CN111122920B - Tool for loading chip module - Google Patents
Tool for loading chip module Download PDFInfo
- Publication number
- CN111122920B CN111122920B CN201911389447.1A CN201911389447A CN111122920B CN 111122920 B CN111122920 B CN 111122920B CN 201911389447 A CN201911389447 A CN 201911389447A CN 111122920 B CN111122920 B CN 111122920B
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- CN
- China
- Prior art keywords
- butt joint
- jig
- loading
- chip connector
- joint part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
Abstract
A tool for loading a wafer module is used for installing the wafer module into a chip connector, wherein the chip connector is provided with a plurality of terminals and a movable plate for promoting the terminals to move locally; the jig comprises a flat plate part and a butt joint part which protrudes downwards from the flat plate part, the butt joint part is used for butt joint with the chip connector, the flat plate part and the butt joint part are provided with channels for the wafer module to pass through, a plurality of pressing parts are arranged in the butt joint part, and when the jig is assembled to the chip connector, the pressing parts enable the moving plate to move so as to drive the terminals to partially move. The pressing part is arranged in the butt joint part, so that the height of the chip connector can be reduced during the test of the wafer module, the stacking number of the wafer modules is increased, the test efficiency is improved, and the time and labor cost is saved.
Description
[ technical field ] A method for producing a semiconductor device
The present invention relates to a tool for loading a chip module.
[ background of the invention ]
The prior art chinese utility model patent No. 200941105Y discloses a tool for loading wafer module, this patent discloses a tool for placing wafer module in electric connector, wherein electric connector includes insulator, upper and lower grafting portion, framework and arranges the driving body on the insulator in, at the in-process of placing wafer module, need make the driving body downstream through pushing down the tool to drive the locking device truns into the state of opening by the off-state, so that wafer module and conductive terminal contact. The jig needs a driving body in the use process, the stacking height of the electric connector after the wafer module is placed on the driving body is too high, the number of the tested wafer modules is reduced in a limited space, and the time and labor cost are increased.
Therefore, there is a need to provide an improved jig for loading a chip module to overcome the above-mentioned drawbacks.
[ summary of the invention ]
The invention aims to provide a jig for loading a wafer module, which can reduce the height of a chip connector after the wafer module is assembled.
The purpose of the invention is realized by the following technical scheme: a tool for loading a wafer module is used for installing the wafer module into a chip connector, wherein the chip connector is provided with a plurality of terminals and a movable plate for promoting the terminals to move locally; the jig comprises a flat plate part and a butt joint part which protrudes downwards from the flat plate part, the butt joint part is used for butt joint with the chip connector, the flat plate part and the butt joint part are provided with channels for the wafer module to pass through, a plurality of pressing parts are arranged in the butt joint part, and when the jig is assembled to the chip connector, the pressing parts enable the moving plate to move so as to drive the terminals to partially move.
Furthermore, the butt joint part is formed by being surrounded by four side walls, and the pressing part extends downwards from the inner top surface of the butt joint part to form; the two opposite side walls are provided with two slots and guide posts positioned between the slots, the two pressing parts are positioned at the inner sides of the two side walls, and the two pressing parts are positioned in the range of the slots when being seen from being vertical to the two side walls,
furthermore, a plurality of elastic elements are arranged in the butt joint part, and when the jig is assembled to the chip connector, the elastic elements are compressed to generate a trend of upward movement.
Furthermore, the elastic element comprises a butting column and a spring matched and connected with the butting column, the butting column penetrates through a through hole formed in the butting portion to reach the chip connector, a cover plate is mounted on the flat plate portion, and the upper end of the spring is fixed by the cover plate.
Further, two operation portions are attached to the flat plate portion.
Furthermore, the butt joint part comprises an outer cylinder formed by surrounding four side walls and an inner cylinder arranged in the side walls of the outer cylinder, and the inner cylinder can move up and down relative to the outer cylinder and can reach the chip connector downwards.
Furthermore, the opposite side walls of the inner cylinder are provided with sliding blocks protruding outwards, the opposite side walls of the outer cylinder are provided with sliding grooves recessed inwards, and the sliding blocks are contained in the sliding grooves and can slide up and down in the sliding grooves.
Further, the slider has the recess of establishing from slider upper surface undercut, corresponding spring is installed to the recess, the spring butt in be fixed in the flat board portion the apron.
Furthermore, the outer barrel is provided with a plurality of elastic elements and through holes for the elastic elements to pass through, and the elastic elements are abutted against the cover plate.
Furthermore, the jig also comprises a fixing plate for fixing the cover plate and the butt joint part on the flat plate part, and the fixing plate, the flat plate part, the cover plate and the butt joint part are provided with channels for the wafer module to pass through.
Compared with the prior art, the invention has the following beneficial effects: according to the invention, the pressing part is arranged in the butt joint part, after the wafer module is assembled, the overall height of the chip connector is reduced, the stacking number of the chip connectors of the wafer module to be tested each time can be increased, the manufacturing cost can be reduced, the number of the wafer modules to be tested each time can be increased, the working efficiency is improved, and the time and labor cost are reduced.
[ description of the drawings ]
Fig. 1 is a schematic perspective view illustrating a jig according to a first embodiment of the present invention and a chip connector.
Fig. 2 is a perspective view illustrating the jig according to the first embodiment of the present invention separated from the chip connector.
Fig. 3 is a perspective view of the chip module not assembled to the chip connector.
Fig. 4 is a perspective view of fig. 2 from another angle.
Fig. 5 is an exploded perspective view of a jig according to a first embodiment of the present invention.
Fig. 6 is an exploded perspective view from another angle of fig. 5.
Fig. 7 is a cross-sectional view of fig. 1 taken along the dashed line a-a.
Fig. 8 is a perspective view illustrating the fitting of a jig and a chip connector according to a second embodiment of the present invention.
Fig. 9 is a perspective view illustrating the second embodiment of the jig of the present invention separated from the chip connector.
Fig. 10 is an exploded perspective view of a jig according to a second embodiment of the present invention.
Fig. 11 is an exploded perspective view of fig. 10 from another angle.
[ description of main element symbols ]
Jig 100, 100' accommodating groove 11
Screw holes 12, 13, 42 of butt parts 2, 2'
The resilient member 24 abuts the post 241
Receiving groove 2413 spring 242
Outer cylinder 21 'chute 212'
Inner cylinder 22 'slider 221'
Recess 222' operating part 3
Screw 31, 43 cover plate 4, 4'
Wafer module 200 chip connector 300
Moving plate 301 with protruding claws 3011
The receiving space 304 is connected to the groove 305
The following detailed description will further illustrate the invention in conjunction with the above-described figures.
[ detailed description ] embodiments
Referring to fig. 1 to 7, which are first embodiments of the present invention, a jig 100 for loading a wafer module is used to mount a wafer module 200 into a chip connector 300, wherein the chip connector 300 has a plurality of terminals (not shown), a moving plate 301 for urging the terminals to move partially, and a base 302 for receiving the moving plate 301. The opposite two sides of the moving plate 301 are provided with protruding claws 3011 protruding outward, the base 302 is provided with four side walls 303 and a receiving space 304 recessed inward from the side walls 303, and the two opposite side walls 303 are further provided with a butt-joint groove 305 recessed inward from the outer wall surface thereof. The protruding claws 3011 are correspondingly accommodated in the accommodating space 304, the size of the accommodating space 304 is larger than that of the protruding claws 3011, and the rest space is used for matching with the jig 100.
The jig 100 includes a flat plate portion 1, an abutting portion 2 protruding downward from the flat plate portion 1, two operation portions 3 mounted on the flat plate portion 1, and a cover plate 4 covering the flat plate portion 1. The flat plate portion 1 and the butt portion 2 are provided with a passage 10 through which the chip module 200 passes.
The flat plate portion 1 is flat and has a receiving groove 11 for receiving the cover plate 4, a screw hole 12 fitted to the cover plate 4, and a screw hole 13 fitted to the operation portion 3.
The abutting portion 2 is used for abutting against the chip connector 300, and includes four side walls 21 vertically extending downward from the flat plate portion 1 and a plurality of pressing portions 22 disposed in the side walls 21. The pressing portion 22 is formed by extending downward from the inner top surface of the abutting portion 2. Two opposite side walls 21 are provided with two slots 211 and a guiding post 212 located between the slots 211. The two pressing portions 22 are located on the inner sides of the two side walls 21, and the two pressing portions 22 are located in the range of the slot 211 when viewed perpendicular to the two side walls 21. When the jig 100 is assembled to the chip connector 300, the guiding post 212 is inserted into the mating slot 305 of the chip connector 300, and the pressing portion 22 is inserted into the accommodating space 304 of the chip connector 300 and pushes the protrusion 3011 to make the moving plate 301 move in the horizontal direction, so as to drive the terminal to move partially. The abutting portion 2 is further provided with a boss 23 protruding inward from the side wall 21 and a plurality of elastic elements 24 arranged in the boss 23. The elastic element 24 includes an abutting column 241 and a spring 242 coupled to the abutting column 241. The abutment post 241 includes an upper end 2411 and a lower end 2412, and the diameter of the upper end 2411 is greater than the diameter of the lower end 2412. The boss 23 is provided with a through hole 231 penetrating through the upper and lower surfaces thereof, the diameter of the upper end opening of the through hole 231 is larger than that of the lower end opening, the upper end 2411 of the abutment post 241 is accommodated in the through hole 231, and the lower end 2412 penetrates through the lower end opening of the through hole 231 for abutting against the chip connector 300. The upper end 2411 has a receiving slot 2413 for receiving the spring 242, the lower end of the spring 242 abuts against the bottom wall of the receiving slot 2413, and the upper end of the spring 242 abuts against the cover plate 4 (see fig. 7). When the jig 100 is assembled to the chip connector 300, the spring 242 in the elastic element 24 is compressed to generate an upward movement tendency, and when the jig 100 needs to be removed, the spring 242 generates an upward elastic force, which has a tendency of bouncing up the jig 100, so that the force of an operator pulling out the jig 100 can be reduced.
The operation part 3 is vertically arranged on the flat plate part 1 at two sides of the channel 10 and symmetrically arranged, and the screw 31 passes through the screw hole 13 to fix the operation part 3 on the flat plate part 1. The operation part 3 in this embodiment is used for facilitating the operator to press the jig.
Referring to fig. 4 to 5, the cover plate 4 is provided with a first channel 41 penetrating through the upper and lower surfaces thereof and four screw holes 42 located at four corners of the cover plate 4. Screws 43 pass through screw holes 42 to fix cover plate 4 to flat plate portion 1. The first channel 41 is connected to the channel 10, and when the wafer module 200 is assembled, the jig 100 is first connected to the chip connector 300, and then the chip module is placed on the chip connector 300 through the first channel 41 and the channel 10. The outer cylinder 21' has a plurality of elastic members 24 and through holes 231 for the elastic members 24 to pass through, and the elastic members 24 are abutted against the cover plate. In the present invention, the height of at least one sidewall 303 of the chip connector 300 is higher than the height of the wafer module 200 when the wafer module 200 is placed on the chip connector 300, so as to prevent the wafer module 200 from falling.
Referring to fig. 8 to 11, a jig 100 'for loading a chip module according to a second embodiment of the present invention includes a plate portion 1', an abutting portion 2 'abutting against a chip connector 300, a cover plate 4' fixed on the abutting portion 2 ', and a fixing plate 5' for fixing the cover plate 4 'to the plate portion 1'. The flat plate part 1 'is provided with a plurality of through holes, and can simultaneously bear a plurality of butt joint parts 2' for butt joint of a plurality of chip connectors 300, so that batch testing is facilitated, and time cost is saved.
Referring to fig. 10 and 11, the docking portion 2 ' includes an outer barrel 21 ' surrounded by four sidewalls 211 ' and an inner barrel 22 ' disposed in the sidewalls of the outer barrel 21 ', the inner barrel 22 ' can move up and down relative to the outer barrel 21 ' and can reach the chip connector 300 downward. The opposite side walls 211 ' of the outer cylinder 21 ' are provided with sliding grooves 212 ' which are recessed inwards, the opposite side walls 211 ' of the inner cylinder 22 ' are provided with sliding blocks 221 ' which protrude outwards, and the sliding blocks 221 ' are accommodated in the sliding grooves 212 ' and can slide up and down in the sliding grooves 212 '.
The slider 221 'has a recess 222' recessed downward from the upper surface of the slider 221 ', and the recess 22' is mounted with a corresponding spring (not shown) abutting against the cover plate 4 'fixed to the flat plate portion 1'. The jig also comprises a fixing plate for fixing the cover plate and the butt joint part on the flat plate part, and the fixing plate, the flat plate part, the cover plate and the butt joint part are provided with channels for the wafer module to pass through.
When the jig 100 'is used for assembling the chip connector 300 of the wafer module, in the descending process of the jig 100', the inner cylinder 22 'is firstly abutted to the chip connector 300, along with the continuous descending of the jig, the inner cylinder upwards compresses the spring and ascends relative to the outer cylinder 21', the wafer module is placed on the chip connector through the channel 10 ', the wafer module can be more accurately placed on the chip connector 300 through the arrangement of the inner cylinder 22', the wafer module is ensured to be separated after being clamped, and the accuracy of the butt joint of the wafer module and the chip connector is improved.
The structure and the motion trajectory of the elastic element in the second embodiment are substantially the same as those in the first embodiment, and are not described herein again.
In summary, the jig of the invention has the following beneficial effects:
1. the pressing parts 22 and 22 'are arranged in the butt joint parts 2 and 2', the chip connector has no pressing part, when the wafer module is assembled, the whole height of the chip connector 300 is reduced, the stacking number of the chip connectors for testing the wafer module at each time can be increased, the manufacturing cost can be reduced, the number of the wafer modules for testing at each time can be increased, the working efficiency is improved, and the time and labor cost are reduced;
2. the jig is provided with the elastic element, so that the jig is convenient to remove;
3. the jig is provided with an operation part so as to facilitate the operator to press or remove the jig;
4. an inner cylinder is added at the butt joint part of the jig to ensure that the wafer module can be accurately placed on the chip connector when the jig moves at a high speed.
The above description is only a part of the embodiments of the present invention, and not all embodiments, and any equivalent variations of the technical solutions of the present invention, which are made by those skilled in the art through reading the present specification, are covered by the claims of the present invention.
Claims (10)
1. A tool for loading a wafer module is used for installing the wafer module into a chip connector, wherein the chip connector is provided with a plurality of terminals and a movable plate for promoting the terminals to move locally; the method is characterized in that: the jig comprises a flat plate part and a butt joint part which protrudes downwards from the flat plate part, the butt joint part is used for butt joint with the chip connector, the butt joint part is formed by surrounding four side walls, the flat plate part and the butt joint part are provided with channels for the wafer module to pass through, a plurality of pressing parts are arranged in the butt joint part, the pressing parts extend downwards from the inner top surface of the butt joint part and are formed, the side walls are provided with first guide parts, the chip connector is provided with second guide parts matched with the first guide parts, and when the jig is assembled to the chip connector, the pressing parts enable the moving plate to move so as to drive the terminals to move locally.
2. The jig for loading a chip module according to claim 1, wherein: the first guide part is composed of two opposite slots arranged on the two side walls and a guide column arranged between the slots, the two pressing parts are arranged on the inner sides of the two side walls, and the two pressing parts are arranged in the range of the slots when being seen from being vertical to the two side walls.
3. The jig for loading a chip module according to claim 1, wherein: the butting part is internally provided with a plurality of elastic elements, and when the jig is assembled to the chip connector, the elastic elements are compressed to generate an upward movement trend.
4. The tool for loading wafer modules of claim 3, wherein: the elastic element comprises a butting column and a spring matched and connected with the butting column, the butting column penetrates through a through hole formed in the butting portion to reach the chip connector, a cover plate is mounted on the flat plate portion, and the upper end of the spring is fixed by the cover plate.
5. The tool for loading wafer modules of claim 4, wherein: the flat plate portion is mounted with two operation portions.
6. The jig for loading a chip module according to claim 1, wherein: the butt joint part comprises an outer cylinder and an inner cylinder, wherein the outer cylinder is formed by surrounding four side walls, the inner cylinder is arranged in the side walls of the outer cylinder, and the inner cylinder can move up and down relative to the outer cylinder and can reach the chip connector downwards.
7. The tool for loading wafer modules of claim 6, wherein: the sliding blocks are accommodated in the sliding grooves and can slide up and down in the sliding grooves.
8. The tool for loading wafer modules of claim 7, wherein: the slider has the recess of establishing from slider upper surface undercut, corresponding spring is installed to the recess, the spring butt in be fixed in the apron of flat board portion.
9. The apparatus for loading a chip module according to claim 8, wherein: the outer barrel is provided with a plurality of elastic elements and through holes for the elastic elements to pass through, and the elastic elements are abutted against the cover plate.
10. The apparatus for loading a chip module according to claim 9, wherein: the jig also comprises a fixing plate for fixing the cover plate and the butt joint part on the flat plate part, and the fixing plate, the flat plate part, the cover plate and the butt joint part are provided with channels for the wafer module to pass through.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911389447.1A CN111122920B (en) | 2019-12-30 | 2019-12-30 | Tool for loading chip module |
| TW109145622A TWI840639B (en) | 2019-12-30 | 2020-12-23 | Jig for loading chip module and chip connector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911389447.1A CN111122920B (en) | 2019-12-30 | 2019-12-30 | Tool for loading chip module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111122920A CN111122920A (en) | 2020-05-08 |
| CN111122920B true CN111122920B (en) | 2022-02-25 |
Family
ID=70504522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911389447.1A Active CN111122920B (en) | 2019-12-30 | 2019-12-30 | Tool for loading chip module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111122920B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05346453A (en) * | 1992-06-15 | 1993-12-27 | Nec Corp | Test jig for semiconductor integrated circuit device |
| CN101153876A (en) * | 2006-09-26 | 2008-04-02 | 富士康(昆山)电脑接插件有限公司 | Tool used for loading and unloading wafer module group |
| TW200818635A (en) * | 2006-10-02 | 2008-04-16 | Hon Hai Prec Ind Co Ltd | Tool for loading and unloading an IC package |
| TWM363590U (en) * | 2009-02-16 | 2009-08-21 | Hon Hai Prec Ind Co Ltd | Tool used for testing socket |
| CN201373887Y (en) * | 2009-02-19 | 2009-12-30 | 富士康(昆山)电脑接插件有限公司 | Jig for testing socket |
| CN201708422U (en) * | 2010-04-01 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN202797526U (en) * | 2012-07-03 | 2013-03-13 | 富士康(昆山)电脑接插件有限公司 | Electrical connector assembly |
| TWM549353U (en) * | 2017-06-13 | 2017-09-21 | Jet Technology Co Ltd | Mechanism linking inspection fixture and test platform |
| CN109066259A (en) * | 2018-09-21 | 2018-12-21 | 上海银晓科技有限公司 | A kind of bonder terminal pressure pushes away jig |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8017434B2 (en) * | 2008-11-24 | 2011-09-13 | Advanced Micro Devices, Inc. | Semiconductor chip package fixture |
-
2019
- 2019-12-30 CN CN201911389447.1A patent/CN111122920B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05346453A (en) * | 1992-06-15 | 1993-12-27 | Nec Corp | Test jig for semiconductor integrated circuit device |
| CN101153876A (en) * | 2006-09-26 | 2008-04-02 | 富士康(昆山)电脑接插件有限公司 | Tool used for loading and unloading wafer module group |
| TW200818635A (en) * | 2006-10-02 | 2008-04-16 | Hon Hai Prec Ind Co Ltd | Tool for loading and unloading an IC package |
| TWM363590U (en) * | 2009-02-16 | 2009-08-21 | Hon Hai Prec Ind Co Ltd | Tool used for testing socket |
| CN201373887Y (en) * | 2009-02-19 | 2009-12-30 | 富士康(昆山)电脑接插件有限公司 | Jig for testing socket |
| CN201708422U (en) * | 2010-04-01 | 2011-01-12 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN202797526U (en) * | 2012-07-03 | 2013-03-13 | 富士康(昆山)电脑接插件有限公司 | Electrical connector assembly |
| TWM549353U (en) * | 2017-06-13 | 2017-09-21 | Jet Technology Co Ltd | Mechanism linking inspection fixture and test platform |
| CN109066259A (en) * | 2018-09-21 | 2018-12-21 | 上海银晓科技有限公司 | A kind of bonder terminal pressure pushes away jig |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202129277A (en) | 2021-08-01 |
| CN111122920A (en) | 2020-05-08 |
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