CN210349811U

CN210349811U - PCB (printed circuit board) matched with low-loss wireless radio frequency chip in packaging manner

Info

Publication number: CN210349811U
Application number: CN201921160713.9U
Authority: CN
Inventors: 王新; 蒋振雷
Original assignee: Hangzhou Microsilicon Tech Co ltd
Current assignee: Hangzhou Microsilicon Tech Co ltd
Priority date: 2019-07-23
Filing date: 2019-07-23
Publication date: 2020-04-17
Anticipated expiration: 2029-07-23

Abstract

The utility model relates to a with low-loss wireless radio frequency chip package complex PCB, wireless radio frequency chip package sets gradually plastic envelope layer and rewiring layer from last to down, plastic envelope layer plastic envelope wireless radio frequency chip, and the tin ball on the rewiring layer and PCB's the corresponding contact electricity interconnection, PCB have the high frequency lead-out wire that extends to PCB positive border corresponding to the tin ball of connecting the high frequency signal contact. Adopt the utility model discloses a high frequency lead-out wire is drawn forth to the design on PCB for radio signal begins to carry out coupling and transmission with the port at PCB's border, thereby has reduced noise interference, improves radio frequency signal transmission efficiency.

Description

PCB (printed circuit board) matched with low-loss wireless radio frequency chip in packaging manner

Technical Field

The utility model relates to a semiconductor package technical field, concretely relates to with low-loss wireless radio frequency chip encapsulation complex PCB.

Background

With the continuous upgrade and development of the radio frequency transmission technology, the frequency of the transmitted signal gradually goes to high frequency (>10GHz) or ultra high frequency (>30GHz), and when the radio frequency chip receives and transmits a high frequency signal, it becomes very critical how to ensure the transmission efficiency of the signal in the chip package and reduce the transmission loss.

SUMMERY OF THE UTILITY MODEL

Utility model purpose: the utility model aims to solve the problem that the PCB that current radio frequency encapsulation corresponds can not carry out high frequency signal's receipt and transmission high-efficiently, and transmission efficiency is low, and transmission loss is big.

The technical scheme is as follows: in order to solve the above problem, the utility model adopts the following technical scheme:

a PCB matched with a low-loss wireless radio frequency chip package comprises the low-loss wireless radio frequency chip package and the PCB, wherein solder balls led out of the low-loss wireless radio frequency chip are electrically interconnected with corresponding contacts on the PCB, and high-frequency lead-out wires extending to the edge of the PCB are arranged on the PCB corresponding to the solder balls connected with high-frequency signal contacts.

Further, the ground contact on the PCB is electrically interconnected with the ground contact from the rewiring layer of the low-loss radio frequency chip package.

Further, the signal contacts on the PCB are electrically interconnected with the signal contacts from the rewiring layer of the low-loss radio frequency chip package.

Further, the high-frequency outgoing line is a copper wire laying high-frequency outgoing line.

Further, the wireless radio frequency chip package is sequentially provided with a plastic package layer and a rewiring layer from top to bottom, and the wireless radio frequency chip is plastically packaged by the plastic package layer.

Has the advantages that: compared with the prior art, the utility model:

a high-frequency outgoing line is led out from the PCB, so that the wireless signal starts to be coupled and transmitted with the port at the edge of the PCB, noise interference is reduced, and the transmission efficiency of the radio-frequency signal is improved.

Drawings

Fig. 1 is a schematic structural diagram of the PCB of the present invention.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and examples.

Example 1

As shown in fig. 1, a PCB matched with a low-loss radio frequency chip package is shown, which includes a low-loss radio frequency chip package 3 and a PCB1, wherein the radio frequency chip package 3 is sequentially provided with a plastic package layer and a rewiring layer from top to bottom, the plastic package layer is used for plastic packaging the low-loss radio frequency chip 4, solder balls led out from the low-loss radio frequency chip 4 are electrically interconnected with corresponding contacts on the PCB1, and the solder balls on the PCB6 corresponding to the contacts for connecting high-frequency signals are provided with high-frequency lead-out wires 2 extending to the edge of the PCB 1.

The ground contact on the PCB1 is electrically interconnected with the ground contact from the rewiring layer of the low-loss radio frequency chip package 3.

The signal contacts on the PCB1 are electrically interconnected with the signal contacts from the rewiring layer of the low-loss radio frequency chip package 3.

The high-frequency outgoing line 2 is a copper wire laying high-frequency outgoing line.

Claims

1. A PCB matched with a low-loss wireless radio frequency chip package is characterized in that: the low-loss wireless radio frequency chip package comprises a low-loss wireless radio frequency chip package and a PCB, wherein solder balls led out from the low-loss wireless radio frequency chip are electrically interconnected with corresponding contacts on the PCB, and high-frequency lead-out wires extending to the edge of the PCB are arranged on the PCB corresponding to the solder balls connected with high-frequency signal contacts.

2. The PCB mated with a low loss radio frequency chip package of claim 1, wherein: the ground contact on the PCB is electrically interconnected with the ground contact from the rewiring layer of the low-loss radio frequency chip package.

3. The PCB mated with a low loss radio frequency chip package of claim 1, wherein: the signal contacts on the PCB are electrically interconnected with the signal contacts from the rewiring layer of the low-loss radio frequency chip package.

4. The PCB mated with a low loss radio frequency chip package of claim 1, wherein: the high-frequency outgoing line is a copper wire laying high-frequency outgoing line.

5. The PCB mated with a low loss radio frequency chip package of claim 1, wherein: the wireless radio frequency chip packaging structure is characterized in that a plastic packaging layer and a rewiring layer are sequentially arranged from top to bottom, and the wireless radio frequency chip is packaged by the plastic packaging layer.