid outlets 6 are made different when the case 1 is laid down, and it is also possible to achieve the outflow of different amounts of liquid refrigerant from the heat radiating member 3, for example, when there are two liquid outlets 6, in the case where the case 1 is laid down, i.e., when the first liquid outlet 6 is located at an intermediate position of the entire heat radiating member 3 in a direction perpendicular to the left and right walls (as shown in fig. 20), the liquid refrigerant in half of the heat radiating member 3 higher than the liquid outlet 6 flows into the heat absorbing member 2 through the liquid outlet 6 (this case is satisfied on the assumption that the entire heat radiating member 3 is filled with the liquid refrigerant by default); when the second liquid outlet 6 is spaced from the top of the heat radiating member 3 by two thirds of the height of the entire heat radiating member 3, the liquid refrigerant in the two thirds of the heat radiating member 3 above the liquid outlet 6 flows into the heat absorbing member 2 through the liquid outlet 6. With this arrangement, the flow of the refrigerant to the heat absorbing member 2 can be promoted to different degrees.
Specifically, the electronic device in the present application may be a computer, the heating device may be a processor of the computer, and the heat dissipation device may be a thermosiphon heat dissipation device.
In this specification, structures of each part are described in a progressive manner, and a structure of each part is mainly described to be different from an existing structure, and the whole structure and the part structure of the electronic device can be obtained by combining the structures of the parts.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. An electronic device, comprising:
a box body;
a heat generating device capable of generating heat;
heat abstractor sets up in the box, heat abstractor includes: a circulation line through which a refrigerant circulates; a heat absorbing part and a heat emitting part disposed in the circulation line; wherein the refrigerant absorbs heat in the heat absorbing part, is vaporized, flows into the heat radiating part, radiates heat in the heat radiating part, is condensed, and flows into the heat absorbing part, and the refrigerant is in the same working temperature range during circulation.
2. The electronic device according to claim 1, wherein the refrigerant circulates between the heat absorbing member and the heat releasing member, a gas outlet of the heat absorbing member and a gas inlet of the heat releasing member communicate through a gas-guide line, and a liquid outlet of the heat releasing member and a liquid inlet of the heat absorbing member communicate through a liquid-guide line.
3. The electronic apparatus according to claim 1, wherein the temperature change of the refrigerant is achieved by absorbing heat generated by the heat generating device in the heat absorbing member and releasing the absorbed heat in the heat releasing member.
4. The electronic device of claim 2, the heat-radiating member being positionable on a front side, a rear side, a top side, a bottom side, a left side, or a right side of the heat-absorbing member.
5. The electronic device of claim 4, wherein the heat absorbing component is disposed at a position where the heat generating component is located and is in contact with the heat generating component, and the heat radiating component can be disposed on different wall surfaces of the case; the case includes a front wall, a rear wall, a top wall, a bottom wall, a left wall, and a right wall, and the heat radiating member may be provided on any one of the front wall, the rear wall, the top wall, the bottom wall, the left wall, and the right wall.
6. The electronic device of claim 5, the heat sink being disposed parallel to the left wall and the right wall, a gas outlet of the heat sink being higher than a gas inlet of the heat sink in a direction parallel to the left wall and the right wall.
7. The electronic apparatus according to claim 6, a setting height of at least a part of the heat releasing member is larger than a setting height of the heat absorbing member in a direction parallel to the left wall and the right wall;
and, in a direction perpendicular to the left wall and the right wall, an installation height of at least a part of the heat radiating member is larger than an installation height of the heat absorbing member.
8. The electronic device of claim 7, the liquid outlet of the heat-radiating member being located at a bottom of the heat-radiating member in a direction perpendicular to the left and right walls.
9. The electronic apparatus according to claim 7, wherein the heat-radiating member has a plurality of liquid outlets, and the liquid conduit is connected to each of the liquid outlets, and the liquid outlets have different heights in a direction perpendicular to the left wall and the right wall.
10. The electronic device of claim 1, wherein the electronic device is a computer, the heat generating component is a processor, and the heat sink is a thermosiphon heat sink.
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| CN202010622239.8A CN111752359A (en) | 2020-06-30 | 2020-06-30 | Electronic equipment |
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| CN109673134A (en) * | 2018-12-28 | 2019-04-23 | 联想(北京)有限公司 | Electronic equipment, humidity control system |
| CN111174613A (en) * | 2020-02-26 | 2020-05-19 | 深圳智焓热传科技有限公司 | Thermosiphon heat sink |
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