CN111132449A - Ball grid array package PCB substrate and impedance matching method thereof - Google Patents
Ball grid array package PCB substrate and impedance matching method thereof Download PDFInfo
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- CN111132449A CN111132449A CN202010002300.9A CN202010002300A CN111132449A CN 111132449 A CN111132449 A CN 111132449A CN 202010002300 A CN202010002300 A CN 202010002300A CN 111132449 A CN111132449 A CN 111132449A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49833—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers the chip support structure consisting of a plurality of insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49838—Geometry or layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a ball grid array package PCB substrate, which comprises: an upper substrate and a lower substrate; the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the area of the pad of the inner conductor is increased to 1-2 times of the design area; the invention also discloses an impedance matching method of the ball grid array packaging PCB substrate, which comprises the following steps: counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate; calculating the quasi-coaxial impedance; and (3) reducing the radial size of the inner conductor of the upper-layer substrate or/and the radial size of the inner conductor of the lower-layer substrate by the calculated quasi-coaxial impedance so that the quasi-coaxial impedance is matched with an external microwave circuit. The invention has the characteristics of simple structure, low process requirement and easy realization of industrial large-scale production, and simultaneously has the characteristic of online debugging of amplitude limiting power; in ensuring standing waves (orParameter S11, or return loss) is not increased, the average value of the axial line assembly errors is increased to
The tolerance level indirectly reduces the process difficulty of the coaxial-like packaging.
Description
Technical Field
The present invention relates to printed circuit boards, and more particularly, to a ball grid array packaged printed circuit board and an impedance matching method thereof.
Background
At present, the circuit integration level is higher and higher, the SIP (system in package) technology is widely applied, the vertical interconnection technology is adopted in the microwave and millimeter wave fields to realize the signal transmission between the substrates,
microwave, millimeter wave vertical interconnection technologies include fuzz button technology, BGA (ball grid array) technology, and the like. The fuzz button technology is a technology which is formed by weaving gold-plated elastic metal wires according to a certain method, compresses along the axial direction and transmits signals by means of elastic contact; BGA (ball grid array) technology is a packaging method in which a certain surface is covered with (or partially covered with) pins in a grid-like arrangement, and a signal is transmitted from one substrate to another, thereby realizing transmission of signals between multiple substrates.
A Printed Circuit Board (PCB) using BGA technology is composed of microstrip lines, solder balls, quasi-coaxial lines including inner conductors, outer conductors, ground layers, partial insulating layers, and the like, and insulating plates, and generally, a multi-layer substrate is connected by solder balls using reflow technology. However, when the system is packaged by the BGA technology, the axial line of the conductor in the upper substrate and the axial line of the conductor in the lower substrate inevitably have a certain misalignment, which causes two problems of reduction of the soldering quality and impedance mismatch, and the problem is not favorable for improving the overall performance of the package of the circuit integrated system. Therefore, how to improve and guarantee the welding quality and realize the microwave circuit matching on the basis of improving the welding quality becomes a problem to be solved for the circuit integrated system package.
Disclosure of Invention
In order to solve the above problems, the present invention provides a PCB substrate for ball grid array package, the PCB substrate comprising: an upper substrate and a lower substrate;
the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the microstrip line, and the other end of the microstrip line is connected with the solder ball; the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the grounding layer, the other end of the outer conductor is connected with the solder balls, the solder balls are welded at one ends of the inner conductor and the outer conductor, and the grounding layer is embedded between the two layers of insulating plates;
the lower substrate comprises a microstrip line, an inner conductor, an outer conductor, an inner conductor pad, an outer conductor pad, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the inner conductor, the inner conductor is embedded into the insulating plate, one end of the inner conductor is connected with the microstrip line, the other end of the inner conductor is connected with the inner conductor pad, the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the ground layer, the other end of the outer conductor is connected with the outer conductor pad, the inner conductor pad is welded at one end of the inner. The grounding layer is embedded between the two insulating plates;
the area of the inner conductor pad is increased to 1-2 times of the design area.
A ball grid array package PCB base plate, the inner conductor radial dimension of the upper strata base plate of PCB base plate and the whole radial dimension of the inner conductor of lower floor's base plate are different or partial radial dimension is different.
A ball grid array package PCB base plate, the radial dimension of inner conductor and the radial dimension of outer conductor of PCB base plate are different.
A ball grid array package PCB base plate, the radial dimension of the inner conductor part of the lower floor base plate of PCB base plate is than the radial dimension of the inner conductor of the upper floor base plate of PCB base plate is little.
A ball grid array package PCB base plate, the whole radial dimension of inner conductor of the lower floor base plate of PCB base plate is than the radial dimension of inner conductor of the upper strata base plate of PCB base plate is little.
A ball grid array encapsulation PCB base plate, the radial dimension of inner conductor of PCB base plate is less than outer conductor radial dimension.
The impedance matching method of the ball grid array package PCB substrate comprises the following steps:
1) counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate;
2) calculating the quasi-coaxial impedance;
3) and (3) reducing the radial size of the inner conductor of the upper-layer substrate or/and the radial size of the inner conductor of the lower-layer substrate according to the quasi-coaxial impedance calculated in the step 2), so that the quasi-coaxial impedance is matched with an external microwave circuit.
In the impedance matching method for the ball grid array package PCB substrate, the step 3) of reducing the radial size of the inner conductor of the upper substrate or/and the radial size of the inner conductor of the lower substrate refers to: reducing the whole diameter of the inner conductor of the upper substrate or the diameter of the inner conductor part of the upper substrate; or reducing the whole diameter of the inner conductor of the lower substrate or the diameter of the inner conductor part of the lower substrate; or the overall diameter of the inner conductor of the upper-layer substrate and the overall diameter of the inner conductor of the lower-layer substrate are reduced; or reducing the diameter of the conductor portion in the upper substrate and the diameter of the conductor portion in the lower substrate.
Theoretically, the general formula of the characteristic impedance of a coaxial transmission line:
in the above formula:
R-each orderInternal resistance of conductors at bit lengths, ohm/m
GConductivity of the medium per unit length, Siemens/m
LInductance per unit length, shared per meter
CCapacitance per unit length, farad/meter
ω=2πf
fFrequency of
When R = G =0, the above formula is simplified to:
at microwave frequencies, the internal inductance of the conductor is small, with the inductance per unit length being very close to the external inductance per unit length:
in the above formula:
Lexternal inductance per unit length, shared per meter
μ ІPermeability of medium, c.m
D-inner diameter of outer conductor
d-outer diameter of inner conductor
The capacitance per unit length can be calculated as follows:
in the above formula:
Ccapacitance per unit length, farad/meter
For common coaxial line
For the coaxial-like transmission line, the coaxial transmission line has a structure similar to that of the coaxial transmission line, and the analysis can be directly carried out by using the theory of the coaxial transmission line.
When the microwave and millimeter wave substrates are packaged, the assembly error of the axial lead exists between the axial lead of the inner conductor of the upper substrate and the axial lead of the inner conductor of the lower substrate
The assembly error is similar to the increase of the inner diameter of the inner conductor at the position of dislocation, and the increase of the inner conductor, the inductance
Reduction of capacitance
The increase, i.e. the increase of the on-axis like capacitive effect (decrease of the inductive effect) and the decrease of the impedance amplitude.
Increasing the inner conductor pad area improves the quality of the coaxial-like solder, which results in a further increase in the capacitive effect of the coaxial-like (further decrease in the inductive effect) and a further decrease in the impedance magnitude.
Both axial lead assembly errors and increased inner conductor pads cause increased capacitive effects (decreased inductive effects) and reduced impedance amplitudes, resulting in microwave circuit impedance mismatches.
Impedance of microwave circuit
Is given by the formula
Wherein
The real part of the impedance (or resistance),
for the imaginary part of the impedance (or reactance),zin order to be the magnitude of the impedance,
is the impedance phase angle. Impedance mismatch, i.e. a change in the real or imaginary part of the impedance (which may also be expressed as a magnitude of the impedance, or a phase angle change). The coaxial-like capacitance effect is enhanced (inductive effect is reduced) and the impedance amplitude is reduced, and in order to re-match the coaxial-like impedance, the capacitance effect is reduced (inductive effect is enhanced) and the impedance amplitude is increased. By reducing the radial dimension of the inner conductors of the upper and lower substrates (the radial dimension of the inner conductor part area, or the overall radial dimension of the upper/lower inner conductors, or the overall radial dimension of the upper and lower inner conductors), a reduction in the capacitive effect (enhancement in the inductive effect) and an increase in the impedance amplitude can be achieved according to the above formula.
The invention improves the welding quality of the upper substrate and the lower substrate by increasing the area of the inner conductor bonding pad, reduces the radial size of the inner conductor of the upper substrate and the lower substrate, enhances the capacitance effect (weakening the inductive effect) and reduces the impedance amplitude caused by the assembly error of the axial lead when the microwave substrate and the millimeter wave substrate are packaged in a system, improves the impedance matching of the similar coaxial and the microwave circuit by utilizing the enhancement of the capacitance effect (strengthening the inductive effect) and the increase of the impedance amplitude, reduces the standing wave (or the parameter S11 or the return loss) of the microwave circuit, and realizes the matching of the microwave circuit again. The invention has the characteristics of simple structure, low process requirement and easy realization of industrial large-scale production, and simultaneously has the characteristic of online debugging of amplitude limiting power; on the premise of ensuring that the standing wave (or the parameter S11 or the return loss) of the microwave circuit is not increased, the average value of the axial lead assembly errors is increased to
The tolerance level indirectly reduces the process difficulty of the coaxial-like packaging.
Drawings
FIG. 1 is a schematic diagram of a PCB substrate structure with aligned upper and lower substrates;
FIG. 2 is a schematic diagram of a PCB substrate structure with staggered upper and lower substrates;
FIG. 3 is a schematic diagram of a PCB substrate structure of an embodiment in which the radial dimension of the inner conductor portion of a lower substrate is smaller than that of the inner conductor portion of an upper substrate;
FIG. 4 is a PCB substrate of the second embodiment, in which the overall radial dimension of the inner conductor of the lower substrate is smaller than that of the upper substrate;
in the embodiment of fig. 5, the radial size of the inner conductor of the upper layer substrate and the lower layer substrate is smaller than that of the outer conductor of the PCB substrate.
1. A lower substrate; 2. an upper substrate; 3. an inner conductor; 4. an outer conductor; 5. an outer conductor pad; 6 microstrip lines; 7. a solder ball; 8. an inner conductor pad.
Detailed Description
The technical scheme of the invention is described by the specific implementation mode and the accompanying drawings:
example one
In this embodiment, a printed circuit board of a ball grid array package is provided, specifically referring to fig. 3, the PCB substrate includes: an upper substrate and a lower substrate; the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the microstrip line, and the other end of the microstrip line is connected with the solder ball; the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the grounding layer, the other end of the outer conductor is connected with the solder balls, the solder balls are welded at one ends of the inner conductor and the outer conductor, and the grounding layer is embedded between the two layers of insulating plates; the lower substrate comprises a microstrip line, an inner conductor, an outer conductor, an inner conductor pad, an outer conductor pad, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the inner conductor, the inner conductor is embedded into the insulating plate, one end of the inner conductor is connected with the microstrip line, the other end of the inner conductor is connected with the inner conductor pad, the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the ground layer, the other end of the outer conductor is connected with the outer conductor pad, the inner conductor pad is welded at one end of the inner. The grounding layer is embedded between the two insulating plates; the area of the inner conductor pad is increased to 1 time of the design area.
The impedance matching method of the ball grid array package PCB substrate of the embodiment comprises the following steps:
1) counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate;
2) calculating the quasi-coaxial impedance;
3) and (3) reducing the radial size of the inner conductor part of the lower substrate according to the quasi-coaxial impedance calculated in the step 2), so that the quasi-coaxial impedance is matched with an external microwave circuit.
Example two
The second embodiment provides a printed circuit board packaged in a ball grid array package, specifically referring to fig. 4, the PCB substrate includes: an upper substrate and a lower substrate; the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the microstrip line, and the other end of the microstrip line is connected with the solder ball; the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the grounding layer, the other end of the outer conductor is connected with the solder balls, the solder balls are welded at one ends of the inner conductor and the outer conductor, and the grounding layer is embedded between the two layers of insulating plates; the lower substrate comprises a microstrip line, an inner conductor, an outer conductor, an inner conductor pad, an outer conductor pad, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the inner conductor, the inner conductor is embedded into the insulating plate, one end of the inner conductor is connected with the microstrip line, the other end of the inner conductor is connected with the inner conductor pad, the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the ground layer, the other end of the outer conductor is connected with the outer conductor pad, the inner conductor pad is welded at one end of the inner. The grounding layer is embedded between the two insulating plates; the area of the inner conductor pad is increased to 1.5 times of the design area.
The impedance matching method of the ball grid array package PCB substrate of the embodiment comprises the following steps:
1) counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate;
2) calculating the quasi-coaxial impedance;
3) and (3) reducing the overall radial size of the inner conductor of the lower substrate according to the quasi-coaxial impedance calculated in the step 2), so that the quasi-coaxial impedance is matched with an external microwave circuit.
EXAMPLE III
In a third embodiment, there is provided a printed circuit board packaged in a ball grid array package, specifically referring to fig. 4, the PCB substrate includes: an upper substrate and a lower substrate; the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the microstrip line, and the other end of the microstrip line is connected with the solder ball; the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the grounding layer, the other end of the outer conductor is connected with the solder balls, the solder balls are welded at one ends of the inner conductor and the outer conductor, and the grounding layer is embedded between the two layers of insulating plates; the lower substrate comprises a microstrip line, an inner conductor, an outer conductor, an inner conductor pad, an outer conductor pad, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the inner conductor, the inner conductor is embedded into the insulating plate, one end of the inner conductor is connected with the microstrip line, the other end of the inner conductor is connected with the inner conductor pad, the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the ground layer, the other end of the outer conductor is connected with the outer conductor pad, the inner conductor pad is welded at one end of the inner. The grounding layer is embedded between the two insulating plates; the area of the inner conductor pad is increased by 2 times of the design area.
The impedance matching method of the ball grid array package PCB substrate of the embodiment comprises the following steps:
1) counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate;
2) calculating the quasi-coaxial impedance;
3) and (3) reducing the radial size of the inner conductor of the PCB substrate according to the quasi-coaxial impedance calculated in the step 2), so that the quasi-coaxial impedance is matched with an external microwave circuit.
The embodiment of the invention improves the welding quality of the upper substrate and the lower substrate by increasing the area of the inner conductor welding pad and reduces the radial size of the inner conductor of the upper substrate and the lower substrateWhen the microwave and millimeter wave substrates are packaged in a system, the capacitance effect is enhanced (the inductive effect is weakened) and the impedance amplitude is reduced, the impedance matching of the similar coaxial microwave circuit and the microwave circuit is improved by utilizing the capacitance effect enhancement (the inductive effect enhancement) and the impedance amplitude increase, the standing wave (or the parameter S11 or the return loss) of the microwave circuit is reduced, and the matching of the microwave circuit is realized again. The invention has the characteristics of simple structure, low process requirement and easy realization of industrial large-scale production, and simultaneously has the characteristic of online debugging of amplitude limiting power; on the premise of ensuring that the standing wave (or the parameter S11 or the return loss) of the microwave circuit is not increased, the average value of the axial lead assembly errors is increased to
The tolerance level indirectly reduces the process difficulty of the coaxial-like packaging.
The foregoing embodiments are merely illustrative of the principles and features of the present invention, which is not limited to the above-described embodiments, and various changes and modifications may be made therein without departing from the spirit and scope of the invention, which is defined by the scope of the claims as set forth in the description thereof.
Claims (8)
1. The utility model provides a ball grid array encapsulation PCB base plate which characterized in that, the PCB base plate includes: an upper substrate and a lower substrate;
the upper substrate comprises a microstrip line, an inner conductor, an outer conductor, a solder ball, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the microstrip line, and the other end of the microstrip line is connected with the solder ball; the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the grounding layer, the other end of the outer conductor is connected with the solder balls, the solder balls are welded at one ends of the inner conductor and the outer conductor, and the grounding layer is embedded between the two layers of insulating plates;
the lower substrate comprises a microstrip line, an inner conductor, an outer conductor, an inner conductor pad, an outer conductor pad, a ground layer and an insulating plate, wherein the microstrip line is attached to the surface of the insulating plate, one end of the microstrip line is connected with the inner conductor, the inner conductor is embedded into the insulating plate, one end of the inner conductor is connected with the microstrip line, the other end of the inner conductor is connected with the inner conductor pad, the outer conductor is embedded into the insulating plate, one end of the outer conductor is connected with the ground layer, the other end of the outer conductor is connected with the outer conductor pad, the inner conductor pad is welded at one end of the inner;
the grounding layer is embedded between the two insulating plates;
the area of the inner conductor pad is increased to 1-2 times of the design area.
2. The ball grid array package PCB substrate of claim 1, wherein the radial dimension of the inner conductor of the upper substrate of the PCB substrate is different from the overall radial dimension or a partial radial dimension of the inner conductor of the lower substrate.
3. The ball grid array package PCB substrate of claim 1, wherein the radial dimension of the inner conductor and the radial dimension of the outer conductor of the PCB substrate are different.
4. The ball grid array package PCB substrate of claim 2, wherein the inner conductor portion of the lower substrate of the PCB substrate has a smaller radial dimension than the inner conductor portion of the upper substrate of the PCB substrate.
5. The ball grid array package PCB substrate of claim 2, wherein the overall radial dimension of the inner conductors of the lower substrate of the PCB substrate is smaller than the radial dimension of the inner conductors of the upper substrate of the PCB substrate.
6. The ball grid array package PCB substrate of claim 3, wherein the PCB substrate has an inner conductor radial dimension that is smaller than an outer conductor radial dimension.
7. The impedance matching method of a ball grid array package PCB substrate of claim 1, wherein the method comprises the steps of:
1) counting the average value of the assembly errors of the axial lead of the conductor in the upper substrate and the axial lead of the conductor in the lower substrate;
2) calculating the quasi-coaxial impedance;
3) and (3) reducing the radial size of the inner conductor of the upper-layer substrate or/and the radial size of the inner conductor of the lower-layer substrate according to the quasi-coaxial impedance calculated in the step 2), so that the quasi-coaxial impedance is matched with an external microwave circuit.
8. The impedance matching method for the BGA package PCB substrate of claim 7, wherein the step 3) of reducing the radial dimension of the inner conductor of the upper substrate or/and the radial dimension of the inner conductor of the lower substrate is: reducing the whole diameter of the inner conductor of the upper substrate or the diameter of the inner conductor part of the upper substrate; or reducing the whole diameter of the inner conductor of the lower substrate or the diameter of the inner conductor part of the lower substrate; or the overall diameter of the inner conductor of the upper-layer substrate and the overall diameter of the inner conductor of the lower-layer substrate are reduced; or reducing the diameter of the conductor portion in the upper substrate and the diameter of the conductor portion in the lower substrate.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112291933A (en) * | 2020-10-10 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Compensation method for keeping impedance continuity of routing layer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112291933A (en) * | 2020-10-10 | 2021-01-29 | 苏州浪潮智能科技有限公司 | Compensation method for keeping impedance continuity of routing layer |
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